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October 4, 2012
 

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   IMAPS EVENTS
Button Thermal Management Workshop - Abstracts Now Due This Friday & Tabletops Nearly SOLD-OUT! (read more...)

Button Wire Bonding Workshop & Tabletops - Abstracts Due Next Friday & Tabletops Available Soon (read more...)

Button Abstracts Being Accepted for IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) (read more...)

Button International Conference and Exhibition on High Temperature Electronics Network (HiTEN) Now Open! (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Indiana Chapter Meeting and Tour of ITT Exelis Product Assurance Laboratory on October 11 (read more...)

Bullet Program Soon for IMAPS France Medical Workshop (read more...)

Bullet 2nd Southeastern Microelectronics Packaging Conference (read more...)

Bullet New England Chapter's 40 Symposium & Expo - Call For Papers (read more...)

 

Palomar Technologies

COHERENT
Master Bond
QSIC

 

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Thermal Management Workshop - Abstracts Now Due This Friday & Tabletops Nearly SOLD-OUT!    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibit on Thermal Management will be held at the Toll House in Los Gatos, California from November 12-14, 2012. Abstracts are now DUE THIS FRIDAY, OCTOBER 5. Only a few tabletops remain - book your exhibit online or contact bschieman@imaps.org this week. Visit www.imaps.org/thermal to submit abstracts, reserve a tabletop or register to attend.

The Early Registration/Exhibit & Hotel Deadlines are next Friday, October 12, 2012. IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Thermal challenges and business and economic drivers which influence change in electronic systems design and manufacturing. Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that are included in this session. Such market and business data sets the framework for new technical solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, telcom, IGBT, RF, and microwave components and systems. Standards for testing and reliability. Organic, metallic, metal, graphitic, and other forms of TIMs are included, as well as developments with nanomaterials.
  • CTE-Matching and High Thermal Conductivity Materials:  Metallic, ceramic, and other composite materials with excellent thermal conductivity and coefficient of thermal expansion targeted to that of GaN, SiC, silicon, or ceramic materials. 
  • 2.5D/3D and Device Packaging:  Chip-level packaging, including System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die and related thermal and interconnect challenges.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Performance, flexibility, reliability, and serviceability improvements.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Cooling provisioning, airflow, temperature distribution, and migration paths to system liquid cooling.
  • Power Semiconductor Thermal Components, Systems, and Solutions:  Discrete and multichip IGBT packaging.
  • Mil/Aerospace:  Thermal management solutions for emerging and future military and aerospace components and platforms.
  • Telecommunications Systems:  Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics:  Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.
  • LED & Solar:  Component and system-level thermal management of high power HB-LED/UHB-LED and solar applications.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than October 5, 2012. No formal technical paper is required.

A post-conference CD containing the full presentation material as supplied by authors will be mailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than November 14, 2012, and will be included on the post-conference CD.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Brian Schieman with questions bschieman@imaps.org or 202-548-8715. You may also contact the workshop chairs.

Wire Bonding Workshop & Tabletops - Abstracts Due Next Friday & Tabletops Available Soon    ^ Top
IMAPS Topical Workshop & Tabletop Exhibition on Wire Bonding will be held January 22-23, 2013, at the Radisson Hotel San Jose Airport in San Jose, California. Abstracts are DUE NEXT FRIDAY, OCTOBER 12. Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.imaps.org/wirebonding to submit abstracts, reserve a tabletop or register to attend.

The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

  • Cu/Low-K packaging processes
  • Terminal pad structures and modifications
  • Wire and Tool Advances
  • Assembly processes and handling issues
  • Copper Wire Bonding
  • Heavy and Fine Wire Wedge Bonding
  • Automotive and other Harsh Enviroments
  • Novel packaging and design
  • Failure Analysis and Reliability
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by October 12, 2012, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than November 30, 2012.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form; will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award. The Foundation will return the registration fee for the winner. The winner must pay for travel and lodging expenses.

Abstracts Being Accepted for IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013)    ^ Top
IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) will be held April 23-25, 2013, at the Buena Vista Palace Hotel & Spa in Orlando, Florida. Abstracts are due November 2, 2012. Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.cicmt.org to submit abstracts, reserve a tabletop or register to attend.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due November 2, 2012
Notice of Acceptance: December 3, 2012
Final Manuscripts Due: February 15, 2013

Please send your 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org or call 1-202-548-8715 (USA).

International Conference and Exhibition on High Temperature Electronics Network (HiTEN) Now Open!    ^ Top
IMAPS International Conference and Exhibition on High Temperature Electronics Network (HiTEN) will be held July 8-10, 2013, at St. Catherine’s College in Oxford, United Kingdom. Abstracts are due January 25, 2013. Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.imaps.org/hiten to submit abstracts, reserve a tabletop or register to attend.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later January 25, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due May 31, 2013, for all accepted abstract.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. 

  Chapter Activities (events listed in chronological order)
 

Indiana Chapter Meeting and Tour of ITT Exelis Product Assurance Laboratory on October 11    ^ Top

Date: Thursday, October 11, 2012
Location:

Tour of ITT Exelis Product Assurance Laboratory
Fort Wayne, IN
Nick Warren, Lab Manager

Dinner and Meeting Don Hall’s Guesthouse Grill
Fort Wayne, IN

Registration:

Advance reservations will be accepted until 4:00 pm on Monday, October 8th. Reservations can be made by contacting Ray Fairchild at 765-451-1068, email: m.ray.fairchild@delphi.com.

ITT Exelis Lab Tour  4:45 pm     All times are EST
Travel to Don Hall's  6:00 pm 
Dinner  6:15 pm 
Meeting  7:30 pm 
Adjourn  8:00pm

$20 Members
$25 Non-Members

Tour of ITT Exelis Product Assurance Laboratory

The Product Assurance Laboratory (PAL) provides accurate, objective, and conclusive analytical services in a timely fashion driven by the busi- ness concerns of the customer. This is achieved by an experienced, multi-disciplined staff and a world-class facility. PAL is an award-winning full-service laboratory established in 1984 to support the U.S. Army’s highest production-rate military electronics program (SINCGARS) and also to support production of space-based instruments critical to weather monitoring (GOES) and national security. Over the years, the lab has evolved into a world class facility, well-staffed and equipped to provide a broad range of analytical services. PAL will help you understand the physics driving your most challenging problems so that corrective action can be implemented quickly and effectively. PAL will also develop or improve your manufacturing process with the most scientific and accurate data. Your components and subassembly quality can be proactively evaluated before procurement or build. Capabilities include:

  • Particle Impact Noise Detection
  • Electrical Test
  • Probe Station / Laser Cutting
  • Micro, Superficial, Rockwell Hardness
  • Tensile / Compression Force Testing
  • Precision Cross Sectioning / Metallography
  • Fine & Gross Leak Testing of Hermetics
  • Photon Emission and IR Hotspot Detection
  • Microelectronics Prototyping
  • IC Die Shear & Wire Bond Strength

Program Soon for IMAPS France Medical Workshop    ^ Top
The 1st Workshop on Advanced Technology on Microelectronics, Systems and Packaging for Medical Electronics will be held on December 4-5 in Paris, France. Abstracts were due in September. For further information, please consult the call for papers at the link: http://france.imapseurope.org/images/stories/documentPDF/cfp_medical_2012.pdf.

Organized in collaboration with Yole Développement, the first day of the workshop will feature internationally recognized speakers from industry and academia :

• Industry Trends & Forecasts in Medical Electronics
• Implantable and Wearable in New Diagnostics and Therapies

Sessions are being organized on following topics:

  • 3D Packaging & Interconnection
  • Component Manufacturing at Chip & Package Level
  • Implantable and Wearable Applications
  • Systems Communication (High Frequency, Data Remote Monitoring)
  • Sensors, Actuators, Power Supply
  • Embedded Passives and Associated Technologies

Please address your questions to imaps.france@imapsfrance.org

Authors will be notified of paper acceptance with instructions for publication before October 15th , 2012. Speaker will benefit with special rate of 120 Euros.

2nd Southeastern Microelectronics Packaging Conference    ^ Top

Date: February 28, 2013
Location:

Rosen Centre Hotel
9840 International Drive
Orlando, FL 32819

Details:

Abstracts Deadline November 23, 2012
Please email Doug Bokil - dbokil@bokil.com with questions

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging. Topics of interest for submission include, but are not limited to:

  • 2.5D / 3D Packaging
  • Flip Chip and Wafer Bumping Processes
  • MEMS Packaging
  • Wire Bonding / Stud Bumping
  • LED / Optoelectronic / Photonic Packaging
  • Underfill / Encapsulants / Adhesives
  • Printed Electronics Technology
  • Design for Manufacturing / Test / Reliability
  • Substrate / PWB Technology
  • Testing of High Density & Microelectronic Assemblies
  • Thermal Management Solutions
  • Non-Hermetic Packaging for Harsh Environments
  • Embedded Device Packaging
  • Pb-Free Solder and RoHS Compliance
  • Microwave & RF Applications
  • Counterfeit Electronics Detection

Those wishing to present a paper at the Southeastern Microelectronics Packaging Conference must submit a 250-300 word abstract electronically no later than November 23, 2012

Further details regarding the conference and abstract submission will be available in October 2012.

This all day conference will have table top exhibits.

Exhibitors: Table top $450.00 Please email Doug Bokil - dbokil@bokil.com to secure your space. Meanwhile if you have any questions please email Doug Bokil

New England Chapter's 40 Symposium & Expo - Call For Papers    ^ Top

Date: Tuesday May 7th, 2013
Location:

Holiday Inn Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

Please send 250 word abstract to: Jim McLenaghan, AJM@Creyr.NET for more details visit us at: www.imapsne.org

Deadline for Abstract Submission – Monday December 31, 2012

For details about Sponsoring, Exhibiting or Attending Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

CALL FOR PAPERS

Symposium Technical Chair
A. James (Jim) McLenaghan, Creyr Innovation, LLC

The Largest Regional Symposium Dedicated to Microelectronics and Packaging

Tuesday May 7th, 2013
----- Featuring -----
Six to Eight Lecture Sessions, Full Poster Session,
Employment Center & 80 Booth Exhibit Hall

The New England Chapter Symposium Technical Program Committee seeks papers that demonstrate how new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Medical Electronics
  • Lasers
  • Telecom – RF & Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal & Power Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Sensors (Manufacturing & Applications)
  • Emerging Technologies
  • Solar, Photovoltaic
  • Aerospace
  • Electronics for Environmental Impact Measurement & Assessment

Advanced Processes & Materials

  • 3D, SiP, and High Density Packaging
  • Nano Materials - Mfg., Applications, & Safety
  • Photonics, Optoelectronics, LED Packaging
  • MEMS and Nano Packaging
  • Underfill - Materials, Applications, Effectiveness
  • Green packaging - Regulation Compliance, Materials, Processes, Recycling
  • Flip-Chip and Bumping Processes & Reliability
  • Wire-bonding and Stud-Bumping
  • Embedded Components – Passives, Magnetics
  • Ceramic, Polymer and Conductive Materials
  • Cu, Low-K
  • Product DFR & DFM Tools, Programs, Implementation
  • Materials Deposition & Delivery - Print, Vapor, Dispensing, Placement, etc.

 

Quik-Pak

LORD Corporation

RGL Enterprises

EPP

Crane AE Banner

2012 Events:

Indiana Chapter
October 11

Thermal Management
November 12-14
*Exhibitors contact bschieman@imaps.org

Medical Applications (IMAPS France) - Dec. 4-5


2013 Events:

Wire Bonding
January 22-23

Southeastern Microelectronics Conference
February 28

Device Packaging
March 11-14
*Exhibitors contact bschieman@imaps.org

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

^ Top

 

Amkor

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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