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April 10, 2013
 

Applied Materials

   IMAPS EVENTS
Button Nano Devices 2013 Program and Registration On-Line - Only 9 Tabletops Now Available (read more...)

Button CICMT 2013 Less Than 2 Weeks Away (read more...)

Button Upcoming Webinar - ADVANCED Flip Chip (new)... (read more...)

Button Abstracts Due Next Friday for New Workshop on Advanced Electronics for Mobile Energy Systems (AEMES)   (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Metro Chapter April 11 Professional Development Course & Vendor Night (read more...)

Bullet San Diego Chapter April 23 Lunch Meeting on Advanced Organic Substrates (read more...)

Bullet Rocky Mountain Chapter May 2 Technical Tour & Crawfish Boil (read more...)

Bullet New England Chapter's 40 Symposium & Expo - One Month Away! (read more...)

Bullet IMAPS France - EMPC 2013 Program Soon (read more...)


   MEMBERSHIP CORNER

Bullet Advancing Microelectronics March/April 2013 Magazine Now On-Line - Ceramic Packaging, Thick & Thin Film Materials  (read more...)

Bullet Journal of Microelectronics and Electronic Packaging 4th Quarter 2012 On-Line - Q1 Available Soon  (read more...)

MST

RGL Enterprises
F&K Delvotec
Amkor

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Nano Devices 2013 Program and Registration On-Line - Only 9 Tabletops Now Available   ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Packaging the Next Generation of Nano Devices will be held April 30-May 1, 2013, at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York. The workshop program, registration and details are on-line at www.imaps.org/nano. The early registration/exhibit deadline is April 20. Registration fees increase after this deadline.

Tuesday, April 30, 2013

CNSE Site/Lab Tours: 10:00 am– 12:00 pm
Registration: 12:00 pm – 7:00 pm
Tabletop Exhibition: 3:00 pm - 7:00 pm

Opening Remarks: 12:30 pm – 12:45 pm
Ray Fillion, General Chair

Keynote Presentation: 12:45 pm – 1:30 pm
College of Nanoscience and Engineering Overview and Derivative Center

With over $14 billion in high-tech investments, the College of Nanoscale Science and Engineering (CNSE) represents the world’s most advanced university-driven research enterprise, with over 300 corporate partners. CNSE’s Albany Nanotech Complex contains 135,000 square feet of Class 1 capable cleanrooms, including a fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line, as well as a new expansion that houses the world’s first Global 450mm Wafer Consortium (G450C).

CNSE’s Derivative Center offers a fully integrated 65nm low power CMOS with plans for 28nm LP BEOL process flows, derivative development in areas that include silicon photonics, memory, and 3D integration. These technologies are fully installed and are available for fully integrated customer prototypes.

In this talk, an overview of CNSE and these leading edge technologies will be discussed.

Dr. Douglas Coolbaugh, Derivatives and 3Di Manager
College of Nanoscale Science and Engineering at Albany-State University of New York NanoFab
Douglas Coolbaugh
received his PhD in Physical Chemistry from SUNY Binghamton, NY in 1987. Doug retired from IBM in 2010 after working 30 years in microelectronics development. Presently he is the Assistant VP of derivatives at the College of Nanoscale Science and Engineering.


SESSION I: Advanced Processing & Reliability
Chairs: Benson Chan, Endicott Interconnect; Voya Markovich
1:30 pm - 5:30 pm

Waferbumping Fluxes Enabling 2.5D and 3D Technology
Andy Mackie, Indium Corporation (Maria Durham, Indium Corporation; Laura Mauer, SSEC)

Wedge Bonding New Wire Alloys for Nano Applications
Lee Levine, Hesse Mechatronics Inc. (Joseph Bubel) 

Solder Joint Encapsulant Adhesive - POP TMV High Reliability And Low Cost Assembly Solution 
Wusheng Yin, YINCAE Advanced Materials, LLC (Mary Liu) 

Inspection and Metrology for 2.5/3D Interconnect Solution
Victor Vartanian, SEMATECH, 3D Interconnect Division

Break in Exhibit Hall:3:30 pm - 4:00 pm

Chemically Vapor Deposited Polymer Coatings for the Environmental Protection of Micro- and Nano-Electronics
Seth Johnson, GVD Corporation 

Understanding Temperature Programmable Behavior of SWCNT-Epoxy Undefill for Component Level Reworkability 
Vishwas Bedekar, University of Arkansas (Ajay Malshe, University of Arkansas; Deepnarayan Gupta, Hypres Inc)

Reliability of Lead-Free BiAgX Solder Paste for Die Attach application 
Hongwen Zhang, Indium Corporation (Runsheng Mao, Ning-Cheng Lee)

Reception in Exhibit Hall: 5:30 pm - 7:00 pm


Wednesday, May 1, 2013

Registration Open : 7:00 am - 4:00 pm
Tabletop Exhibits : 10:00 am - 3:30 pm

Opening Remarks:  8:00 am – 8:15 am
John Torok and Jing Zhang, Technical Co-Chairs

Keynote Presentation: 8:15 am – 9:00 am
Advancing Technology in Expert Integrated Systems

In the era of smart computing, big data and deep analytics place a strong demand on our IT infrastructure and are significant drivers for hardware development to meet those needs. The computing systems on which these applications can efficiently operate are integrated systems where computing, storage, networking and software components work well together. High compute density, high bandwidth and low-latency are key metrics to define the raw processing capability of these systems that provide a foundation for the targeted applications. These key metrics must be met under stringent power and cost constraints. New technology elements including nanotechnology provide many opportunities. Some examples are 3D stacked silicon and packaging provides computing density, integrating new magnetic material enables advanced voltage regulation integrated into devices, materials with advanced propagation characteristics overcome signal loss limitations, and advances in thermal interface materials allow the increased performance to be realized while the cost, power and reliability constraints are still met.

Dr. W. Dale Becker, Distinguished Engineer
IBM Corporation
Dale Becker
received the B.E.E degree from the University of Minnesota, M.S.E.E. from Syracuse University and the Ph.D. from the University of Illinois at Urbana Champaign. He is a Distinguished Engineer in IBM Systems and Technology Group and a member of the IBM Academy of Technology. He is the System Electrical Architect for the IBM POWER and System Z Enterprise Systems. His responsibilities include designing the high-speed channels to enable the computer system performance and the power distribution networks for reliable operation of the integrated circuits that make up the processor subsystem. Dr. Becker has 25 patents on electrical design of computer systems and has presented 75 papers in refereed journals and international conferences covering many aspects of electrical computer system design including power distribution analysis and design and modeling of signal and power distribution networks. He is a senior member of IEEE, a iNEMI Technical Committee member and a member of IMAPS.


SESSION II: 3D Processing
Chairs: Maria Durham, Indium Corporation; Ray Fillion, Fillion Consulting
9:00 AM – 10:30 AM

Packaging Materials for 2.5/3D Technology 
Brian Schmaltz, NamicsTechnologies, Inc. 

A Novel Underfill for 3D TSV Package
Wusheng Yin, YINCAE Advanced Materials, LLC 

Characterization of AL-X Carbon Resistors 
George Hernandez, Auburn University (Stephen Patenaude, Daniel Martinez, Maria Auad, Michael Hamilton) 

Break in Exhibit Hall:10:30 am - 11:00 am

SESSION III: 3D Interconnects
Chair: Ying Yu, IBM Corporation
11:00 am - 12:30 pm

3D Integration with High Performance Coaxial Through Silicon Via (TSV) 
Stephen Adamshick, College of Nanoscale Science and Engineering, University at Albany, SUNY (Douglas Coolbaugh, Michael Liehr)

Development of Glass and Silicon 3D-IC Interposers: A Comparison in Performance and Reliability 
Aric Shorey, Corning Incorporated 

Standard Measurement Methods for Enabling 3D Stacked Integrated Circuits
Richard Allen, SEMATECH (Victor Vartanian, Iqbal Ali, SEMATECH; David Read, NIST/SEMATECH)

Lunch in Exhibit Hall: 12:30 pm - 1:30 pm

SESSION IV: 3D Advanced Packaging & Materials
Chairs: John Torok, Jing Zhang, IBM Corporation
1:30 pm - 4:30 pm

Nano-Materials for Thermal Conductive Materials
Fred Lo, AI Technology, Inc (Kevin Chung) 

Infusion of Next Generation of Nano Devices into Military/Space Standards
Shri Agarwal, NASA Jet Propulsion Laboratory

Signal Integrity Comparison between Copper and CNT-based TSVs 
Bruce Kim, City University of New York (Sukeshwar Kannan, Anurag Gupta, Kaushal Kannan)

Break in Exhibit Hall:3:00 pm – 3:30 pm

Ink-jet Printed Cu/Ag Memristor 
Simin Zou, Auburn University (Pingye Xu, Michael Hamilton)

Organic Interposer Technology for 2.5D and 3D Packages
Tomoyuki Yamada, Kyocera America, Inc.

Closing Remarks - Ray Fillion: 4:30 pm

If you need assistance, please email Brian Schieman (bschieman@imaps.org) or call 202-548-8715.

Register on-line at www.imaps.org/nano

CICMT 2013 Less Than 2 Weeks Away    ^ Top
IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) will be held April 23-25, 2013, at the Buena Vista Palace Hotel & Spa in Orlando, Florida. The program and registration is now online - visit http://www.cicmt.org.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.
• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.


Tuesday, April 23
Registration: 7:00 am – 5:30 pm
Continental Breakfast: 7:00 am – 7:45 am

Exhibit Hours: 10:00 am – 6:00 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 7:50 am – 8:00 am
Conference Chairs

Keynote Presentation: 8:00 am – 8:40 am
Solid Oxide Fuel Cells—Applications, Commercialization and Supply Chain in 2013
Dr. Matt Seabugh, Nexceris

Keynote Presentation: 8:40 am - 9:20 am
Recent Progress in Ni-MLCC Technology
Dr. Youichi Mizuno, Taiyo Yuden

Session TA1:
Ceramic Nanomaterials and Nanostructuring
Chairs: Thomas Berfield, University of Louisville; Beth Guiton, University of Kentucky; Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)
9:20 am – 12:00 pm

Piezoelectric and Dielectric Enhancement of New Nano-structured Ceramics with Heteroepitaxial Interfaces
Satoshi Wada, University of Yamanashi (Shuto Kawashima, Ichiro Fujii, Shinichiro Ueno, Kouichi Nakashima, Eisuke Magome, Chikako Moriyoshi, Yoshihiro Kuroiwa)

Investigations of Both the Fundamental Materials Science and Functional Parameters of the Perovskite Family
Philip Ryan, Argonne National Laboratory (Jong-Woo Kim, June-Hyuk Lee, Argonne National Laboratory; Paul Thompson, Simon Brown, XMaS, ESRF; France Peter Normile, Universidad de Castilla-La Mancha; Turan Birol, Craig Fennie, Darrell Schlom, Cornell University; Anke Weidenkaff, Andrey Shkabko, University of Bern, EMPA)

Break in Exhibit Hall: 10:00 am – 10:20 am

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Complex Superstructures Resulting from Compositional Modulation and Octahedral Tilt Twinning in AA'BB'O6 Doubly Cation Ordered Perovskites
Graham King, Los Alamos National Laboratory (Susana Garcia-Martin, Esteban Urones-Garrote, Gwilherm Nenert, Patrick M. Woodward)

Room-Temperature Ceramic Nanocoating Using Nanosheet Deposition Technique
Minoru Osada, National Institute for Materials Science (Takayoshi Sasaki)

Direct Observation of the Growth and Evolution of Nanowire Heterostructures
Beth Guiton, University of Kentucky (Bethany Hudak, Yao-Jen Chang, Daniel Earle, Guohua Li)

Spontaneous Routes to Porous and Biphasic Nanostructured Materials Through Processing
Ram Seshadri, University of California, Santa Barbara

Lunch in Exhibit Hall: 12:00 pm – 1:20 pm

 

Session TP1:
Piezoelectric Materials and Devices

Chairs: Antonio Feteira, Sheffield Hallam University; Helene Debeda, Universite de Bordeaux
1:20 pm – 3:00 pm

Session TP2:
RF Packaging and Devices

Chairs: Steven Dai, Sandia National Laboratories; Jens Mueller, Ilmenau University of Technology
1:20 pm – 3:20 pm

Feasibility of Screen-Printed PZT Microceramics for Piezocomposites Applications
Helene Debeda, Universite de Bordeaux (Riadh Lakhmi, Isabelle Favre, Jonathan Argillos, Mario Maglione, Valerie Budinger, Xavier Hochart, Wilfrid Sourbe, Claude Lucat)

Two-Step Sintering and Property of (1-x)BiScO3-xPbTiO3 Piezoelectric Nanoceramics
Longtu Li, Tsinghua University

Multilayer Actuators for High Temperature Piezoelectric Applications
Ian Reaney, University of Sheffield

Bismuth-Alkali-Titanate Based Ceramics for Piezoelectric Actuator Applications
Klaus Reichmann, Christian-Doppler-Laboratory for Advanced Ferroic Oxides, Graz University of Technology (W. Krauss, D. Schuetz, M. Naderer, T. Kainz, A. Feteira, M. Deluca, P. Supancic)

Strain Measurement and Mechanical Property Evolution in Sol-Gel PZT Thin Films
Thomas Berfield, University of Louisville (Brek Meuris, Daniel Porter)

Temperature Compensated Bandpass Filters in LTCC
Steve Dai, Sandia National Laboratories (Lung-Hwa Hsieh)

Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside a LTCC Fluidic Structure
Jens Mueller, Ilmenau University of Technology

Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
John Bailey, Auburn University (Michael Glover, Emmanuel Decrossas, Kaoru Porter, Tom Cannon, Alan Mantooth, Michael Hamilton)

Transmit/Receive (T/R) Modules - Key Elements for Active Phased Array Antennas
Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN (Joerg Schroth)

Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCC
Byron Caudle, Auburn University (Michael Baginski, Michael Hamilton)

Dielectric Resonators for Enhanced Magnetic Resonance Imaging
Steven Perini, Penn State University (Matthew Pyrz, Yiqing He, Ryan Tom, Thomas Neuberger, Fang Chen, Elena Semouchkina, Michael Lanagan)

Break in Exhibit: 3:20 pm – 4:00 pm

POSTER PRESENTATIONS (in the Exhibit Hall)
4:00 pm – 5:00 pm

0.84(K0.48Na0.52)NbO3-0.16K0.56Li0.38NbO3 Lead-Free Piezoelectric Ceramic Prepared by Multilayer Ceramic Process
Zhiqiang Zhang, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Zhifu Liu, Yongxiang Li)

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

 

Reception in Exhibit Hall: 5:00 pm - 6:00 pm

 


Wednesday, April 24
Registration: 7:00 am – 6:00 pm
Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 4:00 pm
Refreshment Breaks & Lunch in Exhibit Hall

Awards: 8:00 am – 8:20 am

Keynote Presentation: 8:20 am - 9:00 am
Recent Progress in Ni-MLCC Technology
Speaker, Soshu Kirihara, Taiyo Yuden Co., Ltd.

Session WA1:
Metamaterials
Chairs: Khalid Rajab, Queen Mary University of London; Elena Semouchkina, Michigan Technological University
9:00 am – 11:40 am

Multilayered CRLH Metamaterials Using Magnetic Dipole-like Resonant Dielectric Particles and Cut-off TE Modes in Metallic Structures
Tetsuya Ueda, Kyoto Institute of Technology (Yoshiaki Sato, Yuichi Kado, Tatsuo Itoh)

Zero-Index All-Dielectric Metamaterials at Optical Frequencies
Yuanmu Yang, Vanderbilt University (Parikshit Moitra, Zachary Anderson, Jason Valentine)

Dielectric Metamaterials: Toward Low-Loss, Single Element Backward Wave Metamaterials
Paul Clem, Sandia National Laboratories (M.B. Sinclair, M.P. Rye, C.J. Jeon, E.S. Kim)

Break in Exhibit Hall: 10:00 am – 10:20 am

Realization of High-Q Fano Resonances in Ceramic Dielectric Metamaterials for Sensing, Cloaking, and Lossless Energy Transfer Applications
Elena Semouchkina, Michigan Technological University (Arash Hosseinzadeh, George Semouchkin)

Metamaterial Bandwidth Enhancement Using Active Electronics
Khalid Rajab, Queen Mary University of London (Yifeng Fan, Yang Hao)

Fabrication of Diamond Photonic Crystals with Oxide and Metallic Glasses Lattices for Terahertz Wave Control by Using Micro Pattering Stereolithography
Soshu Kirihara, Osaka University

3D-metamaterial Structures and Transmission-line Metamaterials: Microwave to Terahertz Applications
Dmitry Kholodnyak, St. Petersburg Electrotechnical University (Irina Vendik, Mikhail Odit, Dmitry Kozlov, Viacheslav Turgaliev, Irina Munina, Alexander Rusakov)

Lunch in Exhibit Hall: 11:40 am – 1:20 pm

Session WP1:
Microsystem Materials and Applications

Chairs: Paula Maria Vilarinho, University of Aveiro; Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research
1:20 pm – 3:20 pm

Session WP2:
Power/High Temperature Electronics

Chairs: Markus Eberstein, Fraunhofer IKTS; Wenli Zhang, Viginia Tech-Center for Power Electronics Systems
1:20 pm – 3:20 pm

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

LTCC-3D Flow Focusing Microfluidic Device for Nanoparticle Fabrication and Production Scale-Up
Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research (Juliana de Novais Schianti, Andre da Costa Teves, Adriano Marim de Oliveira, Natalia Neto Pereira Cerize)

Feasibility of Micro-Plasma Transistor Device in LTCC
Brooke Garner, Boise State Univeristy

Multifunctional LTCC Substrates for Thermal Actuation of Tunable Steffen Leopold, Ilmenau University of Technology (Thomas Geiling, Caroline Fliegner, Martin Hoffmann)

Fine Dust Measurement with Electrical Fields - Concept of A Hybrid Particle Detector
Thomas Geiling, Ilmenau University of Technology (Tilo Welker, Martin Hoffmann)

Electric Micro-Propulsion in Low Temperature Co-Fired Ceramics
Jesse Taff, Boise State University

Characterization of Low Temperature Sintered Ferrite Laminates for High Frequency Point-of-Load Converters
Wenli Zhang, Center for Power Electronics Systems (Mingkai Mu, Yipeng Su, Qiang Li, Fred Lee)

Thick Film Pastes for Aluminium Nitride and Silicon Nitride Ceramics
Marco Wenzel, Fraunhofer IKTS (Christel Kretzschmar, Richard Schmidt, Markus Eberstein)

Integrated Magnetic Structures for High Temperature Power Electronics
John Fraley, Arkansas Power Electronics Intl. (Brandon Passmore, Stephen Minden)

Characterization of Dense LTCC 9K7 Based Low-Impedance Via Structures up to 3GHz
Alexander Pfeiffenberger, Auburn University (Michael Hamilton, Michael Glover, Emmanuel Decrossas, Alan Mantooth, Kaoru Porter)

Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology
Dominique Ortolino, Lehrstuhl for Funktionsmaterialien, University Bayreuth (Jaroslaw Kita, Roland Wurm, Andreas Pletsch, Karin Beart, Ralf Moos)

Thick Film Pastes for Power Application
Christina Modes, Heraeus Precious Metals GmbH & Co. KG, TFD-TH (Jochen Langer, Melanie Bawohl, Jessica Reitz, Anja Eisert, Heraus Precious Metals, TFD-TH; Mark Challingsworth, Virginia Garcia, Samson Shabhazi, Heraeus Precious Metals North America Conshohocken LLC)

Break in Exhibit Hall: 3:20 pm – 4:00 pm

Session WP3:
Lab on a Chip and Biomedical Applications

Chair: Shubhra Gangopadhyay, University of Missouri-Columbia; Leszek Golonka, Wroclaw University of Technology
4:00 pm – 6:00 pm

Session WP4:
Energy/Fuel Cells/Batteries

Chair: Tim Yosenick, General Electric; Hiroya Abe, Osaka Univerisity; Matthew Seabaugh, Nexceris
4:00 pm – 5:20 pm

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

Preparation of Inorganic-Organic Hybrid Membrane for Peripheral Nerve Reconstruction
Yuki Shirosaki, Kyushu Institute of Technology

Effect of Platinum Metallization in Cofired Platinum /Alumina Microsystems for Implantable Medical Applications
Ali Karbasi, Florida Internationl University (Ali Hadjikhani, Kinzy Jones)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

An LTCC-based Microfluidic Electrochemical Biosensing System for Label-free Detection of Cortisol
Abhay Vasudev, Florida International University (Ajeet Kaushik, Shekhar Bhansali)

All-Crystal-State Lithium-Ion Batteries: Innovation Inspired by Novel Flux Coating Method
Katsuya Teshima, Shinshu University (Hajime Wagata, Shuji Oishi)

Development of Advanced Ceramic Film Capacitors for Power Electronics in Electric Drive Vehicles
U. (Balu) Balachandran, Argonne National Laboratory (M. Narayanan, S. Liu, B. Ma)

Electrostatic Dry Coating of Cathode Materials for Li Ion Battery
Hiroya Abe, Osaka University (Akira Kondo, Makio Naito, Takashi Wakimoto, Masayuki Yamaguchi, Honda Engineering Co.,Ltd.)

Routes for LTCC to Power-electronics
Franz Bechtold, VIA electronic GmbH (Mohamed Ashari)

 

Thursday, April 25
Registration: 7:00 am – 11:30 am
Continental Breakfast: 7:00 am – 8:00 am

Session THA1:
Integrated Passives and Ferrites
Chair: Robert Pullar, University of Aveiro
8:00 am – 9:20 am
Session THA2:
Direct Write/3D Printing
Chairs: Klaus Krueger, Helmut Schmidt University; Mike Newton, Newton Cyberfacturing, LLC
8:00 am – 9:40 am

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

A Study on Reliability Test of Multilayer Chip Inductors
Wen-Hsi Lee, National Cheng-Kung University (Shih-Feng Chien, C. S. Chiang, Wen-Hsi Lee, Wen-Yu Lin, Po-Chih Shen, Chin-Pei Lin)

On-chip Tunable Magnetoelectric Components
Shashank Priya, Virginia Tech

Hexagonal Ferrite Fibres
Robert Pullar, University of Aveiro

In-Situ-Blending of Inkjet-Printed Resistors
Dietrich Jeschke, University of the Federal Armed Forces (Mathias Niemann, Klaus Kruger)

Direct Printing and its Application in LTCC
Xudong Chen, nScrypt Inc (Kenneth Church)

Inkjet Printing of Piezoelectric Lead Magnesium Niobate-Lead Titanate Thick Films
Andreas Rathjen, Helmut Schmidt University / University of the Federal Armed Forces (Clemens Junker, Klaus Kruger, Helmut Schmidt University; Hana Ursic, Marija Kosec, Jozef Stefan Institute)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Aerosol Jet Printing of Two Component Thick Film Resistors on LTCC
Markus Eberstein, Fraunhofer IKTS (Kai Swiecinski, Robert Jurk, Egle Dietzen, Martin Ihle)

Break in Foyer: 9:40 am – 10:00 am

Session THA3:
Ceramic Functional Materials

Chairs: Satoshi Wada, University of Yamanishi; Minoru Osada, National Institute for Materials Science (NIMS)
10:00 am – 12:00 am

Session THA4:
Advance Packaging Technologies

Chair: Torsten Rabe, BAM, Federal Institute for Materials Research and Testing; Brian Rowden, General Electric, Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN
10:00 am – 12:00 pm

Evaluation of TFR-Characteristics in a Wide Temperature Range
Uwe Partsch, Fraunhofer IKTS (Christian Lenz, Marco Wenzel, Marco Eberstein)

Effects of Al2O3 and B2O3-SiO2 Modification on the Microstructure and Dielectric Properties of BaTiO3 Ceramics
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences

LTCC Multilayer Modules with Integrated Functional Materials
Jorg Topfer, University of Applied Sciences (T. Reimann, R. Lehnert, S. Bierlich, S. Barth, B. Capraro, H. Bartsch de Torres, J. Muller)

Structure-Property Relationships in BaTiO3-BiFeO3-BiYbO3 Ceramics
Antonio Feteira, Christian Doppler Lab in Advanced Ferroic Oxides, Sheffield Hallam University (Luke Luisman, Giorgio Schielo, Marco Deluca, Klaus Reichmann)

Modulating the Temperature Coefficient of the Permittivity by Substrate Induced Texturization in BaO-Ln2O3-TiO2 Thick Films
Ana Senos, University of Aveiro, Ciceco (L. Amaral, P.M. Vilarinho, C. Jamin, O. Guillon)

Alternative Strategies for the Preparation of Multiferroic Thin Films
Paula Maria Vilarinho, University of Aveiro

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding
Mustafa Oezkoek, Atotech Germany GmbH

Surface Characteristics of LTCC Substrates Fabricated by Pressure-Assisted Sintering
Bjoern Brandt, BAM Federal Institute for Materials Research and Testing (Torsten Rabe)

Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Michael Hambuch, University of Erlangen-Nuremberg (Andreas Roosen)

In Situ Characterization of the Sintering Behavior of LTCC Laminates with Embedded Cavities by High Temperature Laser Profilometry
Andreas Heunisch, BAM Federal Institute for Materials Research and Testing (Ulrich Marzok, Marco Munchow, Ralf Muller, Torsten Rabe)

Electroplating and Electroless Plating Process Development for DuPont GreenTape™ 9K7 LTCC
Allan Beikmohamadi, DuPont (Deepukumar Nair, Steve Stewart, Jim Parisi, Mark McCombs, Michael Smith, Ken Souders, J.C. Malerbi, K.M. Nair, Michael Farb)

Application of Cylindrical Pipe-Type LTCC Substrates as a Platform for Multi-Array Gas Sensors
Jaroslaw Kita, University of Bayreuth (Annica Brandenburg, Ralf Moos)

Closing Remarks: 12:00 pm

Register On-Line

 

Upcoming Webinar - ADVANCED Flip Chip (new)...    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on New Developments in ADVANCED FLIP CHIP Applications
Phillip Creter, Creter and Associates | May 7, and May 9, 2013 at 12:00 NOON EASTERN

Abstracts Due Next Friday for New Workshop on Advanced Electronics for Mobile Energy Systems (AEMES)    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Advanced Electronics for Mobile Energy Systems (AEMES) will be held June 6-7 at the Florida Solar Energy Center in Cocoa, Florida. Abstracts are due next Friday, April 19. Submit abstracts, register, reserve tabletops, and book hotel online at www.imaps.org/energy.

Overview: The objective of the AEMES Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of electronic packaging, power generation, harvesting and storage for mobile applications. This workshop enables discussion and presentations on the latest materials, process, design & emerging technologies of Mobile Energy Systems and applications.

Abstracts are being solicited in the following areas:

Solar • Batteries • Super Caps • TEG • Rectenna • Fuel Cells

  • Mobile Applications
  • Emerging 3D Electronic Packaging
  • Power Management
  • Thermal Management
  • Module and devices
  • Advanced materials & Processes
  • Additive/Digital Manufacturing/Printed Circuit Structures

Those wishing to present a paper at the workshop must submit a 300-500 word abstract electronically no later than March 29, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions. Full papers are not required. A post-conference CD-ROM containing the presentation material as supplied by the presenter onsite will be distributed to all attendees. Speakers are required to pay a reduced registration fee.

  Chapter Activities (events listed in chronological order)
 

TOMORROW: Metro Chapter April 11 Professional Development Course & Vendor Night    ^ Top

METRO IMAPS PRESENTS

Full Day Symposium and Vendor Night
OVER 50 TOP VENDORS AND SUPPLIERS WILL BE REPRESENTED

TOMORROW: April 11, 2013
At the Holiday Inn Ronkonkoma

Schedule:

4:00pm
Advanced High Frequency Microelectronics
by Harvey Smith(EMA)
Sandvik Osprey CE Alloys

6:00pm
DNA Marking: Implementation of a Proactive Counterfeit Risk Mitigation Solution
Janice Meraglia
Applied DNA Sciences

8:00-4:30 Professional Development
Introduction to the Basics of Conventional and Advanced Microelectronic Packaging

Course Leader: Tom Terlizzi, GM Systems, LLC.

Course Description:  The course presents design, manufacturing, materials, quality and reliability information in terms understandable to engineering and non-engineering personnel. Packaging history, characteristics and drivers will be outlined. Types of packages (IC, chip scale, MEMS, Hybrid, MCM, BGA) and substrates (Thick and thin film, co-fired ceramic, organic) and critical differences among them and their applications will be discussed. The course will look at the design selection to meet use and application environments. Step-by-step manufacturing flow for different packages and products will be presented as an example to understand the complexity of processes, materials and equipment involved in their manufacture. Advanced packaging concepts for 2.5D and 3 D will be introduced. Materials selection with respect to application environments will be discussed. Quality and reliability issues related to chip packaging and SMT and their solution will be outlined.

Who Should Attend? It will help the attendees understand the application and assembly of microelectronic package technology on the next level interconnect and the service environment that microelectronic packages must protect its components. Personnel entering the microelectronic packaging field will have a critical look at the quality, reliability and materials issues related to the development and manufacture of chip packages. Non-packaging personnel will learn the ins and outs of chip packaging. Non-technical personnel will learn the material and manufacturing intricacies of microelectronic packages and the associated buzzwords used to describe them.

Tabletop exhibits and Technical Presentations

3:00 PM-8:00PM –Some of the companies represented at this time:
Micross, Newport, Eastern States, Avid Associates, Proton Onsite, AdTech Ceramics, PEI, HMI, WJB Sales, Inc., GM Systems, Static Solutions, AI Technology LFG Micro, Epoxy Technology, Gel Pack/Quick Pak, EMA Sales & Marketing, Finetech, Henkel, Century Seals, O & S Sales, UTZ, Palomar, Interfet Corporation, Century Seals, HMI and more.....

There is no charge for the vendor night or evening technical sessions but you must register to be eligible for the door prizes

6:30 PM-8:00 PM
Cocktail Reception and Door Prize Drawing for prizes totaling over 500.00

4:00-7:00 PM
Evening Technical Sessions`

To Register:
Contact Steve Lehnert Phone (650) 644-5218
Email metroimaps@optonline.net
Make Checks Payable to: Metro Imaps
10 Northview Trail
Ridge, NY 11961

Registration and Continental Breakfast start at 7:30 AM
Location: Holiday Inn Ronkonkoma
                 3845 Veterans Highway
                 Ronkonkoma, NY 11779
                 Ph: 631-585-9500

 

Walter J. Becker
WJB Sales, Inc.
631-331-0689
631-879-8408

 

San Diego Chapter April 23 Lunch Meeting on Advanced Organic Substrates    ^ Top

Date: Tuesday, April 23 at 12:00
Location:

QUALCOMM
Sorrento Valley, San Diego
Building & Room location TBD, will confirm soon

Registration::

Space is limited to 40 registrants due to room size; please sign up quickly.

$20.00 for RSVPed IMAPS members. $25.00 for non-members. Free for students with an ID.

Registration closes Friday, April 19, at noon. To register, please contact David Virissimo of Coining Inc. at David.Virissimo@ametek.com or 619-464-5430.

Advanced Organic Substrates

Abstract:
Kyocera has developed an advanced organic substrate technology, called APX (Advanced-SLC Package X) with a composite CTE of 10ppm/C and capability to support 5um lines and spaces. APX substrates with these advanced design rules and enhanced material properties are being considered for 2.5D interposers. This presentation will discuss the key features and potential applications.

Speaker Bio:
Joe Dang is a Field Applications Engineer with Kyocera's Organic Products division. He has been working in substrate manufacturing for 15 years. His focus is on the manufacturing, reliability and design aspects of the organic buildup laminates that have been necessary to service the needs of semiconductor companies ranging from high volume MPU to small volume high-end ASIC applications.

Rocky Mountain Chapter May 2 Technical Tour & Crawfish Boil    ^ Top

Date: Thursday, May 2 | 4:00-6:00pm
Location:

Pioneer Product Development LLC
5280 Marshall St, Unit B
Arvada, CO 80002

Registration::

RSVP before April 26 at 5pm EASTERN
Registration Fees:
IMAPS members - $ 15.00. Non-members - $ 20.00

Questions or “off-line” registration, Contact Time LeClair: tleclair@yahoo.com, 858-449-2316 On-line Registration SOON

Please join us for a Facility Open House, Crawfish Boil, and Industry Networking!

Pioneer Product Development LLC, Arvada, Colorado
We are planning a crawfish boil and brief IMAPS local meeting at the facilities of Pioneer Product Development LLC. This meeting involves a open house at the facility in Arvada Colorado

IMAPS meeting 4:15 – 4:30

Crawfish, Brats and Beer & Wine 4:30 – 6:00

Event Location:
Pioneer Product Development LLC
5280 Marshall St, Unit B
Arvada, CO 80002

Directions: From I-70 and Wadsworth, go North on Wadsworth to 52nd Ave. Turn East on 52nd and go approx 1 mile to Marshall St. Turn Left (North) on Marshall St and go Half a Block to Pioneer Product Development LLC on your right. Turn into the paved driveway on the South Side of the Valve and Filter Corp sign and park in any space on your right. We are in the rear of the TAN building just to the north of where you just parked.

 

New England Chapter's 40 Symposium & Expo - One Month Away!    ^ Top

Invitation to Exhibitors!
It's Only One Month Away!!! Act Now....!!

iMAPS NEW ENGLAND

40thSymposium & Expo

"ROBOTS & ROBOTICS"

Tuesday May 7, 2013

The Largest Regional Microelectronics Symposium

8 Sessions with 46 Speakers

Special Robotics Demonstrations

by New England FIRST Student Teams

HOLIDAY INN BOXBOROUGH WOODS CONFERENCE CENTER
 
Boxborough, Massachusetts
Exhibit Booths are still available!
Click for Exhibitor Registration
Click for Sponsor Registration

Featuring

  • Expanded Technical Program: 8 Sessions with 46 Speakers & Full Poster Session
  • Robotics Demonstrations by New England FIRST Student Teams
  • Student Paper & Poster Competition with Cash Prizes
  • Microwave Packaging Technology, May 8 - 10 - TJ Green with iMAPS New England - Click Here
  • 40th Annual Symposium - "ROBOTS & ROBOTICS" Theme
  • Employment Center - Submit Opportunities to: John Blum - jbblum1@gmail.com
  • Special Symposium Hotel Rate at Holiday Inn - Click to Register On-Line  [Group Code "MAP"]
  • Loads of Fun, Games and Raffle Prizes...!!!

For Program Updates and Attendee Information:
http://www.imapsne.org/SymposiumExpo.html
For Exhibitor, Sponsor or General Information Contact:
Harvey Smith HarveyS@imapsne.org or Judi Eicher Judi@imapsne.org 
or call 508-699-4767

IMAPS France - EMPC 2013 Program Soon    ^ Top
EMPC 2013 CALL FOR PAPERS HAS CLOSED
EUROPEAN ELECTRONICS PACKAGING CONFERENCE

The Technical Program will be available soon

Questions?
Visit EMPC2013 Website www.empc2013.com

Florence VIRETON
Tél: 33 (0) 1 39 67 17 73
email:imaps.france@imapsfrance.org

  Membership Corner
 

Advancing Microelectronics March/April 2013 Magazine Now On-Line - Ceramic Packaging, Thick & Thin Film Materials    ^ Top

March/April 2013:
Volume 40, No. 2
Ceramic Packaging, Thick & Thin Film Materials

The March/April 2013 issue featured four technical articles on: Tracing the Origins of Printed Electronic Materials at DuPont - Reflections from a Recent Retiree; Engineering Solutions in Ceramic Packaging: Meeting the Demand for Performance at Cost; High Density Cofired Platinum/Alumina Microsystems for Implantable Medical Applications; and Tunable Ferroelectric Capacitors Embedded inside LTCC.

download magazine PDF (7mb)

Journal of Microelectronics and Electronic Packaging 4th Quarter 2012 On-Line - Q1 Available Soon   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 9, Number 4
Fourth Quarter 2012



Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, and Heiko Wolf, IBM Research Zurich

149

Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
Quanling Zheng, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein, University of Notre Dame

160
Millimeter-Wave Frequency Performance of Conductor-Backed Coplanar Waveguide on FR408 Packaging Material
Supreetha Aroor and Rashaunda Henderson, University of Texas
166

Design, Fabrication, and Operation of a Nitrogen Monoxide Measurement Device Based on LTCC
Thomas Geiling, Tilo Welker, and Jens Müller, Institute of Micro and Nanotechnologies Ilmenau University of Technology; Christiane Ehrling, Analytik Jena AG

171

All-Dielectric Metamaterials for New Areas of Application
Elena Semouchkina and George Semouchkin, Michigan Technological University; Elena Semouchkina, George Semouchkin, and Michael Lanagan, Pennsylvania State University

178
Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Defi nition Printed Electronic Devices
C. Dossou-Yovo, M. Mougenot, E. Beaudrouet, M. Bessaudou, N. Bernardin, F. Charifi , C. Coquet, M. Borella, and R. Noguera, CeraDrop, Ester Technopole; C. Modes, Heraeus; M. Lejeune, SPCTS; P. Laurier and D. Detemmerman, CMAC; P. Escure and H. Laville, EuroFarad; N. Delhotes and S. Verdeymes, XLIM, CNRS
187
   

LORD Corporation

EPP

Crane AE Banner

2013 Events:

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

Next Gen Nano Devices
April 30 - May 1
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

Medical & Hi-Rel Devices
May 13-14
*Exhibitors contact bschieman@imaps.org

Mobile Energy Systems
June 6-7
*Exhibitors contact bschieman@imaps.org

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

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