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April 30, 2013
 

Applied Materials

   IMAPS EVENTS
Button Registration Deadline Extended For Microelectronic Packaging for Medical and Hi-Rel Devices - Exhibits SOLD OUT (read more...)

Button Last Chance to Register For Short Course on Hermetic Seal and Testing of Class III Medical Implants (read more...)

Button ADVANCED Flip Chip (new) Webinar Next Week... (read more...)

Button Abstracts Still Being Accepted for New Workshop on Advanced Electronics for Mobile Energy Systems (AEMES)   (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet THIS THURSDAY: Rocky Mountain Chapter May 2 Technical Tour & Crawfish Boil (read more...)

Bullet NEXT TUESDAY: New England Chapter's 40 Symposium & Expo (read more...)

Bullet IMAPS France - EMPC 2013 Program Soon (read more...)

Bullet IMPACT-IAAC 2013 Call for Papers Now is Open (read more...)

MST

RGL Enterprises
F&K Delvotec
Amkor

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Registration Deadline Extended For Microelectronic Packaging for Medical and Hi-Rel Devices - Exhibits SOLD OUT   ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Microelectronic Packaging for Medical and Hi-Rel Devices will be held May 13-14, 2013, at the Crowne Plaza Northstar in Minneapolis, Minnesota. The workshop program, registration and details are on-line at www.imaps.org/medical. The early registration deadline is now May 3. Registration fees increase after this deadline.

Premier Sponsor:
Corporate Sponsor - Micro Systems Technologies (MST)

The International Microelectronics and Packaging Society (IMAPS) will hold an Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Rel Devices. The workshop will be held in Minneapolis, Minnesota at the Crowne Plaza Minneapolis Northstar Downtown.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Monday, May 13, 2013

Registration: 12:00 pm – 5:00 pm

The following short-course precedes the Workshop on Monday afternoon
and will be offered at an additional registration fee...

Professional Development Course (PDC):
Hermetic Seal and Testing of Class III Medical Implants

1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates

This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA tests results.

Class III medical implants such as the new retinal implants, heart pacers, deliberators, cochlear implants and a entire new generation of bio MEMS and micro fluidic devices all have one thing in common…HERMETICITY. The need to keep body fluids and moisture from entering into the package cavity and degrading the sensitive microelectronics contained inside is paramount for reliable, safe, long term operation in the human body. Conversely, a properly made hermetic seal will also keep toxins contained within the device from leaching back out into the blood stream. In recent years there have been a number of FDA warning letters issued to major corporations regarding problems related to hermeticity. This PDC will impress upon the student the critical importance of hermeticity in Class III medical products.

Historically, hermeticity requirements for Class III implants have mirrored that for military and aerospace applications. This course will review the hermetic seal process and related hermeticity test methods (helium fine leak and bubble method) and some of the pitfalls and lessons learned over the years. Proposed changes to the hermeticity spec, TM 1014 (Seal), will be discussed along with the latest techniques available to measure tighter leak rates such as, Optical Leak Test (OLT) and Cumulative Helium Leak Detection (CHLD).

Packages made from polymeric materials (e.g. LCP and others) as opposed to traditional hermetic seals (i.e. metals, glasses, ceramic etc) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass to metal seal. Included is a brief review of the techniques and methods needed to evaluate a "near-hermetic" package.

Biography:
Mr. Thomas Green is an independent consultant and respected teacher. He is a hermeticity expert and has consulted for a variety medical companies and serves as an expert witness in legal cases related to failures of Class III medical implants He has over thirty years of experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques including, CHLD (cumulative helium leak detection) and OLT (optical leak test). At USAF Rome Labs he worked as a senior reliability engineer and analyzed hermeticity component failures from AF avionic equipment along with providing technical support for a variety of Mil specs including MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com)

This PDC is a separate registration fee from the workshop registration. You can register for this PDC “session” on-line at www.imaps.org/medical and follow the register on-line link. You will first select your workshop registration and on page 2 SESSIONS, you can select the DPC fee.

 

Tuesday, May 14, 2013

Registration: 7:00 am – 4:45 pm
Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 8:00 am – 5:30 pm (Setup Must Be Complete by 7:45am)
Sessions, Tabletop Exhibits and Breaks all in the same room

Opening Remarks: 8:00 am – 8:15 am
General Chair: Sean Ferrian, Ferrian Sales & Associates

Session I: 3D Packaging and Technologies
8:15 am - 11:30 am

Soldering Technologies Enabling Medical Device Packaging in the 3D Era 
Carol Gowans, Indium Corporation (Andy Mackie, Ron Laskey)  

A Study On Nonhermetic Micropackage For Implantable MEMS Systems
W.H.Ko, Case Western Reserve University

Amazing and Robust Silicon Capacitor Technology for Miniaturization
Catherine Bunel, IPDIA (Franck Murray)

Break: 9:45 am – 10:30 am

Biocompatible Solid State Batteries for Medical Devices
Jeff Sather, Cymbet Corporation 

Passive RFID and Packaging Technology for Wireless Sensor Applications
Aaron Reinholz, North Dakota State University (Nathan Schneck)

Lunch Break: 11:30 pm - 1:00 pm

Session II: Microelectronics and Applications
1:00 pm – 4:00 pm

Custom Integrated Circuit Design Enables Miniature Implantable Medical Devices
Andrew Kelly, Cactus Semiconductor, Inc.

A Low-Silver SAC Solder Alloy for High Reliability Applications
Brook Sandy-Smith, Indium Corporation 

Break: 2:00 pm - 2:30 pm

Advanced Organic Substrate Technologies for HiRel and Medical Applications  
Susan Bagen, Endicott Interconnect Technologies, Inc. (Frank Egitto, Rabindra Das, Dave Alcoe, Kim Blackwell, Steve Rosser, Glen Thomas)

Multilayer and Injection Molded Ceramics for High Reliability Microelectronic Packaging 
Bill Minehan, AdTech Ceramics

Workshop Reception: 3:30 pm – 5:00 pm
Sponsored by:

Reception Sponsor - Benchmark Electronics

Register On-line

Last Chance to Register For Short Course on Hermetic Seal and Testing of Class III Medical Implants    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Microelectronic Packaging for Medical and Hi-Rel Devices will be held May 13-14, 2013, at the Crowne Plaza Northstar in Minneapolis, Minnesota. The following short-course precedes the Workshop on Monday afternoon and will be offered at an additional registration fee. The workshop program, registration and details are on-line at www.imaps.org/medical.

This PDC is a separate registration fee from the workshop registration. You can register for this PDC “session” on-line at www.imaps.org/medical and follow the register on-line link. You will first select your workshop registration and on page 2 SESSIONS, you can select the PDC fee.

The following short-course precedes the Workshop on Monday afternoon, May 13 (1-5pm)
and will be offered at an additional registration fee...

Professional Development Course (PDC):
Hermetic Seal and Testing of Class III Medical Implants

1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates

This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA tests results.

Class III medical implants such as the new retinal implants, heart pacers, deliberators, cochlear implants and a entire new generation of bio MEMS and micro fluidic devices all have one thing in common…HERMETICITY. The need to keep body fluids and moisture from entering into the package cavity and degrading the sensitive microelectronics contained inside is paramount for reliable, safe, long term operation in the human body. Conversely, a properly made hermetic seal will also keep toxins contained within the device from leaching back out into the blood stream. In recent years there have been a number of FDA warning letters issued to major corporations regarding problems related to hermeticity. This PDC will impress upon the student the critical importance of hermeticity in Class III medical products.

Historically, hermeticity requirements for Class III implants have mirrored that for military and aerospace applications. This course will review the hermetic seal process and related hermeticity test methods (helium fine leak and bubble method) and some of the pitfalls and lessons learned over the years. Proposed changes to the hermeticity spec, TM 1014 (Seal), will be discussed along with the latest techniques available to measure tighter leak rates such as, Optical Leak Test (OLT) and Cumulative Helium Leak Detection (CHLD).

Packages made from polymeric materials (e.g. LCP and others) as opposed to traditional hermetic seals (i.e. metals, glasses, ceramic etc) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass to metal seal. Included is a brief review of the techniques and methods needed to evaluate a "near-hermetic" package.

Biography:
Mr. Thomas Green is an independent consultant and respected teacher. He is a hermeticity expert and has consulted for a variety medical companies and serves as an expert witness in legal cases related to failures of Class III medical implants He has over thirty years of experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques including, CHLD (cumulative helium leak detection) and OLT (optical leak test). At USAF Rome Labs he worked as a senior reliability engineer and analyzed hermeticity component failures from AF avionic equipment along with providing technical support for a variety of Mil specs including MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com)

This PDC is a separate registration fee from the workshop registration. You can register for this PDC “session” on-line at www.imaps.org/medical and follow the register on-line link. You will first select your workshop registration and on page 2 SESSIONS, you can select the PDC fee.

ADVANCED Flip Chip (new) Webinar Next Week...    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on New Developments in ADVANCED FLIP CHIP Applications
Phillip Creter, Creter and Associates | May 7, and May 9, 2013 at 12:00 NOON EASTERN

Abstracts Still Being Accepted for New Workshop on Advanced Electronics for Mobile Energy Systems (AEMES)    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Advanced Electronics for Mobile Energy Systems (AEMES) will be held June 6-7 at the Florida Solar Energy Center in Cocoa, Florida. Abstracts are due IMMEDIATELY. Submit abstracts, register, reserve tabletops, and book hotel online at www.imaps.org/energy.

Overview: The objective of the AEMES Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of electronic packaging, power generation, harvesting and storage for mobile applications. This workshop enables discussion and presentations on the latest materials, process, design & emerging technologies of Mobile Energy Systems and applications.

Abstracts are being solicited in the following areas:

Solar • Batteries • Super Caps • TEG • Rectenna • Fuel Cells

  • Mobile Applications
  • Emerging 3D Electronic Packaging
  • Power Management
  • Thermal Management
  • Module and devices
  • Advanced materials & Processes
  • Additive/Digital Manufacturing/Printed Circuit Structures

Those wishing to present a paper at the workshop must submit a 300-500 word abstract electronically ASAP, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions. Full papers are not required. A post-conference CD-ROM containing the presentation material as supplied by the presenter onsite will be distributed to all attendees. Speakers are required to pay a reduced registration fee.

  Chapter Activities (events listed in chronological order)
 

THIS THURSDAY: Rocky Mountain Chapter May 2 Technical Tour & Crawfish Boil    ^ Top

Date: Thursday, May 2 | 4:00-6:00pm
Location:

Pioneer Product Development LLC
5280 Marshall St, Unit B
Arvada, CO 80002

Registration::

RSVP TODAY...
Registration Fees:
IMAPS members - $ 15.00. Non-members - $ 20.00

On-Line Registration
Questions or “off-line” registration, Contact Time LeClair: tleclair@yahoo.com, 858-449-2316

Please join us for a Facility Open House, Crawfish Boil, and Industry Networking!

Pioneer Product Development LLC, Arvada, Colorado
We are planning a crawfish boil and brief IMAPS local meeting at the facilities of Pioneer Product Development LLC. This meeting involves a open house at the facility in Arvada Colorado

IMAPS meeting 4:15 – 4:30

Crawfish, Brats and Beer & Wine 4:30 – 6:00

Event Location:
Pioneer Product Development LLC
5280 Marshall St, Unit B
Arvada, CO 80002

Directions: From I-70 and Wadsworth, go North on Wadsworth to 52nd Ave. Turn East on 52nd and go approx 1 mile to Marshall St. Turn Left (North) on Marshall St and go Half a Block to Pioneer Product Development LLC on your right. Turn into the paved driveway on the South Side of the Valve and Filter Corp sign and park in any space on your right. We are in the rear of the TAN building just to the north of where you just parked.

 

NEXT TUESDAY: New England Chapter's 40 Symposium & Expo    ^ Top

LAST CHANCE TO PRE-REGISTER...

iMAPS NEW ENGLAND

40thSymposium & Expo

"ROBOTS & ROBOTICS"

Tuesday May 7, 2013

The Largest Regional Microelectronics Symposium

8 Sessions with 46 Speakers

Special Robotics Demonstrations

by New England FIRST Student Teams

HOLIDAY INN BOXBOROUGH WOODS CONFERENCE CENTER
 
Boxborough, Massachusetts
Exhibit Booths are still available!
Click for Exhibitor Registration
Click for Sponsor Registration

Featuring

  • Expanded Technical Program: 8 Sessions with 46 Speakers & Full Poster Session
  • Robotics Demonstrations by New England FIRST Student Teams
  • Student Paper & Poster Competition with Cash Prizes
  • Microwave Packaging Technology, May 8 - 10 - TJ Green with iMAPS New England - Click Here
  • 40th Annual Symposium - "ROBOTS & ROBOTICS" Theme
  • Employment Center - Submit Opportunities to: John Blum - jbblum1@gmail.com
  • Special Symposium Hotel Rate at Holiday Inn - Click to Register On-Line  [Group Code "MAP"]
  • Loads of Fun, Games and Raffle Prizes...!!!

For Program Updates and Attendee Information:
http://www.imapsne.org/SymposiumExpo.html
For Exhibitor, Sponsor or General Information Contact:
Harvey Smith HarveyS@imapsne.org or Judi Eicher Judi@imapsne.org 
or call 508-699-4767

IMAPS France - EMPC 2013 Program Soon    ^ Top
EMPC 2013 CALL FOR PAPERS HAS CLOSED
EUROPEAN ELECTRONICS PACKAGING CONFERENCE

The Technical Program will be available soon

Questions?
Visit EMPC2013 Website www.empc2013.com

Florence VIRETON
Tél: 33 (0) 1 39 67 17 73
email:imaps.france@imapsfrance.org

IMPACT-IAAC 2013 Call for Papers Now is Open    ^ Top
Submit Your Abstract Before June 15!

International Microsystems, Packaging, Assembly and Circuits Technology Conference—IMPACT 2013 call for paper is open now! This year, the 2nd IAAC (IMAPS All Asia Conference) is rotated in Taiwan and joined with IMPACT 2013. To cater for the technology trends, the theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-life”. In addition, the IMPACT Best Student Paper Award winner will be invited to join ECWC 13 in Nürnberg, Germany next year. Do you have any new discovery or stunning research? Summit your paper to IMPACT-IAAC 2013 conference before June 15th immediately. It is truly your best access and practice to this new paradigm shift.

IMPACT-IAAC 2013 which is jointly organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA, and co-organized by ISU, NTU, SMTA and TTMA , and keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A.. As usual, IMPACT-IAAC 2013 will be held in conjunction with TPCA Show on Oct. 22-25, 2013, at Taipei Nangang Exhibition Hall. To construct a complete spectrum of technology trends, the theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-life”. Over the past years, IMPACT conference continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications. In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact.

IMPACT-IAAC 2013 will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations. The series of IMPACT conferences has been acknowledged as successful annual gathering to share high quality papers and facilitate international participation. Furthermore, this year, TPCA offers the IMPACT Best Student Paper Award winner traveling to Germany to join ECWC 13 conference in 2014. Want to win the ticket to Nürnberg? Researchers in academia, industries and research institutes, submit your paper before June 15. Your participation is a key to cross-domain communication and inter-field innovation, and this Conference is believed to become an important and valuable resource under your contribution and participation.

Conference: IMPACT-IAAC 2013
Exhibition: TPCA Show 2013
Theme: Green & Cloud: Creating Value and Toward Eco-life
Date: Oct 22 (Tue.)-25(Fri.), 2013
Venue: Taipei Nangang Exhibition Hall
On-line Submission:http://www.impact.org.tw

PAPER AWARD
Best Student Paper Award and Outstanding Paper Award will be elected by IMPACT Technical Program Committee from student and industrial papers respectively. The paper awardees will be announced and honored at the conference.
SPONSOR
IMPACT 2013 sponsors can improve the corporate image, enhance professional development, create networking opportunities and enjoy exclusive benefits. There are multiple sponsorship packages for you to choose!
ORGANIZER
IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)
INTERNATIONAL MICROELECTRONICS AND PACKAING SOCIETY -TAIWAN (IMAPS-Taiwan)
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN (ITRI)
TAIWAN PRINTED CIRCUIT ASSOCIATION (TPCA)

CO- ORGANIZER 
Communication Research Center, NTU  
International Conference on Electronics Packaging (ICEP) The International Electronics Manufacturing Initiative (iNEMI)
I-SHOU UNIVERSITY (ISU)
SURFACE MOUNT TECHNOLOGY ASSOCIATION (SMTA)
TAIWAN THERMAL MANAGEMENT ASSOCIATION (TTMA)

Contact Window
Taiwan Printed Circuit Association (TPCA)
Tel: +886-3-3815659 #404 (Sophia Huang)
Fax: +886-3-3815150
Email: service@impact.org.tw

http://www.impact.org.tw

 

 

   
   
   

LORD Corporation

EPP

Crane AE Banner

2013 Events:

New England Chapter 40th Symposium & Expo
May 7

Medical & Hi-Rel Devices
May 13-14
*Exhibitors contact bschieman@imaps.org

Mobile Energy Systems
June 6-7
*Exhibitors contact bschieman@imaps.org

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

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