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February 26, 2013
 

DPC Sponsor: SANTIER

   IMAPS EVENTS
Button Last Chance for In-Person Industry Training on 3D, Interposers, Flip Chip, MEMS, Polymers, Glass Technology, Advanced Packaging and more... (read more...)

Button 9th Annual Global Business Council Spring Conference Featuring Presentations from Medtronic, Starkey, Yole, TechSearch, IBM, and Many Others! (read more...)

Button Golf For A Good Cause! (read more...)

Button CICMT 2013 - Program Now Available; Register & Reserve Tabletops On-Line (read more...)

Button Nano Devices 2013 - Abstracts Due March 8 (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet THIS THURSDAY: 2nd Southeastern Microelectronics Packaging Conference (read more...)

Bullet Metro Chapter Dinner Meeting NEXT TUESDAY (read more...)

Bullet Viking Chapter March 21 Social Event at St. Paul Curling Club (read more...)

Bullet New England Chapter's 40 Symposium & Expo - Program "Sampler" (read more...)

Bullet IMAPS France - EMPC 2013 Program Soon (read more...)

 

DPC Sponsor: Applied Materials

MST

RGL Enterprises
F&K Delvotec
QSIC

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Last Chance for In-Person Industry Training on 3D, Interposers, Flip Chip, MEMS, Polymers, Glass Technology, Advanced Packaging and more...    ^ Top
IMAPS 9th International Conference and Exhibition on Device Packaging will be held at the Radisson Fort McDowell Resort in Fountain Hills, Arizona from March 11-14, 2013. Visit www.imaps.org/devicepackaging this week to register, view the program and more.

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 11th, preceding the technical conference (and for an additional registration fee). Morning PDCs will run from 8:00am until 12:00 noon. Afternoon PDCs will be held from 1:00pm until 5:00pm. The Welcome Reception will immediately follow the PDCs from 5:00pm until 6:30pm in the foyer. A Microelectronics Foundation Texas Hold-em Tournament will be held this year from 7:00pm until 10:00pm (TBD).

When you register on-line for these courses, you should first select your Device Packaging Conference registration category on page 1, and then under SESSIONS (page 2 of registration) you will select your PDCs. If you DO NOT plan on attending the conference (Tuesday-Thursday), then simply select EXHIBITS ONLY on page 1 ($0 charge) and then select your PDCs on page 2. Contact bschieman@imaps.org with questions..

Morning Professional Development Courses
8:00 am - Noon
Monday, March 11

PDC1: 2.5D/3D, Flip Chip WLP, MEMS & LED Packaging Trends, Updates & Advances
Course Leader: Phillip G. Creter, Creter & Associates

Course Description:
This NEW overview focuses on the four technical topics of this 2013 Device Packaging Conference, independently reviewing leading edge technical developments featuring the latest in microelectronics updates/trends.

Specific topics from 2012-1Q2013 conferences, technical papers, news reports:

- 2.5D/3D (Status/market, wide I/O memory stacking, polymer isolated TSVs, silicon bridge TSVs, fusion glass substrates, wafer adhesives, thin stacking, test vehicle demos, self-assembly).
- Flip Chip Wafer Level Packaging (Status/market, fine pitch copper pillars, electromigration, intermetallic compound studies, non-conductive film used in wafer level underfill, low cost FC-PoP, electromigration of lead free solder bumps).
- MEMS (Status/market, challenges, novel approaches, hermetic wafer level packaging, drop reliability, flex adhesive).
- LED Packaging (Status/market, high power heat sinks/die attach material, novel encapsulants, silicon/glass/GaN substrates).

Technical innovations related to the above topics presented with input from leading industrial/academic institutions: Advanced Semiconductor Engineering/ASE, Altera, Amkor, CEA-Leti, Corning, DELO, Georgia Institute of Technology, Global Foundries, Hitachi, Hong Kong University, IBM, IFTLE, Intel, ITRS, Karlsruhe Institute, Microsystems, NAMICS, National Tsing Hua University, Oracle, Philips Lumileds, Qualcomm, Samsung, Sandia National Labs, Sematech, Solid State Technology, Siliconware Precision Industries/SPIL, TechSearch, Tohoku University, Toray, Toshiba, University of California, Wuhan National Laboratory for Optoelectronics, Xilinx, Yole and others.

Emphasis on visual aids (photos, figures, videos) with pass-around microcircuit samples. An invaluable handout includes over 100 references.

Who Should Attend?
Designed primarily for all engineers, scientists and others interested in an up-to-date overview of new developments in 3D, Flip Chip, MEMS and LED. The course uses simple terms and many graphics and figures to describe these elements of advanced packaging for those who are new to the field and needing a running start in these four focused areas of packaging technology. Ideal for entry-level technicians and engineers but also for people in quality assurance, sales, marketing, purchasing, safety, administration and program management since it also includes a short review of current single chip and advanced wafer levels of 3D packaging.

Phillip Creter is a consultant (Creter & Associates) with 30 years of microelectronics experience at Polymer Flip Chip, Mini-Systems, GTE, Itek Corporation. Past positions at GTE included Microelectronics Center Manager (received GTE Corporate Lesley Warner Technical Achievement Award), and Principal Investigator of GTE IR&D Projects. Other positions elsewhere included management in Projects/Process Engineering, Process Development, Materials Engineering/Manufacturing Engineer, receiving many awards of distinction. Creter has been teaching college-level microelectronics courses since 1997. He has continuously taught PDCs since 2004 for online webinars and national microelectronics symposia/workshops. He is a well-known presenter having published technical papers in IEEE Transactions, Solid State Technology, High Density Interconnect, Circuits Manufacturing, Insulation Circuits, others. He has chaired many technical symposia sessions, given numerous technical presentations, is a US patent-holder. He is an active certified Department of Homeland Security instructor, a Life member of IMAPS, elected Fellow of the Society, and has held several executive committee offices both locally/nationally.

PDC2: Recent Advances in Glass and Silicon Interposers for 2.5D and 3D Integration
Course Leader: Venky Sundaram, Georgia Institute of Technology (PRC)

Course Description:
This course will present a comprehensive review of the latest 2.5D and 3D interposer approaches being developed worldwide. High density interposers are emerging as a mainstream technology for packaging of heterogeneous ICs and 3D ICs, but also as a simpler and better alternative to 3D ICs with TSV, eventually providing a path for integration of sub-systems or entire systems. Silicon and glass interposers are emerging as the front-runners to address the I/O, CTE, warpage and thermal limitations of current organic packages. The topics covered include Electrical & Mechanical Design, Silicon Interposers, Glass Interposers, Chip Level & Board Level Interconnections, Applications and Markets, and Manufacturing Infrastructure for interposers. Wafer based BEOL Si interposers as well as emerging panel based glass and other interposer technologies will be described in detail. A variety of materials and process options for interposer fabrication will be presented. The technical and business challenges that must be addressed for successful implementation of interposers in 3D packages will be discussed. Specific examples of key interposer developments such as Xilinx stacked silicon interconnect, MEMS packaging using glass interposers, silicon interposer for high performance CPU packaging, and logic-memory high bandwidth 3D integration will be highlighted. For 2013, the course materials will be updated to include technology highlights in the past twelve months.

Who Should Attend?
This popular course is a must-attend event for those highly interested in interposer technology advances for the future. The course is intended for a broad audience including semiconductor and packaging managers, technologists, engineers, industry and academic researchers, and students.

Dr. Venky Sundaram is the Director of Research at the 3D Systems Packaging Research Center (PRC), Georgia Tech. He is the Program Manager for the Silicon and Glass Interposer (SiGI) industry consortium with more than 25 active global industry members. His research expertise is in the areas of System on a Package (SOP) technology, 3D packaging and integration, ultra-high density interposers, embedded components and systems integration. He is a globally recognized expert in packaging technology and a co-founder of Jacket Micro Devices, an RF/wireless start-up acquired by AVX. Dr. Sundaram is the co-chairman of the IEEE CPMT Technical Committee on Interconnections and Substrates and is on the Executive Council of IMAPS as Director of Education Programs. Dr. Sundaram has won several best paper awards and has 15+ patents and 100+ publications. He received his BS from IIT Mumbai, and MS and PhD in Materials Science and Engineering from Georgia Tech.

PDC3: High-Temperature Electronics - with an Emphasis on Assembly & Packaging
Course Leader: Randall Kirschman, Consultant

Course Cancelled

PDC4: Hermetic Sealing and Testing of Small Volume MEMS Packages
Course Leader: Thomas J. Green, TJ Green Associates LLC

Course Description:
Reliable packaging of MEMS requires the ability to create and maintain a suitable inert atmosphere or vacuum inside the package cavity for the expected lifetime of the device. Traditional hermetic ceramic/metal packages are being replaced by wafer level packaging techniques, which present unique challenges from a hermeticity testing perspective. This course begins with an overview of traditional hermetic sealing processes along with wafer level MEMS packaging processes and methods. In some cases near-hermetic packages, such as LCP are suitable for some applications. Testing of small cavity MEMS packages according to the traditional Mil Spec TM 1014 requirements may not be sufficient to guarantee reliable operation. Difficulties and limitations in fine leak testing of small volume packages will be addressed. Recent advances in Optical Leak Testing (OLT), Cumulative Helium Leak Detection (CHLD) along with other hermeticity techniques, such as pirani vacuum sensors, are reviewed in light of the new tighter hermeticity specifications. Gaseous ingress is of primary concern for a small volume MEMS cavity packages. Moisture level vs. surface area to volume ratio is an important concept, along with material outgassing and the potential to mitigate these problems with getters. These along with other critical MEMS packaging issues are addressed.

Who Should Attend?
This PDC is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for packaging and hermetic testing of small volume cavity style packages.

Thomas J. Green is the principal at TJ Green Associates LLC (www.tjgreenllc.com), a veteran owned small business specializing in teaching and consulting for the microelectronics industry. Tom has demonstrated expertise in sealing and hermeticity testing of products intended for high rel military and medical applications. He is currently on the JEDEC committee helping to revise TM 1014 and has served as an expert witness in medical cases related to hermeticity failures. Tom is an active member of IMAPS and a Fellow of the Society. He has a B.S. in Materials Engineering from Lehigh University and a Masters in Engineering.

PDC5: Failure Mode Analysis of Flip Chip and Advanced Package and Board Assemblies
Course Leader: Daniel Baldwin, Engent, Inc.

Course Description:
Over the past few years, numerous advanced packaging and process technologies have emerged such as flip chip in package, PoP, SiP, WLCSP, 3D-WLCSP, QFN, etc.. While a large number of technical publications are available to help with process requirements, understanding failure modes and reliability standards is essential for these technologies to be successfully sustained in production. This course will present reliability test procedures, assembly process defects, and common failure modes that occur in advanced package and board level assemblies. It will focus on process defect identification and resolution, failure mechanisms and the associated analysis tools needed to identify them such as FTIR, XRF, transmission X-ray analysis, acoustic microscopy and scanning electron microscopy. Numerous process defects and failure modes will be presented along with extensive visual aids to provide a more intuitive understanding of the defects and failure modes associated with these advanced assemblies. It will also discuss artifacts leading to process defects and how they can contribute to premature failure.

Who Should Attend?
Individuals associated with electronics packaging, package reliability, package failure analysis, and assembly process control/defects are encouraged to attend. The following are encouraged to attend. Managers. Knowledge gained through this course will allow managers to make informed decisions about the technical feasibility, implementation factors, performance benefits, reliability, and risks of implementing flip chip technology. Engineers. Manufacturing, quality, design, and packaging engineers in integrated circuit, equipment, materials, and system design who are challenged to solve process defects and packaging problems. Knowledge gained through this course will allow engineers and technologists to make informed decisions about the technical feasibility, implementation factors, performance benefits, reliability, and risks of implementing flip chip technology.

Dr. Daniel F. Baldwin is the President and CEO of Engent, Inc.-Enabling Next Generation Technologies providing enabling manufacturing services and process technologies in the areas of microelectronics, flip chip, optoelectronics, and MEMS. He is one of the 2003 founding partners of Engent. He recently completed an Adjunct Associate Professor of Mechanical Engineering position at the Georgia Institute of Technology. He was a tenured Associate and Assistant Professor of Mechanical Engineering at Georgia Tech from 1995 through 2005. At Georgia Tech, he headed the Low Cost Flip Chip Processing program for the Packaging Research Center, the Advanced Interconnect Technologies research program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR. Prior to joining the faculty, he was a Member of the Technical Staff at Bell Laboratories, Princeton NJ working on electronic product miniaturization. He was formerly the Vice President of Siemens' Advanced Assembly Technology Division. He also served as a research manager and research assistant at MIT's Laboratory for Manufacturing and Productivity from 1990 to 1994, a Draper Fellow at the Charles Stark Draper Laboratory in Cambridge MA from 1988 to 1990, and an Engineering Intern for Mitsubishi Electric, Kamakura, Japan in 1987. Dr. Baldwin received his S.M. and Ph.D. degrees in Mechanical Engineering from MIT in 1990 and 1994, respectively. Dr. Baldwin served as the Technical Program Chair of the IMAPS 2nd International Advanced Technology Workshop on Flip Chip Technology and the General Chair of the IMAPS 3rd International Advanced Technology Workshop on Flip Chip Technology. Dr. Baldwin was the recipient of the ASME Electrical and Electronics Packaging Division's Outstanding Young Engineer Award, 1998 and the Milton C. Shaw Outstanding Young Manufacturing Engineer Award, Society of Manufacturing Engineers, 1999. He has sixteen years of experience in the electronics manufacturing and packaging industries, eight U.S. Patents, over 230 scholarly publications, and expertise in electronics packaging, MEMS packaging, advanced materials processing and manufacturing systems design. Dr. Baldwin is a past President of the Surface Mount Technology Association (SMTA), and formerly on the Board of Advisors for the Society of Manufacturing Engineers/Electronics Manufacturing Division (SME/EM). He was on the editorial advisor board of Advanced Packaging magazine and HDI magazine. He is on the Board of Directors of Engent, Inc. and Akrometrix, LLC, and the Board of Advisors for IC Interconnect. Dr. Baldwin was also on the technical Board of Advisors of RFIDentics Corp. which was acquired by Avery Dennison Corp.

Break: 10:00 am - 10:20 am


Afternoon Professional Development Courses
1:00 pm - 5:00 pm

PDC6: Fundamentals of Glass Technology and Applications for Advanced Semiconductor Packaging
Course Leader: TJ Kiczenski, Corning, Inc.

Course Description:
The objective of this course is to build a foundation of understanding of engineered glass as a material that technologists can leverage in the development of advanced IC packaging applications. Starting from the fundamental principles of glass structure, composition and properties we will provide a broad overview of glass with a focus on unique attributes that make glass as an enabling material. Subjects to be covered will include strength and reliability, chemical durability, thermal behavior, associated thermal relaxation behavior, and electrical properties. Additionally we will review the platform alternatives as part of the "glass toolkit" available to semiconductor packaging development including various manufacturing (melt & form) approaches, the diversity of compositional options and a survey of glass processing options that can be adapted from adjacent glass technology space to advanced semiconductor packaging. Finally the course will illustrate with case studies how glass is contributing to emerging 3D-IC technologies and explore current and potential applications in advanced semiconductor packaging. We will focus on its role as a carrier for temporary bonding, integrated wafer for CMOS Image Sensor, and 2.5D and 3D glass interposers. Relative costs of glass will be discussed as an alternative to other materials for carriers and interposers.

Who Should Attend?
The target audiences include individuals or companies with little or no experience in using glass. Engineers, technical managers, scientists, buyers, and managers involved in materials, research and development, and 3D IC packaging.

Dr. TJ Kiczenski is a Research Associate with Corning Incorporated. His work includes investigations of the physics of glass relaxation, liquidus relationships in multicomponent glass forming systems, metallic glasses, and glass/glass and glass/ceramic composite materials. He is credited as the inventor or co-inventor of several Corning Display Technology products manufactured by the proprietary fusion process, including Corning Lotus Glass for low-temperature polysilicon display applications. He received his PhD in Geology and M.S. in Materials Science from Stanford University where he investigated the structure of fluorine in silicate and aluminosilicate glasses and his B.A. degree in Physics from Coe College where he studied alkali-germanate glasses. Aric Shorey, PhD, is a Sr. Technical Manager at Corning Incorporated working on the Semiconductor Glass Wafer program. He has BS/MS in Mechanical Engineering and a PhD in Materials Science - all from the University of Rochester. He has spent the majority of his career in material's finishing and characterization for the telecommunications, precision optics and semiconductor industries.

PDC7: Polymers for Electronic Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC

Course Description:
This course will provide a broad overview of polymers and the important structure-property-process-performance relationships for electronic packaging. Topics to be covered are thermosetting polymers versus thermoplastics, thermosetting polymer curing, curing mechanisms (heat and light cured), network formation, and an overview of key chemistries used (epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts). The course will provide a more in-depth discussion of the chemistries, material properties, and process considerations for adhesives (both paste and film), capillary underfills, packaging substrate materials, encapsulants (mold compounds), and coatings. In most cases, adhesives, underfills, mold compounds and coatings are applied as a viscous liquid and then cured. The flow properties are critical to performance in high volume manufacturing. The final portion of the PDC will provide an introduction to rheological characterization methods (various types of rheometers and viscometers) and the properties of adhesives (shear thinning, viscosity, time dependence, rheology changes during curing), underfills, and mold compounds.

Who Should Attend?
Packaging engineers and R&D professionals involved in the development, production, and reliability testing of semiconductor packages would benefit from the course.

Dr. Jeffrey Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success solving complex polymer problems, directing new product development, and enabling clients to improve the financial impact of their polymer technologies. Jeff has consulting experience with companies ranging from early-stage start-ups to Fortune 50 companies. Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to present lectures and short courses at national technical conferences. He has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds 13 issued US patents, and has 8 patents pending. Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in Mechanical Engineering/Materials Science from Marquette University.

PDC8: Thermal and Mechanical Simulation Techniques - An Introductory Course for 3D Enablement Professionals
Course Leader: Kamal Karimanal, Cielution LLC

Course Description:
The industry is becoming increasingly aware of the fact that thermal and mechanical factors are crucial hurdles to the realization of TSV based 3 Dimensionally stacked IC products. These challenges are pervasively felt at all stages of the product development cycle starting from Layout, IC design, power management, assembly processing strategy, package design, and testing. Due to the need to narrow down from a myriad of costly choices even prior to test chip or prototype development, engineering simulation is an important tool at the disposal of the engineer. As a result, engineers from all IC design and packaging background who are tasked with the responsibility of enabling 3D ICs are interested in utilizing thermal and mechanical simulation. This is an introductory course on thermal and mechanical simulation techniques pertaining to 3D Through Silicon Stacking meant for engineering professionals involved in the enablement of TSV based 3D stacked SOCs. Thermal Modeling Techniques: Steady-State, Transient, Detailed and Compact. Modeling Tools and Techniques for 3D IC Thermal Management. Overview of mechanical challenges to 3D stacking: warpage, assembly Yield, CPI effects on Yield & reliability Mechanical Modeling Tools and Techniques for Technology development and Reliability. Mobility/stress distribution: Contributions from package, TSV and devices.

Who Should Attend?
Any Engineering professional involved in 3D enablement with interest in the Thermal and mechanical challenges. Also suited for technologists and managers interested in deploying engineering simulation as a strategic tool for understanding thermo-mechanical feasibility, risks and benefits of costly technological investments related to 3D TSV based products.

Kamal Karimanal is the Founder of Cielution LLC, which is an engineering simulation software and services company serving the electronics supply chain. Prior to starting Cielution, Dr. Karimanal has served in several engineering simulation focused roles at Fluent Inc, ANSYS Inc and Globalfoundries. Dr. Karimanal has contributed to several detailed and compact modeling methodologies which are being widely used by the electronics industry today. He has written several conference and journal papers and online application notes. Dr. Karimanal received his Ph. D in Mechanical Engineering from The University of Texas at Austin.

PDC9: MEMS Reliability and Packaging
Course Leader: Slobodan Petrovic, Oregon Institute of Technology

Course Description:
This course provides a comprehensive discussion of a broad array of MEMS packaging and reliability issues. An overview of the principles of operation, fabrication methods, and materials used in building MEMS structures will be presented as well. Because each MEMS device requires a distinctive packaging approach, practical examples and illustrations will be used to demonstrate uniqueness of solutions and interactions between micromachined structures and packaging. A full range of MEMS devices will be discussed while a particular emphasis will be placed on sensors and actuators used in industrial, medical, and automotive applications. Extensive case studies that will be used to most effectively demonstrate diverse packaging principles for devices such as accelerometers, pressure sensors, and digital micromirror devices. The course will be divided in 2 major sections: general MEMS competence; and packaging and reliability. The following major topics will be covered: fabrication technologies, materials, design and device physics, main MEMS types, integration aspects, selected industrial application, design considerations, types of packaging, quality control, reliability and failure analysis.

Who Should Attend?
While some prior knowledge by the participants of MEMS in general is helpful, the packaging discussion will include a detailed explanation of the principles of operation, fabrication methods, and materials used in building MEMS structures. The course is therefore open to participants with no prior MEMS knowledge and would provide a reasonably broad general introduction into the field. The participants will have the opportunity to gain knowledge about MEMS in general through the eyes of a packaging and reliability specialist.

Dr. Slobodan Petrovic is an associate professor at the Oregon Institute of Technology in Portland, OR. His research interests are in the areas of MEMS fuel cells, sensor media compatibility, hydrogen generation and storage, and dye-sensitized solar cells. Prior to that, he was at the Arizona State University, where he taught courses in MEMS, Sensors, and alternative energy. Dr. Petrovic also held appointments at Clear Edge Power as a Vice President of Engineering; at Neah Power Systems as Director of Systems Integration; and Motorola, Inc. as a Reliability Manager. Dr. Petrovic has over 25 years of experience in MEMS, sensors, energy systems; fuel cells and batteries; and electrochemical solar cells. He has over 50 journal publications and conference proceedings; 2 book contributions and 24 pending or issued patents.

PDC10: Basics of Conventional and Advanced Packaging
Course Leader: Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU

Course Description:
The course presents manufacturing, materials, quality and reliability info in terms understandable to engineering and non-engineering personnel. Packaging characteristics and drivers will be outlined. Types of packages and critical differences among them and their applications will be discussed. The course will look at the design selection to meet use and application environments. Step-by step manufacturing flow for plastic packages will be presented as an example to understand the complexity of processes, materials and equipment involved in their manufacture. Advanced packaging will be introduced. Materials selection with respect to application environments will be discussed. Quality and reliability issues related to chip packaging and SMT and their solution will be outlined. Topics: Packaging characteristics and drivers. Types of packages and critical differences among them. Design selection to meet use and application environment. Step-by step manufacturing flow for plastic packages. Advanced packaging. Materials selection. Quality and reliability issues.

Who Should Attend?
It will help the attendees understand the effects of package configurations on their work and the effect of their work on chip packages. Personnel entering the packaging field will have a critical look at the quality, reliability and materials issues related to the development and manufacture of chip pacakages. Non-packaging personnel will learn ins and outs of chip packaging. Non-technical personnel will learn the material and manufacturing intricacies of simple looking chip packages.

Syed Sajid Ahmad contributed to quality and reliability enhancement of assembly processes at Intel (1979-89), especially wire bond. Ahmad also contributed to packaging development at National Semiconductor (1990) and managed quality at GigaBit/TriQuint (1990-91). His major work at Micron Technology (1991-2003) involved the development and implementation of advanced packaging. At the Center for Nanoscale Science and Engineering, Ahmad's focus is on enhancing research and manufacturing capabilities at the center in the areas of thin film, thick film, chip scale packaging (CSP) and surface mount technology (SMT). Ahmad has 34 international publications and presentations and holds 54 patents.

Break: 3:00 pm - 3:20 pm

Welcome Reception (All Attendees Are Invited To Attend)
5:00 pm - 6:30 pm

Microelectronics Foundation Texas Hold'Em Tournament (Separate Register Fees - limited seating)
7:00 pm - 10:00 pm

Register On-Line | Device Packaging Home

9th Annual Global Business Council Spring Conference Featuring Presentations from Medtronic, Starkey, Yole, TechSearch, IBM, and Many Others!    ^ Top
IMAPS 9th Annual GBC Spring Conference and Marketing Forum, Covering the Business Side of Microelectronics Assembly and Packaging, will be held at the Radisson Fort McDowell Resort in Fountain Hills, Arizona from March 10-11, 2013. Visit http://www.imaps.org/programs/gbc13spring.htm this week to register, view the program and more.

The IMAPS GBC is pleased to announce its 2013 Spring Conference. Key industry leaders will provide important information on the critical role that supply chain management plays in our global industry. Presenters will address how business models, industry collaboration, and market dynamics can have profound impacts on the increasingly interconnected semiconductor supply chains. Participants will gain valuable industry insight to achieve a competitive advantage in product development, manufacturing, marketing, and sales. The conference will facilitate networking with key decision-makers across our broad industry supply chain.

Thank you to the GBC Speaker Dinner Sponsors:
GBC Speaker Dinner Sponsor: Solid State Equipment Corp.
GBC Speaker Dinner Sponsor: ASE US, Inc.
GBC Speaker Dinner Sponsor: Amkor Technology
GBC Speaker Dinner Sponsor: Kyocera America

Sunday, March 10, 2013

5:30 - 7:30: Registration and GBC Welcome Reception (Beverages and Appetizers)
7:30 - 9:00: Speaker Dinner (by Invitation)

Monday, March 11, 2013

7:00am - 5:00pm -- Registration
7:00am - 8:00am -- Continental Breakfast

8:00am - 8:15am -- Opening Remarks
Steve Annas, Vice President of Operations, nMode Solutions, Inc.
Chair of the IMAPS Global Business Council

8:15am - 11:55am -- Morning Session:
Medical Electronics Trends for Evolving Healthcare Ecosystems

Moderator: Iris Labadie, Kyocera America; Peter Tortorici, Medtronic, Inc.

8:15am - 9:00am -- “Medical Electronics Crossroad – from Healthcare to Health”
Keith Lindor, Arizona State University

9:00am - 9:30am -- “Implantable Electronics Technology Needs for Improved Cost Efficient Care and Emerging Markets”
David Ruben, Fellow and SMTS, Medtronic, Inc.

9:30am - 10:00am -- “Supply Chain Issues With New Electronic Packaging Technologies”
John Dzarnoski, Director of Microelectronic Packaging, Starkey Hearing Technologies

10:00am - 10:20am -- Coffee Break

10:20am - 10:50am -- “Collaborating to Compete: Biomedical Sensor Failure Prediction”
Colin Drummond, Department Director, Case Western Reserve University

10:50am - 11:20am -- “Latest Trends in Advanced Packaging Technologies and Focus on Medical Applications”
Lionel Cadix, Technology & Market Analyst, Advanced Packaging, Yole Développement

11:20am - 11:55am -- “Opportunities for Microelectronics Packaging Technologies to Advance Wireless/Mobile Health”
Mehren Mehrgany, Director, Case Western Reserve University

12:00pm - 1:00pm -- Lunch & Keynote Presentation

“The 'New' IC Industry Cycle Model”
Bill McClean, President, IC Insights

1:15pm - 5:10pm -- Afternoon Session:
Trends in Microelectronics & Factors Shaping Enabling Technologies

Moderator: Lee Smith, Plexus Corp.; David D’Ambra, DuPont Microcircuit Materials

1:15pm - 2:00pm -- “Saving Lives with MEMS and Sensors: Advancements in Packaging”
E. Jan Vardaman, President, TechSearch International

2:00pm - 2:30pm -- “Material Requirements for the Electronics Industry today and in the Next Decade”
Vern Stygar, Program Manager, AGC Electronics

2:30pm - 3:15pm -- “Microelectronics: Driving Increased Energy Productivity”
Jeff Perkins, Senior Director of Business Development, Energy & Resource Solutions

3:15pm - 3:30pm -- Coffee Break

3:30pm - 4:10pm -- “Supply Chain Eco-systems for Next Generation 3D and High-density Flip Chip Interconnection”
Jean Trewhella, Director of Packaging Research and Development Center, IBM

4:10pm - 4:40pm -- TBD
TBD

4:40pm - 5:10pm -- “Virtual Factory: Cloud Based System for Global Manufacturing & Data Management”
Simon Gonzales, Executive Director of Operations, Murata - RF Monolithics, Inc.

5:10pm - 5:20pm -- Closing Remarks, Final Questions, and Conference Evaluation
Steve Annas, Vice President of Operations, nMode Solutions, Inc.
Chair of the IMAPS Global Business Council

Device Packaging Welcome Reception
5:15pm - 6:45pm (Beverages and Appetizers) GBC Participants Invited

Texas Hold'em Poker Tournament
7:00pm – 10:00pm -- To benefit the IMAPS Educational Foundation

Golf For A Good Cause!    ^ Top
Thursday, March 14, 2013
1:15pm Shotgun Start – “Best Ball” Scramble
Desert Canyon Golf Club
10440 Indian Wells Drive | Fountain Hills, AZ

The IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club. Desert Canyon was named 2009 “Best Places to Play” by Golf Digest and has been voted “Best Public Golf Course” in Fountain Hills for six consecutive years. Desert Canyon Golf Club’s eighteen hole championship course features elevated tees coupled with a variety of elevation changes. Fairways, though open, play tight and prove challenging with strategically placed doglegs.

Cost: $125/golfer -- $450/four-some
The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, lunch in cart, and awards reception following your round.

A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00pm. Golfers will tee off shortly after arriving at the course – 1:15pm shotgun start. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive

Sponsorship Opportunities:

Eagle Sponsor - $3,000 -- 2 SOLD

  • Company logo/name displayed as Awards Reception Sponsor.
  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500 -- 1 SOLD

  • Company logo/name displayed as Lunch Sponsor - in/on boxed lunches.
  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.

Hole Sponsor - $400 ($750 w/ four-some) -- 13 SOLD

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($400 or $750 includes 4-some).
  • Company logo/name on promotional materials and website.

Register On-line

CICMT 2013 - Program Now Available; Register & Reserve Tabletops On-Line    ^ Top
IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) will be held April 23-25, 2013, at the Buena Vista Palace Hotel & Spa in Orlando, Florida. The program and registration is now online - visit http://www.cicmt.org.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.
• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.


Tuesday, April 23
Registration: 7:00 am – 5:30 pm
Continental Breakfast: 7:00 am – 7:45 am

Exhibit Hours: 10:00 am – 6:00 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 7:50 am – 8:00 am
Conference Chairs

Keynote Presentation: 8:00 am – 8:40 am
Solid Oxide Fuel Cells—Applications, Commercialization and Supply Chain in 2013
Dr. Matt Seabugh, Nexceris

Keynote Presentation: 8:40 am - 9:20 am
Recent Progress in Ni-MLCC Technology
Dr. Youichi Mizuno, Taiyo Yuden

Session TA1:
Ceramic Nanomaterials and Nanostructuring
Chairs: Thomas Berfield, University of Louisville; Beth Guiton, University of Kentucky; Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)
9:20 am – 12:00 pm

Piezoelectric and Dielectric Enhancement of New Nano-structured Ceramics with Heteroepitaxial Interfaces
Satoshi Wada, University of Yamanashi (Shuto Kawashima, Ichiro Fujii, Shinichiro Ueno, Kouichi Nakashima, Eisuke Magome, Chikako Moriyoshi, Yoshihiro Kuroiwa)

Investigations of Both the Fundamental Materials Science and Functional Parameters of the Perovskite Family
Philip Ryan, Argonne National Laboratory (Jong-Woo Kim, June-Hyuk Lee, Argonne National Laboratory; Paul Thompson, Simon Brown, XMaS, ESRF; France Peter Normile, Universidad de Castilla-La Mancha; Turan Birol, Craig Fennie, Darrell Schlom, Cornell University; Anke Weidenkaff, Andrey Shkabko, University of Bern, EMPA)

Break in Exhibit Hall: 10:00 am – 10:20 am

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Complex Superstructures Resulting from Compositional Modulation and Octahedral Tilt Twinning in AA'BB'O6 Doubly Cation Ordered Perovskites
Graham King, Los Alamos National Laboratory (Susana Garcia-Martin, Esteban Urones-Garrote, Gwilherm Nenert, Patrick M. Woodward)

Room-Temperature Ceramic Nanocoating Using Nanosheet Deposition Technique
Minoru Osada, National Institute for Materials Science (Takayoshi Sasaki)

Direct Observation of the Growth and Evolution of Nanowire Heterostructures
Beth Guiton, University of Kentucky (Bethany Hudak, Yao-Jen Chang, Daniel Earle, Guohua Li)

Spontaneous Routes to Porous and Biphasic Nanostructured Materials Through Processing
Ram Seshadri, University of California, Santa Barbara

Lunch in Exhibit Hall: 12:00 pm – 1:20 pm

 

Session TP1:
Piezoelectric Materials and Devices

Chairs: Antonio Feteira, Sheffield Hallam University; Helene Debeda, Universite de Bordeaux
1:20 pm – 3:00 pm

Session TP2:
RF Packaging and Devices

Chairs: Steven Dai, Sandia National Laboratories; Jens Mueller, Ilmenau University of Technology
1:20 pm – 3:20 pm

Feasibility of Screen-Printed PZT Microceramics for Piezocomposites Applications
Helene Debeda, Universite de Bordeaux (Riadh Lakhmi, Isabelle Favre, Jonathan Argillos, Mario Maglione, Valerie Budinger, Xavier Hochart, Wilfrid Sourbe, Claude Lucat)

Two-Step Sintering and Property of (1-x)BiScO3-xPbTiO3 Piezoelectric Nanoceramics
Longtu Li, Tsinghua University

Multilayer Actuators for High Temperature Piezoelectric Applications
Ian Reaney, University of Sheffield

Bismuth-Alkali-Titanate Based Ceramics for Piezoelectric Actuator Applications
Klaus Reichmann, Christian-Doppler-Laboratory for Advanced Ferroic Oxides, Graz University of Technology (W. Krauss, D. Schuetz, M. Naderer, T. Kainz, A. Feteira, M. Deluca, P. Supancic)

Strain Measurement and Mechanical Property Evolution in Sol-Gel PZT Thin Films
Thomas Berfield, University of Louisville (Brek Meuris, Daniel Porter)

Temperature Compensated Bandpass Filters in LTCC
Steve Dai, Sandia National Laboratories (Lung-Hwa Hsieh)

Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside a LTCC Fluidic Structure
Jens Mueller, Ilmenau University of Technology

Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
John Bailey, Auburn University (Michael Glover, Emmanuel Decrossas, Kaoru Porter, Tom Cannon, Alan Mantooth, Michael Hamilton)

Transmit/Receive (T/R) Modules - Key Elements for Active Phased Array Antennas
Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN (Joerg Schroth)

Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCC
Byron Caudle, Auburn University (Michael Baginski, Michael Hamilton)

Dielectric Resonators for Enhanced Magnetic Resonance Imaging
Steven Perini, Penn State University (Matthew Pyrz, Yiqing He, Ryan Tom, Thomas Neuberger, Fang Chen, Elena Semouchkina, Michael Lanagan)

Break in Exhibit: 3:20 pm – 4:00 pm

POSTER PRESENTATIONS (in the Exhibit Hall)
4:00 pm – 5:00 pm

0.84(K0.48Na0.52)NbO3-0.16K0.56Li0.38NbO3 Lead-Free Piezoelectric Ceramic Prepared by Multilayer Ceramic Process
Zhiqiang Zhang, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Zhifu Liu, Yongxiang Li)

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

 

Reception in Exhibit Hall: 5:00 pm - 6:00 pm

 


Wednesday, April 24
Registration: 7:00 am – 6:00 pm
Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 4:00 pm
Refreshment Breaks & Lunch in Exhibit Hall

Awards: 8:00 am – 8:20 am

Keynote Presentation: 8:20 am - 9:00 am
Recent Progress in Ni-MLCC Technology
Speaker, Soshu Kirihara, Taiyo Yuden Co., Ltd.

Session WA1:
Metamaterials
Chairs: Khalid Rajab, Queen Mary University of London; Elena Semouchkina, Michigan Technological University
9:00 am – 11:40 am

Multilayered CRLH Metamaterials Using Magnetic Dipole-like Resonant Dielectric Particles and Cut-off TE Modes in Metallic Structures
Tetsuya Ueda, Kyoto Institute of Technology (Yoshiaki Sato, Yuichi Kado, Tatsuo Itoh)

Zero-Index All-Dielectric Metamaterials at Optical Frequencies
Yuanmu Yang, Vanderbilt University (Parikshit Moitra, Zachary Anderson, Jason Valentine)

Dielectric Metamaterials: Toward Low-Loss, Single Element Backward Wave Metamaterials
Paul Clem, Sandia National Laboratories (M.B. Sinclair, M.P. Rye, C.J. Jeon, E.S. Kim)

Break in Exhibit Hall: 10:00 am – 10:20 am

Realization of High-Q Fano Resonances in Ceramic Dielectric Metamaterials for Sensing, Cloaking, and Lossless Energy Transfer Applications
Elena Semouchkina, Michigan Technological University (Arash Hosseinzadeh, George Semouchkin)

Metamaterial Bandwidth Enhancement Using Active Electronics
Khalid Rajab, Queen Mary University of London (Yifeng Fan, Yang Hao)

Fabrication of Diamond Photonic Crystals with Oxide and Metallic Glasses Lattices for Terahertz Wave Control by Using Micro Pattering Stereolithography
Soshu Kirihara, Osaka University

3D-metamaterial Structures and Transmission-line Metamaterials: Microwave to Terahertz Applications
Dmitry Kholodnyak, St. Petersburg Electrotechnical University (Irina Vendik, Mikhail Odit, Dmitry Kozlov, Viacheslav Turgaliev, Irina Munina, Alexander Rusakov)

Lunch in Exhibit Hall: 11:40 am – 1:20 pm

Session WP1:
Microsystem Materials and Applications

Chairs: Paula Maria Vilarinho, University of Aveiro; Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research
1:20 pm – 3:20 pm

Session WP2:
Power/High Temperature Electronics

Chairs: Markus Eberstein, Fraunhofer IKTS; Wenli Zhang, Viginia Tech-Center for Power Electronics Systems
1:20 pm – 3:20 pm

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

LTCC-3D Flow Focusing Microfluidic Device for Nanoparticle Fabrication and Production Scale-Up
Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research (Juliana de Novais Schianti, Andre da Costa Teves, Adriano Marim de Oliveira, Natalia Neto Pereira Cerize)

Feasibility of Micro-Plasma Transistor Device in LTCC
Brooke Garner, Boise State Univeristy

Multifunctional LTCC Substrates for Thermal Actuation of Tunable Steffen Leopold, Ilmenau University of Technology (Thomas Geiling, Caroline Fliegner, Martin Hoffmann)

Fine Dust Measurement with Electrical Fields - Concept of A Hybrid Particle Detector
Thomas Geiling, Ilmenau University of Technology (Tilo Welker, Martin Hoffmann)

Electric Micro-Propulsion in Low Temperature Co-Fired Ceramics
Jesse Taff, Boise State University

Characterization of Low Temperature Sintered Ferrite Laminates for High Frequency Point-of-Load Converters
Wenli Zhang, Center for Power Electronics Systems (Mingkai Mu, Yipeng Su, Qiang Li, Fred Lee)

Thick Film Pastes for Aluminium Nitride and Silicon Nitride Ceramics
Marco Wenzel, Fraunhofer IKTS (Christel Kretzschmar, Richard Schmidt, Markus Eberstein)

Integrated Magnetic Structures for High Temperature Power Electronics
John Fraley, Arkansas Power Electronics Intl. (Brandon Passmore, Stephen Minden)

Characterization of Dense LTCC 9K7 Based Low-Impedance Via Structures up to 3GHz
Alexander Pfeiffenberger, Auburn University (Michael Hamilton, Michael Glover, Emmanuel Decrossas, Alan Mantooth, Kaoru Porter)

Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology
Dominique Ortolino, Lehrstuhl for Funktionsmaterialien, University Bayreuth (Jaroslaw Kita, Roland Wurm, Andreas Pletsch, Karin Beart, Ralf Moos)

Thick Film Pastes for Power Application
Christina Modes, Heraeus Precious Metals GmbH & Co. KG, TFD-TH (Jochen Langer, Melanie Bawohl, Jessica Reitz, Anja Eisert, Heraus Precious Metals, TFD-TH; Mark Challingsworth, Virginia Garcia, Samson Shabhazi, Heraeus Precious Metals North America Conshohocken LLC)

Break in Exhibit Hall: 3:20 pm – 4:00 pm

Session WP3:
Lab on a Chip and Biomedical Applications

Chair: Shubhra Gangopadhyay, University of Missouri-Columbia; Leszek Golonka, Wroclaw University of Technology
4:00 pm – 6:00 pm

Session WP4:
Energy/Fuel Cells/Batteries

Chair: Tim Yosenick, General Electric; Hiroya Abe, Osaka Univerisity; Matthew Seabaugh, Nexceris
4:00 pm – 5:20 pm

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

Preparation of Inorganic-Organic Hybrid Membrane for Peripheral Nerve Reconstruction
Yuki Shirosaki, Kyushu Institute of Technology

Effect of Platinum Metallization in Cofired Platinum /Alumina Microsystems for Implantable Medical Applications
Ali Karbasi, Florida Internationl University (Ali Hadjikhani, Kinzy Jones)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

An LTCC-based Microfluidic Electrochemical Biosensing System for Label-free Detection of Cortisol
Abhay Vasudev, Florida International University (Ajeet Kaushik, Shekhar Bhansali)

All-Crystal-State Lithium-Ion Batteries: Innovation Inspired by Novel Flux Coating Method
Katsuya Teshima, Shinshu University (Hajime Wagata, Shuji Oishi)

Development of Advanced Ceramic Film Capacitors for Power Electronics in Electric Drive Vehicles
U. (Balu) Balachandran, Argonne National Laboratory (M. Narayanan, S. Liu, B. Ma)

Electrostatic Dry Coating of Cathode Materials for Li Ion Battery
Hiroya Abe, Osaka University (Akira Kondo, Makio Naito, Takashi Wakimoto, Masayuki Yamaguchi, Honda Engineering Co.,Ltd.)

Routes for LTCC to Power-electronics
Franz Bechtold, VIA electronic GmbH (Mohamed Ashari)

 

Thursday, April 25
Registration: 7:00 am – 11:30 am
Continental Breakfast: 7:00 am – 8:00 am

Session THA1:
Integrated Passives and Ferrites
Chairs: Hsing-I Hsiang, National Cheng Kung University; Robert Pullar, University of Aveiro
8:00 am – 9:40 am
Session THA2:
Direct Write/3D Printing
Chairs: Klaus Krueger, Helmut Schmidt University; Mike Newton, Newton Cyberfacturing, LLC
8:00 am – 9:40 am

Low Temperature Fired Co2Y-NiCuZn Ferrite Composites
Hsing-I Hsiang, National Cheng Kung University (Ruei-Lin Lin)

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

A Study on Reliability Test of Multilayer Chip Inductors
Wen-Hsi Lee, National Cheng-Kung University (Shih-Feng Chien, C. S. Chiang, Wen-Hsi Lee, Wen-Yu Lin, Po-Chih Shen, Chin-Pei Lin)

On-chip Tunable Magnetoelectric Components
Shashank Priya, Virginia Tech

Hexagonal Ferrite Fibres
Robert Pullar, University of Aveiro

In-Situ-Blending of Inkjet-Printed Resistors
Dietrich Jeschke, University of the Federal Armed Forces (Mathias Niemann, Klaus Kruger)

Direct Printing and its Application in LTCC
Xudong Chen, nScrypt Inc (Kenneth Church)

Inkjet Printing of Piezoelectric Lead Magnesium Niobate-Lead Titanate Thick Films
Andreas Rathjen, Helmut Schmidt University / University of the Federal Armed Forces (Clemens Junker, Klaus Kruger, Helmut Schmidt University; Hana Ursic, Marija Kosec, Jozef Stefan Institute)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Aerosol Jet Printing of Two Component Thick Film Resistors on LTCC
Markus Eberstein, Fraunhofer IKTS (Kai Swiecinski, Robert Jurk, Egle Dietzen, Martin Ihle)

Break in Foyer: 9:40 am – 10:00 am

Session THA3:
Ceramic Functional Materials

Chairs: Satoshi Wada, University of Yamanishi; Minoru Osada, National Institute for Materials Science (NIMS)
10:00 am – 12:00 am

Session THA4:
Advance Packaging Technologies

Chair: Torsten Rabe, BAM, Federal Institute for Materials Research and Testing; Brian Rowden, General Electric, Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN
10:00 am – 12:00 pm

Evaluation of TFR-Characteristics in a Wide Temperature Range
Uwe Partsch, Fraunhofer IKTS (Christian Lenz, Marco Wenzel, Marco Eberstein)

Effects of Al2O3 and B2O3-SiO2 Modification on the Microstructure and Dielectric Properties of BaTiO3 Ceramics
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences

LTCC Multilayer Modules with Integrated Functional Materials
Jorg Topfer, University of Applied Sciences (T. Reimann, R. Lehnert, S. Bierlich, S. Barth, B. Capraro, H. Bartsch de Torres, J. Muller)

Structure-Property Relationships in BaTiO3-BiFeO3-BiYbO3 Ceramics
Antonio Feteira, Christian Doppler Lab in Advanced Ferroic Oxides, Sheffield Hallam University (Luke Luisman, Giorgio Schielo, Marco Deluca, Klaus Reichmann)

Modulating the Temperature Coefficient of the Permittivity by Substrate Induced Texturization in BaO-Ln2O3-TiO2 Thick Films
Ana Senos, University of Aveiro, Ciceco (L. Amaral, P.M. Vilarinho, C. Jamin, O. Guillon)

Alternative Strategies for the Preparation of Multiferroic Thin Films
Paula Maria Vilarinho, University of Aveiro

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding
Mustafa Oezkoek, Atotech Germany GmbH

Surface Characteristics of LTCC Substrates Fabricated by Pressure-Assisted Sintering
Bjoern Brandt, BAM Federal Institute for Materials Research and Testing (Torsten Rabe)

Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Michael Hambuch, University of Erlangen-Nuremberg (Andreas Roosen)

In Situ Characterization of the Sintering Behavior of LTCC Laminates with Embedded Cavities by High Temperature Laser Profilometry
Andreas Heunisch, BAM Federal Institute for Materials Research and Testing (Ulrich Marzok, Marco Munchow, Ralf Muller, Torsten Rabe)

Electroplating and Electroless Plating Process Development for DuPont GreenTape™ 9K7 LTCC
Allan Beikmohamadi, DuPont (Deepukumar Nair, Steve Stewart, Jim Parisi, Mark McCombs, Michael Smith, Ken Souders, J.C. Malerbi, K.M. Nair, Michael Farb)

Application of Cylindrical Pipe-Type LTCC Substrates as a Platform for Multi-Array Gas Sensors
Jaroslaw Kita, University of Bayreuth (Annica Brandenburg, Ralf Moos)

Closing Remarks: 12:00 pm

Register On-Line

Nano Devices 2013 - Abstracts Due March 8   ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Packaging the Next Generation of Nano Devices will be held April 30-May 1, 2013, at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York. Abstracts are now being accepted on-line at www.imaps.org/nano. Abstracts must be received before March 8, 2013.

General Chair:
Ray Fillion
Fillion Consulting
fillion.consulting@gmail.com

Technical Chair:
John Torok
IBM Corporation
jtorok@us.ibm.com
Technical Chair:
Jing Zhan
IBM Corporation
jingzhan@us.ibm.com

In collaboration with:

CNSE - University of Albany

Binghamton University

Workshop Focus:
The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held April 30 and May 1 in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

Abstracts being requested include the following topics:

Packaging Areas:

  • 3D-ICs with TSVs
  • 3D-ICs w/o TSVs
  • PoPs, PiPs
  • 2.5 D Interposers
  • Multichip Modules, Packages
  • Power Packaging
  • MEMS Packaging
  • Optoelectronics Packaging

Technical Areas:

  • Nano Solders, Polymers, Coatings
  • Encapsulants, Underfills
  • Design for Packaging
  • Test, Inspection, Rework
  • Thermal Management, Materials
  • Solders, Conductive Polymers
  • Advanced Wire bonding
  • Flip Chip Technology

 

Those wishing to make a presentation at the Workshop, please submit a 300-500 word abstract electronically by March 8, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org) or call 202-548-8715.

No formal technical paper is required.  A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.


Submit Abstract(s)

  Chapter Activities (events listed in chronological order)
 

THIS THURSDAY: 2nd Southeastern Microelectronics Packaging Conference    ^ Top

Date: February 28, 2013
Location:

Rosen Centre Hotel
9840 International Drive
Orlando, FL 32819

Registration::

Register On-Line
Please email Doug Bokil - dbokil@bokil.com with questions

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging.

Professional Development Course (PDC) on WIRE BONDING:

9AM - 12 NOON
Conducted by Lee Levine who is an expert on this topic & has conducted a similar PDC for IMAPS

TECHNICAL PROGRAM:

1PM - 5PM

DNA Marking to Assure Product Authenticity
Janice Meraglia, Applied DNA Sciences

Additive Manufacturing of Fine Lines and Embedded Electronics for use in Chip Packaging and Microelectronic Systems
Scott Lauer, AdvantechUS, Inc.

Predicting the Reliability of Zero-Level TSVs
Greg Caswell, Dfr Solutions, LLC

Low Temperature Sintering Silver Paste Using MO Technology
Ken Araujo, NAMICS Technologies, Inc.

Rediscovering Multilayer Rigid-Flex with Z-interconnect Technology
Susan Bagen, Endicott Interconnect Technologies, Inc.

Cyberfacturing and the 3rd Industrial Revolution
Mike Newton, Newton Cyberfacturing, LLC

Design Optimization of Micro-channel Heat Exchanger embedded in LTCC
Aparna Aravelli, University of Miami

A Novel Approach to Interconnect Redistribution on Singulated Die
David Herndon, Harris Corporation

KEYNOTE SPEAKER -- 5:00pm:

Patrick Simpkins, Director of Engineering
NASA's John F. Kennedy Space Center in Florida
Dr. Patrick Simpkins is the director of Engineering at NASA's John F. Kennedy Space Center in Florida. In this position, Simpkins leads a group of engineers from multiple disciplines in the design, development and operations of spaceflight hardware and ground systems assigned to the Kennedy Space Center.

EXHIBITS:
3 - 8:30PM

** Raffle: Attendees (excluding Exhibitor representatives) may win an iPad etc. **

Please contact Doug Bokil - dbokil@bokil.com if you have questions.

Metro Chapter Dinner Meeting NEXT TUESDAY    ^ Top

Date: March 5, 2013
Location:

Holiday Inn
Ronkonkoma, New York
Hotel Phone Number (631) 585-9500

Cost:

Price: Members: $30.00 if Pre-Registered by March 1, 2013
$50.00 after March 1, 2013

Non-Members: $50.00 if Pre-Registered by March 1, 2013
$75.00 After March 1, 2013

Student Members: Free if Pre-Registered by March 1, 2013
$25.00 after March 1, 2013

Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering.

Registration Email: andrew.sanchelli@freqelec.com Phone: Scott Baldassarre 631-439-9166 3

Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM

Aluminum Inlay as a Leadframe Material for Power Modules

Presented by Mike McKeown
Regional & Power Electronics Sales Manager
Materion Technical Materials.

Abstract: Aluminum Inlay is one of the most reliable metal systems to wire bond to with large diameter aluminum wire. It is used in numerous automotive, power, military, industrial and alternative energy applications. This paper will discuss the bondable surface requirements; shelf life; as well as recent testing on the Al/Cu intermetallic compound (both high temperature and high current). Comparisons to other bondable surfaces, like Ni-Phos, will be addressed.

Biography: Mike McKeown Regional & Power Electronics Sales Manager Mike McKeown has been involved with wire bonding since the early 1990's starting with Standard Motor Products, then SPM, then Orthodyne Electronics and now with Materion Technical Materials. He is presently finishing his Ph.D. at Leeds University in the United Kingdom.

Viking Chapter March 21 Social Event at St. Paul Curling Club    ^ Top

Date: March 21, 2013
Location:

St. Paul Curling Club

Cost:

No minimum group size. 15 – 20 people expected .
Cost is $25 per person. Food and beverages not included.
Food (pizza) to be paid by the Viking chapter.

Contact: Sean Ferrian, Ferrian and Associates, Email: sean@ferrian.com

 

New England Chapter's 40 Symposium & Expo - Program "Sampler"    ^ Top

Date: Tuesday May 7th, 2013
Location:

Holiday Inn Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

For Complete Technical Program, Registration & Information visit www.imapsne.org

For details about Sponsoring, Exhibiting or Attending Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

Symposium Technical Chair
A. James (Jim) McLenaghan, Creyr Innovation

Symposium Technical Team
Microelectronic Packaging Chairs: Bill Boyce & Mike McKeown
Everything Nano Chairs: Alan Rae & Siva Somu
Thermal Management Chairs: David Saums & Glenn Sundberg
MEMS Chairs: Jacob Trevino & Tina Prevost
DFR, DFM, & Readiness Assessment Chairs: Greg Caswell & Cynthia Hay
LED Applications Chairs: George Hwang & Madis Raukas
Cleaning - Necessity, Process ID & Assessment Chairs: Terry Munson & Eric Camden
Surface Mount Technology Chairs: Jeff Anweiler & Ray Whittier
Poster Session Chairs: Ron Lasky & Daryl Santos

Technical Program Sampler
"Applicability of Non-Hermetic Packaging for Military and Space Applications"

"Using Physics of Failure to Predict System Level Reliability for Avionics"

"Thermal and Electronic Interconnects in LED Packaging and Assembly"

"RF/Microwave Die Attach of GaN Devices in a Flux Free Environment"

"Digital fabrication of flexible circuits with Thermal Transfer Printing"

"New Nano-materials and Structures with Electronic Potential"

"Electrical Current Capabilities of Aluminum Inlay"

"Robotics Assembly from Design to Steady State"

"DNA Marking to Assure Product Authenticity"

"Thermal Conductivity Measurements of Multi-Chip-Module Re-distribution Layers"

"Prognostics for LED Light and Color Degradation by Encapsulant Degradation"

"Application Requirements and Developments for Thermal Core PCBs"

"MEMS Sensors for Surface Flow Sensing in Aerospace Applications"

"Minimizing Voids for Quad Flat-Pack in Lead-Free Assembly"

"Process for Selecting Optimum Wafer Bonding Process"

"Accurate In-Line 3D Measurement for Process Control"

"Thin Film CZTS Solar Cell Using Sputtering Method"

IMAPS France - EMPC 2013 Program Soon    ^ Top
EMPC 2013 CALL FOR PAPERS HAS CLOSED
EUROPEAN ELECTRONICS PACKAGING CONFERENCE

The Technical Program will be available soon

Questions?
Visit EMPC2013 Website www.empc2013.com

Florence VIRETON
Tél: 33 (0) 1 39 67 17 73
email:imaps.france@imapsfrance.org

STATS ChipPAC

LORD Corporation

EPP

Crane AE Banner

2013 Events:

Southeastern Microelectronics Conference
February 28

GBC Spring Conference
March 10-11

Device Packaging
March 11-14
*Exhibitors contact bschieman@imaps.org

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

Next Gen Nano Devices
April 30 - May 1
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

Medical & Hi-Rel Devices
May 13-14
*Exhibitors contact bschieman@imaps.org

Mobile Energy Systems
June 6-7
*Exhibitors contact bschieman@imaps.org

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

^ Top

Amkor

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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