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January 8, 2013
 

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   IMAPS EVENTS
Button Device Packaging 2013 - Program Available This Week! 10 Booths Remain... (read more...)

Button Upcoming Webinars - Component Chip Attach and Intro to Micro... (read more...)

ButtonWire Bonding 2013 - Still Time To Register! (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Metro Chapter January 22 Dinner Meeting with Presentation on Advantages of Using LCP Based Pre-molded Lead-frame Packages for RF & MEMS Applications  (read more...)

Bullet Arizona Chapter January 24 Lunch Meeting with Presentations on the Future of Packaging from Intel and Amkor (read more...)

Bullet IMAPS France 8th European Advanced Technology Workshop on Micropackaging and Thermal management (read more...)

Bullet 2nd Southeastern Microelectronics Packaging Conference (read more...)

Bullet New England Chapter's 40 Symposium & Expo - Call For Papers (read more...)


   MEMBERSHIP CORNER
Bullet Advancing Microelectronics January/February 2013 Magazine Now On-Line - Bumping & Wafer Level Packaging...  (read more...)

Bullet Journal of Microelectronics and Electronic Packaging 3rd Quarter 2012 On-Line - Q4 and Q1 2013 Available Soon  (read more...)

 

Palomar Technologies

RGL Enterprises
F&K Delvotec
QSIC

 

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2013 - Program Available This Week! 10 Booths Remain...    ^ Top
IMAPS 9th International Conference and Exhibition on Device Packaging will be held at the Radisson Fort McDowell Resort in Fountain Hills, Arizona from March 11-14, 2013.Visit www.imaps.org/devicepackaging this week to register, view the program and more.

Device Packaging 2012 was another great conference. The exhibit hall sold again for the 7th consecutive year. We saw an increase in attendance with more than 560 participating in 2012. Abstracts are now being accepted for 2013. 8x10 exhibit booths are also available. We are again limited to 65 booths and expect to sell-out EARLY for the 8th consecutive year. Contact Brian Schieman at bschieman@imaps.org with any questions or if you wish to speak, attend, sponsor and/or exhibit.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2013 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 4 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must contact Brian Schieman IMMEDIATELY by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. A maximum of 65 full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. For an exhibit application and questions, please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.


Upcoming Webinars - Component Chip Attach and Intro to Micro...    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates
Tuesday, January 29 and Thursday, January 31, 2013 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates
Tuesday, February 5 and Thursday, February 7, 2013 - 12:00pm-1:00pm EASTERN

Wire Bonding 2013 - Still Time To Register!    ^ Top
IMAPS Topical Workshop & Tabletop Exhibition on Wire Bonding will be held January 22-23, 2013, at the Radisson Hotel San Jose Airport in San Jose, California. Visit www.imaps.org/wirebonding to register to attend and to view the program on-line.

Wire Bonding Workshop Focus:
The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

Tuesday, January 22, 2013

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:15 am - 7:50 am

Exhibits Open: 10:30 am - 6:30 pm (Breaks, Lunch & Reception in the Exhibit area)

Opening Remarks: 7:50 am
Lee Levine - General Chair

Session 1: Metallurgy and Bond Pad Design
Session Chair: Mike McKeown, Materion Technical Materials
8:00 am - 10:30 am

The Metallurgy of Wire Bonding: Au, Cu, Al, Ag -- (60 Minutes)
Lee Levine, Process Solutions Consulting, Inc.

Use of Wire Bonding to Study Bond Pad Damage from Wafer Probe
Stevan Hunter, Idaho State University & ON Semiconductor

A Bond Pad's View of Wirebonding
Stevan Hunter, Idaho State University & ON Semiconductor (Rob Warnick, Ryan Gohnert, Alan Dutson, Brigham Young University)

TBD
Pac Tech USA

Break in Exhibits: 10:30 am - 11:00 am

Session 2: Contamination
Session Chair: Stevan Hunter, Idaho State University & ON Semiconductor
11:00 am - 12:00 pm

CO2 Surface Preparation for Wire Bonding
David Jackson, CleanLogix LLC

Impact of Thin, Non-Visible Residues on Gold Wire Bond Reliability
Carlyn Smith, Harris Corporation

Lunch: 12:00 pm - 1:00 pm

Session 3: Overview
Session Chair: Lee Levine, Process Solutions Consulting
1:00 pm - 2:00 pm

Overview of Precious Metal Financing and Hedging (60 minutes)
Paul Angland, HSBC Bank USA, National Association

Session 4: Copper Ball Bonding
Session Chair: Leroy Christie, ASM Pacific Technology, Ltd.
2:00 pm - 5:30 pm

Critical Barriers in Fine Pitch Applications Associated with Copper Wire
William Crockett Jr., Tanaka Denshi

Cu Wire Package Reliability Failure Mechanism and Factors Including Molding Compounds
Hidenori Abe, Hitachi Chemical Co., Ltd. (Dongchul Kang, Takahiro Horie, Yoshinori Endo, Masahiko Osaka, Shinya Nakamura)

Break in Exhibits: 3:00 pm - 3:30 pm

Gold to Copper Wire Process Adaptive Capillary Changes
Cesar Alfaro, CoorsTek Gaiser Products (Mark Greenwell)

Microelectronics Interconnection Using Alloyed Copper Wire with Homogeneous Structure
S. Murali, Heraeus Materials Singapore Pte Ltd (Ei Phyu, Phyu Thient, Hoo Siew Mei, Johnny Yeung, Roman Perez)

Meeting the Next Level of Challenges in HVM on Copper Wire Bonding - A Capillary Perspective
Jason Tan, SPT/Small Precision Tools

Wirebond Interconnect: Will it Stand the Test of Time in Era of Shrinking Technology Nodes and Increasing Technology Complexity?
Rich Rice, ASE US, Inc.

Networking & Exhibitor Reception: 5:30 pm - 6:30 pm


Wednesday, January 23, 2013

Registration: 7:00 am - 1:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibits Open: 8:00 am - 10:30 am (Break in the Exhibit area)

Session 5: Alternative Wires and Bonds
Session Chair: Bud Crockett, Tanaka
8:00 am - 10:00 am

The Future of Ag Alloy Wire for Wire Bonding on Al Pad & IC Applications
Leroy Christie, ASM Pacific Technology, Ltd.

Direct Palladium on Bonding Wires
Michael Mayer, University of Waterloo (John Persic)

Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
Dan Evans, Palomar Technologies (David Rasmussen)

1 km Micro Wire Space Tether Production
Timo Rauhala, Finnish Meteorological Institute (Henri Seppanen, Edward Haggstram)

Break: 10:00 am - 10:30 am

Session 6: Wedge Bonding
Session Chair: Jamin Ling, Kulicke & Soffa Industries
10:00 am - 1:00 pm

Electrical Current Capabilities & Characteristics of Al Inlay Leadframes for Power Modules
Mike McKeown, Materion Technical Materials (Barry Njoes)

Pitfalls in Wirebonding: How to Deal with Resonances
Josef Sedlmair, F&K Delvotec GmbH

Ultra Fine Pitch Wedge Bonding
Uri Zaks, Micro Point Pro Ltd.

The Advantages of Wedge Bonding
Lee Levine, Hesse & Knipps, Inc

Large Cu Wire Wedge Bonding
Jamin Ling, Kulicke & Soffa Industries (Tao Xu, Raymond Chen, Orlando Valentine, Christoph Luechinger)

Closing Remarks: 1:00 pm

Register On-Line

 

  Chapter Activities (events listed in chronological order)
 

Metro Chapter January 22 Dinner Meeting with Presentation on Advantages of Using LCP Based Pre-molded Lead-frame Packages for RF & MEMS Applications   ^ Top

Date: January 22, 2013
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500
Hotel Details

Details:

Registration/Networking: 5:00 - 6:30
Dinner Buffet: 6:30 - 7:15
Presentation: 7:15 - 8:15

Advantages of Using LCP Based Pre-molded Lead-frame Packages
for RF & MEMS Applications

Joseph Lynch, Director of Advanced Product Engineering
at Interplex Industries Inc.

This presentation will look at some of the stages of the development of MEMS packages, already engineered to suit robust, high-volume applications. It will detail some of the necessary test processes now required to qualify the technologies. The presentation will show how the materials and manufacturing processes can be developed to provide enhanced reliability for non-hermetic class packages. Interplex will propose some new development concepts that will extend the performance of these materials to meet the more stringent needs of the developing RF and power component markets for better performance packages.

Since 1985, Joseph Lynch has worked in the interconnect industry holding positions as an applications engineer, product engineer, and product engineering manager. For the last nine years has held the position Director of Advanced Product Engineering for Interplex Industries. He holds several patents for specialty interconnects products in the area of shielding, special pins, and contacts for termination of insulated metal substrates and other various specialty interconnect technology areas. He has a business degree from St. John’s University and holds both electrical and mechanical engineering degrees from the New York institute of Technology.

Arizona Chapter January 24 Lunch Meeting with Presentations on the Future of Packaging from Intel and Amkor    ^ Top

Date: January 24, 2013 - Begins at 11:30am
Location:

Dobson Ranch Inn
Mesa, AZ
http://www.roomstays.com/hotel/655665

Details:

Register on-line by January 22 for $25.00. $30.00 at the door. http://imapsaz.org/register-now-for-jan-24th-luncheon/

Please join us for a Double Feature presentation on the Future of Packaging from Intel and Amkor.

Future of Package for Computing Electronics

Speaker: Dr. Hamid R. Azimi, Intel Corporation

Computing, communication and entertainment media have rapidly converged creating a wide range of "smart" devices, driven by the Internet and the need and desire to be "always connected." New device categories are emerging at a rapid pace to bring computing experiences into every aspect of our lives. Consumers are demanding consistency and interoperability across all of their devices, from phone to PC to tablet to TV to gadget, making computing a seamless experience regardless of where you are, what you are doing or what your needs at the time may be. This computing continuum or convergence is predicted to result in more than 10B connected devices by 2015 with significant challenges and opportunities for microelectronic packaging.

This presentation will focus on explaining these challenges and potential future solutions with regard to increased demand for memory bandwidth, multi functionality, and higher wiring density to meet the Si scaling requirements, thinner and smaller form factors, multi-chip and embedded packaging while also addressing the challenges associated with demand for lower cost and environmental sustainability.

The Future of Packaging: Advanced System Integration

Speaker: Curtis Zwenger, Senior Director, Package Development, Amkor Technology

Future packaging technologies now in the development to deployment phase, must address advanced system integration challenges. As advanced computing, communications and multimedia functions continue to be integrated into handheld devices; electrical and thermal performance have become as critical as form factor and mechanical performance in low cost high volume 3D or chip scale package solutions. To deliver higher performance and integration in high volume / low cost packaging solutions, new process and materials technologies are required, including widespread use of wafer level processing. System integration requirements coupled with fragile silicon nodes and advanced performance requirements place increasing challenges in new package development. This is driving increased collaboration and communication across the supply chain in developing and deploying future packaging technologies.

IMAPS France 8th European Advanced Technology Workshop on Micropackaging and Thermal management    ^ Top

Date: February 6-7, 2013
Location:

MERCURE OCEANIDE VIEUX PORT SUD Hotel
Quai Louis Prunier 17000 La Rochelle France
Tel : 33 (0) 5 46 50 61 50/Fax : 33 (0) 5 46 41 24 31
Email : H0569@accor.com

Details:

Early Registration ends on January 11, 2013
Final Registration ends on January 31, 2013
« Formulaire de Convention de formation sur demande »

Organized by:
International Microelectronics And Packaging Society France
49 rue Lamartine 78035 Versailles
Tel : + 33 (0) 1 39 67 17 73/ Fax : + 33 (0) 1 39 02 71 93
E-mail : imaps.france@imapsfrance.org

The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and subsystems.

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also greater reliability; these trends also require improvements and changes in packaging and thermal materials. Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels.

CONFERENCES SCHEDULE (Provisional as of November 27, 2012)

FEBRUARY 6, 2013 (Wednesday)
09.00 am Opening address: J.M.Yannou, President of IMAPS-France

Keynote
09.15 am Thermal Storage Nanocapsules
R. Rodriguez Alonso, Inasmet Tecnalia (Spain)

10.00 am SESSION 1 NEW CONCEPTS
Chairs: J.M. Yannou ASE / W. Eckhard, ECPE

10.00 am Miniaturized Frictionless Fan Concept for Thermal Management of Electronics
R. Schacht, Lausitz University of Applied Sciences, Fraunhofer Enas,
Joint lab Berlin (Germany)

10.25 am Enhanced Boiling Heat Transfer on Micromachined Surfaces Using Acoustic Actuation
A. Glezer, Georgia Institute of Technology (United States)

10.50 am Coffee Break/ Table Top Exhibition

SESSION 2 MATERIALS
Chairs: P. Lewandowski, Continental Automotive / M. Mermet Guyennet Alstom

11.15 am Industrial Application of Cold Spray and Use of this Technology for
Thermal Management
S. Hartmann, Obz Innovation GmbH (Germany)

11.40 am Thermal Management Materials and Cooling Solutions Made by Rapid Hot Pressing and Rapid Sinter Pressing
E. Neubauer, Rhp Technology GmbH (Austria)

12.05 pm Approach for Finding a Proper Golden-Reference Sample for TIM Tester Calibration
A. Vass-Varnai, Mentor Graphics (Hungary)

12.30 pm-02.00 pm Lunch

SESSION 3 MODELING AND EXPERIMENTAL
Chairs: J. Lallier, Thales / S. Feneyrou, Zodiac Aerospace

02.00 pm Application of Complex Thermal Impedance for Multilayer Thermal Structure
Investigations
B. Wiecek, Technical University of Lodz (Poland)

02.25 pm Thermal Resistance Simulation and Measurement of a Double Sided Cooled
Power Module
S. Kraft, Fraunhofer IISB (Germany)

02.50 pm Experimental Investigation of High Density Folded Fin Structures for
Electronics Cooling Applications
A. Engelhardt, Thermacore Europe (United Kingdom)

03.15 pm Practical Evaluation of CFD Models for Heat Sink Design in Photonic System
O. Wittler, Fraunhofer Berlin (Germany)

03.40 pm Coffee Break/ Table Top Exhibition

SESSION 4 SOLUTIONS INTEGRATED AT SUBSTRATE LEVEL
Chairs: N. Chandler, BAE Systems / B. Braux, Astrium

04.15 pm Theoretical Study of the Thermal Impact of a Passive Heat Spreading Layer Integrated in 3D Mobile Device
S. Salman, CEA, LETI, (France)

04.40 pm An Integrated Passive Cooling Solution for PCB Substrates
D. Kearney, J. Griffin, ABB Corporate Centre, (Switzerland)

05.05 pm Developments and Applications for Thermal Core PCBs
D.L. Saums, DS&A LLC (United States)

05.30 pm End of Session

08.00 pm Dinner « Salle de l’Oratoire » 6 rue Albert 1er La Rochelle

FEBRUARY 7, 2013 (Thursday)

SESSION 5 APPLICATIONS
Chairs: C. Sarno, Thales Avionics / M. Massiot, EGIDE

09.00 am Analysis of Thermal Management Techniques in Tablets
E. Rahim, Electronic Cooling Solutions (United States)

09.25 am Autonomous Cooling for Embedded Computer –New Concept
B. Bellin, Thales Avionics (France)

09.50 am Thermal Management of a 49W Computer Processing Unit with a 23W Hotspot
J. Carcone, Airbus Opérations SAS (France)

10.15 am Loop Heat Pipe for the Thermal Management of Hot Spots in Future
Electronic Equipments
R. Hodot, Thales Avionics (France)

10.40 am – 11.15 am POSTER SESSION / TABLE TOP EXHIBITION

SESSION 6 MATERIALS
Chairs: D. Saums DS&A LLC / B.Wiecek Technical University of Lodz

11.15 am Thermal Properties of Carbon Material Reinforced Aluminium Composite Fabricated by Hot Pressing with Semi-Liquid Existent Phase
H. Kurita, ICMCB-CNRS (France)

11.40 am Copper/Diamond Composite Materials for Thermal Management Applications
T. Guillemet, ICMCB-CNRS,(France)

12.05 pm Thermally Conductive Encapsulants –Balancing Critical Properties
P. Hough, Lord Corporation (Germany)

12.30 pm – 2.00 pm Lunch

SESSION 7 MATERIALS FOR HARSH ENVIRONMENT
Chairs: R. Seddon, Inasmet Tecnalia / J.L Diot, Novapack SAS

02.00 pm Silicon Nitride Substrates for Power Electronics
U. Voeller, Curamik Electronics GmbH (Germany)

02.25 pm MEMPHIS: Miniaturized Electronic Module for Power and Hermetic Innovative
Applications In harSh Environment
D. Baudet, B. Braux Astrium (France)

SESSION 8 MODELING
Chairs: R. Seddon, Inasmet Tecnalia / J.L Diot, Novapack SAS

02.50 pm Parametric Transient Thermo-Electrical PSPICE-Model for a Power Cable
R. Schacht, C. Gerner Fraunhofer ENAS (Germany),The Lausitz University of Applied Sciences

03.15 pm Cooling Device Libraries Development for Surrogate Models in Modelica and
VDHL-AMS Languages
D. Lossouarn, EPSILON (France)

03.40 pm End of session / Final Coffee / Departure

2nd Southeastern Microelectronics Packaging Conference    ^ Top

Date: February 28, 2013
Location:

Rosen Centre Hotel
9840 International Drive
Orlando, FL 32819

Details:

Abstract Deadline Passed
Submit Abstracts On-Line ASAP
Please email Doug Bokil - dbokil@bokil.com with questions

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging. Topics of interest for submission include, but are not limited to:

  • 2.5D / 3D Packaging
  • Flip Chip and Wafer Bumping Processes
  • MEMS Packaging
  • Wire Bonding / Stud Bumping
  • LED / Optoelectronic / Photonic Packaging
  • Underfill / Encapsulants / Adhesives
  • Printed Electronics Technology
  • Design for Manufacturing / Test / Reliability
  • Substrate / PWB Technology
  • Testing of High Density & Microelectronic Assemblies
  • Thermal Management Solutions
  • Non-Hermetic Packaging for Harsh Environments
  • Embedded Device Packaging
  • Pb-Free Solder and RoHS Compliance
  • Microwave & RF Applications
  • Counterfeit Electronics Detection

Those wishing to present a paper at the Southeastern Microelectronics Packaging Conference must submit a 250-300 word abstract on-line at www.imaps.org/abstracts.htm no later than November 23, 2012.

This all day conference will have table top exhibits. Register On-Line.

Exhibitors: Table top $450.00 Please email Doug Bokil - dbokil@bokil.com with questions.

New England Chapter's 40 Symposium & Expo - Call For Papers    ^ Top

Date: Tuesday May 7th, 2013
Location:

Holiday Inn Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

Please send 250 word abstract to: Jim McLenaghan, AJM@Creyr.NET for more details visit us at: www.imapsne.org

Abstract Deadline has passed -- contact Jim asap with questions

For details about Sponsoring, Exhibiting or Attending Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

CALL FOR PAPERS

Symposium Technical Chair
A. James (Jim) McLenaghan, Creyr Innovation, LLC

The Largest Regional Symposium Dedicated to Microelectronics and Packaging

Tuesday May 7th, 2013
----- Featuring -----
Six to Eight Lecture Sessions, Full Poster Session,
Employment Center & 80 Booth Exhibit Hall

The New England Chapter Symposium Technical Program Committee seeks papers that demonstrate how new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Medical Electronics
  • Lasers
  • Telecom – RF & Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal & Power Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Sensors (Manufacturing & Applications)
  • Emerging Technologies
  • Solar, Photovoltaic
  • Aerospace
  • Electronics for Environmental Impact Measurement & Assessment

Advanced Processes & Materials

  • 3D, SiP, and High Density Packaging
  • Nano Materials - Mfg., Applications, & Safety
  • Photonics, Optoelectronics, LED Packaging
  • MEMS and Nano Packaging
  • Underfill - Materials, Applications, Effectiveness
  • Green packaging - Regulation Compliance, Materials, Processes, Recycling
  • Flip-Chip and Bumping Processes & Reliability
  • Wire-bonding and Stud-Bumping
  • Embedded Components – Passives, Magnetics
  • Ceramic, Polymer and Conductive Materials
  • Cu, Low-K
  • Product DFR & DFM Tools, Programs, Implementation
  • Materials Deposition & Delivery - Print, Vapor, Dispensing, Placement, etc

 

  Membership Corner
 

Advancing Microelectronics January/February 2013 Magazine Now On-Line - Bumping & Wafer Level Packaging...   ^ Top

January/February 2013:
Volume 40, No. 1
Bumping & Wafer Level Packaging

The January/February 2013 issue featured four technical articles on: A Short History of Flip Chip and Wafer Level Packaging; A Brief History of Electroplating for Bumping and Wafer Level Packaging; Wafer Level Chip-Scale Packaging: Evolving to Meet a Growing Application Space; and Embedded Wafer-Level Packaging is Expected to Increase by 2015, Once Platforms Mature and Fabless Customers Commit

download magazine PDF (10mb)

Journal of Microelectronics and Electronic Packaging 3rd Quarter 2012 On-Line - Q4 and Q1 2013 Available Soon   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 9, Number 3
Third Quarter 2012

download pdf of full Journal - 58mb




INVITED PAPERS:

 

Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate
T. Burkhardt, M. Hornaff, A. Acker, T. Peschel, E. Beckert, R. Eberhardt, and A. Tünnermann, Fraunhofer Institute for Applied Optics and Precision Engineering IOF; T. Burkhardt and A. Tünnermann, Friedrich-Schiller-University Jena; K.-H. Suphan, Micro-Hybrid Electronic GmbH; K. Mensel and S. Jirak, Lastronics GmbH

113

Design and Fabrication of an LTCC Structure for a Microceramic Combustor
Darko Belavic, Marko Hrovat, Kostja Makarovic, and Marina Santo Zarnik, Centre of Excellence NAMASTE; Darko Belavic, HIPOT-RR; Darko Belavic, Marko Hrovat, Gregor Dolanc, Kostja Makarovic, and Marina Santo Zarnik, Jozef Stefan Institute; Marina Santo Zarnik, IN.Medica

120
Inkjet Printing of Multilayer Capacitors
D. Jeschke, E. Ahlfs, and K. Krüger, Institute of Automation Technology Helmut-Schmidt-University and University of the Federal Armed Forces Hamburg
126

Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
Martin Ihle, Uwe Partsch, Sindy Mosch, and Adrian Goldberg, Fraunhofer Institute for Ceramic Technologies and Systems

133

Cold Embossing of Ceramic Green Tapes
Anja Härtel, Hans-Jürgen Richter, and Tassilo Moritz, Fraunhofer Institute of Ceramic Technologies and Systems

138
Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness Loss
A. Ege Engin and Pavithra Pasunoori, San Diego State University
144

 

 

LORD Corporation

EPP

Crane AE Banner

Quik-Pak

2013 Events:

Wire Bonding
January 22-23

Digital Printed Circuit Structures
February 20-21
*Exhibitors contact bschieman@imaps.org

Southeastern Microelectronics Conference
February 28

Device Packaging
March 11-14
*Exhibitors contact bschieman@imaps.org

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

^ Top

 

Amkor

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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