IMAPS Home | Join/Renew
March 22, 2013
 

DPC Sponsor: SANTIER

   IMAPS EVENTS
Button IMAPS 2013 - Abstracts Now Accepted Until March 29....Early Exhibit DEADLINE Next Friday, March 29 (read more...)

Button Last Chance to Register EARLY & BOOK HOTEL for CICMT 2013 - TODAY! (read more...)

Button Nano Devices 2013 - Only 10 Tabletops Now Available...Program Next Week (read more...)

Button Upcoming Webinars - Component Chip Attach and ADVANCED Flip Chip (new)... (read more...)

Button Abstracts DUE TODAY - Packaging for Medical & Hi-Rel Devices  (read more...)

Button Abstracts Due Next Friday for New Workshop on Advanced Electronics for Mobile Energy Systems (AEMES)   (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TUESDAY: San Diego Chapter March 26 Meeting on Polymers Hard at Work in Your Smartphone (read more...)

Bullet Chesapeake Chapter April 3 Spring Symposium at JHUAPL (read more...)

Bullet Cleveland/Pittsburgh Chapter April 9 Technical Meeting & Tour at GrafTech (read more...)

Bullet Metro Chapter April 11 Professional Development Course & Vendor Night (read more...)

Bullet New England Chapter's 40 Symposium & Expo - Program "Sampler" (read more...)

Bullet IMAPS France - EMPC 2013 Program Soon (read more...)


   MEMBERSHIP CORNER

Bullet Advancing Microelectronics March/April 2013 Magazine Now On-Line - Ceramic Packaging, Thick & Thin Film Materials  (read more...)

Bullet Journal of Microelectronics and Electronic Packaging 4th Quarter 2012 On-Line - Q1 Available Soon  (read more...)

DPC Sponsor: Applied Materials

MST

RGL Enterprises
F&K Delvotec
Amkor

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

IMAPS 2013 - Abstracts Now Accepted Until March 29....Early Exhibit DEADLINE Next Friday, March 29    ^ Top

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold

IMAPS 2013 - Orlando
46th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

September 29 - October 3, 2013
Rosen Centre Hotel
Orlando, Florida, USA

www.imaps2013.org


Conference and Exhibition:
October 1-3, 2013
Professional Development Courses:
September 29 - 30, 2013

Abstract Deadline Extended: March 29, 2013
Early Exhibit Deadline: March 29, 2013
Early Registration and Hotel Deadline: August 30, 2013


Program Enhancements
& New Activities Planned for 2013!

500-WORD ABSTRACT & 4-6 Page Final Manuscripts
• PEER-REVIEW
of all Final Manuscripts!
• 6 "Best of Track" Outstanding Paper Awards & 1 "Best of Symposium"
Monday & Thursday Professional Development Courses
• Expanded Exhibits Tuesday-Wed. ONLY
• NEW "Research Lab Corridor" on Exhibit Floor
• Student Poster Session
Student Awards for Best: Papers, Booth & Poster Presentation


 

General Chair:
Matt Nowak
Qualcomm, Inc.
mnowak@qualcomm.com

 

Technical Chair:
Ivan Ndip
Fraunhofer IZM
Ivan.Ndip@izm.fraunhofer.de

 

Technical Co-Chair - USA:
Mark Hoffmeyer
Mark Hoffmeyer, IBM Corporation
hoffmeyr@us.ibm.com
Technical Co-Chair - Europe:
Andre Rouzaud
CEA LETI
andre.rouzaud@cea.fr
Technical Co-Chair - Asia:
Jin Yu
Korea Advanced Institute of Science and Technology (KAIST)
jinyu@kaist.ac.kr

The 46th International Symposium on Microelectronics will be held at the Rosen Centre Hotel in Orlando, Florida, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 46th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2013 will feature 5-6 technical tracks that span the two and a half days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; MODELING, DESIGN, TEST & RELIABILITY; MATERIALS & PROCESSES; ADVANCED PACKAGING & ASSEMBLY; ADVANCED & EMERGING TECHNOLOGIES; and SPECIAL SESSIONS ON PACKAGING & SYSTEM-INTEGRATION, as well as an Interactive Student Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

Track:
INTERPOSERS & 2.5/3D PACKAGING
Topics:
• TSV Materials & Processes • Silicon Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Glass Interposers • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • 3D Simulation and Modeling • Advanced 3D Materials • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D
Track:
MODELING, DESIGN, TEST & RELIABILITY
Topics:
Design for Reliability Modeling & Design for SI, PI and EMC Thermal and Thermo-Mechanical Modeling Testing Methods and Process RF and Microwave Packaging Mechanical Modeling and Related Metrology Design for Manufacturing Package Reliability Testing
Track:
MATERIALS & PROCESSES
Topics:
Advanced Materials & Novel Assembly Processes Polymers, Underfill/Encapsulants and Adhesives Substrate Materials Ceramic & LTCC Packaging Bonding Materials and Processes Embedded and Integrated Passives Thick / Thin Films
Track:
ADVANCED PACKAGING & ASSEMBLY
Topics:
Pb-Free Solder & ROHS Wirebonding & Stud Bumping Flip Chip Interconnects & Technologies MEMS & Sensor Packaging LED and Optoelectronics Packaging Wafer Level Packaging Chip Scale Packaging Copper Pillar Wafer Thinning Wafer Bumping Warpage Characterization and Mitigation Integration, Mounting & Assembly of Packaged LEDs Industry Trends & Market Drivers in Solid State Lighting Optics & Lenses (including phosphor incorporation) Gyros & Accelerometers Sensors & RF Devices Microfluidics & Bio-MEMS Optical MEMS (MOEMS)
Track:
ADVANCED & EMERGING TECHNOLOGIES
Topics:
Medical Device Packaging Emerging Technologies High Performance Interconnect & Boards Printed Electronics & Additive Manufacturing Novel Interconnections, Fabrication & Analysis Methods Packaging for Class III Medical Implants Human Portable Monitoring Devices Patient Monitoring Enabling Technologies for Power Management Microfluidics, Bio-Sensors & Bio-Chips Thin & Printed Battery Technology Membrane & Capacitive Switches Cyber Design/Cyberfacturing Printable Display & Lighting
Track:
SPECIAL SESSIONS ON PACKAGING & SYSTEM-INTEGRATION
Topics:
European Perspective Asian Perspective Southeast USA Perspective Think Thin: Thin IC Packaging For Mobile Devices Automotive, Industrial & Harsh Environment Electronics Applications Packaging for Military Appilcations Power Packaging

Industries Represented:
Consumer, Portable and Wireless Biomedical Telecom Defense and Security Computing, and Gaming Automotive Applications Solar and Alternative Energy

Systems & Applications of these Technologies:
Low Cost Electronics Outsourcing and Supply Chain Management Thermal Management System Packaging Power Management Electromagnetic Interference (EMI) Electrostatic Discharge (ESD) Protection Wireless Sensors and Energy Harvesters Nano-Integrated Packaging Microwave & RF Applications Photonic Packaging Packaging for Harsh Environments Packaging for Medical/Implantable Devices Automotive Microelectronics Thin Packaging for Mobile Devices MEMS Packaging Biological and Microfluidic Packaging LED Packaging Packaging of Compound Semiconductor Devices Emerging Applications

Please send your 500 word abstract electronically only using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schiemant at bschieman@imaps.org or call 202-548-8715.

Submit Abstract(s)


Last Chance to Register EARLY & BOOK HOTEL for CICMT 2013 - TODAY!    ^ Top
IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) will be held April 23-25, 2013, at the Buena Vista Palace Hotel & Spa in Orlando, Florida. The program and registration is now online - visit http://www.cicmt.org.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.
• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.


Tuesday, April 23
Registration: 7:00 am – 5:30 pm
Continental Breakfast: 7:00 am – 7:45 am

Exhibit Hours: 10:00 am – 6:00 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 7:50 am – 8:00 am
Conference Chairs

Keynote Presentation: 8:00 am – 8:40 am
Solid Oxide Fuel Cells—Applications, Commercialization and Supply Chain in 2013
Dr. Matt Seabugh, Nexceris

Keynote Presentation: 8:40 am - 9:20 am
Recent Progress in Ni-MLCC Technology
Dr. Youichi Mizuno, Taiyo Yuden

Session TA1:
Ceramic Nanomaterials and Nanostructuring
Chairs: Thomas Berfield, University of Louisville; Beth Guiton, University of Kentucky; Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)
9:20 am – 12:00 pm

Piezoelectric and Dielectric Enhancement of New Nano-structured Ceramics with Heteroepitaxial Interfaces
Satoshi Wada, University of Yamanashi (Shuto Kawashima, Ichiro Fujii, Shinichiro Ueno, Kouichi Nakashima, Eisuke Magome, Chikako Moriyoshi, Yoshihiro Kuroiwa)

Investigations of Both the Fundamental Materials Science and Functional Parameters of the Perovskite Family
Philip Ryan, Argonne National Laboratory (Jong-Woo Kim, June-Hyuk Lee, Argonne National Laboratory; Paul Thompson, Simon Brown, XMaS, ESRF; France Peter Normile, Universidad de Castilla-La Mancha; Turan Birol, Craig Fennie, Darrell Schlom, Cornell University; Anke Weidenkaff, Andrey Shkabko, University of Bern, EMPA)

Break in Exhibit Hall: 10:00 am – 10:20 am

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Complex Superstructures Resulting from Compositional Modulation and Octahedral Tilt Twinning in AA'BB'O6 Doubly Cation Ordered Perovskites
Graham King, Los Alamos National Laboratory (Susana Garcia-Martin, Esteban Urones-Garrote, Gwilherm Nenert, Patrick M. Woodward)

Room-Temperature Ceramic Nanocoating Using Nanosheet Deposition Technique
Minoru Osada, National Institute for Materials Science (Takayoshi Sasaki)

Direct Observation of the Growth and Evolution of Nanowire Heterostructures
Beth Guiton, University of Kentucky (Bethany Hudak, Yao-Jen Chang, Daniel Earle, Guohua Li)

Spontaneous Routes to Porous and Biphasic Nanostructured Materials Through Processing
Ram Seshadri, University of California, Santa Barbara

Lunch in Exhibit Hall: 12:00 pm – 1:20 pm

 

Session TP1:
Piezoelectric Materials and Devices

Chairs: Antonio Feteira, Sheffield Hallam University; Helene Debeda, Universite de Bordeaux
1:20 pm – 3:00 pm

Session TP2:
RF Packaging and Devices

Chairs: Steven Dai, Sandia National Laboratories; Jens Mueller, Ilmenau University of Technology
1:20 pm – 3:20 pm

Feasibility of Screen-Printed PZT Microceramics for Piezocomposites Applications
Helene Debeda, Universite de Bordeaux (Riadh Lakhmi, Isabelle Favre, Jonathan Argillos, Mario Maglione, Valerie Budinger, Xavier Hochart, Wilfrid Sourbe, Claude Lucat)

Two-Step Sintering and Property of (1-x)BiScO3-xPbTiO3 Piezoelectric Nanoceramics
Longtu Li, Tsinghua University

Multilayer Actuators for High Temperature Piezoelectric Applications
Ian Reaney, University of Sheffield

Bismuth-Alkali-Titanate Based Ceramics for Piezoelectric Actuator Applications
Klaus Reichmann, Christian-Doppler-Laboratory for Advanced Ferroic Oxides, Graz University of Technology (W. Krauss, D. Schuetz, M. Naderer, T. Kainz, A. Feteira, M. Deluca, P. Supancic)

Strain Measurement and Mechanical Property Evolution in Sol-Gel PZT Thin Films
Thomas Berfield, University of Louisville (Brek Meuris, Daniel Porter)

Temperature Compensated Bandpass Filters in LTCC
Steve Dai, Sandia National Laboratories (Lung-Hwa Hsieh)

Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside a LTCC Fluidic Structure
Jens Mueller, Ilmenau University of Technology

Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
John Bailey, Auburn University (Michael Glover, Emmanuel Decrossas, Kaoru Porter, Tom Cannon, Alan Mantooth, Michael Hamilton)

Transmit/Receive (T/R) Modules - Key Elements for Active Phased Array Antennas
Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN (Joerg Schroth)

Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCC
Byron Caudle, Auburn University (Michael Baginski, Michael Hamilton)

Dielectric Resonators for Enhanced Magnetic Resonance Imaging
Steven Perini, Penn State University (Matthew Pyrz, Yiqing He, Ryan Tom, Thomas Neuberger, Fang Chen, Elena Semouchkina, Michael Lanagan)

Break in Exhibit: 3:20 pm – 4:00 pm

POSTER PRESENTATIONS (in the Exhibit Hall)
4:00 pm – 5:00 pm

0.84(K0.48Na0.52)NbO3-0.16K0.56Li0.38NbO3 Lead-Free Piezoelectric Ceramic Prepared by Multilayer Ceramic Process
Zhiqiang Zhang, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Zhifu Liu, Yongxiang Li)

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

 

Reception in Exhibit Hall: 5:00 pm - 6:00 pm

 


Wednesday, April 24
Registration: 7:00 am – 6:00 pm
Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 4:00 pm
Refreshment Breaks & Lunch in Exhibit Hall

Awards: 8:00 am – 8:20 am

Keynote Presentation: 8:20 am - 9:00 am
Recent Progress in Ni-MLCC Technology
Speaker, Soshu Kirihara, Taiyo Yuden Co., Ltd.

Session WA1:
Metamaterials
Chairs: Khalid Rajab, Queen Mary University of London; Elena Semouchkina, Michigan Technological University
9:00 am – 11:40 am

Multilayered CRLH Metamaterials Using Magnetic Dipole-like Resonant Dielectric Particles and Cut-off TE Modes in Metallic Structures
Tetsuya Ueda, Kyoto Institute of Technology (Yoshiaki Sato, Yuichi Kado, Tatsuo Itoh)

Zero-Index All-Dielectric Metamaterials at Optical Frequencies
Yuanmu Yang, Vanderbilt University (Parikshit Moitra, Zachary Anderson, Jason Valentine)

Dielectric Metamaterials: Toward Low-Loss, Single Element Backward Wave Metamaterials
Paul Clem, Sandia National Laboratories (M.B. Sinclair, M.P. Rye, C.J. Jeon, E.S. Kim)

Break in Exhibit Hall: 10:00 am – 10:20 am

Realization of High-Q Fano Resonances in Ceramic Dielectric Metamaterials for Sensing, Cloaking, and Lossless Energy Transfer Applications
Elena Semouchkina, Michigan Technological University (Arash Hosseinzadeh, George Semouchkin)

Metamaterial Bandwidth Enhancement Using Active Electronics
Khalid Rajab, Queen Mary University of London (Yifeng Fan, Yang Hao)

Fabrication of Diamond Photonic Crystals with Oxide and Metallic Glasses Lattices for Terahertz Wave Control by Using Micro Pattering Stereolithography
Soshu Kirihara, Osaka University

3D-metamaterial Structures and Transmission-line Metamaterials: Microwave to Terahertz Applications
Dmitry Kholodnyak, St. Petersburg Electrotechnical University (Irina Vendik, Mikhail Odit, Dmitry Kozlov, Viacheslav Turgaliev, Irina Munina, Alexander Rusakov)

Lunch in Exhibit Hall: 11:40 am – 1:20 pm

Session WP1:
Microsystem Materials and Applications

Chairs: Paula Maria Vilarinho, University of Aveiro; Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research
1:20 pm – 3:20 pm

Session WP2:
Power/High Temperature Electronics

Chairs: Markus Eberstein, Fraunhofer IKTS; Wenli Zhang, Viginia Tech-Center for Power Electronics Systems
1:20 pm – 3:20 pm

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

LTCC-3D Flow Focusing Microfluidic Device for Nanoparticle Fabrication and Production Scale-Up
Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research (Juliana de Novais Schianti, Andre da Costa Teves, Adriano Marim de Oliveira, Natalia Neto Pereira Cerize)

Feasibility of Micro-Plasma Transistor Device in LTCC
Brooke Garner, Boise State Univeristy

Multifunctional LTCC Substrates for Thermal Actuation of Tunable Steffen Leopold, Ilmenau University of Technology (Thomas Geiling, Caroline Fliegner, Martin Hoffmann)

Fine Dust Measurement with Electrical Fields - Concept of A Hybrid Particle Detector
Thomas Geiling, Ilmenau University of Technology (Tilo Welker, Martin Hoffmann)

Electric Micro-Propulsion in Low Temperature Co-Fired Ceramics
Jesse Taff, Boise State University

Characterization of Low Temperature Sintered Ferrite Laminates for High Frequency Point-of-Load Converters
Wenli Zhang, Center for Power Electronics Systems (Mingkai Mu, Yipeng Su, Qiang Li, Fred Lee)

Thick Film Pastes for Aluminium Nitride and Silicon Nitride Ceramics
Marco Wenzel, Fraunhofer IKTS (Christel Kretzschmar, Richard Schmidt, Markus Eberstein)

Integrated Magnetic Structures for High Temperature Power Electronics
John Fraley, Arkansas Power Electronics Intl. (Brandon Passmore, Stephen Minden)

Characterization of Dense LTCC 9K7 Based Low-Impedance Via Structures up to 3GHz
Alexander Pfeiffenberger, Auburn University (Michael Hamilton, Michael Glover, Emmanuel Decrossas, Alan Mantooth, Kaoru Porter)

Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology
Dominique Ortolino, Lehrstuhl for Funktionsmaterialien, University Bayreuth (Jaroslaw Kita, Roland Wurm, Andreas Pletsch, Karin Beart, Ralf Moos)

Thick Film Pastes for Power Application
Christina Modes, Heraeus Precious Metals GmbH & Co. KG, TFD-TH (Jochen Langer, Melanie Bawohl, Jessica Reitz, Anja Eisert, Heraus Precious Metals, TFD-TH; Mark Challingsworth, Virginia Garcia, Samson Shabhazi, Heraeus Precious Metals North America Conshohocken LLC)

Break in Exhibit Hall: 3:20 pm – 4:00 pm

Session WP3:
Lab on a Chip and Biomedical Applications

Chair: Shubhra Gangopadhyay, University of Missouri-Columbia; Leszek Golonka, Wroclaw University of Technology
4:00 pm – 6:00 pm

Session WP4:
Energy/Fuel Cells/Batteries

Chair: Tim Yosenick, General Electric; Hiroya Abe, Osaka Univerisity; Matthew Seabaugh, Nexceris
4:00 pm – 5:20 pm

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

Preparation of Inorganic-Organic Hybrid Membrane for Peripheral Nerve Reconstruction
Yuki Shirosaki, Kyushu Institute of Technology

Effect of Platinum Metallization in Cofired Platinum /Alumina Microsystems for Implantable Medical Applications
Ali Karbasi, Florida Internationl University (Ali Hadjikhani, Kinzy Jones)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

An LTCC-based Microfluidic Electrochemical Biosensing System for Label-free Detection of Cortisol
Abhay Vasudev, Florida International University (Ajeet Kaushik, Shekhar Bhansali)

All-Crystal-State Lithium-Ion Batteries: Innovation Inspired by Novel Flux Coating Method
Katsuya Teshima, Shinshu University (Hajime Wagata, Shuji Oishi)

Development of Advanced Ceramic Film Capacitors for Power Electronics in Electric Drive Vehicles
U. (Balu) Balachandran, Argonne National Laboratory (M. Narayanan, S. Liu, B. Ma)

Electrostatic Dry Coating of Cathode Materials for Li Ion Battery
Hiroya Abe, Osaka University (Akira Kondo, Makio Naito, Takashi Wakimoto, Masayuki Yamaguchi, Honda Engineering Co.,Ltd.)

Routes for LTCC to Power-electronics
Franz Bechtold, VIA electronic GmbH (Mohamed Ashari)

 

Thursday, April 25
Registration: 7:00 am – 11:30 am
Continental Breakfast: 7:00 am – 8:00 am

Session THA1:
Integrated Passives and Ferrites
Chair: Robert Pullar, University of Aveiro
8:00 am – 9:20 am
Session THA2:
Direct Write/3D Printing
Chairs: Klaus Krueger, Helmut Schmidt University; Mike Newton, Newton Cyberfacturing, LLC
8:00 am – 9:40 am

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

A Study on Reliability Test of Multilayer Chip Inductors
Wen-Hsi Lee, National Cheng-Kung University (Shih-Feng Chien, C. S. Chiang, Wen-Hsi Lee, Wen-Yu Lin, Po-Chih Shen, Chin-Pei Lin)

On-chip Tunable Magnetoelectric Components
Shashank Priya, Virginia Tech

Hexagonal Ferrite Fibres
Robert Pullar, University of Aveiro

In-Situ-Blending of Inkjet-Printed Resistors
Dietrich Jeschke, University of the Federal Armed Forces (Mathias Niemann, Klaus Kruger)

Direct Printing and its Application in LTCC
Xudong Chen, nScrypt Inc (Kenneth Church)

Inkjet Printing of Piezoelectric Lead Magnesium Niobate-Lead Titanate Thick Films
Andreas Rathjen, Helmut Schmidt University / University of the Federal Armed Forces (Clemens Junker, Klaus Kruger, Helmut Schmidt University; Hana Ursic, Marija Kosec, Jozef Stefan Institute)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Aerosol Jet Printing of Two Component Thick Film Resistors on LTCC
Markus Eberstein, Fraunhofer IKTS (Kai Swiecinski, Robert Jurk, Egle Dietzen, Martin Ihle)

Break in Foyer: 9:40 am – 10:00 am

Session THA3:
Ceramic Functional Materials

Chairs: Satoshi Wada, University of Yamanishi; Minoru Osada, National Institute for Materials Science (NIMS)
10:00 am – 12:00 am

Session THA4:
Advance Packaging Technologies

Chair: Torsten Rabe, BAM, Federal Institute for Materials Research and Testing; Brian Rowden, General Electric, Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN
10:00 am – 12:00 pm

Evaluation of TFR-Characteristics in a Wide Temperature Range
Uwe Partsch, Fraunhofer IKTS (Christian Lenz, Marco Wenzel, Marco Eberstein)

Effects of Al2O3 and B2O3-SiO2 Modification on the Microstructure and Dielectric Properties of BaTiO3 Ceramics
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences

LTCC Multilayer Modules with Integrated Functional Materials
Jorg Topfer, University of Applied Sciences (T. Reimann, R. Lehnert, S. Bierlich, S. Barth, B. Capraro, H. Bartsch de Torres, J. Muller)

Structure-Property Relationships in BaTiO3-BiFeO3-BiYbO3 Ceramics
Antonio Feteira, Christian Doppler Lab in Advanced Ferroic Oxides, Sheffield Hallam University (Luke Luisman, Giorgio Schielo, Marco Deluca, Klaus Reichmann)

Modulating the Temperature Coefficient of the Permittivity by Substrate Induced Texturization in BaO-Ln2O3-TiO2 Thick Films
Ana Senos, University of Aveiro, Ciceco (L. Amaral, P.M. Vilarinho, C. Jamin, O. Guillon)

Alternative Strategies for the Preparation of Multiferroic Thin Films
Paula Maria Vilarinho, University of Aveiro

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding
Mustafa Oezkoek, Atotech Germany GmbH

Surface Characteristics of LTCC Substrates Fabricated by Pressure-Assisted Sintering
Bjoern Brandt, BAM Federal Institute for Materials Research and Testing (Torsten Rabe)

Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Michael Hambuch, University of Erlangen-Nuremberg (Andreas Roosen)

In Situ Characterization of the Sintering Behavior of LTCC Laminates with Embedded Cavities by High Temperature Laser Profilometry
Andreas Heunisch, BAM Federal Institute for Materials Research and Testing (Ulrich Marzok, Marco Munchow, Ralf Muller, Torsten Rabe)

Electroplating and Electroless Plating Process Development for DuPont GreenTape™ 9K7 LTCC
Allan Beikmohamadi, DuPont (Deepukumar Nair, Steve Stewart, Jim Parisi, Mark McCombs, Michael Smith, Ken Souders, J.C. Malerbi, K.M. Nair, Michael Farb)

Application of Cylindrical Pipe-Type LTCC Substrates as a Platform for Multi-Array Gas Sensors
Jaroslaw Kita, University of Bayreuth (Annica Brandenburg, Ralf Moos)

Closing Remarks: 12:00 pm

Register On-Line

Nano Devices 2013 - Only 10 Tabletops Now Available...Program Next Week   ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Packaging the Next Generation of Nano Devices will be held April 30-May 1, 2013, at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York.

General Chair:
Ray Fillion
Fillion Consulting
fillion.consulting@gmail.com

Technical Chair:
John Torok
IBM Corporation
jtorok@us.ibm.com
Technical Chair:
Jing Zhan
IBM Corporation
jingzhan@us.ibm.com

In collaboration with:

CNSE - University of Albany

Binghamton University

Workshop Focus:
The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held April 30 and May 1 in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

Program Available Next Week! Only 10 tabletops still available.If you need assistance, please email Brian Schieman (bschieman@imaps.org) or call 202-548-8715.

Upcoming Webinars - Component Chip Attach and ADVANCED Flip Chip (new)...    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on Basics of Component Chip Attach: Epoxy, Silver Glass, Eutectic, SMT, Nanosilver and Flip Chip
Phillip Creter, Creter and Associates | April 9, and April 11, 2013 at 12:00 NOON EASTERN

PDC Webinar Series on New Developments in ADVANCED FLIP CHIP Applications
Phillip Creter, Creter and Associates | May 7, and May 9, 2013 at 12:00 NOON EASTERN

Abstracts DUE TODAY - Packaging for Medical & Hi-Rel Devices   ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Microelectronic Packaging for Medical and Hi-Rel Devices will be held May 13-14 at the Crowne Plaza Northstar in Minneapolis, MN. Abstracts are DUE TODAY - March 22. Submit abstracts, register, reserve tabletops, and book hotel online at www.imaps.org/medical.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Abstracts are being solicited in the following areas:

  • Trends and Challenges for Class III Medical Implants
  • Applications for Ultra-Miniature Micro-Electronics
  • Human Portable Monitoring Devices
  • Patient Monitoring
  • Innovations in 3-D Packaging
  • Embedded Passives and Associated Technologies
  • Sensor/MEMS Technology for Medical Devices
  • Enabling Technologies for Power Management
  • Micro-Fluidics, Bio-Sensors and Bio-Chips
  • Hermetic and Near-Hermetic Packaging Solutions
  • Advances in Technology for Folded Flex Circuits

An outstanding program is planned with internationally-recognized authorities from industry and academia. Those wishing to present at the Medical Devices Workshop, should submit a 500-word abstract electronically by March 22, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Brian Schieman (bschieman@imaps.org) or call 202-548-8715.

Abstracts Due Next Friday for New Workshop on Advanced Electronics for Mobile Energy Systems (AEMES)    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibits on Advanced Electronics for Mobile Energy Systems (AEMES) will be held June 6-7 at the Florida Solar Energy Center in Cocoa, Florida. Abstracts are due next Friday, March 29. Submit abstracts, register, reserve tabletops, and book hotel online at www.imaps.org/energy.

Overview: The objective of the AEMES Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of electronic packaging, power generation, harvesting and storage for mobile applications. This workshop enables discussion and presentations on the latest materials, process, design & emerging technologies of Mobile Energy Systems and applications.

Abstracts are being solicited in the following areas:

Solar • Batteries • Super Caps • TEG • Rectenna • Fuel Cells

  • Mobile Applications
  • Emerging 3D Electronic Packaging
  • Power Management
  • Thermal Management
  • Module and devices
  • Advanced materials & Processes
  • Additive/Digital Manufacturing/Printed Circuit Structures

Those wishing to present a paper at the workshop must submit a 300-500 word abstract electronically no later than March 29, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions. Full papers are not required. A post-conference CD-ROM containing the presentation material as supplied by the presenter onsite will be distributed to all attendees. Speakers are required to pay a reduced registration fee.

  Chapter Activities (events listed in chronological order)
 

TUESDAY: San Diego Chapter March 26 Meeting on Polymers Hard at Work in Your Smartphone    ^ Top

Date: Tuesday, March 26th at 12:00
Location:

Bank of the West
4180 La Jolla Village Drive, Suite 405
La Jolla, CA 92037
858.352.0008

Registration::

Space is limited to 30 registrants due to room size; please sign up quickly.

$20.00 for RSVPed IMAPS members. $25.00 for non-members. Free for students with an ID.

To register, please contact Dave Virissimo of Semiconductor Packaging Materials at dvirissimo@sempck.com or 619-464-5430.

“Polymers Hard at Work in Your Smartphone”
You might not think that chemistry and polymer processing is a key part of the manufacturing of electronic devices, but without sophisticated polymers and advanced processing techniques, today’s electronic devices would not be possible. There are a wide variety of polymers used in a typical smartphone. These include epoxy resins for printed circuit boards, adhesives to attach semiconductor chips to substrates, and polymer coatings to protect devices from moisture and dirt.

Presenter Bio:
Prior to founding InnoCentrix, Jeff was the Vice President of Technology for Ablestik Laboratories in Rancho Dominguez, CA where he led global R&D and Engineering. Jeff has over thirty years’ experience in polymers for electronic applications. He has held technical and management positions at IBM, AlliedSignal Electronic Materials, Honeywell, and Ablestik Laboratories. Jeff has extensive background in product development, including stage/gate processes, portfolio management, and is a Black Belt in Design for Six Sigma. He has published more than 60 technical articles and book chapters and has 20 patents and patent applications. Jeff is an experienced speaker with presentations at technical societies, trade

Chesapeake Chapter April 3 Spring Symposium at JHUAPL    ^ Top

Date: Wednesday, April 3, 3:00
Location:

Applied Physics Laboratory of Johns Hopkins University
Howard County Room #3
11100 Johns Hopkins Road, Laurel, MD 20723
Click here for map and directions (www.jhuapl.edu)

Enter in the area marked Lobby 1 and check-in with APL staff.
Call Bruce Romenesko of APL at 240-228-8065 for on-site info. only.

Registration::

Registration fees and member discounts to cover the costs:
IMAPS Members-$30, non-members-$40, and students with ID-$5.00.
Only on-line registration by credit card guarantees a dinner seating.
On-line registration ends on Friday, March 29 at COB.
Checks/cash only on-site. Additional fee at the door of $5.00.

Click Here to Register

Program:

3:00 Registration, Participant Introductions, and Brief Opening Remarks.

3:30 "Moisture in Printed Circuit Boards – Risks and Prevention"
Mr. Bhanu Sood, Center for Advanced Life Cycle Engineering

4:00 “Polymeric Materials for Resins, Coatings, and Encapsulants in Extreme Environments”
Dr. Randy Mrozek, Army Research Labs.

4:30 Brief break.

4:45 “Thin Film Electronics: The Real Enabler of Technologies”
Dr. David Gundlach, National Institute of Standards and Technology

5:15 Event wrap-up. Ideas for next event. Other business.

5:30 Dinner

6:30 Event Concludes

Cleveland/Pittsburgh Chapter April 9 Technical Meeting & Tour at GrafTech    ^ Top

Date: Tuesday, April 9 | 2:00-6:30 PM
Location:

GrafTech International Holdings Inc.
Corporate Headquarters, Technology Center, Testing Facility, Pilot Plant, Advanced Flexible Graphite Manufacturing Facility, Sales Office
12900 Snow Road
Parma, Ohio USA 44130
Phone: 1.216.676.2000

Registration::

RSVP before Wednesday, April 3 at 5pm EASTERN
IMAPS members - $ 15.00. Non-members - $ 25.00. Students – $ 5.00
Special Offer – attend the meeting and sign-up for membership for $80 ($75 membership, $5 meeting)
On-line Registration

Program:

2:00: Welcome, Introductions & Round-the-Room Networking
Brian Schieman, IMAPS; John Mazurowski, Penn State EOC; and Richard Beyerle, GrafTech

2:30: Passive Cooling of Portable Electronics using Flexible Graphite
Andy Reynolds, Director of Global Applications Engineering, GrafTech International

3:00: Integrated Analog Optocouplers with Open Optical Channel
Boris Kolodin, BK Optoelectronics LLC

3:30: Refreshment Break & Networking Refreshments, Coffee, & Snacks

3:45: Advanced Passive Thermal Management for LED Bulb Systems
James Petroski, Principal Engineer - Thermal, Rambus

4:15: Diode Array Manufacturing
Ben Johnson, Pressco Techno-Systems LLC

4:45: Dinner, Networking and Chapter Business (John Mazurowski)
Food and Refreshments

5:15: Tour of GrafTech Product Display Room

5:45: Wrap-up Discussions

Metro Chapter April 11 Professional Development Course & Vendor Night    ^ Top

Date: April 11, 2013
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Registration::

Course fees:
500.00 IMAPS Member 600.00 Non Member
Includes Continental Breakfast and Lunch. Also included is admission to the METRO Chapter Vendor Night and Cocktail Reception immediately following

Group discounts are available
To Register: Contact Steve Lehnert Phone (650) 644-5218 Email metroimaps@optonline.net Make Checks Payable to: Metro Imaps
10 Northview Trail Ridge, NY 11961

Introduction to the Basics of Conventional and Advanced Microelectronic Packaging

Course Leader: Tom Terlizzi, GM Systems, LLC.

Course Description: The course presents design, manufacturing, materials, quality and reliability information in terms understandable to engineering and non-engineering personnel. Packaging history, characteristics and drivers will be outlined. Types of packages (IC, chip scale, MEMS, Hybrid, MCM, BGA) and substrates (Thick and thin film, co-fired ceramic, organic) and critical differences among them and their applications will be discussed. The course will look at the design selection to meet use and application environments. Step-by-step manufacturing flow for different packages and products will be presented as an example to understand the complexity of processes, materials and equipment involved in their manufacture. Advanced packaging concepts for 2.5D and 3 D will be introduced. Materials selection with respect to application environments will be discussed. Quality and reliability issues related to chip packaging and SMT and their solution will be outlined.

Who Should Attend? It will help the attendees understand the application and assembly of microelectronic package technology on the next level interconnect and the service environment that microelectronic packages must protect its components. Personnel entering the microelectronic packaging field will have a critical look at the quality, reliability and materials issues related to the development and manufacture of chip packages. Non-packaging personnel will learn the ins and outs of chip packaging. Non-technical personnel will learn the material and manufacturing intricacies of microelectronic packages and the associated buzzwords used to describe them. What you get? Reference notes – paper on thumb drive.

Tom Terlizzi is VP at GM Systems a Management and Technology consulting firm, providing Business & Strategic plans, Acquisitions, Marketing & Sales strategy, Product development for microelectronic projects and business proposal support. He has designed and developed Power management systems, Single board computers, microelectronic circuits, hybrids, COB modules, ICs, RF modules, for over 30 years for military, aerospace, telecom and consumer markets as a VP/GM, Director of marketing, Chief Engineer, Operations/Engineering manager at Aeroflex, Norden/UTC, G.I. Microelectronics and Grumman Aerospace. He spearheaded, acquisitions & mergers of several high tech companies, & ISO9000/Mil-PRF-38534 quality certifications. He received a BEE from CCNY and a MSEE from NYU-Poly & has published several articles, papers and tutorials at international conferences, edited books on electronic packaging, consulted for the DoD on advanced electronic packaging as well as teaching electronics at the US Army Signal School.

 

New England Chapter's 40 Symposium & Expo - Program "Sampler"    ^ Top

Date: Tuesday May 7th, 2013
Location:

Holiday Inn Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

For Complete Technical Program, Registration & Information visit www.imapsne.org

For details about Sponsoring, Exhibiting or Attending Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

Symposium Technical Chair
A. James (Jim) McLenaghan, Creyr Innovation

Symposium Technical Team
Microelectronic Packaging Chairs: Bill Boyce & Mike McKeown
Everything Nano Chairs: Alan Rae & Siva Somu
Thermal Management Chairs: David Saums & Glenn Sundberg
MEMS Chairs: Jacob Trevino & Tina Prevost
DFR, DFM, & Readiness Assessment Chairs: Greg Caswell & Cynthia Hay
LED Applications Chairs: George Hwang & Madis Raukas
Cleaning - Necessity, Process ID & Assessment Chairs: Terry Munson & Eric Camden
Surface Mount Technology Chairs: Jeff Anweiler & Ray Whittier
Poster Session Chairs: Ron Lasky & Daryl Santos

Technical Program Sampler
"Applicability of Non-Hermetic Packaging for Military and Space Applications"

"Using Physics of Failure to Predict System Level Reliability for Avionics"

"Thermal and Electronic Interconnects in LED Packaging and Assembly"

"RF/Microwave Die Attach of GaN Devices in a Flux Free Environment"

"Digital fabrication of flexible circuits with Thermal Transfer Printing"

"New Nano-materials and Structures with Electronic Potential"

"Electrical Current Capabilities of Aluminum Inlay"

"Robotics Assembly from Design to Steady State"

"DNA Marking to Assure Product Authenticity"

"Thermal Conductivity Measurements of Multi-Chip-Module Re-distribution Layers"

"Prognostics for LED Light and Color Degradation by Encapsulant Degradation"

"Application Requirements and Developments for Thermal Core PCBs"

"MEMS Sensors for Surface Flow Sensing in Aerospace Applications"

"Minimizing Voids for Quad Flat-Pack in Lead-Free Assembly"

"Process for Selecting Optimum Wafer Bonding Process"

"Accurate In-Line 3D Measurement for Process Control"

"Thin Film CZTS Solar Cell Using Sputtering Method"

IMAPS France - EMPC 2013 Program Soon    ^ Top
EMPC 2013 CALL FOR PAPERS HAS CLOSED
EUROPEAN ELECTRONICS PACKAGING CONFERENCE

The Technical Program will be available soon

Questions?
Visit EMPC2013 Website www.empc2013.com

Florence VIRETON
Tél: 33 (0) 1 39 67 17 73
email:imaps.france@imapsfrance.org

  Membership Corner
 

Advancing Microelectronics March/April 2013 Magazine Now On-Line - Ceramic Packaging, Thick & Thin Film Materials    ^ Top

March/April 2013:
Volume 40, No. 2
Ceramic Packaging, Thick & Thin Film Materials

The March/April 2013 issue featured four technical articles on: Tracing the Origins of Printed Electronic Materials at DuPont - Reflections from a Recent Retiree; Engineering Solutions in Ceramic Packaging: Meeting the Demand for Performance at Cost; High Density Cofired Platinum/Alumina Microsystems for Implantable Medical Applications; and Tunable Ferroelectric Capacitors Embedded inside LTCC.

download magazine PDF (7mb)

Journal of Microelectronics and Electronic Packaging 4th Quarter 2012 On-Line - Q1 Available Soon   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 9, Number 4
Fourth Quarter 2012



Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, and Heiko Wolf, IBM Research Zurich

149

Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
Quanling Zheng, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein, University of Notre Dame

160
Millimeter-Wave Frequency Performance of Conductor-Backed Coplanar Waveguide on FR408 Packaging Material
Supreetha Aroor and Rashaunda Henderson, University of Texas
166

Design, Fabrication, and Operation of a Nitrogen Monoxide Measurement Device Based on LTCC
Thomas Geiling, Tilo Welker, and Jens Müller, Institute of Micro and Nanotechnologies Ilmenau University of Technology; Christiane Ehrling, Analytik Jena AG

171

All-Dielectric Metamaterials for New Areas of Application
Elena Semouchkina and George Semouchkin, Michigan Technological University; Elena Semouchkina, George Semouchkin, and Michael Lanagan, Pennsylvania State University

178
Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Defi nition Printed Electronic Devices
C. Dossou-Yovo, M. Mougenot, E. Beaudrouet, M. Bessaudou, N. Bernardin, F. Charifi , C. Coquet, M. Borella, and R. Noguera, CeraDrop, Ester Technopole; C. Modes, Heraeus; M. Lejeune, SPCTS; P. Laurier and D. Detemmerman, CMAC; P. Escure and H. Laville, EuroFarad; N. Delhotes and S. Verdeymes, XLIM, CNRS
187
   

STATS ChipPAC

LORD Corporation

EPP

Crane AE Banner

2013 Events:

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

Next Gen Nano Devices
April 30 - May 1
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

Medical & Hi-Rel Devices
May 13-14
*Exhibitors contact bschieman@imaps.org

Mobile Energy Systems
June 6-7
*Exhibitors contact bschieman@imaps.org

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

^ Top

 
 
 
 
 
 
 
 
 
 
 
 
 
 

View the Electronic Bulletin Archives