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October 24, 2013
 

Applied Materials

   IMAPS EVENTS
Button Thermal Management 2013 Workshop - Updated Program & Registration (read more...)

Button Thank you Thermal Workshop Exhibitors & Sponsors - A Few Spaces Still Remain  (read more...)

Button Wire Bonding Workshop & Tabletop Exhibition - Abstracts Due November 1...Registration & Exhibits Now Open! (read more...)

Button Device Packaging 2014 - Call For Abstracts (read more...)

Button GIT 2013 at Georgia Tech Next Month (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet NEXT WEEK: Cleveland/Pittsburgh Chapter Meeting October 29 on Medical Device Packaging At Valtronic USA (read more...)

Bullet NEXT WEEK: San Diego Chapter Meeting October 29 on Trends in Mobile Industry and Impact on Packaging and Integration (read more...)

Bullet Arizona Chapter Lunch Meeting November 14 on Supply Chain Implications for Advanced Packaging (read more...)

Bullet IMAPS New England 41st Symposium & Expo - Call For Paper Now Open! (read more...)

 

MST

RGL Enterprises
F&K Delvotec
LORD Corporation

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Thermal Management 2013 Workshop - Updated Program & Registration   ^ Top
IMAPS will hold its Advanced Technology Workshop and Tabletop Exhibit on Thermal Management at the Toll House in Los Gatos, California from November 5-7, 2013. Visit the workshop website at www.imaps.org/thermal for registration and more details.

NEW THIS YEAR - KEYNOTE SPEAKERS:

Samsung Electronics | Sung Ki Kim

HP Labs, Hewlett-Packard Co. | Cullen Bash, Distinguished Technologist and Director of Software-Defined Systems Research Group

Intel Corporation | Gaurang N. Choksi, Director, Core Competency, Assembly & Test Technology Development

Tuesday, November 5, 2013

Registration: 7:30 am - 8:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibits Open: 9:00 am - 5:30 pm (During Breaks & Lunch)

Opening Remarks: 9:00 am - 9:15 am

Market Drivers: KEYNOTE
Session Chair: Dave Saums, DS&A LLC
9:15 am - 10:00 am

The Needs and Opportunities for Thermal Management in Consumer Electronics
Sung Ki Kim, Samsung Electronics

Abstract: Thermal issues have gained significant importance, and thermal management technology has evolved to make consumer electronics devices more versatile and powerful in a compact enclosure. In this presentation, we will share the trend of consumer electronics for the past ten years and corresponding development of thermal management technologies to solve the cooling challenges therein. In this presentation, we will show how the needs for thermal management have evolved. For example, the advancement of projection display devices initiated the development of high-performance robust heat dissipating devices, and the miniaturization technology of a liquid cooling system enabled thermal management of high-power LEDs and Xenon lamps with higher brightness, lower acoustics and longer life time. In addition, as more devices incorporate sleek design and portability becomes increasingly important for devices such as smart phones, it led to the development of very thin heat spreaders to manage heat from sources. In response, graphite products and heat pipes have evolved every year, achieving high conductivity of over 1500 W/mK and thickness of 0.6 mm respectively. The trend of high-power density in consumer electronics is expected to continue and we will discuss how these evolving thermal management needs can be met with future technologies. Finally, we will propose how inter disciplinary cooperation between academia and industry can contribute to the successful implementation of consumer electronics technologies.

Session 1: TIM Testing Methods and Requirements
Session Chair: Dave Saums, DS&A LLC
10:00 am - 12:30 pm

Practical Aspects of Thermal Interface Material Testing Methods
Dave Saums, DS&A LLC

Break in the Exhibits: 10:30 am - 11:00 am

An Application-Oriented TIM Thermal Measurement Approach
George Meyer, Celsia Inc; Bernie Siegal, Thermal Eng Assoc. (Tom Tarter, Erin Chen)

Challenges of Thermal Interface Materials in Test of IC Packages
Jaime Sanchez, Intel Corporation

Device Level Thermal Characterization for Photonics and Power Devices
Kazuaki Yazawa, Microsanj LLC (Dustin Kendig, Ali Shakouri)

Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Lunch Presentation - 12:45pm - 1:15pm:
Ancient Engineers Constructed Elaborate Water Supply and Distribution Systems
Charles Ortloff

Abstract: Ancient engineers constructed elaborate water supply and distribution systems for their cities using fluid mechanics technologies predating "official" discovery" by western science by thousands of years. By application of modern CFD methods, the engineering used in ancient water systems can be revealed for the first time. Example cases of surprising technical applications in water engineering used in 300 BC-600 AD Petra (Jordan), 300 BC-1100 AD Tiwanaku (Bolivia), 400- 850 AD Angkor (Cambodia), 100 AD Pont du Gard Aqueduct (Roman France), 400 BC-100 AD Priene (Turkey) and 800 AD coastal Peru illustrate aspects of ancient technology only being discovered in recent times.

Session 2: Thermal Analysis and Modeling I
Session Chair: David Copeland, Oracle
2:00 pm - 3:30 pm

Modeling Thermoelectric Power Generation
John Langley, Ambient Micro LLC (Kristof Hovaten)

Heatsink Thermal Analysis and Optimization using BOE Calculations
Ernest Thurlow, San Jose State University

Micro-Channel MicroCooling Simulation Code
Matt Reeves, Wolverine Tube Inc. - MicroCool Division (Scott Holland, Dwight Brown)

Break in the Exhibits: 3:30 pm - 4:00 pm

Session 3: Advancements in Packaging Materials
Session Chair: George Meyer, Celsia Technologies
4:00 pm - 5:30 pm

Advances in the Use of AuSn Solder for Die Attach
Richard Koba, Materion Corporation

Wide Surface Aluminum Soldering
William Avery, Superior Flux & Mfg. Co. (Yehuda Baskin)

Ultra-Thin B-staged Thermoplastic Polyimide Bondfilm
Jim Fraivillig, Fraivillig Technologies Company

Dinner: 5:30 pm - 7:00 pm

Dinner Sponsored by:

Corporate Sponsor - Bergquist Company
Premier Sponsor - SAMJIN TECH

 

Session 4: Advanced TIM Research
Session Chair: Tannaz Harirchian, Intel ATTD
7:00 pm - 8:30 pm

Thermal Expansion in Bonded Carbon Nanotube Forest Interfaces
John Taphouse, Georgia Institute of Technology (Baratunde Cola)

Enhancing and Manipulating Thermal Transport in Thermal Interface Materials Through Molecular-level Engineering
Tengfei Luo, University of Notre Dame (Teng Zhang)

New Developments in Flexible Graphite Thermal Interface Materials
Martin Smalc, Graftech International Holdings Ltd. (Mathew Getz)

 

Wednesday, November 6, 2013

Registration: 8:00 am - 8:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibits Open: During Breaks & Lunch (10:30-11, 12:30-2, 3:30-4)

Market Drivers: KEYNOTE
Session Chair: Dave Saums, DS&A LLC
9:00 am - 9:45 am

The Future of Computer Architecture and Implications on Thermal Management
Cullen Bash, HP Labs

Abstract: The way in which computer systems are designed and built has gone largely unchanged over the past 50-plus years. While components have gotten smaller and more integrated, enabling significant performance and efficiency improvements, the basic architecture of machines continues to be based on traditional compute, memory and storage hierarchies that use copper wires for communication. This design paradigm is in the process of undergoing several “tectonic shifts” that will change the way in which computer systems are assembled and programmed, and which will enable new ways to interact with the explosion of data that is expected over the next decade. This talk will explore three fundamental technologies that are expected to converge and provide the foundation for the next generation of system architecture within the next decade. In particular, it will explore the emergence of non-volatile memory and its role in the flattening of the traditional storage-memory hierarchy. Evolutionary changes in microprocessor design, particularly with respect to chip-level integration will also be discussed. Additionally, the role of photonics as a potential replacement for copper wires in communication fabrics will be examined. Finally, for each technology shift, the impact on thermal architecture and energy management will be explored and challenges and opportunities will be highlighted.

Session 5: Thermal Components Research
Session Chair: Marlin Vogel, Juniper Networks
9:45 am - 12:30 pm

Thermal Management of COB LED Arrays Using an Advanced Cooling Technology
Brandon Noska, Bridgelux, Inc.

Break in the Exhibits: 10:15 am - 11:00 am

The effects of bending on heat pipes and vapor chambers: Guidelines from real products
George Meyer, Celsia Inc

Energy Efficient Cooling vs Waste Energy Recovery using Thermoelectrics
Kazuaki Yazawa, Purdue University (Ali Shakouri)

Enhancing Fan Efficiency to Lower Power and Improve Acoustics
Roger Dickinson, Bergquist Torrington Company

Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Lunch Presentation - 12:45pm - 1:15pm:
AT&T Network 2020 – Revolutionizing the Telecommunications Network - Engineering Advances Required to Realize the Transformation
Dave Redford, AT&T

 

Session 6: Thermal Interface Materials and Testing
Session Chair: Guy Wagner, Electronic Cooling Solutions
2:00 pm - 3:30 pm

Liquid Dispensed Thermally Conductive Materials
Sanjay Misra, The Bergquist Company

Correlation between Hardness and Storage Modulus of Silicone Gels for Thermal Interface Materials
Kristina Chano, NuSil Silicone Technology (Robert Krizan, Robert Naggs)

Development of a Novel Reliable TIM1
Jason L. Strader, Laird Technologies

Break: 3:30 pm - 4:00 pm

Session 7: Single & Two-Phase Cooling
Session Chair: John Peeples, The Citadel
4:00 pm - 5:30 pm

Transient Heat Exchanger Compact Models for Data Center Applications Using Artificial Neural Networks
Marcelo del Valle, Villanova University (Alfonso Ortega)

Experiments and Modeling of a Cabinet Level Two-Phase Thermosyphon Based Thermal Management System for Rack Mounted Servers
Benjamin Zuk, Villanova University (Alfonso Ortega, Steven Schon, David Santoleri)

Managing Temperature Difference Between Critical Components
Guy Diemunsch, Electronic Cooling Solutions Inc. (Guy Wagner)

Dinner: 5:30 pm – 7:00 pm

Dinner Sponsored by:

Corporate Sponsor - Bergquist Company
Premier Sponsor - SAMJIN TECH

 

Session 8: High Conductivity Materials and Structures
Session Chair: Tannaz Harirchian, Intel ATTD
7:00 pm - 8:30 pm

High Thermal Conductivity Low CTE Thermal Management Products
Aaron Rape, Momentive Performance Materials (Wei Fan, Xiang Liu)

Latest Developments in Diamond Cooling of GaN RF Devices
Brooke Locklin, Element Six Technologies US Corporation (Dan Twitchen)

Embedded (Near Source) Cooling - Application to Next Generation Thermal Management Systems
Michael Ohadi, University of Maryland (Raphael Mandel, Serguie Dessiatoun)

 

Thursday, November 7, 2013

Registration: 8:00 am - 1:00 pm
Continental Breakfast: 8:00 am - 9:00 am

Market Drivers: KEYNOTE
Session Chair: Dave Saums, DS&A LLC
9:00 am - 9:45 am

Enabling Innovation and Integration in Electronic Packaging: Are Modeling, Simulation and Measurement Capabilities Falling Behind?
Gaurang Choksi, Intel Corporation

Abstract: Advances in electronic packaging have supported silicon technology scaling and the package has evolved to become an important enabler of product performance and differentiation. The various market segments ranging from consumer electronics, hand held devices such as phones, tablets, UltrabooksTM and convertibles, to high performance servers; result in an extremely diverse set of designs, multiple levels of integration, materials, and manufacturing processes, extending from 2D, 2.5 to 3D packaging architectures. The engineering of semiconductor packaging has advanced over the past decades and has kept pace with supporting higher performance and cheaper computing devices with hundreds of millions of transistors. The rate of progress in this area will continue to require significant improvements in the collaterals required to enable time-sensitive and cost-effective technology development. This includes appropriate modeling/simulation software tools and measurement tools /techniques for the analysis, characterization, validation and optimization of the different steps of the assembly manufacturing and test process, materials used, mechanical integrity, signal integrity, power delivery and thermal management. Given the pace of feature scaling, level of functional integration, drive to ubiquitous computing, and smaller devices and form factors, are these tools losing the race? Are the modeling, simulation and metrology tools and methods keeping pace with electronic packaging technologies that are required to sustain Moore's Law? Do they provide the right level of capability to help understand and quantify responses to enable cost/performance effective trade-offs and drive decisions across design, materials and manufacturing process parameters for current and future technologies? A critical review of this area will be presented. This presentation will first provide an overview of typical current and future package technologies and associated demands across the different market segments. Challenges that need to be addressed for facilitating the effective analysis and characterization to enable efficient design, materials selection and associated assembly and test manufacturing processes will then be reviewed. This will be mapped to an assessment of the current state-of-the-art and the areas of opportunities where analysis and measurement tools and methods do not provide adequate capability. The role of inter-disciplinary solutions and the need for new competencies will be discussed. A broad perspective of the need for improved solutions, including multi-physics and multi-scale approaches, will be reviewed. Recent trends in technologies, advanced analysis / simulation tools and metrologies and their applications to electronic packaging will be comprehended.

Session 9: 2.5D & 3D Packaging
Session Chair: Vadim Gektin, Futurewei Technologies
9:45 am - 10:45 am

Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation
Ron Zhang, Invensas Corporation (John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, Laura Mirkarimi)

Thermal Performance Enhancement of Glass Interposers with Copper Vias Similar to Silicon Substrates
Sangbeom Cho, Georgia Institute of Technology (Yogendra Joshi, Venky Sundaram, Rao Tummala)

Break: 10:45 am - 11:00 am

Session 10: Thermal Analysis and Modeling II
Session Chair: David Copeland, Oracle
11:00 am - 1:00 pm

Determining the Limits of Natural Convection Cooling for Hand-Held Consumer Electronics Products
Guy Wagner, Electronic Cooling Solutions

A Discrete Tangent based Sensitivity Analysis Method for Electronics Packaging Thermal Management
Prabhu Sathyamurthy, Amoeba Technologies Inc. (Sanjay Mathur)

Thermal Test Chip - the Update
Bernie Siegal, Thermal Engineering Associates, Inc.

Assessing Thermal Management Methods in System-on-Package (SOP) Systems for Electronic Packaging
Edwin Okoampa Boadu, University of Electronics Science and Technology of China (Eric Ashalley)

Closing Remarks: 1:00 pm

Register On-Line

Thank you Thermal Workshop Exhibitors & Sponsors - A Few Spaces Still Remain   ^ Top
IMAPS will hold its Advanced Technology Workshop and Tabletop Exhibit on Thermal Management at the Toll House in Los Gatos, California from November 5-7, 2013. The workshop will again feature a small tabletop exhibition for the vendors and attendees to network over two days of this event. Only a few spots are still available. Visit the workshop website at www.imaps.org/thermal for tabletop registration and more details.

Questions about exhibits?
Brian Schieman, IMAPS, bschieman@imaps.org

Thank you to our Workshop Premier Sponsors:
Premier Sponsor - Bergquist Company Premier Sponsor - SAMJIN TECH

Here are the companies that have already reserved exhibit space:

Exhibitor
Booth
Booth Type
Tabletop # 14
Tabletop
Tabletop # 01
Tabletop
Tabletop # 12
Tabletop
Tabletop # 04
Tabletop
Tabletop # 10
Tabletop
Tabletop # 05
Tabletop
Tabletop # 07
Tabletop
Tabletop # 06
Tabletop
Tabletop # 09
Tabletop
Tabletop # 13
Tabletop
Tabletop # 03
Tabletop
Tabletop # 02
Tabletop
sp3 Diamond Technologies, Inc.
Tabletop # 15
Tabletop
Thermacore, Inc.
Tabletop # 11
Tabletop
Tabletop # 08
Tabletop
Tabletop # 16
Tabletop

A Few Tabletops Still Available - Register On-Line

Wire Bonding Workshop & Tabletop Exhibition - Abstracts Due November 1...Registration & Exhibits Now Open!   ^ Top
IMAPS will hold its Workshop and Tabletop Exhibit on Wire Bonding at the Radisson Hotel San Jose Airport in San Jose, California from January 21-22, 2014. The workshop will again feature a small tabletop exhibition for the vendors and attendees to network over two days of this event. Abstracts are due NEXT FRIDAY, November 1. Visit the workshop website at www.imaps.org/wirebonding to submit your abstracts, for tabletop information, registration and more details.

Thank you to our Corporate Sponsor:
Corporate Sponsor: Hesse Mechatronics
See wire bonding in action... with a link to www.wirebonddemo.com

The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

  • Cu/Low-K packaging processes
  • Terminal pad structures and modifications
  • Wire and Tool Advances
  • Assembly processes and handling issues
  • Copper Wire Bonding
  • Heavy and Fine Wire Wedge Bonding
  • Automotive and other Harsh Enviroments
  • Novel packaging and design
  • Failure Analysis and Reliability
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically before November 1, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

All Speakers are required to pay a reduced registration fee and are required to attend the entire event.


Submit Abstract(s)

Register On-Line

Device Packaging 2014 - Call For Abstracts   ^ Top
The 10th Annual Device Packaging Conference (DPC 2014) will be held in Fountain Hills, Arizona, on March 10-13, 2014. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). Abstracts are due November 22. Visit www.imaps.org/devicepackaging to submit your abstracts, for exhibit information, registration and more details.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring Topical Workshop Tracks on:

  • 2.5D/3D IC & Packaging;
  • Flip Chip and Wafer Level Packaging; and
  • Packaging Innovations & System Challenges for:
    MEMS, Sensors & Miniaturized Devices; Photonics & LED Packaging

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than November 22, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 24, 2014. A post-conference USB containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before January 10, 2014 at: www.imaps.org/devicepackaging or contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2014 - so book early!

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 10th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/pdc no later than November 22, 2013.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.

GIT 2013 at Georgia Tech Next Month   ^ Top

GIT 2013
  Chapter Activities (events listed in chronological order)
 

NEXT WEEK: Cleveland/Pittsburgh Chapter Meeting on Medical Device Packaging At Valtronic USA    ^ Top
IMAPS Cleveland-Pittsburgh Chapter Technical Meeting & Tour
Tuesday, October 29 | 2:00-6:30 PM
Valtronic Technologies (USA) | Solon, Ohio

Please join us for technical presentations, facility tour and networking

Program:

2:00: Welcome, Introductions & Round-the-Room Networking
John Mazurowski, Penn State EOC; Brian Schieman, IMAPS

2:30: Introduction to Valtronic Technologies
Don Styblo, Valtronic Technologies (USA)

2:45: Non-hermetic Micropackage for Chronic Implantable MEMS Systems
Peng Wang, Case Western Reserve University

As MEMS technology continues to be developed for medical implant applications, new packaging technologies that match the small size, weight and flexibility of the MEMS devices themselves are required. The package must be biocompatible and have a small form factor while providing mechanical and electrical protection to the implanted device. In this presentation, we introduce a non-hermetic micropackaging technology developed at CWRU for chronic implantable electronic systems, based on Ko’s multilayer multi-material coating theory developed from previous research work [1-5]. The micropackaging technology aimed to have ultra-low volume (less than 200um thick), pressure sensor compatible and more than 2 year’s lifetime.

3:15: Refreshment Break & Networking Refreshments, Coffee, & Snacks

3:30: Human Performance Applications for MEMS and Sensors
Matt Apanius, SMART Commercialization Center for Microsystems

The massive adoption of MEMS motion sensors has led to the emergence of applications for measuring various aspects of physical activities related to athletics and physical fitness. Improvements in cost, infrastructure, and data processing have enabled the development of compact, comprehensive sensor-based products. However, these systems do not address methodologies that measure sustainment at the limits of human performance and are not useful for predicting and influencing behavioral responses to physical or environmental stress. The human body is a dynamic system where common practices only capture a fraction of the data that exists. Real time measurements of physiological phenomena combined with physical motion can be captured in a laboratory setting. As this is also somewhat limiting, MEMS-based sensor solutions have the potential to enable numerous applications where both physiological and physical data are needed such as athletics, personal fitness, wellness, clinical care, and diagnostics.

4:00: Medical Sensing Using Optical Fibers and Devices
Lucas Cashdollar & John Mazurowski, Penn State Electro-Optics Center

Design and packaging of optical sensors for medical applications will be discussed. Specifically, fiber optic sensors may be used for imaging and spectral measurements. Developers may begin with an application and develop specific sensors, or use available sensors and look for signals that correlate with the application.

4:30: PRESENTATION TITLE - TBD
AUTHOR TBD, Orbital Research

5:00: Dinner, Networking and Chapter Business (John Mazurowski) Food and Refreshments

5:30: Tour of Valtronic Technologies (USA)

Event Location & Directions:

Valtronic Technologies (USA) Inc.
29200 Fountain Parkway
Solon, Ohio 44139
Tel : (888) 291 9422 or (440) 349 1239

Registration Fees:

IMAPS members - $ 15.00.
Non-members - $ 25.00.
Students – $ 5.00
Special Offer – attend the meeting AND receive 6-month “Trial” membership for $35 On-line

On-Line Registration

NEXT WEEK: San Diego Chapter Meeting October 29 on Trends in Mobile Industry and Impact on Packaging and Integration    ^ Top
IMAPS San Diego Chapter
Tuesday, October 29th at 12:00

Lunch Technical presentation on
Trends in Mobile Industry and Impact on Packaging and Integration
Space is limited so please sign up quickly!

Abstract

The last decade has seen an exponential growth in the mobile phone and computing industries. The emergence of smartphones and the ever growing demand of packing more and more features and functionality by the consumers have rapidly driven innovations in advanced packaging and integration. This talk will provide an overview of the latest trends in the mobile and wireless industries, with examples of architectural platforms, several disruptive technology platforms as well as evolutionary trends towards integration and miniaturization. The key focus of this presentation will be on emerging technologies, such as 2.5D TSV interposers and 3D IC integration. The applications of 3D IC integration include CMOS image sensor, MEMS, LED, memory + logic, logic + logic, and memory + microprocessor. For 2.5D, active and passive interposers using Si and glass will be covered. Current R&D and industry status will be presented, including technical, cost, and business factors.

Presenter Bio:

Urmi Ray is currently the technical program manager for Qualcomm's Through Silicon Stacking (TSS) program and is also leading a program on low cost interposer technology. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in NJ working on advanced materials and reliability for a diverse set of product portfolios, including consumer products to high reliability telecommunications projects. She is currently active in the 3D technology area. She has a PhD from Columbia computing systems.

Logistics:

Tuesday, October 29th at 12:00 PM.
Lunch served, followed by presentation.

Location:
Qualcomm, Bldg. R, 10185 McKellar Ct., San Diego, CA 92121

Space is limited to 40 registrants due to room size; please sign up quickly.

$20.00 for RSVP’d IMAPS members. $25.00 for non-members.
Free for students with an ID.

Registration closes Friday, October 25th, at noon. To register, please contact David Virissimo of Coining Inc. at David.Virissimo@ametek.com or 619-464-5430

Arizona Chapter Lunch Meeting November 14 on Supply Chain Implications for Advanced Packaging    ^ Top
Please join the IMAPS Arizona Chapter for our November Luncheon
Thursday, November 14, 2013
Dobson Ranch Inn, Mesa AZ

Registration and exhibits will open at 11:30
Lunch and Presentation from noon to 1pm
Exhibits close at 1:30

Supply Chain Implications for Advanced Packaging
Presented by: Jim Walker, V.P. of Research, Gartner

The markets for advanced packaging have been the major driver for back-end processing in recent years. Many device makers have stated that between 28 and 20nm fab nodes a predominant number of their products will move to flip-chip and wafer-level based processes. This has, and will continue to, introduce new materials, production processes and equipment into the packaging space.

While advanced packaging has been a major growth segment, there are competitive wafer-based processes, in particular, 2.5D and 3D utilizing through silicon vias (TSV) that have shown promise. TSV has been discussed as a major industry initiative for more than 5 years, but has yet to launch into mainstream markets, being limited thus far to high-end products such as FPGA's and memory for file servers. Concerns over production costs and device yield still plaque this market.

This presentation will focus on the latest semiconductor market forecast, including advanced packaging along with supply chain implications for future IC nodes that will utilize wafer level, bumping and TSV processes. Technical, yield and cost issues for these advanced processes will be discussed, along with Gartner's forecast for the overall packaging, test, WLP equipment and 3D/TSV markets.

About Our Speaker
Jim Walker - Vice President - Gartner Jim Walker is vice president of research for Gartner's Worldwide Semiconductor Manufacturing group. Mr. Walker's focus is on semiconductor packaging, assembly and test; semiconductor outsourcing services; PCBA and MEMS. He was a founding member and past national president of the SMTA, and has held memberships in SAMPE, MEPTEC, and ASQC. Before joining Gartner, Mr. Walker was the co-founder and vice president of marketing for Hana USA, a semiconductor assembly and test services (SATS, or OSAT) company. Prior to that, at National Semiconductor, he served as SMT packaging, marketing and strategy manager. Upon graduating with a B.S in Chemistry from California State Polytechnic University, with additional postgraduate work at California State University Los Angeles, Jim started his career developing polymeric materials for adhesive, composite, aerospace, electronic, and semiconductor applications while at Dexter Electronic Materials and DuPont. Mr. Walker also serves or has served on the advisory boards of MEPTEC, Advanced Packaging Magazine and Surfect Technologies, a MEMS and nanotech materials/equipment company.

Luncheon and presentations - $25.00 in advance / $30 at door.

Register On-line by Nov 12.
All IMAPS members who register by end of day November 12 will receive a $5 Starbucks gift card at the door!

IMAPS New England 41st Symposium & Expo - Call For Paper Now Open!    ^ Top
iMAPS New England – 41st Symposium & Expo
The Largest Regional Symposium Dedicated to Microelectronics and Packaging

May 6, 2014
Holiday Inn – Boxborough Woods Conference Center Boxborough, Massachusetts

  • Advanced Packaging Concepts
  • Novel Materials & Processes
  • Surface Mount Technology
  • Thermal Management
  • Defense Electronics
  • Assembly and Test
  • Ceramics, Polymers and Conductive Materials
  • Automotive & Consumer Applications
  • Embedded and Integrated Passives
  • MEMS and Nano Technology
  • Alternative Energy
  • Optoelectronics

Submit Abstracts to Roger Benson – Vice-President, iMAPS New England
Deadline for Submission – December 31, 2013

Please e-mail your 250 word abstract to: roger.benson@verizon.net.

 

Torrey Hills Technologies

Oneida Research Services

Metallix

2013 Events:

Thermal Management 2013
Nov. 5-7
*Exhibitors contact bschieman@imaps.org

2014 Events:

Wire Bonding 2014
Jan. 21-22
*Exhibitors contact bschieman@imaps.org

Device Packaging 2014
Mar. 10-13
*Exhibitors contact bschieman@imaps.org

RF/Microwave 2014
April TBD
*Exhibitors contact bschieman@imaps.org

High Temperature (HiTEC 2014)
May 13-15
*Exhibitors contact bschieman@imaps.org

IMAPS 2014 - San Diego
Oct. 13-16
*Exhibitors contact bschieman@imaps.org

^ Top

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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