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September 12, 2013
 

Applied Materials

   IMAPS EVENTS
Button LAST CALL: Thermal Management 2013 Workshop - Abstracts Due September 20 (read more...)

Button IMAPS 2013 Features 5 Keynotes and a 3D IC Panel Discussion  (read more...)

Button GLOBAL BUSINESS COUNCIL (GBC) Keynote Luncheon & Market Forecasting Analyst Session (read more...)

Button IMAPS 2013 Plant Tour to Micross Components - RSVP To Reserve Your Seat (read more...)

Button IMAPS Orlando Golf Is Closing Soon! (read more...)

Button Discounted Disney Tickets... (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Carolinas Chapter Revival Meeting September 13 (read more...)

Bullet Indiana Chapter September 19 Meeting at GM Components Holdings (read more...)

Bullet Save The Date for the Viking Chapter's First NDSU Microelectronics Summit on October 18 (read more...)

Bullet IMPACT-IAAC 2013 - Agenda, Registration Now On-Line (read more...)

Bullet Save The Date for the Next Cleveland/Pittsburgh Chapter Meeting: October 29 (read more...)

Bullet IMAPS New England 41st Symposium & Expo - Call For Paper Now Open! (read more...)


   MEMBERSHIP CORNER

Bullet Journal of Microelectronics and Electronic Packaging 2nd Quarter 2013 On-Line - Q3 Available Soon  (read more...)


MST

RGL Enterprises
F&K Delvotec
LORD Corporation

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

LAST CALL: Thermal Management 2013 Workshop - Abstracts Due September 20   ^ Top
IMAPS will hold its Advanced Technology Workshop and Tabletop Exhibit on Thermal Management at the Toll House in Los Gatos, California from November 5-7, 2013. Abstracts are now due September 20, 2013. Visit the workshop website at www.imaps.org/thermal for more details.

Exhibit information available soon. Contact bschieman@imaps.org if you wish to reserve one of the limited number of tabletops available at the Toll House.

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992, and is considered to be one of the most successful of the IMAPS ATWs that are held each year. Information will be available on transportation methods by train and/or bus from area airports.

Speakers are expected to attend the entire Workshop to maximize opportunities for interaction with registered attendees. Every year, authors and attendees find this IMAPS Workshop format to be a proven forum for highly effective networking between attendees and speakers. Speakers pay a reduced registration fee, making participation even more beneficial.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Thermal challenges and business and economic drivers which influence change in electronic systems design and manufacturing. Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that are included in this session. Such market and business data sets the framework for new technical solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, telcom, IGBT, RF, and microwave components and systems. Standards for testing and reliability. Organic, metallic, metal, graphitic, and other forms of TIMs are included, as well as developments with nanomaterials.
  • CTE-Matching and High Thermal Conductivity Materials:  Metallic, ceramic, and other composite materials with excellent thermal conductivity and coefficient of thermal expansion targeted to that of GaN, SiC, silicon, or ceramic materials. 
  • Stacked-Die and Device Packaging:  Chip-level packaging, including System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die and related thermal and interconnect challenges.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Performance, flexibility, reliability, and serviceability improvements.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Cooling provisioning, airflow, temperature distribution, and migration paths to system liquid cooling.
  • Power Semiconductor Thermal Components, Systems, and Solutions:  Discrete and multichip IGBT packaging.
  • Mil/Aerospace:  Thermal management solutions for emerging and future military and aerospace components and platforms.
  • Telecommunications Systems:  Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics:  Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than September 20, 2013. No formal technical paper is required.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

A post-conference CD containing the full presentation material as supplied by authors will be mailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than November 7, 2013, and will be included on the post-conference CD.

Questions:  Brian Schieman with questions bschieman@imaps.org or 412-368-1621. You may also contact the workshop chairs.

IMAPS 2013 Features 5 Keynotes and a 3D IC Panel Discussion   ^ Top
The 46th International Symposium on Microelectronics will be held September 30 through October 3 at the Rosen Centre Hotel in Orlando, Florida, USA, and is being organized by the International Microelectronics Assebmly and Packaging Society (IMAPS).

The technical committee has secured world re-nown keynotes this year from Fraunhofer IZM, GLOBALFOUNDRIES, Micron, CNSE at Albany SUNY Nanofab, and TEL NEXX at Tokyo Electron. This year in Orlando, we have setup an entire morning of the conference dedicated to 2.5D & 3D IC, Interposers, Packaging with the three keynotes from Micron, CNSE and TEL NEXX focused on these topics, followed by a panel discussion on "What are preventing 3D IC integrations from High Volume Manufacturing?" Details below. All attendees can participate in the keynote presentations and the panel discussion - "Exhibits Only" (non-paying) attendees as well.

Tuesday, October 1 | 12:00 PM - 12:45 PM | KEYNOTE:
Next Generation of Electronic Systems - Challenges and Solutions for System Integration Technologies

The use of micro-level integration technologies to manufacture high-end electronic systems has increased dramatically around the world, the potential for applications being almost unlimited. To enable a smart planet, driven partly by the internet of things, next generation of electronic systems are expected to be more energy efficient, highly miniaturized and multifunctional with embedded computing, communication and sensing functionalities. In order to achieve this goal, novel heterogeneous system integration technologies and design methodologies are needed.

In this talk, some of the key system integration technologies required for the development of next generation electronic systems will be discussed. The focus will be on 3D wafer level packaging, panel level packaging and on interposer technologies. An overview of innovative electrical, thermal and thermo-mechanical design approaches will also be given.

 

Keynote: Klaus-Dieter Lang

Prof. Dr. -Ing. Dr. sc. techn. Klaus-Dieter Lang - Klaus-Dieter Lang is a Professor with the School of Electrical Engineering and Computer Sciences at the Technical University Berlin, Germany, where he leads research activities in the area of Nano Interconnect Technologies. He is also the Director of the Fraunhofer Institute for Reliability and Microintegration, IZM, Berlin.

Professor Lang began his career as a Research Engineer at Humboldt University Berlin, where he spent 10 years (1981 to 1991) working in the areas of Microelectronic Assembly, Packaging and Quality Assurance. In 1991, he moved to SLV Hannover to build up a Department for Microelectronic and Optic Components Manufacturing. He joined Fraunhofer IZM 20 years ago and was initially responsible for R&D activities in the area of Chip Interconnection Technologies. From 2001 to 2005 he coordinated Fraunhofer IZM's Lab on Microsystem Engineering in Berlin-Adlershof, and from 2003 to 2005 he was the Head of the Department of Photonic and Power System Assembly. In 2006, he was appointed as the Deputy Director of Fraunhofer IZM, a position he held till 2010. Since 2011 he has been the Director of the Institute.

Professor Lang Chairs the German Chapter of IEEE-CPMT and he is a member of numerous scientific boards and conference committees. He is the author and co-author of 3 books and more than 130 publications in the field of Wire Bonding Technologies, Microelectronic Packaging, Microsystems Technologies and Chip-on-Board Technologies. He studied Electrical Engineering at the Humboldt University Berlin, and holds a Master's degree and two Doctorate degrees.

 

Wednesday, October 2 | 11:20 AM - 12:05 PM | KEYNOTE:
Progress in Developing an Open Supply Chain for 2.5D/3D Market Enablement

An open supply chain requires close collaboration, early investment, and focus on the ultimate goal of yield and cost to enable markets. An open supply chain is more complex to develop but will provide the end-customer with the most flexibility and transparency and enables use of expertise in each stage of the supply chain. An open supply chain also requires high levels of sharing, not typical in our industry. Significant progress has been made in test chip development, TSVs, interposers, test strategy, yield, and cost. Data and remaining challenges will be presented in each of these areas. The relationship between memory architecture and cost will also be discussed.

 

Keynote: David McCann

David McCann is Vice President of Packaging at GLOBALFOUNDRIES in Malta, New York. In this role, David is responsible for Packaging R+D, interconnect development, and back-end strategy and implementation. David started at GLOBALFOUNDRIES in 2011.

Prior to GLOBALFOUNDRIES, David worked at Amkor Technology for 11 years, in product group and development roles. He also led cross-functional teams including networking product strategy and mobile product development.

David has supported the Electronic Component and Technology Conference for more than 10 years. He was General Chair in 2012.

David McCann received his Masters in Engineering Management from the Santa Clara University in 1985 and his BS in Ceramic Engineering from the University of Illinois in 1981.

An entire morning of the conference dedicated to 2.5D &
3D IC, Interposers, Packaging...

3D KEYNOTE PRESENTATIONS:

8:00 AM - 8:45 AM
Micron's Hybrid Memory Cube - the New Standard for Memory Performance

Yole Développement research analysts project a $40B market for TSV-enabled 3D devices by 2017 -- nearly 10% of the global chip business. These projections rely heavily on leading technologies such as the Hybrid Memory Cube (HMC) which represents a fundamental change in memory construction and connectivity.

HMC is a three-dimensional structure with a logic device at its base and a plurality of DRAMs vertically stacked above it using through-silicon via (TSV) connections. In this talk, the HMC concept is analyzed, exploring how the DRAM functions are re-architected to deliver a scalable, energy efficient system architecture, delivering extremely high performance and resiliency. The presentation will also address how innovative and disruptive solutions such as HMC require equally innovative tools, ecosystems and go-to-market strategies.

3D Keynote: Scott Graham

Scott Graham - General Manager, Hybrid Memory Cube Technology
Micron Technology, Inc.

Mr. Graham joined Micron in 1994 as an applications engineer in the personal computing division. He has held various managerial positions within Micron and has spent the last 11 years in Micron's memory products division, working on technical marketing for DRAM and NAND memory products. In recent years, Mr. Graham has represented Micron in various organizations responsible for setting industry standards, holding numerous vice-chair, chair, and board-level positions.

Mr. Graham holds a Bachelor of Science in Electronic Engineering Technology from DeVry University and a micro-MBA certification from Boise State University.

8:45 AM - 9:30 AM
Overview of Critical 3D Integration Challenges to Bring Products to Market

The widespread adoption of 3D Integration is inevitable with many companies introducing products into manufacturing or beginning the latter stages of development [1-3]. In this talk, we will discuss three focus areas that need improvement and cost reduction in order to bring 3D integration into the mainstream.

A critical issue that CNSE is currently investigating is thin-wafer handling, which presents many problems in terms of process handling of thinned wafers, debonding from carrier wafers, cleaning, dicing, and shipping. Each of these process steps pose some risk of wafer breakage or defects that decrease process yield and increase final costs. This remains as a significant challenge for the up scaling and mass production of 3D integration products. These challenges and potential solutions will be discussed in this presentation.

The other area that is of high interest to the 3D community is the bonding method used to connect each layer of a 3D stack. Three types of bonding methods are examined: copper-to-copper (Cu-Cu) direct thermo-compression (TC) bonding, transient liquid phase bonding (Cu - Sn on Cu), and solder bonding. The benefits, cost, and technical obstacles of these techniques will be discussed.

Finally, important challenges for Assembly and Test ( with respect to OSATs) will be discussed. There is a significant gap between semiconductor manufacturing and OSATs with regards to 3D integration. Large Fabs have solved this issue in-house with fully integrated semiconductor and packaging solutions. However, the roadmap for the rest of the industry is unclear for packaging of 3D integrated die. This item will be discussed in terms of the expanding role of OSATs that will be required in order to successfully bring 3D integration products into the marketplace.

3D Keynote: Douglas Coolbaugh

Douglas Coolbaugh - Derivatives and 3DI Manager
College of Nanoscale Science and Engineering (CNSE) at Albany SUNY Nanofab

Douglas Coolbaugh received his PhD in Physical Chemistry from SUNY Binghamton, NY in 1987. Doug retired from IBM in 2010 after working 30 years in microelectronics development. Presently he is the Assistant VP of derivatives at the College of Nanoscale Science and Engineering.

9:30 AM - 10:15 AM
Contributing to 3D Interconnect (3DIC): One Toolmakers Approach to Meeting the Challenge

For the last five of six years, identifying the requirements and metrics to meet 3D Interconnect high volume manufacturing (HVM) readiness has been a moving target. Will 3DIC happen in the front end of the line, advanced packaging or somewhere in between? From a toolmakers perspective, it is easy to get confused. It is a management challenge to fund programs one year that are redefined the following year. Finding solutions that will facilitate the transition to 3DIC is our professional obligation as responsible equipment manufacturers and corporate citizens.

At TEL NEXX, we see cost effective solutions as the most significant challenge to 3DIC implementation. During this talk, I will share two of the approaches we used at TEL NEXX to identify and test proposed 3DIC solutions. The first method has been to collaborate with our suppliers transparently in order to speed up development lifecycles and minimize scale up costs. The second method has been to explore alternative solutions outside of the traditional unit process flows in search of disruptive technologies. These strategies helped us offer our customers a path to progress towards 3DIC HVM readiness.

3D Keynote: Tom Walsh

Tom Walsh - President
TEL NEXX at Tokyo Electron

Dr. Tom Walsh is President of TEL NEXX at Tokyo Electron, a leading worldwide semiconductor equipment provider focused on building advanced packaging tools. Walsh led teams of semiconductor professionals to successfully deliver game changing technologies to the market, including the growth and eventual sale of NEXX Systems to Tokyo Electron for Advanced Packaging Deposition (2012), the development of the Novellus Sabre Plating system for Copper Interconnect (1998) and the commercialization of the IBM Atomic Force Microscope (1993). Over the past 25 years, Walsh held roles from scientist to corporate executive at IBM, Novellus and NEXX Systems. He holds a Ph.D. in analytical chemistry from Purdue University and an MBA from the Stern Business School at NYU.



10:15 AM - 10:30 AM: Coffee Break In Foyer


10:30 AM - 12:00 PM
3D IC PANEL DISCUSSION:

What are preventing 3D IC integrations from High Volume Manufacturing?


Moderator: John H. Lau, ITRI, Taiwan

3D IC integration with through-silicon via (TSV) technology provides the opportunity for the shortest chip-to-chip and the smallest pad size and pitch interconnects. Compared with other interconnection technologies, the advantages of 3D IC integration include better electrical performance, lower power consumption, wider data width and thus bandwidth, higher density, smaller form factor and lighter weight. What are preventing 3D IC integrations from High Volume Manufacturing? In this panel, the challenges on costs, business models, value chains, power distribution networks, floorplanning constraints, stacking solutions, tests, standards, ecosystem, temporary bonding and de-bonding of 3D IC integration will be discussed and some solutions are provided.


"Challenges of Implementation of 3D Integration into Application Environment"
Challenges for volume production in 3D integration are, for examples extended standards, flexible production lines, value chain oriented test procedures and the exchange of application experience. With improvement of these emphases we will overcome today's major barrier, the expenses of implementation and products.

3D Panel: Klaus-Dieter Lang

Prof. Dr. -Ing. Dr. sc. techn. Klaus-Dieter Lang - Klaus-Dieter Lang is a Professor with the School of Electrical Engineering and Computer Sciences at the Technical University Berlin, Germany, where he leads research activities in the area of Nano Interconnect Technologies. He is also the Director of the Fraunhofer Institute for Reliability and Microintegration, IZM, Berlin.

Professor Lang began his career as a Research Engineer at Humboldt University Berlin, where he spent 10 years (1981 to 1991) working in the areas of Microelectronic Assembly, Packaging and Quality Assurance. In 1991, he moved to SLV Hannover to build up a Department for Microelectronic and Optic Components Manufacturing. He joined Fraunhofer IZM 20 years ago and was initially responsible for R&D activities in the area of Chip Interconnection Technologies. From 2001 to 2005 he coordinated Fraunhofer IZM's Lab on Microsystem Engineering in Berlin-Adlershof, and from 2003 to 2005 he was the Head of the Department of Photonic and Power System Assembly. In 2006, he was appointed as the Deputy Director of Fraunhofer IZM, a position he held till 2010. Since 2011 he has been the Director of the Institute.

Professor Lang Chairs the German Chapter of IEEE-CPMT and he is a member of numerous scientific boards and conference committees. He is the author and co-author of 3 books and more than 130 publications in the field of Wire Bonding Technologies, Microelectronic Packaging, Microsystems Technologies and Chip-on-Board Technologies. He studied Electrical Engineering at the Humboldt University Berlin, and holds a Master's degree and two Doctorate degrees.

 

"TSV [R]evolution: 2.5D Interposers, 3D Memory Stacks, 3D Logic on Logic"
Adoption of TSVs in high volume applications such as wireless mobile depends on balancing value propositions more heavily weighted by cost considerations. Direct 3D TSV logic on logic stacking must also solve several key technical challenges before it will be ready for product applications, including 3D power distribution networks, floorplanning constraints, and mechanical stress management.

3D Panel: Matt Nowak

Matt Nowak is Senior Director of Engineering in the VLSI Technology Group of Qualcomm Technologies, Inc. His responsibilities include leadership of Advanced Technology Initiatives such as Through Silicon Stacking, Advanced Memory technology, Design for Silicon, Spintronics, and “More than Moore” initiatives. He manages a combination of internal advanced development teams, supplier JDPs, and consortia and university projects.

Matt has over 30 years of semiconductor industry experience in a variety of technical, management, and business roles including wafer fab processes and devices, CMOS ASIC technology, compound semiconductor RF devices, package design and assembly, IC design tools and methodologies, technology transfer, foundry interfacing, and advanced technology. Prior to joining Qualcomm in 2004, Matt worked for the Semiconductor Development group of Unisys/Burroughs Corporation and for the Research Laboratory of Varian Associates. He holds BS and Masters degrees in electrical engineering from Cornell University and has carried out graduate studies at Stanford University and UC San Diego. Matt is a Senior Member of the IEEE with 26 granted US patents and numerous publications and conference presentations.

 

"Challenges of 2.5D and 3D Architectures"
2.5D and 3D architectures face a variety of challenges, most notably those around business model and ecosystem development. This panelist will focus on how Micron is addressing these challenges through the development of innovative solutions along with an ecosystem of OEMs, enablers and advanced toolset providers for their Hybrid Memory Cube.

3D Panel: Scott Graham

Scott Graham - General Manager, Hybrid Memory Cube Technology
Micron Technology, Inc.

Mr. Graham joined Micron in 1994 as an applications engineer in the personal computing division. He has held various managerial positions within Micron and has spent the last 11 years in Micron's memory products division, working on technical marketing for DRAM and NAND memory products. In recent years, Mr. Graham has represented Micron in various organizations responsible for setting industry standards, holding numerous vice-chair, chair, and board-level positions.

Mr. Graham holds a Bachelor of Science in Electronic Engineering Technology from DeVry University and a micro-MBA certification from Boise State University.

"Temporary Bonding and Debonding Challenges"
There are several techniques to do temporary bonding/debonding, which have to be evaluated to suit a specific 3D IC process flow. With each of these techniques, a complex set of manufacturable processes/materials and equipment have to be developed. It is apparent that a large scale manufacturing requires collaboration of process, materials and equipment developers with OSATs and IDMs.

3D Panel: Rajen Chanchani

Rajen Chanchani - Consultant (Formerly with Sandia National Laboratory).

Rajen Chanchani is currently a Consultant in electronic integration technologies. Prior Rajen was managing various advanced packaging and integration technologies for 32 years at Sandia National Laboratories, and at AT&T Bell Laboratories. He received his Ph.D. and M.S. in Materials Science & Engineering from the University of Florida and B. Tech. from the Indian Institute of Technology, Kanpur, India. Rajen is an IEEE Fellow, International Microelectronic and Packaging Society (IMAPS) Fellow. Rajen is also a recipient of William D. Ashman Award for his contribution to advance packaging technologies. Rajen is currently First Past-President of IMAPS.

Rajen has an extensive experience in 3D Integration technologies, micro-systems packaging, wafer-level packaging, chip-scale-packaging, multi-chip modules, thin and thick-film, chip-on-board, flip-chip, MEMS packaging and surface mount technologies and modeling & simulation.

"Status of TSV Manufacturing - Reality Check"
How far we've come, where we are, and how much further do we need to go before HVM for 2.5/3D products?” These questions will be discussed and some answers will be provided.

3D Panel: Rich Rice

Rich Rice - Sr. VP of Sales
ASE (US), Inc.

Rich Rice currently serves as Senior Vice President of Sales for ASE (U.S.) Inc., with responsibilities within the North America region. Previously, he held various engineering and business development positions at Amkor Technology and National Semiconductor Corporation. Mr. Rice serves in advisory roles for MEPTEC as well as the IMAPS Global Business Council. He holds a BS degree in Agricultural Engineering from the University of Illinois.

Register On-Line

GLOBAL BUSINESS COUNCIL (GBC) Keynote Luncheon & Market Forecasting Analyst Session    ^ Top
IMAPS 2013 Orlando will feature a new Global Business Council meeting this year. On Wednesday, October 2, the GBC will hold its Keynote Luncheon and Market Forecasting Analyst Session. All attendees of IMAPS 2013 are invited to attend and must register in advance (www.imaps2013.org) - lunch tickets must be reserved under page 2 of registration: "SESSIONS".

12:30 PM: Welcome Message, GBC Objectives and Agenda Review - Lee Smith, Plexus Corp.

GBC Lunch Sponsored by:

Sikama - GBC Sponsor

12:40 PM - 1:00 PM: GBC Luncheon & Keynote Speaker: The Microelectronics Industry in Brazil
Claudius Feger, IBM Research - Brazil
feger@us.ibm.com

As Brazil's middle class has increased by 35 million people, electronics imports have skyrocketed - resulting in a narrowing of Brazil's trade balance, which in January 2013 turned negative. To address this trend, the Brazilian government made the development of a local microelectronics industry an economic priority. Previously, the government focused on developing IC design skills and the creation of design houses, of which 22 were established to-date. However, the success of these has been limited, mostly because of difficulties in attracting industrial projects and thus over half of the existing design houses are not for profit.

With the announcement in late in 2012 of the creation of SIX Semicondutores, an IDM which once completed, will be the most advanced, commercial chip manufacturer in Latin America, the Brazilian microelectronics industry started a new chapter. SIX Semi will be using IBM 130 and 90 nm technology to provide advanced mixed signal / hybrid semiconductor devices and products for the medical devices, smart card, sensor, energy management and similar markets. In doing so, Brazil hopes to start making a dent in the import of about US$4 - 5 billion annual imports of ICs.

Another focus area is electronic packaging. But even after the announcement in 2012 of HT Micron, (a joint venture between the Brazilian Altus and the Korean Hana Micron), this area will remain poorly served in Brazil, because HT Micron will focus exclusively on the highly competitive memory packaging segment.

Over the years the Brazilian government has instituted several laws and regulations to support the formation of an electronics industry with Brazilian content. This spans efforts from creating academic programs and research institutions to laws requiring industrial research investments to direct investments by the Brazilian development bank in industries. However many hurdles remain.

This talk will describe successes and hurdles in the development of a successful microelectronics ecosystem in Brazil and will provide an up-to-date picture of this important emerging market.

1:00 PM - 2:00 PM: Industry Analyst & Panel Discussion
"Addressing Major Changes in the Supply and Demand for Advanced Packaging Technologies"

1:00 PM - 1:20PM: "Demand Outlook for 2.5 / 3D and Wafer Level Packaging"
Yole Developpment - Christophe Fitamant, Sales & Marketing Director

  • Technical trends for 2.5 / 3D, Wafer level packaging (fan in and fan out) and embedded chip in substrate;
  • Associated driving applications and demand outlook over the next 5 years.

1:20 PM - 1:40 PM: "Supply Chain Implications for Advanced Packaging"
Gartner Dataquest - Mark Stromberg, Senior Director

  • Impact on supply chain associated with these trend to new technologies with high wafer level process content;
  • Equipment trends to service these technologies and economic impact on OSATs as these wafer level processes have high capex $, with long lead times and major step function in capacity to manage;
  • (Tentative)SWOT or comparison between tier 1 OSATs and Foundries who will both collaborate and compete in this space.

1:40 PM - 2:00 PM: Panel Format with Audience Questions & Answers
Moderator - Lee Smith

IMAPS 2013 Plant Tour to Micross Components - RSVP To Reserve Your Seat    ^ Top
Plant Tour at Micross Components in Orlando. YOU MUST RSVP...

Micross Components will provide a valuable industry tour that will highlight two of their facilities in Orlando. Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high reliability and state of the art electronics, Micross’ solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish.

The plant tour is set for Wednesday, October 2: bus leaving Rosen Centre at 11:30am and returning by 2:00pm (subject to change).

YOU MUST RSVP to bschieman@imaps.org if you wish to attend.

The Micross Tour is open to US Citizens ONLY. Students and industry professionals are welcome to participate. Micross will manage the approved attendee list and communicate with registrants as the tour approaches.

Micross Components

IMAPS Orlando Golf Is Closing Soon!    ^ Top

19th Annual IMAPS Golf Classic
to benefit The Microelectronics Foundation

Monday, September 30, 2013
8:00am Shotgun Start - "Best Ball" Scramble

Shingle Creek Golf Club
9939 Universal Blvd | Orlando, Florida 32819
407-996-9933 |
www.shinglecreekgolf.com

Shingle Creek - Hole 8

The IMAPS Microelectronics Foundation Fall Golf invitational will be held at the Shingle Creek Golf Club. Experience this remarkable new orlando golf course, which takes its name from the pristine creek, which traverses the property. Early Central Florida settlers, circa 1800, were drawn to the area by the abundance of game, fishing, ancient cypress trees, and of course, the beautiful creek.

Cost is $125 per person.

$450 for a team of four; $750 for a team of four including a hole sponsorship.
$500 for one individual golfer and 1 hole sponsorship.

The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, and a breakfast/lunch

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive
  • Mulligans for sale!

Golfers will tee off shortly after arriving at the course. Times are tentative and will be confirmed before the outing. Callaway rental clubs are available for $50 plus tax.

 

Golf fees and hole sponsorships under SESSIONS during on-line registration...
Register On-Line


Sponsorship Opportunities:

Eagle Sponsor - $3,000

  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500 -- 1 SOLD

  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Hole Sponsor - $500 ($750 w/ four-some) -- 12 Holes Remain

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($500) or one four-some ($750).
  • Company logo/name on promotional materials and website.

Sponsors receive signange, on-line recognition, and other benefits as defined on the sponsorship page. Contact David Virissimo, IMAPS 2013 Foundation Chair, with questions - David.Virissimo@ametek.com. Or contact Brian Schieman, IMAPS, at bschieman@imaps.org.

Golf Sponsors
"Birdie" Sponsor &
Hole Sponsor:

LORD - Golf "Birdie" Sponsor
Hole Sponsor: Golf Hole Sponsor: Coining Inc/Ametek
Hole Sponsor:
Golf Hole Sponsor: Infinite Graphics
Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor:
Golf Hole Sponsor: Micross Components
Hole Sponsor:
Technic - Golf Hole Sponsor

Discounted Disney Tickets...   ^ Top
IMAPS has teamed up with Disney for a special offer for those attending IMAPS 2013 in Orlando. Have a little fun while visiting Orlando for our 46th Sympsoium...

If you're planning a trip to Walt Disney World® Resort during your participation at IMAPS 2013 Orlando in September-October 2013, please visit www.mydisneymeetings.com/imps13/ for information about ordering tickets in advance, at the special conference rate!

  Chapter Activities (events listed in chronological order)
 

TOMORROW: Carolinas Chapter Revival Meeting September 13    ^ Top
The planning committee composed of Dr. John Lannon and Alan Huffman of RTI International, Dr. Phil Garrou of NCMC and Michael O’Donoghue of IMAPS staff announces the Carolinas Chapter revival meeting TOMORROW, Friday, September 13, 2013. Please register asap TODAY so you can attend.

Conferences Rooms A & B
RTI International
The Center for Materials and Electronics Technologies
3040 East Cornwallis Road
Research Triangle Park, NC 27709

Program:

12:00: Lunch kick-off
RTI International

1:00: Welcome, Introductions & Round-the-Room Networking
Rex Anderson and Alan Huffman, RTI International;
Phil Garrou, Microelectronic Consultants of NC;
Michael O’Donoghue, IMAPS Executive Director

1:30: RTI International’s Microsystem and Packaging Technology Toolbox
Rex Anderson, RTI International

2:00: On the Frontlines of Packaging: An Asia Perspective
Glenn Rinne, Amkor Technology

2:30: Refreshment Break & Networking Refreshments, Coffee, & Snacks

2:45: Electroplating and Electroless Plating Process Development for DuPont™ GreenTape™ 9K7 LTCC material
Allan Beikmohamadi, Dupont Microcircuit Materials

3:15: PolyStrata – a disruptive architecture for 3D integrated systems
David Sherrer, Nuvotronics

3:45: Closing Comments, Networking and Chapter Business (Rex, Alan, Phil) Refreshments

4:00: Window Tour of RTI Facilities

Event Location & Directions:
RTI International 3021 Cornwallis Rd. RTP, NC 27709

Registration Fees: IMAPS members - $ 15.00. Non-members - $ 25.00. Students – $ 5.00
Special Offer – attend the meeting and sign-up for membership for $80 ($75 membership, $5 meeting)

NOTE: Advance registration BEFORE 5pm TODAY, SSEPTEMBER 12 is necessary to guarantee space on the facility tour. On-site registration will be limited. NON-US CITIZENS MUST REGISTER IN ADVANCE TO TOUR THE FACILITY. On-site registration will be available without the tour to non-US citizens.

On-line Registration

Indiana Chapter September 19 Meeting at GM Components Holdings    ^ Top
Tour of GM Components Holdings, LLC
Kokomo, IN Electronics Assembly

Brian King New Business Development Manager

Dinner and Meeting: Pastarrific Restaurant, Kokomo, IN

Plant Tour 4:00
Travel to Pastarrific 5:30
Dinner 6:00
Meeting 7:00

Registration:
IMAPS Members $20.00
Non-Members $20.00

Advance reservations are being taken by Ray Fairchild and will be accepted until 4:00 pm on Tuesday, September 17, 2013. Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email m.ray.fairchild@delphi.com.

Note: The scheduled tour will cover the Electronics Assembly and Thick Film Business Units

Save The Date for the Viking Chapter's First NDSU Microelectronics Summit on October 18    ^ Top
Save the date!

The summit will be held at the Research 1 building on NDSU Research Park Drive in North Dakota State University (NDSU) at Fargo ND. There will be student poster contest sponsored by IMAPS. A technical meeting will include presentations from the electronics industry leaders in the Red River Valley Research Corridor. A tour of the Center for Nanoscale Science and Engineering (CNSE) will be offered. CNSE houses design, modeling, manufacture, testing and characterization facilities for thin film, thick film, semiconductor packaging and surface mount technology. Lunch and refreshments are included in registration.

For additional information concerning the summit, please contact Syed Ahmad, Syed.Ahmad@ndsu.edu.

IMPACT-IAAC 2013 - Agenda, Registration Now On-Line    ^ Top

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.  

IMPACT sincerely welcomes you to IMPACT-IAAC 2013 Joint Conference which will be held in conjunction with TPCA Show 2013 on 22nd -25th at Taipei Nangang Exhibition Hall. This year, the 2nd IAAC (IMAPS All Asia Conference) is rotated in Taiwan, and a joint international conference of IMPACT and IAAC is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA. To cater for the technology trends, the theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations. Furthermore, IMPACT keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A. We hope this Conference to be successful and to become an important and valuable resource under your contribution and participation.

Conference: IMPACT-IAAC 2013
Exhibition: TPCA Show 2013
Theme: Green & Cloud: Creating Value and Toward Eco-life
Date: Oct 22 (Tue.)-25(Fri.), 2013
Venue: Taipei Nangang Exhibition Hall
Website:http://www.impact.org.tw

Save The Date for the Next Cleveland/Pittsburgh Chapter Meeting: October 29    ^ Top
Save the date!

The planning committee for the Cleveland/Pittsburgh Chapter has confirmed that the next Chapter Meeting will be held Tuesday October 29 at Valtronic Technologies (USA), Inc. at 29200 Fountain Pkwy, Solon, OH 44139. The meeting will focus on medical device packaging topics - details soon.

IMAPS New England 41st Symposium & Expo - Call For Paper Now Open!    ^ Top
iMAPS New England – 41st Symposium & Expo
The Largest Regional Symposium Dedicated to Microelectronics and Packaging

May 6, 2014
Holiday Inn – Boxborough Woods Conference Center Boxborough, Massachusetts

  • Advanced Packaging Concepts
  • Novel Materials & Processes
  • Surface Mount Technology
  • Thermal Management
  • Defense Electronics
  • Assembly and Test
  • Ceramics, Polymers and Conductive Materials
  • Automotive & Consumer Applications
  • Embedded and Integrated Passives
  • MEMS and Nano Technology
  • Alternative Energy
  • Optoelectronics

Submit Abstracts to Roger Benson – Vice-President, iMAPS New England
Deadline for Submission – December 31, 2013

Please e-mail your 250 word abstract to: roger.benson@verizon.net.

 

  Membership Corner
 

Journal of Microelectronics and Electronic Packaging 2nd Quarter 2013 On-Line - Q3 Available Soon   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 10, Number 2
Second Quarter 2013

download pdf of full Journal - 45mb



Development of Silver Nanoparticle Ink for Printed Electronics
Yiliang Wu, Ping Liu, and Tony Wigglesworth, Xerox Research Centre of Canada

49

Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite
M. Faqir, J. W. Pomeroy, T. Batten, and M. Kuball, University of Bristol; M. Faqir, Université Internationale deRabat (UIR); T. Mrotzek and S. Knippscheer, Plansee SE; O. Vendier and S. Rochette, Thales Alenia Space; M. Massiot and L. Letteron, Egide, Site Industriel du Sactar; J. M. Desmarres and F. Courtade, CNES

54
Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato and Yoshinori Murakami, R&D Partnership for Future Power Electronics Technology (FUPET) c/o AIST; Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi and Yoshinori Murakami, Nissan Motor Co., Ltd.; Shinji Sato, Sanken Electric Co., Ltd.; Masato Takamori and Takashi Iseki, Sumitomo Metal Mining Co., Ltd.
59

High Temperature Characterization up to 450°C of MOSFETs and Basic Circuits Realized in a Silicon-on-Insulator (SOI) CMOS Technology
K. Grella, S. Dreiner, A. Schmidt, W. Heiermann, H. Kappert, H. Vogt, and U. Paschen, Fraunhofer Institute for Microelectronic Circuits and Systems, IMS

67

The Distribution and Transport of Alpha Activity in Tin
Brett M. Clark, Honeywell Electronic Materials

73
Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
M. Mirgkizoudi, C. Liu, and P. P. Conway, Loughborough University; S. Riches, GE Aviation Systems-Newmarket
80
   

Torrey Hills Technologies

Oneida Research Services

Metallix

2013 Events:

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

Thermal Management 2013
Nov. 5-7
*Exhibitors contact bschieman@imaps.org

2014 Events:

Wire Bonding 2014
Jan. 21-22
*Exhibitors contact bschieman@imaps.org

Device Packaging 2014
Mar. 10-13
*Exhibitors contact bschieman@imaps.org

High Temperature (HiTEC 2014)
May 13-15
*Exhibitors contact bschieman@imaps.org

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