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August 7, 2014
 

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   IMAPS EVENTS
Button Thermal Management 2014 - Abstracts Due September 1; Tabletops Still Available (read more...)

Button IMAPS 2014 - Only 11 Industry Booths Remain (read more...)

Button IMAPS 2014 - Space Still Available in our 19 Short Courses (read more...)

Button Golf in San Diego - What More Could You Ask For?! (read more...)

XYZTEC


   CHAPTER ACTIVITIES (events listed in chronological order)
Button NEXT TUESDAY: Central Texas Chapter's Electronics Design, Manufacturing & Test Symposium on August 12 (read more...)

Button Cleveland-Pittsburgh Chapter Announces September 17 Meeting at Carnegie Mellon University - Details Soon (read more...)


   MEMBERSHIP CORNER
BulletIMAPS Awards Nominations Due TOMORROW: Nominate a Deserving Colleague or Friend TODAY!  (read more...)

RGL Enterprises
F&K Delvotec
Petroferm

Palomar Technologies

 

  IMAPS Events (view full Web Calendar)
 

Thermal Management 2014 - Abstracts Due September 1; Tabletops Still Available    ^ Top
ABSTRACTS DUE SEPTEMBER 1
IMAPS Advanced Technology Workshop and Tabletop Exhibit on Thermal Management is being held at the Toll House in Los Gatos, California, from October 28-30, 2014. Abstracts are due in a few weeks and can be submitted on-line at www.imaps.org/thermal. You can also register, reserve tabletops and more from the website.

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992, and is considered to be one of the most successful of the IMAPS ATWs that are held each year. Information will be available on transportation methods by train and/or bus from area airports.

Speakers are expected to attend the entire Workshop to maximize opportunities for interaction with registered attendees. Every year, authors and attendees find this IMAPS Workshop format to be a proven forum for highly effective networking between attendees and speakers. Speakers pay a reduced registration fee, making participation even more beneficial.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Thermal challenges and business and economic drivers which influence change in electronic systems design and manufacturing. Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that are included in this session. Such market and business data sets the framework for new technical solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, telcom, IGBT, RF, and microwave components and systems. Standards for testing and reliability. Organic, metallic, metal, graphitic, and other forms of TIMs are included, as well as developments with nanomaterials.
  • CTE-Matching and High Thermal Conductivity Materials:  Metallic, ceramic, and other composite materials with excellent thermal conductivity and coefficient of thermal expansion targeted to that of GaN, SiC, silicon, or ceramic materials. 
  • Stacked-Die and Device Packaging:  Chip-level packaging, including System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die and related thermal and interconnect challenges.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Performance, flexibility, reliability, and serviceability improvements.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Cooling provisioning, airflow, temperature distribution, and migration paths to system liquid cooling.
  • Power Semiconductor Thermal Components, Systems, and Solutions:  Discrete and multichip IGBT packaging.
  • Mil/Aerospace:  Thermal management solutions for emerging and future military and aerospace components and platforms.
  • Telecommunications Systems:  Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics:  Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than September 1, 2014. No formal technical paper is required.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

A post-conference CD containing the full presentation material as supplied by authors will be mailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than October 30, 2014, and will be included on the post-conference CD.

Questions:  Brian Schieman with questions bschieman@imaps.org or 412-368-1621. You may also contact the workshop chairs.

Submit Abstract | Register On-Line

 

IMAPS 2014 - Only 11 Industry Booths Remain    ^ Top
The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). IMAPS 2014 - San Diego, The Future of Packaging - will be held October 13-16, 2014, with the exhibition open the 14th and 15th of October. Only 11 industry booths remain, along with 14 spots reserved for Research Labs. So we are close to our first SOLD OUT symposium hall in several years. Don't miss out!

Thank you to our 2014 Exhibitors!

Exhibitor Booth Booth Type Booth Category
5N Plus Inc. 429 10 x 10 In-Line
Accu-Tech Laser Processing, Inc. 506 10 x 10 Corner
AdTech Ceramics 616 10 x 10 Corner
Advance Reproductions Corp. 336 10 x 10 In-Line
Advanced Dicing Technologies 415 10 x 10 In-Line
Advantest Corporation 523 10 x 10 Corner
AI Technology, Inc. 402 10 x 10 In-Line
AMICRA Microtechnologies GmbH 330 10 x 10 Corner
ASM Pacific Technology, Ltd. 504 10 x 10 Corner
ATV Technologie GmbH 617 10 x 10 Corner
Azimuth Electronics, Inc. 509 10 x 10 Corner
Besi North America, Inc. 225 10 x 10 In-Line
Camtek USA, Inc. 622 10 x 10 Corner
Canon USA 510 10 x 10 Corner
Ceradyne, Inc., a 3M company 526 10 x 10 In-Line
Chip Scale Review (Media Sponsor) 426 10 x 10 In-Line
Cleanlogix LLC 229 10 x 10 In-Line
Coining, Inc., an AMETEK company 607 10 x 10 In-Line
Conductive Containers, Inc. 417 10 x 10 Corner
CORWIL Technology 424 10 x 10 In-Line
CVInc 327 10 x 10 In-Line
Deweyl Tool Company, Inc. 408 10 x 10 In-Line
DuPont Microcircuit Materials 431 10 x 10 Corner
East China Research Institute of Microelectronics 512 10 x 10 In-Line
Electronic Production Partners GmbH 501 10 x 10 Corner
Element Six Technologies US Corp. 530 10 x 10 Corner
Epoxy Technology, Inc. 407 10 x 10 Corner
ESL ElectroScience 605 10 x 10 Corner
F & K Delvotec, Inc. 514 10 x 20 Corner
Ferro Corporation 331 10 x 10 Corner
Finetech, Inc. 317 10 x 10 Corner
Fogale Nanotech 528 10 x 10 In-Line
FRT of America, LLC 620 10 x 10 Corner
Geib Refining Corporation 301 10 x 10 In-Line
Gel-Pak/Quik-Pak 312 10 x 10 Corner
Haiku Tech, Inc. 115 10 x 10 In-Line
Harrop Industries, Inc. 522 10 x 10 In-Line
Hary Manufacturing Incorporated 104 10 x 10 Corner
HD Microsystems 236 10 x 20 Corner
Heraeus Electronic Materials Division 205 10 x 20 Island
Hesse Mechatronics, Inc. 309 10 x 20 Corner
Hi-Rel Laboratories, Inc 413 10 x 10 In-Line
Hybond, Inc. 435 10 x 10 In-Line
i3 Electronics (formerly Endicott Interconnect Technologies) 507 10 x 10 In-Line
IBM Corporation 427 10 x 10 In-Line
Indium Corporation 217 10 x 10 In-Line
Infinite Graphics 314 10 x 10 In-Line
Inkron Ltd. 614 10 x 10 In-Line
Interconnect Systems, Inc. 401 10 x 10 In-Line
Kulicke & Soffa Industries, Inc. 215 10 x 10 In-Line
Kyocera America, Inc. 410 10 x 10 In-Line
KOA Speer Electronics 425 10 x 10 In-Line
LINTEC OF AMERICA, INC 214 10 x 10 Corner
Metalor Technologies USA 209 10 x 20 Island
MicroScreen LLC 316 10 x 10 Corner
Micross Components 420 10 x 10 Corner
Micro Systems Technologies, Inc. 335 10 x 10 In-Line
Mini-Systems, Inc. 406 10 x 10 In-Line
Momentive Performance Materials 610 10 x 10 In-Line
MRSI Systems LLC 231 10 x 10 Corner
NAMICS Corporation 320 10 x 10 Corner
Natel Electronic Manufacturing Services, Inc. 105 Island - 20 x 20 Island
Neu Dynamics Corp. 405 10 x 10 Corner
NorCom Systems, Inc. 210 10 x 10 Corner
Nordson DAGE 227 10 x 10 In-Line
NTK Technologies, Inc. 517 10 x 10 Corner
Palomar Technologies, Inc. 221 10 x 20 Corner
Perfection Products, Inc. 505 10 x 10 Corner
Photofabrication Engineering, Inc. 111 10 x 10 Corner
Plasma-Therm, LLC 108 10 x 20 Island
Polysciences, Inc. 422 10 x 10 In-Line
Reldan Metals Co., Div of AR Metals, LLC 521 10 x 10 Corner
Riv, Inc. 100 10 x 10 Corner
Royce Instruments, Inc. 321 10 x 10 Corner
Rudolph Technologies 520 10 x 10 Corner
Sage Analytical Lab, LLC 428 10 x 10 In-Line
Sales & Service, Inc. 423 10 x 10 In-Line
Samtec 421 10 x 10 Corner
SANTIER Thermal Management Solutions 500 10 x 10 In-Line
SavanSys Solutions LLC 329 10 x 10 Corner
Semi Dice, Inc. 102 10 x 10 In-Line
Sikama International, Inc. 213 10 x 10 Corner
Sonoscan, Inc. 315 10 x 10 Corner
Souriau PA&E 414 10 x 10 Corner
SST International 305 10 x 20 Corner
Stellar Industries Corp. 400 10 x 10 In-Line
Taiyo Ink Mfg. Co., Ltd. 613 10 x 10 In-Line
TDK Corporation 606 10 x 10 In-Line
Technic, Inc. 411 10 x 10 Corner
Teledyne Microelectronic Technologies, Inc. 300 10 x 10 Corner
Torrey Hills Technologies, LLC 515 10 x 10 Corner
TPT Wire Bonder 325 10 x 10 In-Line
Tresky Corporation 323 10 x 10 In-Line
U.S. Tech (Media Sponsor) 430 10 x 10 Corner
UBOTIC Company Ltd. 322 10 x 10 Corner
Unisem Group 524 10 x 10 In-Line
UTZ Technologies 328 10 x 10 In-Line
West Bond, Inc. 416 10 x 10 Corner
XYZTEC 404 10 x 10 Corner
YINCAE Advanced Materials, LLC. 326 10 x 10 Corner
YXLON International, Inc. 502 10 x 10 In-Line
Zeta Instruments 604 10 x 10 Corner
Total Booths: 114

 

Exhibitor Questions or need assistance reserving a booth?
Contact Brian Schieman at bschieman@imaps.org or call 919-293-5000

IMAPS 2014 - Space Still Available in our 19 Short Courses    ^ Top
IMAPS 2014 - San Diego, The Future of Packaging - will be held October 13-16, 2014, with 19 PDCs being offered before the conference on Monday the 13th, as well as Thursday morning the 16th. Details below and at www.imaps2014.org.

PDCs (Professional Development Course) are a big part of the Annual IMAPS Symposium each year. Why not plan to take a course on Monday or a Thursday AM session and take advantage of the rich learning opportunities available at the IMAPS symposium. This year the Monday courses are going to have a delayed start kicking off at 10 AM and running till 6 PM with a working lunch. It's something new and we hope you like it. This new time slot will give the locals a chance to beat the traffic and a little extra time for the out of town folks to get organized and prepare for a full day of learning.

PDCs create a unique environment whereby students can personally interact with the instructors, and with each other in the classroom and over lunch. It's mentally stimulating and the new found professional connections will prove to be valuable in the long run. Learning on line is fine, but it cannot duplicate eight hours spent immersed in a specific topic, led by an industry expert in the field and surrounded by like minded professionals. My father used to say, "it's not what you say but how you say it." So much of what we learn is contained in the tone of voice and non-verbal cues. PDCs provide that learning environment that's just not available on line.

This year we've put together another impressive assortment course options Our goal is to make the IMAPS PDCs the premier learning experience; so we ask that you take time to fill out the evaluation form that accompanies each course and give us your feedback on this or any other aspects of the PDCs. Read through the course descriptions on line and pick the course that best suits your company and career objectives. Every PDC includes a full set of comprehensive course notes. Class sizes typically range from eight to twenty students and there is always ample time for questions. We hope you will consider joining us in San Diego for a learning experience like no other.

NEW PDC FORMAT - Monday & Thursday Courses:
Monday, October 13: full-day courses, running 10:00 am - 6:00 pm;
Monday, Half-day courses running 10:00am - 1:45pm & 2:15 pm - 6:00 pm

All Thursday, October 16 are half-day, running 8:00 am - 12:00 pm

MONDAY FULL-DAY PDCs: (10am-6pm)
- Introduction to 3D Printed Power Electronics & Wide Bandgap Power Semiconductor Packaging;
- Introduction to the Design and Fabrication of RF, High Speed and Microwave Hybrids, MCM's and Modules;
- Introduction to Microelectronics Packaging;
- Polymer Challenges in Electronic Packaging Including 2.5D and 3D Integration;
- Technology of Screen Printing;
- Wire Bonding

MONDAY MORNING HALF-DAY PDCs: (10am-1:45pm)
- ENIG - Electroless Nickel & Immersion Gold Plating for Electronics: From the Plating Solutions to the Equipment;
- High-Temperature Electronics;
- MEMS and nanoMEMS Devices and Applications;
- Package level integration : 2-D, 2.5-D and 3-D, Impact on Mobile Systems

MONDAY AFTERNOON HALF-DAY PDCs: (2:15pm-6pm)
- Low-Temperature Electronics;
- Package on Package Technology - What It Is, What Works, What Doesn't Work;
- Thermal And Mechanical Simulation Techniques For IC Package Yield, Reliability And Performance

THURSDAY HALF-DAY PDCs: (8am-12pm)
- Chip Packaging Processes and Materials;
- Fundamentals of Microelectronics Packaging;
- IC Fabrication and Electronic Packaging;
- Interposers - Silicon, Organic and Glass;
- Packaging and Testing of Implanted Medical Devices;
- Understanding the Common Failure Modes from a Physics of Failure Perspective

Golf in San Diego - What More Could You Ask For?!    ^ Top
Have a little fun before IMAPS 2014 - San Diego kicks off! Join us for the 20th Annual IMAPS Golf Classic, to benefit The Microelectronics Foundation, on Monday, October 13, 2014, at the Riverwalk Golf Course. The outing begins at 8:00am with a Shotgun Start - "Best Ball" scramble. Information for the Riverwalk Golf Course: 1150 Fashion Valley Road San Diego, CA 92108 | www.riverwalkgc.com. Details below and at www.imaps.org/imaps2014/golf.htm.

The Riverwalk Golf Course encompasses three nine-hole layouts that can be combined in a variety of ways to create a unique experience every time you play. Distinctive in character but consistent in quality, every hole was meticulously designed by Ted Robinson, Sr. and Jr. in the old style, leaving the terrain completely natural. Mature stands of palm, oak and eucalyptus trees frame undulating fairways and manicured greens, with numerous wetland areas, nearly 100 bunkers and an array of picturesque water features creating both strategic diversity and a visually stunning backdrop for golf.

Cost is $125 per person.

$450 for a team of four; $750 for a team of four including a hole sponsorship.
$500 for one individual golfer and 1 hole sponsorship.

The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, and a breakfast/lunch -- TBD.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive
  • Team Awards
  • Mulligans for sale!

Golfers will tee off shortly after arriving at the course. Times are tentative and will be confirmed before the outing. Club rentals available - email David Virissimo for more information.

Sponsorship Opportunities:

Eagle Sponsor - $3,000

  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500

  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Hole Sponsor - $500 ($750 w/ four-some)

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($500) or one four-some ($750).
  • Company logo/name on promotional materials and website.

Sponsors receive signange, on-line recognition, and other benefits as defined on the sponsorship page. Contact David Virissimo, IMAPS 2014 Foundation Chair, with questions - David.Virissimo@ametek.com. Or contact Brian Schieman, IMAPS, at bschieman@imaps.org.

Golf Sponsors
Golf Hole:
Technic - Golf Hole Sponsor
Golf Hole:
Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole:
Golf Hole Sponsor: AGC Electronics America
available

Register Online
PDC registration is listed under SESSIONS during the on-line registration process

 

  Chapter Activities (events listed in chronological order)
 

NEXT TUESDAY: Central Texas Chapter's Electronics Design, Manufacturing & Test Symposium on August 12    ^ Top

Electronics Design, Manufacturing & Test Symposium
Tuesday, August 12, 2014
Flextronics at 12455 Research Boulevard in NW Austin


Program:

2:00  -   Registration Begins

2:30  -   Welcome and Introductions

2:35  -   "Flextronics Product Innovation Center:  Advanced New Product Introduction (NPI) and
Technology Services,”  David Mendez, Process & Technology Director, and Neal Klubak,
                Process Engineering Manager,  Flextronics

3:05  -   Flextronics Product Innovation Center (PIC) Tours

4:05  -   Break & Networking

4:20  -   "Outsmart the Competition Through Patent Research"
               Steve Pearson,  Founder,  The Pearson Strategy Group, LLC

4:50  -   "Wire Bond Reliability Challenges Across Electronic Packaging Platforms”
  Steve Safai,  Product Package Engineer,  Freescale Semiconductor

5:20  -   "Update on Conflict Minerals Impact on Electronics Manufacturing"
               Brad Heath,  CEO,  VirTex Enterprises

5:50  -   Closing Remarks and Door Prizes Drawing

6:00  -   Food & Refreshments Served with More Networking

Registration:

RSVP to Bob Baker at:  rjbakeratx@austin.rr.com

No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)

Event Location:

Flextronics at 12455 Research Boulevard, Austin, Texas (between Riata Trace Pkwy & Oak Knoll Dr)
See Map at:   (Map to Flextronics)

In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)

Cleveland-Pittsburgh Chapter Announces September 17 Meeting at Carnegie Mellon University - Details Soon    ^ Top
IMAPS Cleveland-Pittsburgh Chapter will host a Technical Meeting & Tour on Wednesday, September 17, from 2:00-6:30 PM at Carnegie Mellon University in Pittsburgh, Pennsylvania. Please join us for technical presentations, facility tour and networking. Program, registration and other details will be available soon.

  Membership Corner
 

IMAPS Awards Nominations Due TOMORROW: Nominate a Deserving Colleague or Friend TODAY!    ^ Top

2014 Society Awards - Your Help Needed
Nomination Deadline: August 8, 2014

by Voya Markovich
IMAPS First Past President and 2014 Awards Chairman



IMAPS has many deserving members who have given their time, energy, and expertise to ensure our industry has a robust future.  Every year IMAPS members are asked to point out those Society’s members who have done such notable work that they deserve the distinction of the Society’s awards to publicly acknowledge their accomplishments.   The awards presentation will be on Tuesday, October 14, 2014, preceding the Symposium’s keynote speaker.

You can make sure these deserving members are recognized by nominating them for one of our prestigious awards!  The 2013 Awards Nominating Committee is actively seeking nominations for these awards.  Nominees for each award are evaluated by their respective Selection Committee. The Award Committees are chaired by the First Past President.

Steve Adamson Student Recognition Award 2014
The IMAPS Foundation’s Steve Adamson Student Recognition Award honors an active student member’s participation in IMAPS events, chapters, and programs. Significant technical research and/or service contributions to IMAPS and the microelectronics industry will be considered during the judge’s review.

The Award winner will receive a check for $3000. Also student membership dues will be waived until graduation. The Award will be presented at the Society Awards Ceremony on the first full day of and on-site at the IMAPS Symposium.

Nominees must be current IMAPS student members. Students can be at an undergraduate or graduate level taking courses or in an approved internship in either engineering or natural sciences. Students must attend a four-year college or university. Nominators must be IMAPS members. Contact Brianne Lamm at blamm@imaps.org for the nomination form and additional information.

The seven Society awards presented annually are: the Daniel D. Hughes, Jr. Memorial Award; the William D. Ashman Achievement Award; the John A. Wagnon Technical Achievement Award; the Fellow of the Society Award; the Corporate Recognition Award; the International Award; and the Outstanding Educator Award. The Lifetime Achievement Award is also an individual award, but will be awarded only occasionally when a deserving individual is identified and nominated.

Criteria for each award are as follows:

The Daniel C. Hughes, Jr. Memorial Award is the highest, most prestigious annual honor, and is awarded to the individual who, in the opinion of the Daniel C. Hughes, Jr. Memorial Award Selection Committee, has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS. One must be an IMAPS member in good standing for a minimum of five years to qualify for this Award. Recipients of this award automatically become Life Members and Fellows of the Society.

The William D. Ashman Achievement Award recognizes an individual who, in the opinion of the William D. Ashman Achievement Award Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member. Recipients of this award automatically become Life Members and Fellows of the Society.

The John A. Wagnon Technical Achievement Award is given to a member of the Society who, in the opinion of the John A. Wagnon Technical Achievement Award Selection Committee, has made outstanding technical contributions related to microelectronics technology. The award may be given for a specific accomplishment, for a number of accomplishments over a period of years, or for general overall contributions to the microelectronics industry.

The Fellow of the Society Award honors and recognizes those who, in the opinion of the Fellow of the Society Award Selection Committee, have made significant and continuing contributions to IMAPS over the years at any level – local or national. A nominee must have been an IMAPS member for ten (10) consecutive years. Examples of the nomination criteria usually considered for this award are: (1) service as an officer of a local chapter or in a national office; (2) service as a member of a local, regional, or national committee or task force; and/or (3) presentation of papers or conducting of short courses at local, regional, or national symposia. Recipients of this award automatically become Life Members of the Society.

The Corporate Recognition Award honors and recognizes a corporation (or the appropriate division or department of a corporation) that in the opinion of the Corporate Recognition Award Selection Committee has made significant technical contributions to the microelectronics industry, while demonstrating support of IMAPS through participation in such activities as Organizational and Regular Memberships, promoting member participation in IMAPS-sponsored activities, sponsorships, Educational Foundation contributions, and by exhibiting at the Annual Symposium.

The Sidney J. Stein International Award recognizes an individual who, in the opinion of the Sidney J. Stein International Awards Selection Committee, has provided significant international technical and/or leadership contributions to the microelectronics packaging industry, while participating and demonstrating support of IMAPS International activities to enhance the electronics packaging profession. A minimum of 5 years service with an International IMAPS chapter is a pre-requisite. The following points should be delineated in the nomination form.

Personal capacity:

  • Has a good overview of a considerable part of IMAPS' technology palate and has a good understanding of the technical dissemination process.
  • Has minimum 4 years of professional experience in these fields.
  • Has tirelessly spent his/her own resources for the good of the organization.

Personal achievement:

  • Patent OR New technology OR Paper award OR Business success that is related to the IMAPS portfolio of technologies.

IMAPS activity:

  • Contributed considerably to bringing IMAPS Chapters together in some big event or on a continuous basis or both.
  • Contributed to the international cross border spirit even when collaboration has been uneasy.
  • Has presented paper(s) or tutorials at IMAPS conference(s) outside his/her home organization.

The IMAPS Outstanding Educator Award recognizes an individual who, in the opinion of the IMAPS Outstanding Educator Selection Committee, has provided significant contributions to education for the electronics packaging industry and/or to the advancement of IMAPS Student Chapters. Note that this does not have to be restricted exclusively to academic education.

The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, candidates may be nominated only by senior members, life members, or previous recipients of either the Fellow or Technical Achievement awards. Recipients of this award automatically become Life Members and Fellows of the Society.

Nominations and supporting materials must be received by August 8, 2014. Award nominations must be submitted on-line. Contact Brianne Lamm at IMAPS headquarters 919-293-5000 or blamm@imaps.org if you have problems or questions.

There are few things we each value more than the recognition of our peers. This is your chance to recognize a deserving member with the prestige of an award – and only you, the membership, can do that. You have the keys to a vital part of our professional network – and your actions in recognizing other members’ accomplishments are key to making IMAPS much more valuable to us all!

Voya Markovich

IMAPS First Past President and 2014 Awards Chairman

Nomination Deadline: August 8, 2014

 

 

 

Metallix

Oneida Research Services

2014 Events:

IMAPS 2014 - San Diego
Oct. 13-16
*Exhibitors contact bschieman@imaps.org

Thermal Management
Oct. 28-30, 2014
*Exhibitors contact bschieman@imaps.org

2015 Events:

Device Packaging 2015
Mar. 16-19, 2015
*Exhibitors contact bschieman@imaps.org

HiTEN 2015 (High Temp)
Jul. 6-8, 2015
*Exhibitors contact bschieman@imaps.org

IMAPS 2015 - Orlando
Oct. 26-29
*Exhibitors contact bschieman@imaps.org

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