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January 2, 2014
 

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   IMAPS EVENTS
Button NEW - PDC Webinar Series on 2013 Packaging Advances - Begins NEXT WEEK (read more...)

Button Wire Bonding Workshop & Exhibit in 3 Weeks - Still Space (read more...)

Button Device Packaging 2014 - Program Soon, Exhibits Almost Sold Out AGAIN... (read more...)

Button RaMP 2014 (RF & Microwave Packaging) Workshop - Abstracts Now Being Accepted (read more...)

Button CICMT 2014, Japan - Abstracts Still Being Accepted (read more...)

Button HiTEC 2014 (High Temperature) Abstracts Due January 17 (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
2014 Chapter Activities to be announced soon


   MEMBERSHIP CORNER
Bullet Advancing Microelectronics January/February Magazine Now On-Line - DPC, Wafer Level Packaging, IPD  (read more...)

Bullet Journal of Microelectronics and Electronic Packaging 4th Quarter 2013 On-Line  (read more...)

MST

RGL Enterprises
F&K Delvotec
LORD Corporation

Palomar Technologies

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

NEW - PDC Webinar Series on 2013 Packaging Advances - Begins NEXT WEEK   ^ Top
IMAPS PDC Webinar Series on
Best of "2013 Packaging Advances, Updates & Trends"
Featuring 4 separate webinars on: 3D, Flip Chip, MEMS, & Embedded Chips

Webinar 1 - 3D: January 7 & 9, 2014 at 12:00 NOON EASTERN
Webinar 2 - Flip Chip: January 14 & 16, 2014 at 12:00 NOON EASTERN
Webinar 3 - MEMS: January 21 & 23, 2014 at 12:00 NOON EASTERN
Webinar 4 - Embedded Chips: January 28 & 30, 2014 at 12:00 NOON EASTERN

Each webinar consists of two sessions/days.
Take each series separately or register for all 4 webinars at a discounted rate!

1 Webinar: $200 (Member); $300 (Non-Member)
4 Webinar Bundle: $600 (Member); $900 (Non-Member)

Register On-Line

A NEW series of 4 stand-alone webinars (3D, Flip Chip, MEMS and Embedded Chips) has evolved from one of the best attended Professional Development Courses, "2013 Packaging Advances, Updates and Trends" presented at the IMAPS2013 Symposium in Orlando, and the overwhelming response by engineers who took this course. The engineers reviewed 66 white paper topics and selected 48 topics as the most relevant. These topics form the basis of Best of 2013 Packaging Advances, Updates & Trends, a webinar series which has been divided into 4 main technical areas (3D, Flip Chip, MEMS and Embedded Chips), each with 2 sessions. Each 2-day webinar stands alone. This new series of webinars provide a unique engineer-rated update in technology trends based on selected highlights of papers presented at 2013 conferences and symposia along with excerpts from trade press and publicity releases.

Specific input for this series was chosen from the following organizations: CEA-LETI, STMicroelectronics, Disco, Shinko Electric Industries Co., Taiwan Semiconductor Manufacturing Company (TSMC), Tohoku University, Amkor Technology Inc., Dow Electronic Materials, Fraunhofer IZM, IBM Corporation, Sumitomo 3M, Qualcomm, Institute of Microelectronics, Namics Corporation, Yole Développement, Texas Instruments Inc., Vitesse Semiconductor Corp., Hanyang University, Siliconware Precision Industries Co., Ltd, Georgia Institute of Technology, HKUST, Huazhong University of Science & Technology, Nordson ASYMTEK, National Institute of AIST, University of Freiburg & IMTEK, Industrial Technology Research Institute (ITRI), Advanced Semiconductor Engineering, Inc., Mitsubishi Materials Corporation, KAIST, Toray Industries Inc., STATS ChipPAC Ltd., Intel Corporation, Fraunhofer Institute for Reliability and Microintegration, Unimicron Technology Corp, FlipChip International.

Attendees will have access to their webinar's slides and technical references. Email requests from attendees will be honored for additional specific complete references used in their webinar.

Who Should Attend?

This webinar's target is the time-constrained participant with little to no extra time to constantly review daily news releases and/or attend major symposia/workshops to stay current with the latest technological developments in new advanced packaging technology. Also relevant for entry-level technicians and engineers and people in quality assurance, sales, marketing, purchasing, safety, administration and program management. The course uses simple terms, defines the many acronyms for ease of understanding, and avoids complex concepts and equations. However, these advanced details are also provided upon request.

Below is a course outline for each webinar course and the specific sessions. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Webinar #1:
Course Title: 3D - Best of "2013 Packaging Advances, Updates & Trends"

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesday, January 7, 2014 and Thursday, January 9, 2014, 12 noon - 1 p.m. EASTERN

3D Session 1 of 2: Tuesday, January 7 -- 12:00-1:00 PM EASTERN

  • Overview
  • Summary of 3D polymeric materials
  • Chip on Wafer on Substrate (CoWoS) design integration
  • Ultra thin die stacking
  • Interposer warpage control
  • PoP warpage control

3D Session 2 of 2: Thursday, January 9 -- 12:00-1:00 PM EASTERN

  • 3D Integration using self-assembly
  • Low cost chip on chip
  • Temporary & permanent wafer bonding
  • Thermally enhanced underfill
  • Chip Package Interactions (CPI) at 22nm
  • 3D microbump electromigration study)

Webinar #2:
Course Title: Flip Chip - Best of "2013 Packaging Advances, Updates & Trends"

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesday, January 14, 2014 and Thursday, January 16, 2014, 12 noon - 1 p.m. EASTERN

Flip Chip Session 1 of 2: Tuesday, January 14 -- 12:00-1:00 PM EASTERN

  • Overview
  • Differential heating/cooling bonding
  • No clean flux for large FC bonding
  • Thermal compression/non-conductive paste for fine pitch FC
  • Improved prediction of FC electromigration
  • 20 um pitch bonding

Flip Chip Session 2 of 2: Thursday, January 16 -- 12:00-1:00 PM EASTERN

  • Electro vs. electroless microbump plating
  • Microbump bondability guidelines
  • Microbump plating
  • Nanofiber Sn58Bi solder anisotropic conductive films (ACF)
  • Coreless substrates

Webinar #3:
Course Title: MEMS - Best of "2013 Packaging Advances, Updates & Trends"

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesday, January 21, 2014 and Thursday, January 23, 2014, 12 noon - 1 p.m. EASTERN

MEMS Session 1 of 2: Tuesday, January 21 -- 12:00-1:00 PM EASTERN

  • Overview
  • Sealing dispensing for MEMS
  • Chip on chip or face to face Possum™ MEMS
  • Hermetic wafer level packaging of MEMS

MEMS Session 2 of 2: Thursday, January 23 -- 12:00-1:00 PM EASTERN

  • High efficiency carrier wafer self-assembly
  • Outgassing characteristics of thin film materials
  • SiC-MEMS operating at 500°C
  • MEMS-based combo sensors utilizing wafer level packaging (WLP)

Webinar #4:
Course Title: Embedded Chips - Best of "2013 Packaging Advances, Updates & Trends"

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesday, January 28, 2014 and Thursday, January 30, 2014, 12 noon - 1 p.m. EASTERN

Embedded Chips Session 1 of 2: Tuesday, January 28 -- 12:00-1:00 PM EASTERN

  • Overview
  • Innovative fan-out (FO)
  • Embedded wafer level ball grid array (eWLB) solutions
  • Embedded capacitors in microprocessors
  • Wafer level to panel level mold embedding

Embedded Chips Session 2 of 2: Thursday, January 30 -- 12:00-1:00 PM EASTERN

  • Embedded high power electronics modules using sintered silver chip attach
  • Innovative embedded interposer carrier
  • Wafer level packaging for embedding ultrathin (6 µm) chips
  • ChipsetT™ embedded die substrate applications

 

Phil Creter

Presenter

Phillip Creter has over 30 years of microelectronics packaging experience. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (received GTE Corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager, and Manufacturing Engineer, receiving many awards of distinction. He is a well-known presenter who has published technical papers in IEEE Transactions, Solid State Technology, High Density Interconnect, Circuits Manufacturing, Insulation Circuits, and others. He has chaired many technical sessions for symposia, has given hundreds of technical presentations, and is a U.S. patent holder. He has been developing and teaching college-level microelectronics courses since 1997 and has continuously taught professional development courses for online webinars and at various national microelectronics symposia and workshops. He is an active certified instructor for the Department of Homeland Security, currently teaching courses locally. He is a Life member of the International Microelectronics Assembly and Packaging Society (IMAPS). He was elected Fellow of the Society, National Treasurer and President of the New England Chapter.

Register On-Line

Wire Bonding Workshop & Exhibit in 3 Weeks - Still Space    ^ Top
IMAPS will hold its Workshop and Tabletop Exhibit on Wire Bonding at the San Jose Airport Hotel in San Jose, California from January 21-22, 2014. The workshop will again feature a small tabletop exhibition for the vendors and attendees to network over two days of this event. Visit the workshop website at www.imaps.org/wirebonding for tabletop information, registration and more details.

Thank you to our Corporate Sponsor:
Corporate Sponsor: Hesse Mechatronics
See wire bonding in action... with a link to www.wirebonddemo.com

The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

Tuesday, January 21, 2014

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:15 am - 7:50 am

Exhibits Open: 10:00 am - 7:00 pm (Breaks, Lunch & Reception in the Exhibit area)

Opening Remarks: 7:50 am
Lee Levine - General Chair

Session 1: Market Outlook
Session Chairs: Lee Levine, Process Solutions Consulting; Jack Belani, Heraeus Thick Film Division
8:00 am - 10:15 am

KEYNOTE: OSAT Subcon Outllook (45 min.)
Rich Rice, ASE US, Inc.

Semiconductor Market Update & Outlook: From Bonding Wire Perspective (45 min.)
Bud Crockett Jr., Tanaka Denshi Group Saga

The Future of Packaging - The Relevance of Wire Bonding (45 min.)
Bob Chylak, Kulicke & Soffa

Break in Exhibits: 10:15 am - 11:00 am

PANEL DISCUSSION & Question/Answer Session
Moderator: Lee Levine, Process Solutions Consulting
11:00 am - 12:00 pm

Panelists: Rich Rice, ASE US, Inc.; Bud Crockett Jr., Tanaka Denshi Group Saga; Bob Chylak, Kulicke & Soffa

Lunch in Exhibits: 12:00 pm - 1:00 pm

Session 2: Fine Wire
Session Chairs: Daniel Evans, Palomar Technologies; Bud Crockett Jr., Tanaka Denshi Group Saga
1:00 pm - 6:00 pm

Proliferation of Bonding-Wire Types for IC Interconnect
Jack Belani, Heraeus Thick Film Division

Predicting Optimal Material Combinations for Copper Wire Bond Processes Through Finite Element Analysis Models
Aditi Malik, ON Semiconductor (Harold Anderson, Roger Stout)

Ball Bond Reliability: Simulation of Pull and Shear Test
Stevan Hunter, ON Semiconductor (Levi Hill, Tiago Rodrigues, Dustin Whittaker, Aditi Mallik)

Capillary Selection for Challenging Wire Bonding
Mark Greenwell, CoorsTek Inc. / GAISER (Cesar Alfaro, CoorsTek Inc. / GAISER; Lee Levine, Process Solutions Consulting)

Break in Exhibits: 3:00 pm - 3:30 pm

Transforming Wire Bond Eco System
Leroy Christie, ASM Pacific Technology, Ltd.

Increasing the Lifetime of Power Modules by Smaller Bond Wire Diameters
Aaron Hutzler, Fraunhofer IISB (Alan Wright, Andreas Schletz)

Introduction of Copper Alloy Bonding Wire for the Semiconductor Industry
Bud Crockett Jr., Tanaka Denshi Group Saga

Practical Ball Bump Techniques
Mark Greenwell, CoorsTek Inc. / GAISER

ENIG and ENEPIG as Wire Bondable Surface Finishes
George Milad, Uyemura International Corp. (Gerard O'Brien)

Networking & Exhibitor Reception: 6:00 pm - 7:00 pm


Wednesday, January 22, 2014

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibits Open: 10:00 am - 3:30 pm (Breaks and Lunch in the Exhibit area)

Session 3: Wedge Bonding - Fine and Heavy
Session Chairs: Mike McKeown, Hesse Mechatronics, Inc.; Mark Greenwell, CoorsTek Inc. / GAISER
8:00 am - 12:00 pm

Wedge Tool Design Considerations
Uri Zaks, Micro Point Pro Ltd.

Nanoscale Bonding?
Henri Seppainen, Finnish Meteorological Institute

Active and Passive Vibration Control of Ultrasonic Bonding Transducers
Hans Hesse, Hesse Mechatronics, Inc. (Michael Broekelmann)

Small Wire Wedge Tip Geometries
Russell Bell, CoorsTek Inc. / GAISER

Break in Exhibits: 10:00 am - 11:00 am

Convertible Bond Head Enabling Advanced Interconnect
Tao Xu, Kulicke & Soffa Industries

High Speed Aluminum Wire Bonding for Molded Packages
Ken Pham, Texas Instruments Inc. (Yoshihito Hagiwara, Shinkawa Ltd.)

Lunch: 12:00 pm - 1:00 pm

Professional Development Course (PDC)
Instructor: Lee Levine, Process Solutions Consulting
1:00 pm - 5:00 pm

Break in Exhibits: 2:30 pm - 3:00 pm

Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield

Course Description: Wire bonding is the dominant method for chip interconnection. This year the semiconductor industry will produce over 1312(13 trillion) wire bonds. As a result of the increase in the cost of gold a significant portion (approximately 15%) of the entire market has already converted to copper ball bonding. A comparison of the costs, reliability, and difficulty of copper ball bonding will be included. The objective of the short course will be an understanding of the process from the metallurgy to process optimization and capillary selection.

  • The Ball Bond Process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Al-Cu bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on ultra-fine pitch reliability
  • Wire properties, testing and chemistry
  • Pull and shear testing wire bonds
  • Long term accelerated testing of wire bonds
  • Understanding wire stiffness and the effect on looping
  • Wire bond loop shapes
  • The second bond
  • Diffusion
  • The principal bonding variables
  • Capillary design and selection for optimized processes
  • Simple bond screening designed experiments
  • How to optimize the bonding process

Who Should Attend? Engineers and technical people involved in wire bonding and wafer interconnection at all levels from beginners to advanced.

Lee Levine's previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He was awarded 4 patents, published more than 70 technical papers, and won both the 1999 John A. Wagnon Technical Achievement award and the 2012 Daniel C Hughes award from the International Microelectronics and Packaging Society, IMAPS. Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. He is a Fellow, a life member and previously was IMAPS V.P Technology.

Workshop Closing Remarks: 5:00 pm

Register On-Line

Device Packaging 2014 - Program Soon, Exhibits Almost Sold Out AGAIN...   ^ Top
The 10th Annual Device Packaging Conference (DPC 2014) will be held in Fountain Hills, Arizona, on March 10-13, 2014. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The technical program and sessions will be announced in the days ahead. Only a few exhibits are still available - contact Brian at bschieman@imaps.org immediately if you wish to exhibit and/or sponsor. Visit www.imaps.org/devicepackaging for exhibit information, registration and more details.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring Topical Workshop Tracks on:

  • 2.5D/3D IC & Packaging;
  • Flip Chip and Wafer Level Packaging; and
  • Packaging Innovations & System Challenges for:
    MEMS, Sensors & Miniaturized Devices; Photonics & LED Packaging

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about submitting an abstract for immediate consideration.

RaMP 2014 (RF & Microwave Packaging) Workshop - Abstracts Now Being Accepted   ^ Top
RaMP 2014 - the RF and Microwave Packaging Workshop - will be held April 8-10 at the Crowne Plaza San Diego, in San Diego, CA. Abstracts are due January 30. Tabletop exhibits are still available - contact Brian at bschieman@imaps.org immediately if you wish to exhibit or need assistance submitting an abstract. Visit www.imaps.org/rf for exhibit information, registration, and to submit abstracts.

Thank you to our Premier Sponsors:

Palomar Technologies - Premier Sponsor
Quik-Pak - Premier Sponsor

RaMP 2014 Focus:
The objective of the RaMP 2014 Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. RaMP enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-sponsored by IMAPS-UK and will be the first in a series of joint RaMP workshops between IMAPS and IMAPS-UK.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New Uncooled IR sensors
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Low loss, wide BW, high power interconnects
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics
  • Medical Electronics
  • Wearable Electronics

Awards will be given in the following categories: Best RaMP Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RaMP 2014 Workshop must submit a 200-300 word abstract electronically no later than January 31, 2014, using the on-line submittal form at: www.imaps.org/abstracts.htm.

No formal technical paper is required.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.


Submit Abstract(s)

CICMT 2014, Japan - Abstracts Still Being Accepted   ^ Top
IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014) is being held April 14-16 at Hotel Hankyu Expo Park in Osaka, Japan Abstracts are still being accepted. Tabletop exhibits are available - contact Brian at bschieman@imaps.org immediately if you wish to exhibit or need assistance submitting an abstract. Visit www.imaps.org/ceramics for exhibit information, registration, and to submit abstracts.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due: IMMEDIATELY
Notice of Acceptance: January 17, 2014
Final Manuscripts Due: February 28, 2014

Please send your 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org or call 1-412-368-1621 (USA).

HiTEC 2014 (High Temperature) Abstracts Due January 17    ^ Top
The International Conference on High Temperature Electronics (HiTEC 2014) is being held May 13-15 at the Albuquerque Marriott Pyramid North in Albuquerque, New Mexico. Abstracts are due January 17. Tabletop exhibits are still available - contact Brian at bschieman@imaps.org immediately if you wish to exhibit and/or sponsor. Visit www.imaps.org/hitec for exhibit information, registration, and/or to submit abstracts.

HiTEC 2014 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2014 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

Those wishing to present a paper at the HiTEC 2014 Conference must submit a 300-500 word abstract electronically by January 17, 2014, using the on-line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee. 

Students wishing to present at the High Temperature Electronics Conference must also submit a 300-500 word abstract electronically no later than January 17, 2014; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on March 21, 2014.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org) or call 412-368-1621.

 

 

  Chapter Activities (events listed in chronological order)
 

2014 Chapter Activities to be announced soon

 

  Membership Corner
 

Advancing Microelectronics January/February Magazine Now On-Line - DPC, Wafer Level Packaging, IPD    ^ Top

January/February 2014:
Volume 41, No. 1
DPC, Wafer Level Packaging, IPD

The January/February 2014 issue featured four technical articles on: Advanced eWLB PoP Structures; Flip Chip Interconnect: Examining the Infrastructure; Improving WLCSP Reliability through Solder Joint Geometry Optimization; and Spheron (TM) WLCSP Technology Qualification and Scale Up to 300mm.

download magazine PDF (6mb)

Journal of Microelectronics and Electronic Packaging 4th Quarter 2013 On-Line   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 10, Number 4
Fourth Quarter 2013



Tin Nanoparticle-Based Solder Paste for Low Temperature Processing
Alfredo J. Diaz and Pedro O. Quintero, University of Puerto Rico-Mayaguez David Ma and Alfred Zinn, Lockheed Martin Corporation

129

High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices
Christina DiMarino, Zheng Chen, Dushan Boroyevich, Rolando Burgos, and Paolo Mattavelli, Virginia Tech

138
Surface Characteristics of LTCC Substrates Fabricated by Pressure-Assisted Sintering
Bjoern Brandt and Torsten Rabe, BAM Federal Institute for Materials Research and Testing
144

Reliability Investigations up to 350C of Gate Oxide Capacitors Realized in a Silicon-on-Insulator CMOS Technology
K. Grella, S. Dreiner, H. Vogt, and U. Paschen, Fraunhofer Institute for Microelectronic Circuits and Systems

150

A 4H-SiC Bipolar Technology for High-Temperature Integrated Circuits
L. Lanni, B. G. Malm, C.-M. Zetterling, and M. Östling, KTH Royal Institute of Technology

155
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
S. T. Riches, GE Aviation Systems C. Johnston and A. Lui, Oxford University Materials
163
Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing
Alexander Schmidt, Holger Kappert, and Rainer Kokozinski, Fraunhofer Institute for Microelectronic Circuits and Systems
171
 

 

 

Torrey Hills Technologies

Oneida Research Services

Metallix

2014 Events:

2013 Packaging Advances WEBINARS
(3d, Flip Chip, MEMS & Embedded Chips)
Jan. 7,9,14,16,21,23,28,30, 2014

Wire Bonding 2014
Jan. 21-22
*Exhibitors contact bschieman@imaps.org

Device Packaging 2014
Mar. 10-13
*Exhibitors contact bschieman@imaps.org

RF/Microwave 2014
April 8-10
*Exhibitors contact bschieman@imaps.org

CICMT 2014 (Japan)
April 14-16
*Exhibitors contact bschieman@imaps.org

High Temperature (HiTEC 2014)
May 13-15
*Exhibitors contact bschieman@imaps.org

IMAPS 2014 - San Diego
Oct. 13-16
*Exhibitors contact bschieman@imaps.org

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