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March 20, 2014

Heraeus TFD

Button IMAPS 2014 San Diego - Abstracts Due Next Friday (read more...)

Button IMAPS 2014 Early Exhibit Deadline - MARCH 28 (read more...)

Button RaMP 2014 (RF & Microwave Packaging) Workshop 2 Weeks Away (read more...)

Button CICMT 2014, Japan Begins April 14 - Registration/Hotel Deadline TOMORROW (read more...)

Button HiTEC 2014 (High Temperature) Program On-Line - Registration/Hotel Deadline April 18 (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Button San Diego Chapter Lunch Presentation On March 25th: Polymer Challenges in 2.5D and 3D Packaging (read more...)

Button METRO Chapter Dinner Presentation On March 27th: Paving the Path Towards High Frequencies and Higher Temperatures (read more...)

Button Indiana Chapter Dinner Meeting & Tour of L-3 Communications on March 27 (read more...)

Button ICEP 2014 Being Held April 23-25 in Toyama, Japan (read more...)

Button IMAPS New England May 6 Symposium Explores Next-Generation Microelectronics (read more...)

Bullet Journal of Microelectronics and Electronic Packaging 1st Quarter 2014 On-Line  (read more...)


RGL Enterprises
F&K Delvotec
LORD Corporation

Palomar Technologies


  IMAPS Events (view full Web Calendar)

IMAPS 2014 San Diego - Abstracts Due Next Friday    ^ Top
The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 47th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2014 will feature 6 technical tracks that span the two and a half days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; THE FUTURE OF PACKAGING; ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY; MATERIALS & PROCESSES; MODELING, DESIGN, & TEST; and SPECIAL SESSIONS ON SYSTEM-INTEGRATION, POWER & HIGH-RELIABILITY, as well as an Interactive Student Poster Session.


Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

• TSV Materials & Processes • Silicon Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Glass Interposers • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • 3D Simulation and Modeling • Advanced 3D Materials • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D • Think Thin: Thin IC Packaging For Mobile • 3D Printing (Inkjet & others)
• Roadmaps • Package Scaling • Printed Electronics & Additive Manufacturing • Sensor Packaging • Medical Device Packaging • Microfluidics & Bio-MEMS • Packaging for Medical Implants & Ingestibles • Portable & Patient Monitoring Devices • Wearable Devices • Membrane & Capacitive Switches • Printable Display & Lighting • Automotive Microelectronics: "Infotainment" • "Internet of Things"
• Wirebonding & Stud Bumping • Flip Chip Interconnects & Technologies • MEMS • Wafer Level Packaging • Chip Scale Packaging • Wafer Finishing (Bumping, Copper Pillar, Thinning) • Warpage Characterization and Mitigation • Gyros & Accelerometers • RF Devices • Optical Interconnects • Optical MEMS (MOEMS) • LED and Optoelectronics Packaging • Silicon Photonics • High Performance Interconnect & Boards • Novel Interconnections, Fabrication & Analysis Methods
• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Polymer Interposers • Substrate Materials • Ceramic & LTCC Packaging • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films • Pb-Free Solder & ROHS
• Design for Reliability • Modeling & Design for SI, PI and EMC • Thermal and Thermo-Mechanical Modeling • Testing Methods and Process • RF and Microwave Packaging • Mechanical Modeling and Related Metrology • Design for Manufacturing • Package Reliability Testing • Fine Pitch Probes
• European Perspective on System Integration • Asian Perspective on System Integration • Automotive Electronics • Harsh Environment / High Temperature • High Reliability for Military/Aero Applications • High-rel Drilling/Geo-Thermal • Power Packaging • Enabling Technologies for Power Management • Thin & Printed Battery Technology

Industries Represented:
Consumer, Portable and Wireless Biomedical Telecom Defense and Security Computing, and Gaming
Automotive Applications Solar and Alternative Energy
Gas, Drilling & GeoThermal

Please send your 500 word abstract electronically only using the On-line submittal form at: All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at or call 412-368-1621.

Submit Abstract(s)

IMAPS 2014 Early Exhibit Deadline - MARCH 28    ^ Top
IMAPS 2014 is being held at the Town & Country in San Diego, California with the Exhibition being held October 14-15, 2014. The early exhibit deadline is next Friday, March 28. More than 70 booths have already been rented, but many good spots still remain.

Contact Brian Schieman with questions, Fill out the linked booth application form and return it to Brian immediately. Brian will contact you to assign your exact booth location. Reserve Booth(s) | Floorplan


RaMP 2014 (RF & Microwave Packaging) Workshop 2 Weeks Away   ^ Top
RaMP 2014 - the RF and Microwave Packaging Workshop - will be held April 8-10 at the Crowne Plaza San Diego, in San Diego, CA. Visit for exhibit information, registration, and to for the program details.

Thank you to our Premier Sponsors:

Palomar Technologies - Premier Sponsor
Quik-Pak - Premier Sponsor

The objective of the RaMP 2014 Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. RaMP enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-organized by IMAPS-UK and will be the first in a series of joint RaMP workshops between IMAPS and IMAPS-UK.

SOLD OUT 2014 Tabletop Exhibit -- Limited to 15 tabletops

Tuesday, April 8 , 2014

Registration: 7:00 am - 7:00 pm

Continental Breakfast: 7:00 am - 7:45 am

Tabletop Exhibition: 3:00 pm - 7:00 pm
Refreshment Breaks & Reception will be held in the Exhibit Area

OPENING REMARKS: 8:00 am - 8:15 am
RaMP 2014 Workshop General Chair
Ken Kuang, Torrey Hills Technologies, LLC

KEYNOTE SPEAKER: 8:15 am - 9:00 am
3D Research for Electronics Packaging
Dr. Robert Kay, Additive Manufacturing Research Group (AMRG), Loughborough University

Dr. Robert Kay obtained an honours degree in Electrical & Electronic Engineering and a Ph.D in Microsystems Engineering from Heriot-Watt University, Edinburgh, UK. Robert is now a Senior Lecturer in Additive Manufacturing within the Wolfson School of Mechanical and Manufacturing engineering at Loughborough University. His research interests primarily focuses around using additive manufacturing processes for integrating microsystems technology into a wide range of applications for creating smarter more functional devices.

During the course of Robert's Doctorate studies he developed a novel microfabrication manufacturing process for the production of precision electroformed stencils used mainly for the deposition of interconnects for electronic packaging. He successfully commercialised this research by founding MicroStencil Limited in 2003. Through his supervision of the Company he scaled the product up for commercial production, build a diverse customer base and established a manufacturing partnership license agreement in Asia.

Session 1: Advanced RF Packaging
Session Chair: Michel de Langen, NXP
9:00 am - 12:30 pm

9:00 am - 9:30 am
Qualification of RF Package for Automotive Application
Mumtaz Bora, Peregrine Semiconductor

9:30 am - 10:00 am
Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina
Rick Sturdivant, RLS Design, Inc.

10:00 am - 10:30 am
Challenges and Opportunities for Ceramic Packaging
Ken Kuang, Torrey Hills Technologies, LLC

Coffee Break in Foyer: 10:30 am - 11:00 am

11:00 am - 11:30 am
High Performance Hydrogen Getter for Hermetic Packaging of Electronic Devices
Alessandro Morbiato, SAES Group (E. Rizzi, L.Mauri, A.Hayden, H.Florence)

11:30 am - 12:00 pm
A Wide Bandgap Discrete Package for High Performance, High Temperature Applications
Brandon Passmore, Arkansas Power Electronics International (B. McPherson, Z. Cole, P. Killeen, D. Martin, T. McNutt)

12:00 pm - 12:30 pm
Aluminum Nitride Energy Harvesters for High Temperature Wireless Sensor Systems
Yun-Ju Lai, University of California, Berkeley (Albert P. Pisano)

Lunch Break: 12:30 pm - 1:30 pm

Session 2: RF Packaging Assembly
Session Chair: Paul Huggett, ESP-KTN
1:30 pm - 5:30 pm

1:30 pm - 2:00 pm
Optimizing Solder Bonding for High Power Applications
Ramesh Varma, Northrop Grumman Corporation (Thomas Knight, Martin Goetz, William Winkel)

2:00 pm - 2:30 pm
Failure Analysis of SnPb Solder Joints on Cu-Fe-P Lead Frame of Power MOSFET
Lihua Cao, Institute of Metal Research, Chinese Academy of Sciences (Zhiquan Liu, Chinese Academy of Sciences; Yongliang Zhang, Cui Zhang, Renzhe Zhao, Huawei Technologies)

2:30 pm - 3:00 pm
Automated Eutectic Attachment Technology Studies in RF & Microwave Packages
Daniel Evans, Palomar Technologies, Inc. (Zeger Bok)

Coffee Break in Exhibits: 3:00 pm - 4:00 pm

4:00 pm - 4:30 pm
Surface Preparation for Wire Bonding
David Jackson, CleanLogix LLC

4:30 pm - 5:00 pm
Assembly of a Integrated High-Power Amplifier
Michel de Langen, NXP Semiconductors

5:00 pm - 5:30 pm
The Influence of the Coating Layer of the Soldered Device to the Reliability of Their Interconnection with Ni Coated Cu Wires
Ying Zhong, Harbin Institute of Technology (Chunqing Wang, J.F.J. Caers, Xiujuan Zhao)

Reception in Exhibits: 5:30 pm - 7:00 pm


Wednesday, April 9, 2014

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 7:45 am

Tabletop Exhibition: 10:00 am - 1:30 pm
Lunch & Refreshment Break will be held in the Exhibit Area

OPENING REMARKS: 8:00 am - 8:15 am
RaMP 2014 Workshop General Co-Chair
Susan Trulli, Raytheon RF Components

KEYNOTE SPEAKER: 8:15 am - 9:00 am
Electronics & Bio-Tech TBD
TBD - Illumina


Session 3: Modeling and Simulation
Session Chair: Sean Cahill, Maxim
9:00 am - 12:00 pm

9:00 am - 9:30 am
Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging
Rick Sturdivant, RLS Design, Inc.

9:30 am - 10:00 am
Passive Macromodeling Methodology for TSV and Bondwire Interconnects
Eva Kozachenko, San Diego State University (Arif Engin)

Coffee Break in Exhibits: 10:00 am - 10:30 am

10:30 am - 11:00 am
Package and Board Effects in RF Multi-Function Assemblies
Tony Donisi, ANSYS, Inc.

11:00 am - 11:30 am
TBD - Asahi Glass
Vern Stygar, AGC

Lunch Break in Exhibits: 11:30 am - 1:30 pm

KEYNOTE SPEAKER: 1:30 pm - 2:15 pm
Future Telecomm Packaging TBD
TBD - Qualcomm


Session 4: Thermal Management for RF Packaging
Session Chairs: Iris Labadie, Kyocera America; Cai Liang, Integra
2:15 pm - 5:15 pm

2:15 pm - 2:45 pm
The Effect of Plating, Surface Finish, and Bond Line Thickness on AuSn Solder Joints
Greg Rudd, Spectra-Mat, Inc (John Paff, Rob Brox)

2:45 pm - 3:15 pm
How Can Millions of Aligned Graphene Layers Cool High Power RF and Microwave Electronic
Wei Fan, Momentive Performance Materials Inc. (Xiang Liu, Aaron Rape)

Coffee Break in Foyer: 3:15 pm - 3:45 pm

3:45 pm - 4:15 pm
New Thermal Management of GaN RF PA's: A Progress Report
Thomas Obeloer, Element Six Technologies (Felix Ejeckam, Daniel Francis, Firooz Fiali, Frank Lowe, Daniel Twitchen, Bruce Bolliger)

4:15 pm - 4:45 pm
Development of Seven Layer Cu/Mo/Cu Thermal Management Material
Guosheng, Jiang Central South University

4:45 pm - 5:15 pm
Development and Application of Copper-Graphite Composite Thermal Control Cores for High-Reliability RF System PCBs
David Saums, DS&A LLC (Rob Hays, MMCC LLC)

Closing Remarks: 5:15 pm
Workshop General Chairs

On-Line Registration

CICMT 2014, Japan Begins April 14 - Registration/Hotel Deadline TOMORROW    ^ Top
IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014) is being held April 14-16 at Hotel Hankyu Expo Park in Osaka, Japan. Visit for exhibit information, registration, and to view the program.

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications.

Monday, 14 April, 2014

Registration: 8:00 am - 17:00 pm

Tabletop Exhibition: 10:00 am - 18:00 pm
Lunch, Refreshment Breaks & Dinner will be held in the Exhibit Area

Session 1: 3D Printing and Direct Writing
Session Chair: Soshu Kirihara, Osaka University
9:00 am - 12:00 pm

PLENARY SPEAKER: 9:00 am - 9:40 am
Two Photon Polymerization for 3D Printing of Small-Scale Medical Devices
Roger Narayan, University of North Carolina

PLENARY SPEAKER: 9:40 am - 10:20 am
Can the Room Temperature Coating Technology Escalate the Use of 3D Printer?
Jun Akedo, AIST(National Institute of Advanced Industrial Science & Technology)

Coffee Break in Exhibit: 10:20 am - 10:40 am

10:40 am - 11:00 am
Evaluating the Aerosol Printing Technology for the Manufacturing of Sensory Microsystems
Steffen Ziesche, Fraunhofer IKTS (M. Ihle, S. Mosch, S. Conze, S. Hildebrandt, I. Kinski, U. Partsch)

11:00 am - 11:20 am
Three Dimensional Ceramics Printing to Create Ordered Dendrite Structures for Energy and Material Flows Modulation
Soshu Kirihara, Osaka University

11:20 am - 11:40 am
Electromagnetic Pump Made in a Hybrid Polymer-Ceramic Technology
Mateusz Czok, Wroclaw University of Technology (Karol Malecha, Leszek Golonka)

Lunch Break in Exhibits: 12:00 pm - 13:00 pm

Session 2: Ceramic Nanomaterials and Nanostructuring
Session Chairs: Sean Li, The University of New South Wales; Xiulan Hu, Nanjing Tech University
13:00 pm - 16:20 pm

13:00 pm - 13:20 pm - INVITED SPEAKER
Facile Synthesis of Metal Oxide Nanomaterials by Plasma in Water
Xiulan Hu, Nanjing Tech University (Xiaodong Shen, Jianbo Zhang, Junjun Shi, Yoshitake Masuda, Kazumi Kato, Osamu Takai, Nagahiro Saito)

13:20 pm - 13:40 pm - INVITED SPEAKER
Functional Hybrid Silica
Michel Wong Chi Man, Institut Charles Gerhardt Montpellier

13:40 pm - 14:00 pm
Printed Electronics Based on Nanoparticular TCO Materials
Moritz Wegener, University of Erlangen-Nuremberg (Nadja Kolpin, Andreas Roosen)

14:00 pm - 14:20 pm
Microstructure and Gas Sensitive Properties of High Orientated LaBaCo2O5+δ Thin Films on SiO2/ Si (001)
Dunhua Hong, State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science & Technology of China (Min Gao, Yin Zhang, Yuan Lin)

14:20 pm - 14:40 pm
High-k Nanosheet Devices Fabricated from Solution-Based Layer-by-Layer Assembly
Minoru Osada, MANA, NIMS (Takayoshi Sasaki)

Coffee Break in Exhibits: 14:40 pm - 15:00 pm

15:00 pm - 15:20 pm - INVITED SPEAKER
Self-assembly of CeO2 Nanocubes: an Approach for the Development of Resistive Random Access Memory Device
Sean Li, The University of New South Wales (Adnan Younis, Dewei Chu)

15:20 pm - 15:40 pm
Nano-structuring of Metal Oxides for Molecular Sensors
Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)

15:40 pm - 16:00 pm
Tailored-Made and Surface Modification of Anatase TiO2 Towards High Photocatalytic Performance
Zhenquan Tan, Joining and Welding Research Institute, Osaka University (Kazuhiro Yamamoto, Nan Qiu, Takeshi Hashishin, Satoshi Ohara)

16:00 pm - 16:20 pm
Ferroelectric Properties of BaTiO3 Thin Films on Polycrystalline Ni Substrate Grown by Polymer-assisted Deposition After Rapid Thermal Annealing
Hui Du, State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science & Technology of China (Weizheng Liang, Yang Li, Min Gao, Yin Zhang, Chonglin Chen, Yuan Lin)

Session 3: Aerosol Deposition
Session Chair: Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)
16:20 pm - 17:00 pm

16:20 pm - 16:40 pm
Percolative BaTiO3 Composite Films Fabricated by Aerosol Deposition
Yoon-Hyun Kim, Waseda University, National Institute for Materials Science (Minoru Osada)

16:40 pm - 17:00 pm
Enhanced Polarization and Leakage Current Properties of High Quality Self-supported Bismuth Sodium Titanate Thick Films by AD Method
Muneyasu Suzuki, National Institute of Advanced Industrial Science and Technology (Jun Akedo)

Dinner in Exhibits: 18:00 pm - 20:00 pm


Tuesday, 15 April, 2014

Registration: 8:00 am - 17:00 pm

Tabletop Exhibition: 10:00 am - 16:00 pm
Lunch, Refreshment Breaks & Banquet will be held in the Exhibit Area

Session 4: Advanced Packaging Technology
Session Chairs: Jens Müller, Technische Universitaet Ilmenau; Min Gao, University of Electronic Science & Technology of China
9:00 am - 12:00 pm

9:00 am - 9:20 am
Enhancing the Thermal Conductivity of Composite Materials
Min Gao, State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science & Technology of China (Jiang huang, Taisong Pan, Yin Zhang, Yuan Lin)

9:20 am - 9:40 am
Performance Improvement of Heat Sink with Carbon Nanotube Array
Taisong Pan, State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China (Zhenlong Huang, Min Gao, Yin Zhang, Yuan Lin)

9:40 am - 10:00 am
Wetting Behaviour of LTCC and Glasses on Nanostructured Silicon Surfaces During Sintering
Sebastian Gropp, lmenau University of Technology (M. Fischer, L. Dittrich, B. Pawlowski, J. Müller, M. Hoffmann)

10:00 am - 10:20 am
Co-fired AlN-TiN Assembly as a New Substrate Technology for High Temperature Power Electronics Packaging
Sophie Guillemet-Fritsch, CNRS/Yniversity Paul Sabatier/ CIRIMAT (Zarel Valdez-Nava, Marc Ferrato, Masahiro Kozako, Thierry Lebey)

Coffee Break in Exhibits: 10:20 am - 10:40 am

10:40 am - 11:00 am - INVITED SPEAKER
Electromagnetic Isolation (EMI) Structure-Property Relationships in Low Temperature Cofired Ceramic (LTCC)
Jack Harder, Honeywell FM&T (Daniel S. Krueger)

11:00 am - 11:20 am
Low Temperature Co-fired Ca-Cu Titanate Multilayers for Integration into LTCC Modules
Jorg Topfer, EAH Jena, Univ. Appl. Sciences (Jena R. Löhnert, S. Barth, B. Capraro, H. Bartsch, J. Müller, R. Schmidt)

11:20 am - 11:40 am
RF-MEMS-Platform Based on Silicon-Ceramic-Composite-Substrates
Michael Fischer, Ilmenau University of Technology (Sebastian Gropp, Jacek Nowak, Beate Capraro, Martin Hoffmann, Jens Müller)

11:40 am - 12:00 pm
Dielectric Constant, Loss Tangent, and Surface-Roughness Loss Characterization of Ceramic Substrates
A. Ege Engin, San Diego State University

Lunch Break in Exhibits: 12:00 pm - 13:00 pm

Session 5: Design and Integration of LTCC
Session Chair: A. Ege Engin, San Diego State University
13:00 pm - 14:40 pm

13:00 pm - 13:20 pm
Constrained Sintering of a Low-fire, Polycrystalline Bi2(Zn1/3Nb2/3)2O7 Dielectric
Jau-Ho Jean, National Tsing Hua University (YJ Chu, SC Lin)

13:20 pm - 13:40 pm
Integrated ESD Circuit in Low Temperature-Co-fired Ceramics
Naoyuki Okamoto, Hitachi Metals Ltd. (Shinroh Itoh,Hiroyuki Itoh)

13:40 pm - 14:00 pm
Manufacturing of Precise Embedded Resistors by a Tape-on-LTCC Process
Jens Müller, Technische Universitaet Ilmenau

14:00 pm - 14:20 pm
Suppression of Silver Diffusion in Low Temperature Co-fired Ceramic by Copper Oxide Addition
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Mingsheng Ma, Yongxiang Li)

14:20 pm - 14:40 pm
Zinc Oxide on Oxygenated Aligned Multiwalled Carbon Nanotubes for Photodetector Applications
Chia-I, Hung National Tsing Hua University (Hua-Chiang Wen, Wen-Kuang Hsu)

Coffee Break in Exhibits: 14:40 pm - 15:00 pm

Session 6: Processing and Application of Ceramic Thick Film
Session Chairs: Markus Eberstein, Fraunhofer IKTS; Mark Challingsworth, Heraeus Precious Metals North America Conshohocken, LLC
15:00 pm - 17:00 pm

15:00 pm - 15:20 pm
Thick Print Copper and Silver Conductors for Power Circuit Applications
Mark Challingsworth, Heraeus Precious Metals North America Conshohocken, LLC (Virginia Garcia, Ryan Persons, Christina Modes, Melanie Bawohl)

15:20 pm - 15:40 pm
Concept and Manufacturing of a Pressure Sensor Based on a LTCC Thin Film Strain Gauge
Bjoern Brandt, BAM Federal Institute for Materials Research and Testing (Ralf Koppert, Torsten Rabe)

15:40 pm - 16:00 pm
Potentiometric and Conductimetric pH Sensors Based on RuO2-TiO2 Thick Films
Libu Manjakkal, Institute of Electron Technology, Krakow Division (Katarina Cvejin, Jan Kulawik, Krzysztof Zaraska, Dorota Szwagierczak)

16:00 pm - 16:20 pm
Study on the Impedancemetric NO Sensor Fabricated in Thick Film Technology
Katarina Cvejin, Institute of Electron Techonology, Krakow Division (Libu Manjakkal, Jan Kulawik, Krzysztof Zaraska, Dorota Szwagierczak)

16:20 pm - 16:40 pm
LTCC-based Thick-film Thermoelectric Energy Harvester
Piotr Markowski, Wroclaw University of Technology

16:40 pm - 17:00 pm
Post Fired Via Metallizations with Enhanced Functional Properties
Markus Eberstein, Fraunhofer IKTS (Christel Kretzschmar, Lars Rebenklau, Angela Rebs, Guenter Reppe)

Banquet in Exhibits: 18:00 pm - 20:00 pm


Wednesday, 16 April, 2014

Registration: 8:00 am - 12:40 pm

Session 7: Fuel Cells and Batteries
Session Chair: Minoru Osada, MANA, NIMS
9:00 am - 10:20 am

PLENARY SPEAKER: 9:00 am - 9:40 am
Advanced Composite Electrodes for Solid State Li-ion Battery
Kiyoshi Kanamura, Tokyo Metropolitan University (Mao Shoji, Jungo Wakasugi, Hirokazu Munakata)

9:40 am - 10:00 am - INVITED SPEAKER
Development of Tubular Electrochemical Cell for SOFC/SOEC Applications
Toshiaki Yamaguchi, National Institute of Advanced Industrial Science and Technology (Unhi Honda, Yoshinobu Fujishiro)

10:00 am - 10:20 am
Electrostatic Dry Deposition of Nanocomposite Particles for Li Ion Battery
Hiroya Abe, Osaka University (Akira Kondo, Makio Naito, Osaka Univ.; Masayuki Yamaguchi, Honda Engineering Co.Ltd.)

Coffee Break: 10:20 am - 10:40 am

Session 8: High Performance Electronics
Session Chair: Hiroya Abe, Osaka University
10:40 am - 12:40 pm

10:40 am - 11:00 am - INVITED SPEAKER
Bonding Process using Metal Nanoparticles for High-temperature Applications
Hiroshi Nishikawa, Joining and Welding Research Institute, Osaka University (Tomoaki Hirano, Lishun Wei, Nobuhito Terada)

11:00 am - 11:20 am - INVITED SPEAKER
VO2 Thermochromic Smart Window: from Energy Savings to Electricity Generation
Yanfeng Gao, Shanghai University

11:20 am - 11:40 am
Evaluation of Fracture Toughness of Ceramic Substrates for Power Modules
Hiroyuki Miyazaki, National Institute of Advanced Industrial Science and Technology (Yu-ichi Yoshizawa, Kiyoshi Hirao, Tatsuki Ohji)

11:40 am - 12:00 pm
Design and Fabrication of Integrated Fluidic Channels for Liquid Cooling of a LTCC Device
Tilo Welker, Ilmenau University of Technology (Jens Müller)

12:00 pm - 12:20 pm
Synthesis and Integration of Ceria Nanocubes for Solid Oxide Fuel Cells at Low Operating Temperature
Satoshi Ohara, Osaka University (Kazuhiro Yamamoto, Takeshi Hashishin, Nan Qiu, Zhenquan Tan)

12:20 pm - 12:40 pm
Insulating Ceramic Layers Fabricated by Aerosol Deposition for Circuit Boards of High Power Electronics
Hiroki Tsuda, National Institute of Advanced Industrial Science and Technology (AIST) (Muneyasu Suzuki, Jun Akedo)

Conference Closing Remarks: 12:40 pm

Register On-Line & Hotel

HiTEC 2014 (High Temperature) Program On-Line - Registration/Hotel Deadline April 18    ^ Top
The International Conference on High Temperature Electronics (HiTEC 2014) is being held May 13-15 at the Albuquerque Marriott Pyramid North in Albuquerque, New Mexico. Visit for exhibit information, registration, and to view the program.

HiTEC 2014 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2014 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.



Registration: 10:00 am - 7:00 pm

Includes: PDC Lunch: 1:00 pm - 2:00 pm & Afternoon Break: 4:30 pm - 4:45 pm

High Temperature Electronics
Professional Development Course (PDC - Short Course)
PDC Instructor: Randall Kirschman, Consultant

Additional registration fee from HiTEC Attendee Registration
Register On-Line - Under SESSIONS During Check-out

Course Description: High-Temperature Electronics (HTE) is a valuable option for substantially improving overall system performance. Operating temperature may be thought of as an additional design parameter when justified by system performance requirements. The course is updated and expanded for 2014.

Applications of HTE include many areas: petroleum and geothermal wells, ground vehicles, aircraft, Solar System exploration, and electric power. Relocating electronic subsystems to high temperature can improve overall system efficiency, decrease size and weight, simplify maintenance and improve reliability. At the same time there are many technical challenges, related to materials and their interactions, component behavior, circuit design and interfacing.

The focus of this course is semiconductor electronics at high temperatures: device behavior, applications, advantages and drawbacks, technical issues and present situation. Basic materials characteristics related to electronics at high temperatures, and passive electronic component behavior are included, as well as assembly, packaging and interconnection. The temperature range covered in this course extends from +125C upward, as high as 1000C. Depending on the temperature range, HTE semiconductor devices may be based on Si, SiGe, GaAs, SiC, GaN, C (diamond) and other materials.

Although future developments in electronics are difficult to predict, it is likely that high-temperature electronics will find increased use for enhanced performance in extreme environments.


I. - Introduction and definitions, course description & objectives, temperature ranges, history and background.
II. - Applications: oil and geothermal well measurements, space exploration and power, aircraft,  automotive. Reasons for high-temperature operation of electronics; benefits and drawbacks.
III. - Materials behavior - non-semiconductors: thermal conductivity, thermal expansion, heat capacity, thermal diffusivity, electrical conduction, glass transition temperature, strength, temperature capabilities, dielectric properties, magnetic properties.
IV. - General semiconductor materials behavior: carrier generation, mobility, electrical conductivity, behavior and capabilities of Ge, Si, SiGe, GaAs, GaN, SiC, BN, C (diamond), etc. - semiconductor device temperature capabilities/limits.
V. - Silicon device behavior: diodes, bipolar transistors, FETs (JFETs, MOSFETs, etc.), power devices (MOSFETs, IGBTs, thyristors, etc.), integrated circuits (bipolar, CMOS, SOI); SiGe devices.
VI. - Devices based on medium-bandgap semiconductor materials: GaAs, AlGaAs, GaP, etc.
VII. - Devices based on large-bandgap semiconductor materials: GaN, SiC, BN, C (diamond).
VIII. - Passive components (resistors, capacitors, inductors) for high temperatures.
IX. – Assembly and packaging for high temperatures: thin-film, thick-film, die-attach, wirebonding, soldering, packages, interfacing, examples of assemblies.
X. - Modeling & simulation.
XI. - Reliability & aging: how high temperature differs from room temperature, mechanical stress, failure rates, temperature cycling, testing examples, adaptive circuitry.
XII. - Radiation effects with examples.
XIII. - Design issues and ideas: choosing components, factors, temperature/temperature range, lifetime requirements, environment & additional stresses, mechanical, resources, custom vs commercial.
XIV. - Alternative technologies for high temperature electronics.
Commercial components for high temperatures: passives, semiconductor devices, circuits.
XV. - References & Bibliography

Course Objectives: Provide an overview of situations where the technologies of electronics and high temperatures are brought together. Provide an overview of the applications for high temperature electronics. Survey the relationships between fundamental phenomena, materials behavior, and device and system characteristics and performance at high temperatures. Overview the behavior of materials and components used in electronics at high temperatures: metals, ceramics, plastics, passive components, semiconductor materials and devices, and electronic circuits and assemblies. Provide practical information on materials, devices, circuits and techniques for those involved in developing high-temperature electronics.

Copies of the slides (approximately 275), course notes (approximately 150 pages), and more than 500 references/bibliographic items are provided.

Who Should Attend?: Engineers and technical persons in research or development of electronics for high-temperature applications. Familiarity with electronic devices and circuits is an advantage; however, materials and device fundamentals will be reviewed.

Dr. Randall Kirschman is an internationally recognized authority on extreme-temperature electronics. He has been consulting to industry, government and academe since 1980 in the areas of microelectronic materials and fabrication technology, and electronics for extreme temperatures. Before going into business for himself in 1982, he managed the processing laboratory at the R&D Center at a division of Eaton Corporation, where he was responsible for the fabrication of thin-film hybrids for microwave components. Prior to that, he was on the staff of the Jet Propulsion Laboratory, performing research on semiconductor materials and devices. During 1990-91 he was a Visiting Senior Research Fellow at the Institute of Cryogenics, University of Southampton, England. Between 1998-2005, he was a member of the Physics Department at Oxford University. He edited the 1999 IEEE Press/Wiley book High-Temperature Electronics. He completed his undergraduate studies at the University of California, and earned his Ph.D. in Physics and Electrical Engineering at the California Institute of Technology in 1972.

Additional registration fee from HiTEC Attendee Registration
Register On-Line
When registering for HiTEC...add PDC on page 2 Under SESSIONS During Check-out

Tuesday, May 13

Registration: 7:00 am - 6:30 pm

Breakfast: 7:00 am - 7:45 am

Opening Remarks: 8:00 am - 8:15 am
Conference Chairs

Exhibit Hours: 11:30 am - 6:30 pm
(Afternoon Refreshment Break, Lunch & Reception will be held in the Exhibit Area)

Session TA1: Power I
Chair: Liang-Yu Chen, OAI/NASA Glenn Research Ctr.
8:15 am - 11:45 am

New Battery Possibilities for High-temperature Electronics
Alexander Potanin, High Power Battery Systems Company (HPBS)

Using Parallel Multipliers for 100kV Downhole Neutron Tube Power Supplies
Gary Hanington, American High Voltage

SiC Power Schottky Diode for Solar Cell Protection
Pierre Brosselard, University de Lyon, INSA de Lyon (Dominique Tournier, Laboratoire Ampere; Philippe Godignon, CNM-CSIC)

Session TA2: Sensors
Chair: Harold L. Snyder, Jr., Physical Solutions
8:15 am - 11:45 am

Demonstration of SiC Pressure Sensors at 750ºC.
Robert Okojie, NASA Glenn Research Center

A MEMS Gyroscope for High Temperature Environments
Jeff Watson, Analog Devices (Venkataraman Chandrasekaran)

Extreme Environment Hybrid Systems Utilizing CVD Nanodiamond Smart Sensors
John Fraley, Arkansas Power Electronics International, Inc. (Lauren Kegley, Stephen Minden, Jimmy Davidson, David Kerns)

Break: 9:45 am - 10:15 am

New Generations of Highly Integrated High Temperature DC-DC Converters
Pierre Delatte, CISSOID (Thomas Francois, David Baldwin, Jan Beranek, Zlatan Gradincic, Etienne Vanzieleghem)

A High Temperature (> 250°C) SiC Schottky Diode Bridge Rectifier for Extreme Environment Applications
Brandon Passmore, Arkansas Power Electronics International (Sergei Storkov, Dan Martin, Greg Falling, Robert Shaw, Ty McNutt, Kraig Olejniczak)

A 200°C Quad-Output Switched Mode Power Supply IC
Walt Merrill, BluBerry LLC (Daniel Goff, Steve Majerus)

High Temperature Microelectromechanical Systems Using Piezoelectric Aluminum Nitride
Benjamin Griffin, Sandia National Laboratories (Scott Habermehl, Peggy Clews)

High Temperature Dynamic Pressure Measurements Using Silicon Carbide Pressure Sensors
Robert Okojie, NASA Glenn Research Center

A Low Power Precision Data Acquisition Solution for High Temperature Applications
Jeff Watson, Analog Devices (Maithil Pachchigar)

Lunch Break in the Exhibit Hall: 11:45 am - 1:15 pm
(Food Served 12:15 pm - 1:15 pm)

Premier Sponsor Lunch-Time Presentations: 12:30 pm - 1:00 pm

Session TP1: Wide Bandgap
Chair: Jeff Casady, SemiSouth
1:30 pm - 5:30 pm

High Temperature Capable SiC Schottky Diodes, based on Buried Grid Design
Tomas Hjort, Ascatron AB

Analog and Logic High Temperature Integrated Circuits based on SiC JFETs
Peter Alexandrov, United Silicon Carbide, Inc. (Xueqing Li, Matt O’Grady, John Hostetler)

Experimental Results of Testing High-Temperature High-Current Pulsed Operation of SiC MOSFETs and SiC Diodes
Steven Morris, Baker Hughes (Zinovy Krugliak, Ruichen Zhang)

500°C Silicon Carbide MOSFET-based Integrated Circuits
Cheng-Po Chen, General Electric Global Research (Reza Ghandi, Liang Yin, Xingguang Zhu)

Session TP2: Passives
Chair: Bruce Ohme, Honeywell
1:30 pm - 5:00 pm

High Temperature Tantalum-MnO2 Capacitors: >200ºC
Humberto Jasso, Kemet Electronics (Kristin Tempel, Henry Bishop)

Design Considerations for Reliable High Temperature Performance of Wet Electrolytic Tantalum Capacitors
Jeremy Ladd, Evans Capacitor Company

Stacked Ceramic Capacitors for High Temperatures (≥200°C)
John Bultitude, KEMET Electronics Corporation (Lonnie Jones, John McConnell, Abhijit Gurav)

Class-I and Class-II Ceramic Capacitors for High Temperature Applications
Abhijit Gurav, KEMET Electronics Corporation (Xilin Xu, Jim Magee, Reggie Phillips, Travis Ashburn)

Break in Exhibit Area: 3:30 pm - 4:00 pm

500kHz-5MHz Phase-Locked Loops in High-Temperature Silicon Carbide CMOS
Paul Shepherd, University of Arkansas (Ashfaqur Rahman, Shamim Ahmed, H. Alan Mantooth)

500°C operation of AlGaN/GaN and AlInN/GaN Integrated Circuits
M. Gaevski, Sensor Electronic Tech. (G.Simin, J.Deng, R.Gaska)

Topside Nanocrystalline Diamond Integration on AlGaN/GaN HEMTs for High Temperature Operation
Andrew Koehler, Naval Research Laboratory (Travis Anderson, Marko Tadjer, Karl Hobart, Tatyana Feygelson, Jennifer Hite, Bradford Pate, Francis Kub, Charles Eddy, Jr)

Ceramic-Polymer Film Capacitors for High Temperature Power Converters
Kirk Slenes, TPL Inc. (Lew Bragg, Dale Perry)

Integrated Passive Devices with Embedded Capacitors and Resistors with Outstanding Stability and Reliability for Harsh Environment Applications
Catherine Bunel, IPDiA (Laurent Lengignon)

Reception in Exhibit Area: 5:00 pm - 6:30 pm

Wednesday, May 14

Registration: 7:00 am - 5:30 pm

Breakfast: 7:00 am - 7:45 am

Exhibit Hours: 10:00 am - 4:00 pm
(Refreshment Break & Lunch will be held in the Exhibit Area.)

Complimentary Shuttle To Old Town
6:00 pm (first departure) - 10:30 pm (last return)


Session WA1: Si
Chair: Randy Normann, Perma Works LLC
8:00 am - 12:00 pm

A 256 kb (32kx8) EEPROM for >200 C Applications
Dennis Adams, Northrop Grumman Corporation (Randall Lewis, Jason O’Brien, Bill Hand, Greg Marsh, Ian Manwaring, Donald Pierce, Cory Sherman, Sze Wong)

The Effects of Repeated Refresh Cycles on the Oxide Integrity of EEPROM Memories at High Temperature
Lynn Reed, Tekmos (Vema Reddy)

New High Temperature SRAMs and ARM® CortexTM-M0 SOCs for 225°C Applications
David Duff, SST (Wes Morris, David Gifford, Scott Peterson, Rex Lowther)

Characterization of Circuit Blocks for Configurable Analog-Front-End
Bruce Ohme, Honeywell Aerospace (Mark Larson; Bhal Tulpule, Embedded Systems LLC; Alireza Behbahani, Air Force Research Lab (AFRL))

Session WA2: Packaging I: Die Attach
Chair: Patrick McCluskey, University of Maryland
8:00 am - 12:00 pm

Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C Applications
Fang Yu, Auburn University (R. Wayne Johnson, Tennessee Tech University; Mike Hamilton, Auburn University)

Development of Low Temperature Sintered Nano Silver Pastes Using MO Technology and Resin Reinforcing Technology
Ken Araujo, NAMICS Corporation (Koji Sasaki, Noritsuka Mizumura)

Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
Andrew Wereszczak, Oak Ridge National Laboratory (Zhenxian Liang, Laura Marlino)

Thermo-mechanical Simulation of Sintered Ag Die Attach
M.F. Sousa, Fraunhofer IZM (M.v. Dijk, H. Walter, C. Weber, H. Oppermann, O. Wittler, K.D. Lang)

Break in Exhibit Area: 10:00 am - 11:00 am

High Temperature 0.35 Micron Silicon-on-Insulator CMOS Technology
Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Stefan Dreiner, Katharina Grella, Miriam Klusmann, Norbert Kordas, Alexander Schmidt, Uwe Paschen, Rainer Kokozinski)

A 200°C Motor Control ASIC
Steve Majerus, Bluberry, LLC (Dan Goff, Walter Merrill)

Development of a Ag/Glass Die Attach Paste for High Power and High Use Temperature Applications
Maciej Patelka, NAMICS North American R&D Center - Diemat, Inc. (Noriyuki Sakai, Cathy Trumble)

Stress Intensity of Delamination in a Sintered-Silver Interconnection
D. J. DeVoto, National Renewable Energy National Laboratory (Andrew Wereszczak, Paul Paret)

Lunch Break in Exhibit Area: 12:00 pm - 1:30 pm

Student Paper Competition Award in Exhibit Hall: 1:15 pm - 1:30 pm

Student Paper Competition Award
Sponsored by:
IMAPS Microelectronics Foundation

Session WP1: Power II
Chair: Susan Heidger, Air Force Research Laboratory

1:30 pm - 5:30 pm

GaN Power Module with High Temperature Gate Driver and Insulated Power Supply
Remi Perrin, Ampere Laboratory UCBL INSA (Dominique Bergogne, Gonzalo Picun, X-Rel Semi; Regis Meuret, Labinal Power Systems; Christian Martin, Pascal Bevilacqua, Ampere Lab.)

Highly Integrated and Isolated Universal Half-Bridge Power Gate Driver and Associated Flyback Power Supply for High Temperature and High Reliability Applications
David Gras, X-REL Semiconductor (Christophe Pautrel, Amir Fanaei, Gregory Thepaut, Maxime Chabert, Fabien Laplace, Gonzalo Picun)

Integrating the Control Loop and Magnetics for High Temperature Switch Mode Power Supplies
Harold L. Snyder, Jr., Physical Solutions

Session WP2: Packaging II: Materials
Chair: Iris Labadie, Kyocera America
1:30 pm - 5:30 pm

High Temperature Laminate Characterization
David Shaddock, General Electric Global Research (Liang Yin)

Extreme Thermal Resistance of All-Polyimide Bondlines with TPI Adhesive
Jim Fraivillig, Fraivillig Technologies

Temperature Dependence of High Dielectric Strength Potting Materials for Medium Voltage Power Modules
Chad O’Neal, Arkansas Power Electronics International Inc. (Brandon Passmore, Matthew Feurtado, Jennifer Stabach, Ty McNutt)

Break: 3:00 pm - 4:00 pm

Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver IC
Paul Shepherd, University of Arkansas (Dillon Kaiser, Michael Glover, Sonia Perez, A. Matt Francis, H. Alan Mantooth)

8-15 kV High Temperature SiC PiN and Schottky Rectifiers
Ranbir Singh, GeneSiC Semiconductor Inc. (Siddarth Sundaresan)

Performance and Reliability Characterization of 1200 V Silicon Carbide Power JFETs at High Temperatures
Jack Flicker, Sandia National Laboratories (David Hughart, Matthew Marinella, Stanley Atcitty, Robert Kaplar)

Enhancing Performance and Reliability of High Temperature Electronics Through Thermally Stable Parylene HT
Rakesh Kumar, Specialty Coating Systems, Inc.

Modeling of Thermomechanical Behavior of Wire Bonded Electronic Devices Under Combined Thermal and Vibration Loads
Richard Man, Loughborough University (Changqing Liu, Maria Mirgkizoudi)

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package
Liang-Yu Chen, Ohio Aerospace Institute/NASA Glenn Research Center

Complimentary Shuttle To Old Town
6:00 pm (first departure) - 10:30 pm (last return)
Attendees can spend the evening in old visiting shops, restaurants, etc.
Attendees ON OWN for all meals/purchases in Old Town

Thursday, May 15

Registration: 7:00 am - 11:30 am

Breakfast: 7:00 am - 7:45 am


Session THA1: Applications
Chair: Robert Estes, Baker Hughes
8:00 am - 12:00 pm

A System On Chip (SOC) ASIC Chipset for Aerospace and Energy Exploration Applications
Bhal Tulpule, Embedded Systems LLC (Bruce Ohme, Mark Larson, Honeywell; Al Steines, John Gerety, Embedded Systems LLC)

Design and Assembly of High Temperature Distributed Aero-engine Control System Demonstrator
Steve Riches, GE Aviation Systems (Lucian Stoica, Geoff Rickard, Colin Warn, Colin Johnston)

Platform for Testing Sensors in HT Geothermal Wells
Randy Normann, Perma Works LLC

Session THA2: Packaging III: Solders & Assemblies
Chair: Colin Johnston, Oxford University
8:00 am - 12:00 pm

Off the Shelf Chip and Die Extraction for Long Term Reliability
Terence Q. Collier, CVInc

The Melting-point Increase of Sn-Bi Solder Joint by Cu Particles Addition
Omid Mokhtari, Joining and Welding Research Institute, Osaka University (Hiroshi Nishikawa)

Characterization of BiAgX Solder Paste on Thick Film for 200°C Applications
Zhenzhen Shen, Auburn University (R. Wayne Johnson, Tennessee Tech University; Michael Hamilton, Auburn University)

Break: 9:30 am - 10:00 am

230°C Accelerometer with Digitized Output for Directional Drilling
Douglas MacGugan, Honeywell Aero. (Eric Abbott, Chris Milne)

HPHT Coiled Tubing Casing Collar Locator Enhancement Via Digital Signal Processing Techniques for Accurate Depth Control in Wire-line Well Interventions
Rito Mijarez, Instituto de Investigaciones Electricas (David Pascacio, Ricardo Guevara, Carlos Tello, Olimpia Pacheco, Joaquin Rodri­guez)

Galvanic Isolation of Logic Signals at Extreme Temperatures
Bruce Ferguson, Microsemi, Inc.

Has Microelectronic MCM Technology Matured and is it Capable of Servicing the Widespread Needs of Down Well 225°C Operating Applications in the Oil & Gas Industry?
Bob Hunt, API Technologies Corp. (Mark Read, Andy Tooke)

Processing, Reliability and Corrosion Resistance of Lead-Free BiAgX(TM) Solder Paste
Hongwen Zhang, Indium Corp. (Runsheng Mao, Ning-Cheng Lee)

Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints
F. Patrick McCluskey, University of Maryland (Hannes Greve, Seyed Ali Moeini)

Effect of Sn component surface finish on 92.5Pb-5Sn-2.5Ag
Harry Schoeller, Universal Instruments AREA Consortium, Binghamton University (Eric Cotts, Martin Anselm, Imran Khan)

Design and Manufacturing of a Double-side Cooled, SiC based, High Temperature Inverter Leg
Cyril Buttay, Laboratoire Ampere (Raphael Riva, Marie-Laure Locatelli, Vincent Bley, Bruno Allard)


Closing Remarks From Chairs: 12:00 pm - 12:15 pm


Register On-Line



  Chapter Activities (events listed in chronological order)

San Diego Chapter Lunch Presentation On March 25th: Polymer Challenges in 2.5D and 3D Packaging    ^ Top
IMAPS San Diego Chapter will hold its next meeting on Tuesday, March 25, 2014, at 12:00pm featuring a Lunch and technical presentation on Polymer Challenges in 2.5D and 3D Packaging.

Sponsored by Pacific Rim Engineering

Space is limited so please sign up quickly!

Mobile computing is driving significant advances in electronic packaging. To meet the ever growing need for increased bandwidth, 2.5D and 3D packaging have become a necessity. Polymers are key enabling technologies including underfills, redistribution layers, mold compounds, and adhesives for packages such as embedded wafer level packaging (eEWLP). The presentation will highlight the emerging 2.5D and 3D packaging methods and how polymers will provide key performance characteristics.

Presenter Bio
Jeff Gotro, Ph.D., is the President and Founder of InnoCentrix, LLC. InnoCentrix proves a wide range of consulting services to the polymer industry in the areas of technical problem solving, innovation and new product/process development, business development and Intellectual Property management. Jeff has over thirty years of experience in polymers having held scientific and leadership positions at IBM, AlliedSignal, Honeywell International, and Ablestik Laboratories. Jeff brings to his clients a solid proficiency in managing the research, development and commercialization of new products. He has consulting experience with companies ranging from early-stage start-ups to Fortune 50 companies. His unique combination of deep technical knowledge and business experience allow him to drive projects to commercial success. He is a nationally recognized author and speaker. Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science.

Tuesday, March 25th at 12:00 PM. Lunch from Boston Market.

Qualcomm Bldg R
10185 McKellar Ct
San Diego, CA 92121-4233

Space is limited to 40 registrants due to room size; please sign up quickly.

$20.00 for RSVPed IMAPS members.
$25.00 for non-members.
Free for students with an ID.
Registration closes EOB on Friday, March 21st.

To register, please contact Dave Virissimo of Coining at or 619-464-5430. Include citizenship when registering if not U.S. !

METRO Chapter Dinner Presentation On March 27th: Paving the Path Towards High Frequencies and Higher Temperatures    ^ Top
Paving the Path Towards High Frequencies and Higher Temperatures
by Dr. Ranbir Singh, founder of GeneSiC Semiconductor Inc

Abstract / Biography
Dr. Ranbir Singh, received a Ph.D. and MS degrees in Electrical and Computer Engineering, North Carolina State University, Raleigh, NC, and B. Tech from Indian Institute of Technology, Delhi. He founded GeneSiC Semiconductor Inc. in 2004. Prior to that he conducted research on SiC power devices first at Cree Inc, and then at the NIST, Gaithersburg, MD. In 2012, EE Times named Dr. Singh as among "Forty Innovators building the foundations of next generation electronics industry.” In 2011, he won the R&D100 award towards his efforts in commercializing 6.5kV SiC Thyristors. He has published over 130 journal and conference papers, is an author on 28 issued US patents, and has authored a book.

Logistics and Registration:
Clarion (former Holiday Inn) Ronkonkoma

3845 Veterans Highway
Ronkonkoma, NY 11779

Registration/Networking 5:30-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM

Price: Members: $30.00 if Pre-Registered by March 24, 2014
$50.00 after March 24, 2014

Non-Members: $50.00 if Pre-Registered by March 24, 2014
$75.00 After March 24, 2014

Student Members: Free if Pre-Registered by March 24, 2014
$25.00 after March 24, 2014

If you wish to join membership information is available at

Registration Email:
Phone: Scott Baldassarre 516-752-2367

There are a limited number of vendor tables available for this event.

Indiana Chapter Dinner Meeting & Tour of L-3 Communications on March 27   ^ Top
Indiana Chapter is hosting a Product Demonstration and Tour on March 27, 2014, at L-3 Communications Cincinnati Electronics in Mason, OH. Terry Baum and Clayton Sippola will be the Hosts.

Dinner and Meeting at Carrabbas's Italian Grill

Sign in at L-3 CE 3:30 - 4:00 pm
Capabilities Presentation: 4:00pm
Tour and Presentation: 4:30pm
Dinner: 6:15pm
Business Meeting: 7:00pm
Adjourn: 7:15pm

Advance reservations will be accepted until 4:00 pm on Tuesday, March 25th. Reservations can be made by contacting Ray Fairchild at 765-451-1068 Email:

L-3 Cincinnati Electronics is a leading provider of infrared imaging systems and space electronics. As a first-rank engineering and production company, L-3 CE is engaged in the design, development and manufacture of highly sophisticated electronics equipment that is used in a variety of product areas for government, civil and commercial applications.

Infrared Products and Systems: L-3 CE offers leading-edge design and manufacturing of infrared sensors, high-performance imaging systems and cryogenics for applications including surveillance and reconaissance, situational awareness, target acquisition and threat warning.

Space Electronics: Entering its sixth decade of spaceflight heritage, L-3 CE specializes in the design, manufacture and testing of high-reliability electronic equipment specially built and qualified for use on missiles, launch vehicles and spacecraft.

Environmental Services: L-3 CE’s environmental services group specializes in advanced testing and other technical services for the aerospace, aviation and defense industries. Services include comprehensive testing, measurement and analysis to satisfy a wide range of electromagnetic interference/compatibility (EMI/EMC) and simulated environmental requirements including vibration and stress.

L-3 CE traces its roots back to the early 1920’s and the Crosley Radio Corporation, producers of radios, automobiles and major appliances. Powel Crosley sold the company to AVCO in 1946, and it became known as Cincinnati Electronics in 1973, manufacturing electronic equipment for communication, space and electronic warfare. The company was acquired by L-3 Communications in 2004.

L-3 CE Tour Rules and Policy
Upon arrival at the front desk, each person will be required to check with the receptionist or security guard, obtain a visitor’s badge, and show photo identification, such as driver’s license or passport to confirm US. Citizenship. ADDITIONALLY, CAMERAS , CELL PHONES AND PALM PILOTS OR ANY DEVICE CAPABLE OF TAKING PICTURES ARE PERMITTED IN THE BUILDING BUT MUST REMAIN IN THE CONFERENCE ROOM..

ICEP 2014 Being Held April 23-25 in Toyama, Japan   ^ Top
ICEP 2014 - the International Conference on Electronics Packaging - is being held April 23-25, 2014, at the Toyama International Convention Center in Toyama, Japan. The Conference is sponsored by JIEP, IEEE CPMT Society Japan Chapter and IMAPS.

We welcome you to the International Conference on Electronics Packaging (ICEP) 2014, the largest and premier international conference on electronics packaging in Japan, to be held from April 23rd to 25th at the Toyama International Conference Center in Toyama, Japan.

The papers in the ICEP2014 conference cover a wide range of the “JISSO” technologies. Major topics are Advanced Packaging, Substrate and Interposer, 2.5D and 3DIC Packaging, Design/Modeling/Reliability, Thermal Management, Materials and Processes, Printed Electronics, N-MEMS, Optoelectronics, Power Devices, Automotive Technology, and Medical Device. The technical program will include five keynote lectures. More than 160 papers regarding JISSO technologies will be presented by promising researchers from more than 10 countries.

We, the organization committee, are confident that the conference will provide excellent opportunities for participants to obtain practical information of technologies and to develop global network.

Toyama Prefecture is blessed with a beautiful natural environment. Toyama has beautiful mountains and a bay. Toyama bay produce delicious seafood. You can enjoy not only the conference but also many kinds of foods. In addition to the conference, we prepare a wonderful sightseeing as an excursion event. You can enjoy the big snow wall in Tateyama Kurobe Alpine Route. People in Toyama are also preparing to welcome all participants with hospitality.

Secretariat of ICEP 2014
JIEP (The Japan Institute of Electronics Packaging)
3-12-2 Nishiogi-kita, Suginami-ku Tokyo 167-0042, Japan

IMAPS New England May 6 Symposium Explores Next-Generation Microelectronics    ^ Top
The International Microelectronics Assembly and Packaging Society (iMAPS) New England Chapter invites you to explore “The Next Generation of Microelectronics” at our annual symposium & expo:

The 41st Annual iMAPS New England Symposium & Expo
7:30 a.m. to 4:30 p.m., May 6, 2014
(first session starts at 8:30 a.m.)
Holiday Inn Conference Center—Boxborough, MA

On-Line Registration Now Open—Reserve Your Spot Today!

Symposium & Expo Highlights

  • Star Trek Theme: “The Next Generation of Microelectronics”
  • Keynote Speaker: Germany’s Dr. Timo Lebold, Retina Implant, devices that re-store human vision
  • 50+ Exhibitors: See the latest technologies and preview future innovations
  • Comprehensive Technical Program: 7 Technical Sessions/36 Presenters
  • Multi-Course Lunch: To keep you going all day long!
  • Lots of Fun, Games and Prizes!!!


You can also collaborate with more than 50 industry exhibitors demonstrating the latest cost-saving and efficiency-improvement technologies. Our technical sessions feature the leading experts—including Lockheed Martin, Fairchild and Raytheon.

Program Information and Registration Links


For More Information
Click on the attached flyer or feel free to reach out to iMAPS today:


  Membership Corner

Journal of Microelectronics and Electronic Packaging 1st Quarter 2014 On-Line   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 11, Number 1
First Quarter 2014

Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Astrid-Sofie B. Vardøy and Maaike M. V. Taklo, SINTEF ICT
H. J. van de Wiel, Greg R. Hayes, and Hartmut R. Fischer, TNO
Stian Martinsen and Adriana Lapadatu, Sensonor
Knut E. Aasmundtveit, Vestfold University College


LT-TLPS Die Attach for High Temperature Electronic Packaging
Hannes Greve and F. Patrick McCluskey, University of Maryland

Redistribution Layers (RDLs) for 2.5D/3D IC Integration
J. Lau, P. Tzeng, C. Lee, C. Zhan, Y. Hsin, P. Chang, Y. Chang, J. Chen, S. Chen, C. Wu, H. Chang, C. Chien, C. Lin, T. Ku, R. Lo, and M. Kao, Industrial Technology Research Institute (ITRI)
M. Li, J. Cline, and K. Saito, Rambus Inc.

Reliability of SiC Digital Telemetry Circuits on AlN Substrate
Reza Ghandi, Cheng-Po Chen, Liang Yin, Rich Saia, Tammy Johnson, and Peter Sandvik, GE Global Research
Kun Fang and R. Wayne Johnson, Auburn University


Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Roderich Zeiser, Suleman Ayub, Jochen Hempel, Michael Berndt, and Juergen Wilde, University of Freiburg

Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates
Burton Carpenter and Betty Yeung, Freescale Semiconductor, Inc.
Yuan Yuan
Ultra Low Weight Spacer for PCB to PCB Interconnections
Luca Petricca and Per Ohlckers, Vestfold University College
Geir Morten Mellem, ProxDynamics



Torrey Hills Technologies

Oneida Research Services


2014 Events:

RaMP (RF/Microwave)
April 8-10
*Exhibitors contact

CICMT 2014 (Japan)
April 14-16
*Exhibitors contact

Nano Devices
April 29-30
*Exhibitors contact

High Temperature (HiTEC 2014)
May 13-15
*Exhibitors contact

IMAPS 2014 - San Diego
Oct. 13-16
*Exhibitors contact

^ Top


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