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May 2, 2014
 

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   IMAPS EVENTS
Button IMAPS 2014 San Diego - Last Call For Abstracts (read more...)

Button HiTEC 2014 (High Temperature) Begins May 12 (read more...)

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   CHAPTER ACTIVITIES (events listed in chronological order)
Button TUESDAY: IMAPS New England May 6 Symposium Explores Next-Generation Microelectronics (read more...)

Button TUESDAY: Central Texas Chapter's Electronics Design, Manufacturing & Test Symposium (read more...)

Button NEXT THURSDAY: Angel Chapter (Los Angeles) would like to invite its members to tour the SpaceX facility in Hawthorne, CA (read more...)

Button NEXT THURSDAY: METRO Chapter Full Day Symposium and Vendor Night (read more...)

Button IMAPS UK Packaging Workshop July 3 - Sponsored by Microsemi (read more...)


   MEMBERSHIP CORNER
Bullet Journal of Microelectronics and Electronic Packaging 1st Quarter 2014 On-Line - 2nd Issue Available Soon  (read more...)

MST

RGL Enterprises
F&K Delvotec
LORD Corporation

Palomar Technologies

 

  IMAPS Events (view full Web Calendar)
 

IMAPS 2014 San Diego - Last Call For Abstracts    ^ Top
LAST CALL FOR ABSTRACTS
The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 47th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2014 will feature 6 technical tracks that span the two and a half days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; THE FUTURE OF PACKAGING; ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY; MATERIALS & PROCESSES; MODELING, DESIGN, & TEST; and SPECIAL SESSIONS ON SYSTEM-INTEGRATION, POWER & HIGH-RELIABILITY, as well as an Interactive Student Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

Track:
INTERPOSERS & 2.5/3D PACKAGING
Topics:
• TSV Materials & Processes • Silicon Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Glass Interposers • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • 3D Simulation and Modeling • Advanced 3D Materials • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D • Think Thin: Thin IC Packaging For Mobile • 3D Printing (Inkjet & others)
Track:
THE FUTURE OF PACKAGING
Topics:
• Roadmaps • Package Scaling • Printed Electronics & Additive Manufacturing • Sensor Packaging • Medical Device Packaging • Microfluidics & Bio-MEMS • Packaging for Medical Implants & Ingestibles • Portable & Patient Monitoring Devices • Wearable Devices • Membrane & Capacitive Switches • Printable Display & Lighting • Automotive Microelectronics: "Infotainment" • "Internet of Things"
Track:
ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY
Topics:
• Wirebonding & Stud Bumping • Flip Chip Interconnects & Technologies • MEMS • Wafer Level Packaging • Chip Scale Packaging • Wafer Finishing (Bumping, Copper Pillar, Thinning) • Warpage Characterization and Mitigation • Gyros & Accelerometers • RF Devices • Optical Interconnects • Optical MEMS (MOEMS) • LED and Optoelectronics Packaging • Silicon Photonics • High Performance Interconnect & Boards • Novel Interconnections, Fabrication & Analysis Methods
Track:
MATERIALS & PROCESSES
Topics:
• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Polymer Interposers • Substrate Materials • Ceramic & LTCC Packaging • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films • Pb-Free Solder & ROHS
Track:
MODELING, DESIGN, & TEST
Topics:
• Design for Reliability • Modeling & Design for SI, PI and EMC • Thermal and Thermo-Mechanical Modeling • Testing Methods and Process • RF and Microwave Packaging • Mechanical Modeling and Related Metrology • Design for Manufacturing • Package Reliability Testing • Fine Pitch Probes
Track:
SPECIAL SESSIONS ON SYSTEM-INTEGRATION, POWER & HIGH-RELIABILITY
Topics:
• European Perspective on System Integration • Asian Perspective on System Integration • Automotive Electronics • Harsh Environment / High Temperature • High Reliability for Military/Aero Applications • High-rel Drilling/Geo-Thermal • Power Packaging • Enabling Technologies for Power Management • Thin & Printed Battery Technology

Industries Represented:
Consumer, Portable and Wireless Biomedical Telecom Defense and Security Computing, and Gaming
Automotive Applications Solar and Alternative Energy
Gas, Drilling & GeoThermal

Please send your 500 word abstract electronically only using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org or call 412-368-1621.

Submit Abstract(s)

 

HiTEC 2014 (High Temperature) Begins May 12    ^ Top
The International Conference on High Temperature Electronics (HiTEC 2014) is being held May 13-15 at the Albuquerque Marriott Pyramid North in Albuquerque, New Mexico. Visit www.imaps.org/hitec for exhibit information, registration, and to view the program. Register on-line before Tuesday to save time and avoid lines when you arrive in Albuquerque.

HiTEC 2014 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2014 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Register On-Line

 

  Chapter Activities (events listed in chronological order)
 

TUESDAY: IMAPS New England May 6 Symposium Explores Next-Generation Microelectronics    ^ Top
The International Microelectronics Assembly and Packaging Society (iMAPS) New England Chapter invites you to explore “The Next Generation of Microelectronics” at our annual symposium & expo:

The 41st Annual iMAPS New England Symposium & Expo
7:30 a.m. to 4:30 p.m., May 6, 2014
(first session starts at 8:30 a.m.)
Holiday Inn Conference Center—Boxborough, MA
___________________

On-Line Registration Now Open—Reserve Your Spot Today!
___________________

Symposium & Expo Highlights

  • Star Trek Theme: “The Next Generation of Microelectronics”
  • Keynote Speaker: Germany’s Dr. Timo Lebold of Retina Implant, devices that re-store human vision
  • Comprehensive Technical Program: 7 Technical Sessions/36 Presenters
  • 50+ Exhibitors: See the latest technologies and preview future innovations
  • Networking Opportunities: With the best and the brightest of the microelectronics industry
  • Full Poster Session: Explore creative posters and chat with the authors
  • Student Paper & Poster Competition: Cash prize for the top submission
  • Employment Listings: Review job opportunities
  • RF Microwave Packaging Technology Class: (Post Conference May 7-9) with TJ Green Associates and iMAPS New England (see link below)
  • Multi-Course Lunch: To keep you going all day long!
  • Lots of Fun, Games and Prizes!!! Three Grand Prizes!

Session and Presentation Topics:
• NANO and MEMS • Wire Bonding & Advanced Interconnections • RF/Microwave Innovations Part I & II • 2.5/3D Packaging Technologies & Methods • Counterfeit Prevention & Mitigation Strategies • Bumped Die Attach

A Sampling of Companies supporting their Authors:
With the support of many well-known authors and their companies, you will find many technical tracks that peak your interest and strengthen your knowledge. Here’s a sampling of the companies that will present their technical expertise:
• Lockheed Martin • Fairchild • Raytheon • NXP Semiconductors • DuPont • NAMICS • MIT/Brookhaven Labs • TAS Consulting • Cree • Hesse Mechatronics • IBM • Panasonic Factory Solutions

Program Information and Registration Links

 

For More Information
Click on the attached flyer or feel free to reach out to iMAPS today:

TUESDAY: Central Texas Chapter's Electronics Design, Manufacturing & Test Symposium    ^ Top
Central Texas Electronics Association
Electronics Design, Manufacturing & Test Symposium
Tuesday, May 6, 2014
TyRex Group at 12317 Technology Blvd, #200, in NW Austin

Program:

2:00 - Registration Begins

2:30 - Welcome to TyRex by Andrew Cooper, CEO

2:35 - TyRex Company Factory Tours of SabeRex and Austin Reliability Labs

3:35 - "Batteries: Risks and Realities” Dave Rahe, Vice President, TyRex / Austin Reliability Labs

4:05 - "Transmissive X-ray Applications for Electronics Manufacturing" Stephen Schoppe, President, Process Sciences Inc.

4:35 - Break & Networking

4:50 - "Coatings and Pottings: Issues and Challenges” Greg Caswell, Sr Member of the Technical Staff, DfR Solutions

5:20 - "Hyperspectral Imaging in a Medical Device: A Texas Story" Brian Crowell, President, TyRex / Digital Light Innovations

5:50 - Closing Remarks and Door Prizes Drawing

6:00 - Food & Refreshments Served with More Networking

Registration:
RSVP to Bob Baker at: rjbakeratx@austin.rr.com

No charge for SMTA & IMAPS members; $10 for all non-members >> (Cash or Check ONLY!)

Event Location:
TyRex Group
12317 Technology Blvd, #200, Austin, Texas
(near McNeil Dr & Technology Blvd)
Map to TyRex

In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)

NEXT THURSDAY: Angel Chapter (Los Angeles) would like to invite its members to tour the SpaceX facility in Hawthorne, CA    ^ Top
The IMAPS Angel (Los Angeles) Chapter would like to invite its members to tour the SpaceX facility in Hawthorne, CA! A free tour for IMAPS Angel chapter members will be conducted on Thursday May 8th and will start at 6 pm. If you are interested in attending, please respond to Ken Rotunno at Ken.Rotunno@ngc.com.

In the email, please provide:
- Your full name
- The name of your employer
- Your U.S. citizenship status. Note: there is a possibility that SpaceX may be able to accommodate non-U.S. citizens/non-permanent residents, but they’ll need to know well before the tour date.

The tour will be limited to only 15 seats and seats will be filled in the order that email requests are received. Note: SpaceX has reserved a second, optional tour date for us about a month later, if the first tour fills up. Hope to see you at the tour!

NEXT THURSDAY: METRO Chapter Full Day Symposium and Vendor Night    ^ Top
METRO Chapter Full Day Symposium and Vendor Night
OVER 50 TOP VENDORS AND SUPPLIERS WILL BE REPRESENTED

Thursday May 8th, 2014
At The Clarion (former Holiday Inn)
3845 Veterans Highway, Ronkonkoma, New York

Schedule:
3:00 PM-8:00 PM
Tabletop Exhibits and Technical Presentations
There is no charge for the vendor night or evening technical sessions but you must register to be eligible for the door prizes

6:30 PM-8:00 PM
Cocktail Reception and Door Prize Drawing for prizes totaling over 500.00

4:00-7:00 PM
Evening Technical Sessions
See Evening Sessions Topics below

4:00PM
Silver Sinter Die Attach Material Development
Kyocera America, Inc
Speaker: Nobu Fukabori

4:45PM
Thermal Connectors; a new approach to thermal management in SMT assemblies
TEM Products Inc
Speakers: Dean Gouramanis - Founder and CEO and Bob Gross - VP Business Development

5:30PM
Advanced Packaging needs to meet advancing Semiconductor technologies and to meet (HPC) High Performance Computing Demands
Microelectronic Advanced Hardware Consulting, LLC
Speaker: Voya Markovich –President

6:15PM
High Thermal Conductivity Heat Spreaders Using CTE Matching AlSiC with Embedded Pyrolytic Graphite; Hermetic Packages Using AlSiC Heat Spreaders
CPS Technologies
Speaker : Bo Sullivan - Senior Account Manager

DON’T FORGET TO REGISTER EARLY TO BE ELIGIBLE FOR DOOR PRIZES
Please Register with
andrew.sanchelli@freqelec.com or by Phone: Scott Baldassarre 516-752-2367

Tables are still available but space is limited. Vendor Registration contact Walter Becker wbecker@wjbsales.com 631 331 0689 for details.

IMAPS UK Packaging Workshop July 3 - Sponsored by Microsemi    ^ Top
This Unique Packaging Workshop, organised by IMAPS-UK and sponsored by Microsemi is your opportunity to learn about the technology of Semiconductor device Packaging and discover how to select the right solutions for your new and emerging applications.

The programme will consist of 3 workshop sessions, on Basics of Packaging, Hermeticity and Plastic Package Trends followed by short case studies, 3 from service providers and 3 from package users.

Attendees will also be invited to visit the Microsemi Caldicot facilities, the home of Microsemi’s Advanced Packaging Business. The company designs and develops miniaturised electronic modules which are at the heart of mission-critical projects in such applications as pacemakers, neurostimulators, sensors, hearing aids and patient monitoring.

The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues of packaging, how to address these and how to develop the optimum packaging solution.

Registration & Workshop Fees:
IMAPS-UK Member: £155
IMAPS-UK Partner (NMI & IEEE-CPMT) : £165
Non Member: £195
Student: £125

Venue:
Microsemi Portskewitt, Caldicot, Wales

Timing:
Registration opens at 8.30 am
The workshop will finish at 5.00 pm

All prices are exclusive of VAT and include entry, workshop presentation notes & lunch/refreshments.

Registration website: https://www.regonline.co.uk/pw14

Contact:
IMAPS-UK Secretariat
c/o PandA Europe Oakbury House, Mill Lane, Lambourn, Berkshire, RG17 8YP UK
Tel: 0131 202 9004, Mob: 07854 946660
e-mail: andy.longford@imaps.org.uk
IMAPS-UK Website: www.imaps.org.uk

Provisional Agenda:
–8.30 Registration & Coffee
–9.00 Intro, welcome + sponsor(s)
–9.10 Session 1 "The Basics & Trends of Packaging" by Mr Andy Longford, PandA Europe: 45 minutes + questions
–10.00 Networking break & Cleanroom tour #1
–10.35 Session 2 – "The need for Hermeticity" by Dr. Anne Vanhoest, UCL: 45 minutes + questions
–11.25 Networking break & Cleanroom tour #2
–12.00 Session 3 – "Packaging in Plastic QFN" by Mr Alan Evans, Unisem Europe: 45 minutes + questions
–12.50 Lunch & Cleanroom tour #3
–13. 50 Packaging provider case studies –
•Optocap – Mr S Duffy
•Micross – Mr S Jackson
•Inseto – Mr E Redmond
Each is 10 minutes + 5 minutes questions
–14.35 Networking break & Cleanroom tour #4
–15.10 Packaging user case studies
•CSR – Mr P Robinson
•Microsemi – “Embedded Die” - Mr P Tremlett
•Selex ES - TBC
Each is 10 minutes + 5 minutes questions
–15.50 Networking break & Cleanroom tour #5
–16.25 Wrap-up Session. Questions and Workshop Review (Attendee certificates given out)
–17.00 End of workshop

 

  Membership Corner
 

Journal of Microelectronics and Electronic Packaging 1st Quarter 2014 On-Line - 2nd Issue Available Soon   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 11, Number 1
First Quarter 2014



Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Astrid-Sofie B. Vardøy and Maaike M. V. Taklo, SINTEF ICT
H. J. van de Wiel, Greg R. Hayes, and Hartmut R. Fischer, TNO
Stian Martinsen and Adriana Lapadatu, Sensonor
Knut E. Aasmundtveit, Vestfold University College

1

LT-TLPS Die Attach for High Temperature Electronic Packaging
Hannes Greve and F. Patrick McCluskey, University of Maryland

7
Redistribution Layers (RDLs) for 2.5D/3D IC Integration
J. Lau, P. Tzeng, C. Lee, C. Zhan, Y. Hsin, P. Chang, Y. Chang, J. Chen, S. Chen, C. Wu, H. Chang, C. Chien, C. Lin, T. Ku, R. Lo, and M. Kao, Industrial Technology Research Institute (ITRI)
M. Li, J. Cline, and K. Saito, Rambus Inc.
16

Reliability of SiC Digital Telemetry Circuits on AlN Substrate
Reza Ghandi, Cheng-Po Chen, Liang Yin, Rich Saia, Tammy Johnson, and Peter Sandvik, GE Global Research
Kun Fang and R. Wayne Johnson, Auburn University

25

Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Roderich Zeiser, Suleman Ayub, Jochen Hempel, Michael Berndt, and Juergen Wilde, University of Freiburg

30
Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates
Burton Carpenter and Betty Yeung, Freescale Semiconductor, Inc.
Yuan Yuan
36
Ultra Low Weight Spacer for PCB to PCB Interconnections
Luca Petricca and Per Ohlckers, Vestfold University College
Geir Morten Mellem, ProxDynamics
42
 

 

 

Metallix

Torrey Hills Technologies

Oneida Research Services

2014 Events:

High Temperature (HiTEC 2014)
May 13-15
*Exhibitors contact bschieman@imaps.org

IMAPS 2014 - San Diego
Oct. 13-16
*Exhibitors contact bschieman@imaps.org

Thermal Management
October 28-30, 2014
*Exhibitors contact bschieman@imaps.org

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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