IMAPS Home | Join/Renew
November 6, 2014
 

Heraeus TFD

   IMAPS EVENTS
Button Device Packaging 2015 - Abstracts Due NEXT FRIDAY, November 14 (read more...)

Button Device Packaging 2015 - Exhibit Hall Nearly SOLD OUT (read more...)

Button RaMP 2015 (RF/Microwave) Abstracts Due November 30 (read more...)

Button CICMT 2015 Germany (Ceramic Interconnect/Microsystems) Abstracts Due November 30 (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Button NEXT THURSDAY: IMAPS Arizona Chapter Lunch Meeting featuring Qualcomm Speaker - VENUE CHANGE (read more...)

Button November 20: IMAPS Benelux Chapter Meeting on Packaging for Sensors (read more...)

Button IMAPS France 2nd Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Applications (read more...)

Button New England Chapter 42nd Symposium & Expo - Call For Papers (read more...)


   MEMBERSHIP CORNER
Bullet Journal of Microelectronics and Electronic Packaging 3rd Quarter 2014 On-Line - 4th Issue Available Soon  (read more...)

Bullet Advancing Microelectronics September/October Magazine (MEMS & Thermal) On-Line now; November/December Issue Coming Soon  (read more...)

Bullet Congratulations to the IMAPS 2014 Society Award Winners!  (read more...)

XYZTEC

RGL Enterprises
Petroferm

Palomar Technologies

 

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2015 - Abstracts Due NEXT FRIDAY, November 14    ^ Top
The 11th Annual Device Packaging Conference (DPC 2015) will be held in Fountain Hills, Arizona, on March 16-19, 2015. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). Full conference details online at www.imaps.org/devicepackaging..

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring Topical Workshop Tracks on:

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than November 14, 2014, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 23, 2015. A post-conference USB containing the full presentation material as supplied by authors will be mailed after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before February 1, 2015 at: www.imaps.org/devicepackaging or contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2015! We advise you to book early - before January 1 - as we had more than 13 exhibitors on a wait-list in 2014!

Device Packaging Professional Development Courses (PDCs):

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 16th, preceding the technical conference. PDC details and registration on-line soon.

If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/pdc no later than November 14, 2014.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.

 

Device Packaging 2015 - Exhibit Hall Nearly SOLD OUT    ^ Top
Device Packaging Conference 2015 will again be held in Fountain Hills, Arizona, on March 16-19, 2015. IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2015! We advise you to book early - before January 1 - as we had more than 13 exhibitors on a wait-list in 2014!

RaMP 2015 (RF/Microwave) Abstracts Due November 30    ^ Top
IMAPS 2015 RaMP Workshop and Tabletop Exhibition is being held April 16, 2015, at the Weetwood Hall Conference Centre in the United Kingdom. The objective of the RF and Microwave Technical Conference is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging & related technologies. This Conference will enable discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, the hosted by IMAPS-UK and co-sponsored by IMAPS-US & KTN, is the second in a series of joint Technical Conferences on RF and Microwave packaging between IMAPS-US and IMAPS-UK. Full workshop details are online at www.imaps.org/rf. Abstracts are due November 30.

Sessions are being planned and abstracts are being requested in the following areas:

Design Modelling & Test

Technologies

Materials

Applications
  • New Power Amplifier Design Beyond LDMOS
  • Characterization Techniques
  • Modelling
  • Test
  • 3D RF/MW
  • RFIC/MMIC packaging
  • RF MEMS
  • Reliability
  • Electromagnetic modelling
  • Package-Circuit Co-simulation
  • Multi-physics modelling
  • 60 GHz Personal Area Network (PAN)
  • IR, Photonics & Terahertz Packaging
  • Nano-packaging
  • 3D RF/MW
  • New and Disruptive Technology
  • EMI Shielding for RF/MW Packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • RF/MW over Optical
  • Thermal Management
  • New Uncooled IR Sensors
  • Plastic RF/MW Packaging
  • RF MEMS
  • Low loss, wide BW, high Power Interconnects
  • Graphene
  • Substrates
  • Ceramics
  • LTCC
  • TIMS
  • Printed Materials
  • Photoimageable
  • Polymers
  • Military / space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Pulsed Power
  • Space / Sat Comms
  • Extreme Environments
  • MEMS/NEMS
  • Biomedical /Biosensing
  • Reliability
  • Automotive
  • High Speed Electronics Medical electronics
  • Wearable electronics
  • Multi-GHz Radar Systems
  • Electronic Warfare (EW)
  • RFID
  • 5G & Telecoms
  • 60 GHz Personal Area Network (PAN)

SUBMISSION:
Those wishing to present a paper at the RaMP 2014 Workshop must submit a 200-300 word abstract electronically no later than NOVEMBER 30, 2014, using the on-line submittal form at: www.imaps.org/abstracts.htm.

All abstracts submitted must represent original, previously unpublished work. Student submissions will only be considered for the “Academic Research Session”. No formal technical paper is required. The chosen abstracts will be reproduced in the event handbook along with a short ‘Author biography’ and photograph. This information must be supplied to IMAPS by 20 February 2015. A copy of the full presentation should be submitted by 16 March 2015 latest, for preparation and inclusion in the event delegate pack. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. All authors and attendees find that this Conference format is a proven forum for informal but highly effective networking between attendees and speakers.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

CICMT 2015 Germany (Ceramic Interconnect/Microsystems) Abstracts Due November 30    ^ Top
IMAPS/ACerS 11th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2015) is being held April 20-23, 2015, at the Fraunhofer Institute Center in Dresden, Germany. The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities. Full conference details are online at www.cicmt.org. Abstracts are due November 30.

Ceramic Interconnect Track
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due: November 30, 2014
Notice of Acceptance: December 11, 2014
Program Published: January 8, 2015
Final Manuscripts Due: February 27, 2015

Please send your 300-500 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org or call 1-412-368-1621 (USA).

 

  Chapter Activities (events listed in chronological order)
 

NEXT THURSDAY: IMAPS Arizona Chapter Lunch Meeting featuring Qualcomm Speaker - VENUE CHANGE    ^ Top
The IMAPS Arizona Chapter November Luncheon will be held at a NEW LOCATION next Thursday, November 13, 2014: Holiday Inn & Suites, 1600 South Country Club Drive, Mesa, AZ 85210.

Mechanical, Thermal, and Reliability Challenges in Packaging for Mobile Applications

Presented by:
Ahmer Syed, Sr. Director, Package Engineering Qualcomm Technologies, Inc.

Limited PCB real estate and phone thickness constraints pose a number of technical challenges for designing IC packages for mobile applications. While thin packages are required to meet height constraints requirements, room temperature co-planarity and high temperature warpage become critical issues for packages with thin substrate, die, and mold cap.

Similarly, while PoP provides numerous benefits from size, height, and business standpoint; poor heat dissipation path limits the device performance for extended periods of time. Further, Chip-package interactions and board level reliability continue to be pushed to their limits with increased IO density, both at die and package level.

This presentation will highlight some of these challenges and identify areas where partnership across the supply chain is required to overcome these challenges.

About Our Speaker:
Ahmer Syed - Sr. Director, Package Engineering - Qualcomm
Prior to his current position as Sr. Director at Qualcomm Package Engineering, Mr. Syed spent 16 Years at Amkor Technology where he managed board level and electromigration reliability programs, establishing test methods and test facilities, and supported development of Cu Pillar, PoP, TSV, WLCSP, Flip Chip, CSP, BGA, QFN, Stacked CSP, FusionQuad and various other packages with mechanical and thermal characterization.

Mr. Syed also participates in various industry consortiums and task groups, has chaired JEDEC group for drop and bend test development, and authored JEDEC standards JESD-22-B111 and JESD-22-B113.

Widely recognized as an industry expert in package and board level reliability, mechanical simulation and characterization, solder joint life prediction, stress analysis, electromigration reliability, and package material and design optimization, Mr. Syed is a highly sought after speaker for industry symposiums and has authored and co-authored 50+ technical papers and articles.

Luncheon and presentations - $25.00 in advance / $30 at door.
Register On-line by Nov. 12th  
All IMAPS members who register by end of day September 10th will receive a $5 Starbucks gift card at the door!

November 20: IMAPS Benelux Chapter Meeting on Packaging for Sensors   ^ Top
Imaps Benelux Autumn 2014 event: PACKAGING FOR SENSORS
Venue : Melexis, Rozendaalstraat 12, 8900 Ieper (B)
When: Thursday November 20th

Program :

9h30 : welcome coffee

10h00 : "Package functional part of a sensor system", Ignas van Dommelen, Sencio (NL)

10h30 : "Low temperature processing as a key enabler for sensors and microfluidic systems assembly", Serguei Stoukatch, University of Liege (B)

11h00 : coffee break

11h30 : "Energy dispersive detection module for X-rays in a CT scanner", Co Van Veen, Philips Research (NL)

12h00 : "Packaging Automotive Integrated Current Sensor", Jian Chen, Melexis (B)

12h30 : lunch and Melexis Ieper fab tour

14h00 : "Encapsulation of Sensor Devices, now and in the future", Huub Claassen, Towa Europe (NL)

14h30 : "The role of modeling in packaging reliability", imec (B)

15h00 : coffee

15h20 : "Packaging of Infra red sensors for automatic doors", BEA (B)

15h50 : closing drink

Registrations:
Katrien Vanneste, ELIS-CMST, Gent University
Technologiepark 914A, B-9052 Zwijnaarde
Tel: +32 (0) 9 264 5350
FAX: +32 (0) 9 264 5374
E-mail : katrien.vanneste@ugent.be

IMAPS France 2nd Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Applications    ^ Top
Be part of this attractive conference and table top exhibition!

REGISTRATION OPEN :
2nd Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Applications

December 10th & 11th, 2014 - Lyon, France

http://imaps.nukomeet.com/atw-medical/buy
More details on www.france.imapseurope.org

General Chairman:
Alexandre Val (3D PLUS)

Technical Committee:
Sanae Boulay Gilles SIMON (CEA-LETI)
Bernard SAYAG (CICOR MICROELECTRONICS)
Jean-Pierre Cazenave (THALES)

New England Chapter 42nd Symposium & Expo - Call For Papers   ^ Top
CALL FOR PAPERS
IMAPS New England 42nd Symposium & Expo
May 5, 2015

The Largest Regional Symposium Dedicated to Microelectronics and Packaging

Some Technical Topics of Current Interest :

Advanced Packaging Concepts
Novel Materials & Processes
Surface Mount Technology
Thermal Management
Defense Electronics
Assembly and Test
Ceramics and Polymers
Conductive Materials
Automotive-Consumer Applications
Embedded-Integrated Passives
MEMS and Nano Technology
Microwave Packaging
Printed Electronics
Optoelectronics

Submit Abstracts to Tom Green - President, TJ Green Associates, LLC
Deadline for Submission - December 31, 2014

Please e-mail your 250 word abstract to: info@tjgreenllc.com
Visit us at - www.imapsne.org - for more details

  Membership Corner
 

Journal of Microelectronics and Electronic Packaging 3rd Quarter 2014 On-Line - 4th Issue Available Soon   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 11, Number 3
Third Quarter 2014



Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects
Vladimir O. Cherman, Nga P. Pham, John Slabbekoorn, and Harrie A.C. Tilmans, imec Alessandro Faes and Benno Margesin, MEMS Research Unit

87

A Control-Chart-Based Method for Solder Joint Crack Detection
Jianbiao Pan, California Polytechnic State University

94
Advanced Thermal Management Solutions on PCBs for High Power Applications
Gregor Langer and Markus Leitgeb, Austria Technologie & Systemtechnik AG Johann Nicolics and Michael Unger, Vienna University of Technology Hans Hoschopf, Tridonic Jennersdorf GmbH Franz P. Wenzl, Institute for Surface Technologies and Photonics
104

A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive Structures
Brian Curran, Klaus-Dieter Lang, and Herbert Reichl, Technical University of Berlin Ivan Ndip, Jorg Bauer, Harald Pötter, Klaus-Dieter Lang, and Herbert Reichl, Fraunhofer Institute for Reliability and Microintegration Ege Engin, San Diego State University

115

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology
Robert N. Dean, Michael C. Hamilton, and Michael E. Baginski, Auburn University

122
Prolonging the Lifetime of PEEK Packages for Implantable Electronic Devices Using Commercially Available Vacuum Thin Film Coatings
Nathaniel Dahan and Nick Donaldson, University College London Stephen Taylor, IOMS, University College London Nuno Sereno, Invibio Ltd., IGTC
128

Advancing Microelectronics September/October Magazine (MEMS & Thermal) On-Line now; November/December Issue Coming Soon    ^ Top

Advancing Microelectronics

September/October 2014:
Volume 41, No. 5
MEMS & Thermal Management

The September/October 2014 issue featured 6 articles on: Recent Advances in Die Attach Film; Passive Thermal Management of LED Bulb Systems; MEMS Packaging - What Makes it so Special?; High Temperature Electronics for LED-Lighting Architectures (European SEEL Project...); Metal Inter-Diffusion and Eutectic Wafer Bonding Processes for Advances in MEMS Packaging; and Wafer-Level Packaging for Microsystems - from Automotive to Mobile Electronics and Beyond.

download magazine PDF (5mb)

Congratulations to the IMAPS 2014 Society Award Winners!   ^Top
The 2014 Award Winners were recognized Tuesday, October 14th, 2014, at the 47th International Symposium on Microelectronics (IMAPS 2014) in San Diego, California. Congratulations to all those listed below! A special THANK YOU for all each of these dedicated members has done for IMAPS and our industry over the years!!

William D. Ashman Achievement Award
Dr. Andy Mackie, Indium

The William D. Ashman Achievement Award recognizes an individual who, in the opinion of the William D. Ashman Achievement Award Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member. Recipients of this award automatically become Life Members and Fellows of the Society.

John A. Wagnon Technical Achievement Award
Dr. Jeffrey Gotro, Innocentrix, LLC

The John A. Wagnon Technical Achievement Award is given to a member of the Society who, in the opinion of the John A. Wagnon Technical Achievement Award Selection Committee, has made outstanding technical contributions related to microelectronics technology. The award may be given for a specific accomplishment, for a number of accomplishments over a period of years, or for general overall contributions to the microelectronics industry.

IMAPS Fellow of the Society Award
Ken Kuang, Torrey Hills Technologies
Dr. Robert Dean, Jr., Auburn University
Dr. Ivan Ndip, Fraunhofer IZM
Dr. Jeffrey Gotro, Innocentrix, LLC

The Fellow of the Society Award honors and recognizes those who, in the opinion of the Fellow of the Society Award Selection Committee, have made significant and continuing contributions to IMAPS over the years at any level – local or national. A nominee must have been an IMAPS member for ten (10) consecutive years. Examples of the nomination criteria usually considered for this award are: (1) service as an officer of a local chapter or in a national office; (2) service as a member of a local, regional, or national committee or task force; and/or (3) presentation of papers or conducting of short courses at local, regional, or national symposia. Recipients of this award automatically become Life Members of the Society.

Corporate Recognition Award
Honeywell
Accepted by Daniel Krueger

The Corporate Recognition Award honors and recognizes a corporation (or the appropriate division or department of a corporation) that in the opinion of the Corporate Recognition Award Selection Committee has made significant technical contributions to the microelectronics industry, while demonstrating support of IMAPS through participation in such activities as Organizational and Regular Memberships, promoting member participation in IMAPS-sponsored activities, sponsorships, Educational Foundation contributions, and by exhibiting at the Annual Symposium.

Steve Adamson Award
Elviz George, University of Maryland

The IMAPS Foundation /Steve Adamson Student Recognition Award honors and recognizes an Active IMAPS Student Member (Graduate or Undergraduate in a 4-year College) that in the opinion of the Student Recognition Award Selection Committee has made significant technical and/or service contributions to the microelectronics industry, while demonstrating support of IMAPS through participation in such activities as Local, National and/or Global Memberships, promoting member participation in IMAPS-sponsored activities, volunteering in Student Leadership positions, Involvement in Educational Foundation activities, and by participation in IMAPS Symposium, Conferences and/or local Chapter Sponsored Events.

Lifetime Achievement Award
Dr. Harry Charles, Jr., The Johns Hopkins University Applied Physics Laboratory

The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, candidates may be nominated only by senior members, life members, or previous recipients of either the Fellow or Technical Achievement awards. Recipients of this award automatically become Life Members and Fellows of the Society.

 

 

 

 

Metallix

Oneida Research Services

2015 Events:

Device Packaging 2015
Mar. 16-19, 2015
*Exhibitors contact bschieman@imaps.org

RaMP 2015 (RF/Micro - UK)
Apr. 16, 2015

CICMT 2015 (Germany)
Apr. 20-23, 2015

HiTEN 2015 (High Temp)
Jul. 6-8, 2015
*Exhibitors contact bschieman@imaps.org

IMAPS 2015 - Orlando
Oct. 26-29
*Exhibitors contact bschieman@imaps.org

Automotive Microelectronics
Spring 2015

Packaging for Wearable Electronics
Spring 2015

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

View the Electronic Bulletin Archives