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September 12, 2014

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Button Last Call for Thermal Management 2014 Abstracts - A Few Tabletops Still Available (read more...)

Button IMAPS 2014 - Early Registration & Hotel Deadlines TODAY - Get Online Now!  (read more...)

Button IMAPS 2014 - Industry Booths SOLD OUT - A Few Research Lab Booths Remain (read more...)

Button Training You Need: 3D Printed Power Electronics, Intro to Micro, Intro to RF, Screen Printing, High-Temp Electronics, MEMS, 3D on Mobile, Low-Temp, Chip Packaging, IC Fab, Medical Devices, Physics of Failure, and many more! (read more...)

Button Golf in San Diego - What More Could You Ask For?! (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Button WEDNESDAY Cleveland-Pittsburgh Chapter September 17 Meeting at Carnegie Mellon University - Register Before MONDAY (read more...)

Button Viking Chapter & NDSU announce the 2nd Annual IMAPS NDSU Microelectronics Summit (read more...)

Button Benelux Chapter Autumn Meeting on November 20 (read more...)

Button EMPC 2015 (Germany) - Call for Papers (read more...)

RGL Enterprises
F&K Delvotec

Palomar Technologies


  IMAPS Events (view full Web Calendar)

Last Call for Thermal Management 2014 Abstracts - A Few Tabletops Still Available    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibit on Thermal Management is being held at the Toll House in Los Gatos, California, from October 28-30, 2014. Abstracts are due in a few weeks and can be submitted on-line at You can also register, reserve tabletops and more from the website.

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992, and is considered to be one of the most successful of the IMAPS ATWs that are held each year. Information will be available on transportation methods by train and/or bus from area airports.

Speakers are expected to attend the entire Workshop to maximize opportunities for interaction with registered attendees. Every year, authors and attendees find this IMAPS Workshop format to be a proven forum for highly effective networking between attendees and speakers. Speakers pay a reduced registration fee, making participation even more beneficial.


  • Market Drivers:  Thermal challenges and business and economic drivers which influence change in electronic systems design and manufacturing. Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that are included in this session. Such market and business data sets the framework for new technical solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, telcom, IGBT, RF, and microwave components and systems. Standards for testing and reliability. Organic, metallic, metal, graphitic, and other forms of TIMs are included, as well as developments with nanomaterials.
  • CTE-Matching and High Thermal Conductivity Materials:  Metallic, ceramic, and other composite materials with excellent thermal conductivity and coefficient of thermal expansion targeted to that of GaN, SiC, silicon, or ceramic materials. 
  • Stacked-Die and Device Packaging:  Chip-level packaging, including System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die and related thermal and interconnect challenges.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Performance, flexibility, reliability, and serviceability improvements.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Cooling provisioning, airflow, temperature distribution, and migration paths to system liquid cooling.
  • Power Semiconductor Thermal Components, Systems, and Solutions:  Discrete and multichip IGBT packaging.
  • Mil/Aerospace:  Thermal management solutions for emerging and future military and aerospace components and platforms.
  • Telecommunications Systems:  Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics:  Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than September 15, 2014. No formal technical paper is required.

Abstracts must be submitted on-line at

A post-conference CD containing the full presentation material as supplied by authors will be mailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than October 30, 2014, and will be included on the post-conference CD.

Questions:  Brian Schieman with questions or 412-368-1621. You may also contact the workshop chairs.

Submit Abstract | Register On-Line


IMAPS 2014 - Early Registration & Hotel Deadlines TODAY - Get Online Now!   ^ Top
The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). IMAPS 2014 - San Diego, The Future of Packaging - will be held October 13-16, 2014. The early registration and hotel deadlines ARE TODAY - FRIDAY. Registration fees increase tomorrow, and IMAPS cannot guarantee hotel room availability or pricing. So get online today and reserve your spot!



IMAPS 2014 - Industry Booths SOLD OUT - A Few Research Lab Booths Remain    ^ Top
IMAPS 2014 - San Diego, The Future of Packaging - will be held October 13-16, 2014, with the exhibition open the 14th and 15th of October. This is our first SOLD OUT symposium hall in several years. Don't miss out!

Thank you to our 2014 Exhibitors!

Exhibitor Booth Booth Type Booth Category
5N Plus Inc. 429 10 x 10 In-Line
Accu-Tech Laser Processing, Inc. 506 10 x 10 Corner
AdTech Ceramics 616 10 x 10 Corner
AdValue Photonics 535 10 x 10 In-Line
Advance Reproductions Corp. 336 10 x 10 In-Line
Advanced Dicing Technologies 415 10 x 10 In-Line
Advantest Corporation 523 10 x 10 Corner
AI Technology, Inc. 402 10 x 10 In-Line
AIM Solder 612 10 x 10 In-Line
AMADYNE GmbH 434 10 x 10 In-Line
AMICRA Microtechnologies GmbH 330 10 x 10 Corner
ASM Pacific Technology, Ltd. 504 10 x 10 Corner
ATV Technologie GmbH 617 10 x 10 Corner
Axus Technology 634 10 x 10 Corner
Azimuth Electronics, Inc. 509 10 x 10 Corner
Besi North America, Inc. 225 10 x 10 In-Line
Camtek USA, Inc. 622 10 x 10 Corner
Canon USA 510 10 x 10 Corner
Ceradyne, Inc., a 3M company 526 10 x 10 In-Line
Center for Nanoscale Science & Engineering, North Dakota State Univ. 706 10 x 10 - RESEARCH CORRIDOR In-Line
Chip Scale Review (Media Sponsor) 426 10 x 10 In-Line
Cleanlogix LLC 229 10 x 10 In-Line
Coining, Inc., an AMETEK company 607 10 x 10 In-Line
Conductive Containers, Inc. 417 10 x 10 Corner
CORWIL Technology 424 10 x 10 In-Line
CVInc 327 10 x 10 In-Line
Deweyl Tool Company, Inc. 408 10 x 10 In-Line
DISCO Hi-Tec America. 611 10 x 10 In-Line
DuPont Microcircuit Materials 431 10 x 10 Corner
East China Research Institute of Microelectronics 512 10 x 10 In-Line
Electronic Production Partners GmbH 501 10 x 10 Corner
Element Six Technologies US Corp. 530 10 x 10 Corner
Epoxy Technology, Inc. 407 10 x 10 Corner
ESL ElectroScience 605 10 x 10 Corner
F & K Delvotec, Inc. 514 10 x 20 Corner
Ferro Corporation 331 10 x 10 Corner
Finetech, Inc. 317 10 x 10 Corner
Fogale Nanotech 528 10 x 10 In-Line
Fraunhofer Institute for Reliability and Microintegration IZM 705 10 x 10 - RESEARCH CORRIDOR In-Line
FREEDM-Laboratory for Packaging Research in Electronic Energy Systems (NCSU) 703 10 x 10 - RESEARCH CORRIDOR Corner
FRT of America, LLC 620 10 x 10 Corner
Geib Refining Corporation 301 10 x 10 In-Line
Gel-Pak/Quik-Pak 312 10 x 10 Corner
Georgia Tech 3D Systems Packaging Research Center (PRC) 704 10 x 10 - RESEARCH CORRIDOR Corner
Haiku Tech, Inc. 115 10 x 10 In-Line
Harrop Industries, Inc. 522 10 x 10 In-Line
Hary Manufacturing Incorporated 104 10 x 10 Corner
HD Microsystems 236 10 x 20 Corner
Heraeus Electronic Materials Division 205 10 x 20 Island
Hesse Mechatronics, Inc. 309 10 x 20 Corner
Hi-Rel Laboratories, Inc 413 10 x 10 In-Line
Hybond, Inc. 435 10 x 10 In-Line
i3 Electronics (formerly Endicott Interconnect Technologies) 507 10 x 10 In-Line
IBM Corporation 427 10 x 10 In-Line
Indium Corporation 217 10 x 10 In-Line
Infinite Graphics 314 10 x 10 In-Line
Inkron Ltd. 614 10 x 10 In-Line
Integrated Electronics Engineering Center (IEEC), Binghamton Univer. 707 10 x 10 - RESEARCH CORRIDOR In-Line
Interconnect Systems, Inc. 401 10 x 10 In-Line
Isola Group 534 10 x 10 In-Line
Kulicke & Soffa Industries, Inc. 215 10 x 10 In-Line
Kyocera America, Inc. 410 10 x 10 In-Line
KOA Speer Electronics 425 10 x 10 In-Line
LINTEC OF AMERICA, INC 214 10 x 10 Corner
Metalor Technologies USA 209 10 x 20 Island
MicroScreen LLC 316 10 x 10 Corner
Micross Components 420 10 x 10 Corner
Micro Systems Technologies, Inc. 335 10 x 10 In-Line
Mini-Systems, Inc. 406 10 x 10 In-Line
Momentive Performance Materials 610 10 x 10 In-Line
MRSI Systems LLC 231 10 x 10 Corner
NAMICS Corporation 320 10 x 10 Corner
Natel Electronic Manufacturing Services, Inc. 105 Island - 20 x 20 Island
Neu Dynamics Corp. 405 10 x 10 Corner
NorCom Systems, Inc. 210 10 x 10 Corner
Nordson DAGE 227 10 x 10 In-Line
NTK Technologies, Inc. 517 10 x 10 Corner
Palomar Technologies, Inc. 221 10 x 20 Corner
Perfection Products, Inc. 505 10 x 10 Corner
Photofabrication Engineering, Inc. 111 10 x 10 Corner
PJC Technologies, Inc. 615 10 x 10 In-Line
Plasma-Therm, LLC 108 10 x 20 Island
Polysciences, Inc. 422 10 x 10 In-Line
Reldan Metals Co., Div of AR Metals, LLC 521 10 x 10 Corner
Riv, Inc. 100 10 x 10 Corner
Royce Instruments, Inc. 321 10 x 10 Corner
Rudolph Technologies 520 10 x 10 Corner
Sage Analytical Lab, LLC 428 10 x 10 In-Line
Sales & Service, Inc. 423 10 x 10 In-Line
Samtec 421 10 x 10 Corner
SANTIER Thermal Management Solutions 500 10 x 10 In-Line
SavanSys Solutions LLC 329 10 x 10 Corner
Semi Dice, Inc. 102 10 x 10 In-Line
Shinko Electric America 609 10 x 10 In-Line
Sierra Circuits, Inc. 608 10 x 10 In-Line
Sikama International, Inc. 213 10 x 10 Corner
Sonoscan, Inc. 315 10 x 10 Corner
Souriau PA&E 414 10 x 10 Corner
SST International 305 10 x 20 Corner
Stellar Industries Corp. 400 10 x 10 In-Line
Taiyo Ink Mfg. Co., Ltd. 613 10 x 10 In-Line
Tango Systems, Inc. 436 10 x 10 In-Line
TDK Corporation 606 10 x 10 In-Line
Technic, Inc. 411 10 x 10 Corner
Teledyne Microelectronic Technologies, Inc. 300 10 x 10 Corner
Torrey Hills Technologies, LLC 515 10 x 10 Corner
TPT Wire Bonder 325 10 x 10 In-Line
Tresky Corporation 323 10 x 10 In-Line
U.S. Tech (Media Sponsor) 430 10 x 10 Corner
UBOTIC Company Ltd. 322 10 x 10 Corner
Unisem Group 524 10 x 10 In-Line
Ushio, Inc. 536 10 x 10 In-Line
UTZ Technologies 328 10 x 10 In-Line
VIOX (now Ceradyne, Inc., a 3M company) 526 10 x 10 In-Line
West Bond, Inc. 416 10 x 10 Corner
XYZTEC 404 10 x 10 Corner
YINCAE Advanced Materials, LLC. 326 10 x 10 Corner
YXLON International, Inc. 502 10 x 10 In-Line
Zeta Instruments 604 10 x 10 Corner
Total Booths: 130


Exhibitor Questions or need assistance reserving a booth?
Contact Brian Schieman at or call 919-293-5000

Training You Need: 3D Printed Power Electronics, Intro to Micro, Intro to RF, Screen Printing, High-Temp Electronics, MEMS, 3D on Mobile, Low-Temp, Chip Packaging, IC Fab, Medical Devices, Physics of Failure, and many more!    ^ Top
IMAPS 2014 - San Diego, The Future of Packaging - will be held October 13-16, 2014, with 19 PDCs being offered before the conference on Monday the 13th, as well as Thursday morning the 16th. Details below and at

PDCs (Professional Development Course) are a big part of the Annual IMAPS Symposium each year. Why not plan to take a course on Monday or a Thursday AM session and take advantage of the rich learning opportunities available at the IMAPS symposium. This year the Monday courses are going to have a delayed start kicking off at 10 AM and running till 6 PM with a working lunch. It's something new and we hope you like it. This new time slot will give the locals a chance to beat the traffic and a little extra time for the out of town folks to get organized and prepare for a full day of learning.

PDCs create a unique environment whereby students can personally interact with the instructors, and with each other in the classroom and over lunch. It's mentally stimulating and the new found professional connections will prove to be valuable in the long run. Learning on line is fine, but it cannot duplicate eight hours spent immersed in a specific topic, led by an industry expert in the field and surrounded by like minded professionals. My father used to say, "it's not what you say but how you say it." So much of what we learn is contained in the tone of voice and non-verbal cues. PDCs provide that learning environment that's just not available on line.

This year we've put together another impressive assortment course options Our goal is to make the IMAPS PDCs the premier learning experience; so we ask that you take time to fill out the evaluation form that accompanies each course and give us your feedback on this or any other aspects of the PDCs. Read through the course descriptions on line and pick the course that best suits your company and career objectives. Every PDC includes a full set of comprehensive course notes. Class sizes typically range from eight to twenty students and there is always ample time for questions. We hope you will consider joining us in San Diego for a learning experience like no other.

NEW PDC FORMAT - Monday & Thursday Courses:
Monday, October 13: full-day courses, running 10:00 am - 6:00 pm;
Monday, Half-day courses running 10:00am - 1:45pm & 2:15 pm - 6:00 pm

All Thursday, October 16 are half-day, running 8:00 am - 12:00 pm

MONDAY FULL-DAY PDCs: (10am-6pm)
- Introduction to 3D Printed Power Electronics & Wide Bandgap Power Semiconductor Packaging;
- Introduction to the Design and Fabrication of RF, High Speed and Microwave Hybrids, MCM's and Modules;
- Introduction to Microelectronics Packaging;
- Polymer Challenges in Electronic Packaging Including 2.5D and 3D Integration;
- Technology of Screen Printing;
- Wire Bonding

- ENIG - Electroless Nickel & Immersion Gold Plating for Electronics: From the Plating Solutions to the Equipment;
- High-Temperature Electronics;
- MEMS and nanoMEMS Devices and Applications;
- Package level integration : 2-D, 2.5-D and 3-D, Impact on Mobile Systems

- Low-Temperature Electronics;
- Package on Package Technology - What It Is, What Works, What Doesn't Work;
- Thermal And Mechanical Simulation Techniques For IC Package Yield, Reliability And Performance

- Chip Packaging Processes and Materials;
- Fundamentals of Microelectronics Packaging;
- IC Fabrication and Electronic Packaging;
- Interposers - Silicon, Organic and Glass;
- Packaging and Testing of Implanted Medical Devices;
- Understanding the Common Failure Modes from a Physics of Failure Perspective

Golf in San Diego - What More Could You Ask For?!    ^ Top
Have a little fun before IMAPS 2014 - San Diego kicks off! Join us for the 20th Annual IMAPS Golf Classic, to benefit The Microelectronics Foundation, on Monday, October 13, 2014, at the Riverwalk Golf Course. The outing begins at 8:00am with a Shotgun Start - "Best Ball" scramble. Information for the Riverwalk Golf Course: 1150 Fashion Valley Road San Diego, CA 92108 | Details below and at

The Riverwalk Golf Course encompasses three nine-hole layouts that can be combined in a variety of ways to create a unique experience every time you play. Distinctive in character but consistent in quality, every hole was meticulously designed by Ted Robinson, Sr. and Jr. in the old style, leaving the terrain completely natural. Mature stands of palm, oak and eucalyptus trees frame undulating fairways and manicured greens, with numerous wetland areas, nearly 100 bunkers and an array of picturesque water features creating both strategic diversity and a visually stunning backdrop for golf.

Cost is $125 per person.

$450 for a team of four; $750 for a team of four including a hole sponsorship.
$500 for one individual golfer and 1 hole sponsorship.

The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, and a breakfast/lunch -- TBD.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive
  • Team Awards
  • Mulligans for sale!

Golfers will tee off shortly after arriving at the course. Times are tentative and will be confirmed before the outing. Club rentals available - email David Virissimo for more information.

Sponsorship Opportunities:

Eagle Sponsor - $3,000

  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500

  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Hole Sponsor - $500 ($750 w/ four-some)

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($500) or one four-some ($750).
  • Company logo/name on promotional materials and website.

Sponsors receive signange, on-line recognition, and other benefits as defined on the sponsorship page. Contact David Virissimo, IMAPS 2014 Foundation Chair, with questions - Or contact Brian Schieman, IMAPS, at

Golf Sponsors
Golf Hole:
Technic - Golf Hole Sponsor
Golf Hole:
Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole:
Golf Hole Sponsor: AGC Electronics America
Golf Hole:
Golf Hole Sponsor: Quik-Pak
Golf Hole:
Hole Sponsor: NAMICS
golf holes still available

Register Online
PDC registration is listed under SESSIONS during the on-line registration process


  Chapter Activities (events listed in chronological order)

WEDNESDAY Cleveland-Pittsburgh Chapter September 17 Meeting at Carnegie Mellon University - Register Before MONDAY    ^ Top
IMAPS Cleveland-Pittsburgh Chapter will host a Technical Meeting & Tour on Wednesday, September 17, from 2:00-6:30 PM at Carnegie Mellon University in Pittsburgh, Pennsylvania. Please join us for technical presentations, facility tour and networking. Program details below. Register Online BEFORE MONDAY!

IMAPS Cleveland-Pittsburgh Chapter Technical Meeting & Tour
Wednesday, September 17 | 2:00-6:30 PM
Carnegie Mellon University | Pittsburgh, Pennsylvania


2:00: Welcome, Introductions & Round-the-Room Networking
Scott Lauer, Advantech; Brian Schieman, IMAPS

2:30: Introduction to CMU
Gary Fedder, Carnegie Mellon University

2:45: Effect of Gas Environment and Materials on Electrical Contact Reliability in Micro- and Nanoswitches
Maarten P. De Boer, Mechanical Engineering Dept., Carnegie Mellon University

Nanoelectromechanical ohmic switches are candidate devices for complementing silicon transistors because they exhibit a near zero subthreshold swing and can operate at less than 100 mV. An important issue, however, is their electrical contact reliability. In particular, a resistive polymeric deposit can form at the contacts. Here, we explore how the formation of the formation and evolution of this deposit depends on the contact materials as well as the environment in which they operate. This work may lead to packaging guidelines for these promising devices.

3:15: Refreshment Break & Networking Refreshments, Coffee, & Snacks

3:30: Challenges in the Design, Manufacturing, and Usage of MEMS Microphones
Brett Diamond, MEMS Development Manager, Akustica

The need for a microphone to have an open acoustic port provides a unique set of challenges to both microphone suppliers and customers. This talk will focus on how exposure of the device to the environment needs to be taken into account in design, manufacturing, and end-device assembly.

4:00: MEMS and Sensors Trends – Enabling a Truly Interactive and Connected World
Karen Lightman, Executive Director, MEMS Industry Group

MicroElectroMechanical Systems (MEMS) has been on a double-digit growth ride for the past five years and is expected to more than double again from $11B in 2012 to $23.5B by 2018 (source: Yole Développement). There is no shortage of innovation in MEMS and sensors. Higher levels of integration, such as 6- and 9-axis (or even 12-axis) accelerometer/gyro suite, conserve board “real estate” and speed up design-to-development cycles. The application of sensor fusion lets designers intelligently manage sensor resources, making easier tradeoffs between power and performance. WSNs are increasingly vital to gathering and analyzing more accurate data in an ever-connected world. From smartphones and wearables to smart home applications, MEMS and sensors are clearly the core building blocks in the IoT. While MEMS and sensors may be new to some, the technology is reaching market maturity to claim a spot in the mainstream spotlight. In her presentation, Mrs. Lightman also will highlight the latest progress made in MEMS standardization. She will address the robust manufacturing ecosystem in which specialized MEMS foundries and traditional CMOS foundries compete for customers, ultimately benefitting OEMs who get more for their money. Understanding trends in MEMS and sensors can and will enable designers to successfully leverage the mobile ecosystem in the realization of the next generation of MEMS- and sensor-enabled products.

4:30: Environmental and Packaging Effects on High-Performance Gyroscopes
Erdinc Tatar, Graduate Student, Carnegie Mellon University

MEMS gyroscope technology is progressing towards the navigation grade performance in these days. On this end, environmental stress and temperature effects become important on gyroscope performance. These effects are originated from the temperature induced stress due to thermal coefficient of expansion mismatch and packaging stress. This presentation is focused on modeling and measurement of stress and temperature effects on high performance MEMS gyroscopes and discrete level vacuum packaging of MEMS.

5:00: Pizza Dinner, Networking and Chapter Business (Scott Lauer, Advantech)

5:30: Tour of CMU Labs – We will split into 2 groups
Group A: Majidi Soft Materials Lab (15 min) -> MEMS Lab (HH 1212) (15 min) -> Nanofab (HH F level) (10 min with walking)
Group B: MEMS Lab (HH 1212) (15 min) -> Nanofab (HH F level) (10 min with walking) -> Majidi Soft Materials Lab (15 min)

Event Location & Directions:
Carnegie Mellon University Campus Information Parking & campus map – a. Map designating available parking at the East Campus Garage and our Building. (attached and provided by IMAPS) b. Our office is located at 4800 Forbes Avenue, Hamburg Hall. When you enter the building, ICES is located on the 1st floor, all the way down the hall on the right, Suite 1201 (ICES signage is on the doors). We can set up the sign-in table at the entrance to our suite. c. The meeting will be held in Hamburg Hall, Conference Room 1216.

Registration Fees:
Thanks to the generous sponsorship of MEMS Industry Group, there is a registration fee of only $5 for ALL to attend (includes meeting, snacks, drinks and pizza dinner)

On-line Registration

Viking Chapter & NDSU announce the 2nd Annual IMAPS NDSU Microelectronics Summit    ^ Top
IMAPS Viking Chapter is happy to announce the 2nd annual IMAPS NDSU Microelectronics Summit to be held Friday, October 3, 2014, at North Dakota State University's Center for Nanoscale Science and Engineering (CNSE).

Research 1 at 1735 NDSU Research Park Dr, Fargo ND

Mark your calendars now for the 2nd annual NDSU Microelectronics Summit.

Building on the success of last year, more items are added to this year’s venue.
 Technical presentations and a keynote speaker will be in the morning sessions.
 Research lab and industry tours will highlight the afternoon hours.
 Student poster presentations will again be a very important part of this year’s program.
 Pre-Summit Social Gathering the night before in the acclaimed downtown Fargo area!!

Website for Registration >>Events calendar>>2014 Viking Chapter NDSU Microelectronics Summit

Onsite registration also available.

Registration fee includes lunch and refreshments:
$5 students, $25 members, $35 nonmembers + 6-month free membership.

Registration Contact:
Greg Strommen ( (701) 231-5339

Candlewood Suites, 1831 NDSU Research Park Dr N, Fargo, ND (701) 235-8200. Ask for NDSU Discount.

Homewood Suites by Hilton, 2021 16th Street North, Fargo, ND (701) 235-3150. Ask for 10% NDSU discount.

Days Inn and Suites, 1507 19th Avenue North, Fargo, ND (701) 232-0000. Ask for 10% NDSU discount.

Benelux Chapter Autumn Meeting on November 20    ^ Top
IMAPS Benelux Chapter will hold their autumn event on PACKAGING FOR SENSORS at Melexis (Ieper, Belgium) on the 20th of November. So, book your agendas and contact us if you want to submit a technical/scientific contribution through a presentation or a poster. Contact Sebastien on LinkedIn.

EMPC 2015 (Germany) - Call for Papers    ^ Top
EMPC 2015 (European Microelectronics Packaging Conference) is the premier international conference organized by IMAPS Germany and supported by IMAPS-Europe and IEEE-CPMT. This event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

DEADLINE for abstract submission: January 15, 2015

Conference topics EMPC 2015:

• Technologies & Methods for 2.5 / 3D Packaging & Integration with Silicon and Glass Interposers • Through Via and 3D Materials & Processes • Stacked Dies, Packages and Memories • 3D Simulation and Modeling • High Density Interposers & Integrated Passives • Vertical Interconnects • Think Thin: Thin IC Packaging • 3D Printing (Inkjet & others)

• Package Scaling • Printed Electronics & Additive Manufacturing • Thin & Printed Battery Technology • Sensor Packaging • Device Packaging for Medical Microsystems, Medical Implants & Ingestibles • Portable & Patient Monitoring Devices • Microfluidics & Bio-MEMS • Wearable Devices • Membrane & Capacitive Switches • Printable Display & Lighting • „Internet of Things“ • Industry 4.0

• Wirebonding & Stud Bumping • Flip Chip Interconnects & Technologies • PCB Embedding Technologies • MEMS • Wafer Level Packaging • Chip Scale Packaging • Wafer Finishing (Bumping, Copper Pillar, Thinning) • Warpage Characterization and Mitigation • Ceramic & LTCC Packaging • MID • Gyros & Accelerometers • RF Devices and Microwave Packaging • Optical Interconnects • Optical MEMS (MOEMS) • LED and Optoelectronics Packaging • Power Electronic Packaging • Automotive Microelectronics • Silicon Photonics • High Performance Interconnect & Boards • Novel Interconnection, Fabrication & Analysis Methods

• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Polymer Interposers • Substrate Materials • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films • Pb-Free Solder & ROHS • Harsh Environment / High Temperature • High Reliability for Military / Aero /Drilling / Geo-Thermal Applications

• Design for Reliability • Board Level Reliability • Material and Micro Characterization • Modeling & Design for SI, PI and EMC • Thermal and Thermo-Mechanical Modeling • Electrical and RF design • Mechanical Modeling and Related Metrology • Testing Methods and Process • Design for Manufacturing and Testing • Package Reliability Testing • Fine Pitch Probes • Quality Assurance • Non-destructive Evaluation • Modeling, Simulation and Optimization of Processes • Tools for Planning and Controlling of Manufacturing Processes

Abstract Submission:
Authors are invited to submit an abstract of 250 words (no figures, no tables, no formulas) that provides original and previously unpublished, non-confidential and non-commercial information. Information about abstract submission and the conference in general can be found at

For any queries please contact our conference office at A prize for both the best paper and the best poster presentation will be awarded by the program committee.





Oneida Research Services

2014 Events:

IMAPS 2014 - San Diego
Oct. 13-16
*Exhibitors contact

Thermal Management
Oct. 28-30, 2014
*Exhibitors contact

2015 Events:

Device Packaging 2015
Mar. 16-19, 2015
*Exhibitors contact

HiTEN 2015 (High Temp)
Jul. 6-8, 2015
*Exhibitors contact

IMAPS 2015 - Orlando
Oct. 26-29
*Exhibitors contact

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