NEXT WEDNESDAY: METRO Chapter Dinner Presentation on Technology Overview 3D Printers ^ Top
Technology Overview 3D Printers:
From table top to direct metal printers with applications from design review, prototyping, rapid manufacturing fixtures, figures, injection mold tools, casting and customized mass production
by Drew DaHarb
Sales Engineer CadBlu
3D printing - once a term used for science fiction, star trek and other futuristic endeavors is now a house-hold term and proving to be a cost-effective main-stream manufacturing tool. The 3D printing markets and applications are rapidly expanding from traditional prototyping and product development into the manufacturing, tooling and hi-precision markets on one end as well as the low-end hobbyist market. This rapid growth can be attributed to the decrease in capital expense required to obtain a 3D printer and more importantly to the materials and output (print) quality available today.
With such a wide scope of applications, materials and 3D printers understanding and acquiring the best printer and material for a desired application can be overwhelming. CadBlu Manufacturing the Future with 3D Printing 2.0 presentation (including videos, parts from 3d printers and active discussion) will bring you up to date with the systems, materials and applications that best fit your needs now and into the future.
PowerPoint with videos on multiple 3D printing technologies, sample parts to view/discuss and opportunity to discuss specific applications.
Drew DaHarb has over 12 years’ experience in the 3D printing market including sales/support (all technology platforms), rapid manufacturing (manufacturing using 3d printing), rapid prototyping, product development, channel (VAR) development and is very familiar not only with the 3D Systems printers but all of the major manufacturers of 3D printers. He has been directly involved with sales of 3D printers from table top to multi-system manufacturing centers and the development of systems, materials and specialty applications of 3D printing. Currently living in Colorado Drew supports CadBlu’s five office locations (CA-2, CO, NY, MN) and personnel for all industrial and manufacturing applications along with technical support for the dental, casting and jewelry markets.
Logistics and Registration:
Clarion (former Holiday Inn) Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Registration/Networking 5:30-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM
Price: Members: $30.00 if Pre-Registered by April 9, 2015
$50.00 after April 9, 2015
Non-Members: $50.00 if Pre-Registered by April 9, 2015
$75.00 After April 9, 2015
Student Members: Free if Pre-Registered by April 9, 2015
$25.00 after April 9, 2015
If you wish to join membership information is available at www.imaps.org
Registration Email: email@example.com
Phone: Scott Baldassarre 516-752-2367
There are a limited number of vendor tables available for this event.
NEXT THURSDAY: Join the IMAPS Arizona Chapter for the next Luncheon Featuring a Presentation from ASE ^ Top
Thursday, April 16, 2015
Holiday Inn & Suites
1600 South Country Club Drive, Mesa, AZ 85210
Registration and exhibits will open at 11:30
Lunch and Presentation from noon to 1pm
Exhibits close at 1:30
Innovation in Fan Out Packaging for Mobile Applications
Presented by: John Hunt Director of Engineering, ASE
Mobile electronics has created the need for ever increasing density and performance in electronics packaging. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging. The packaging industry has responded with a plethora of packaging options, each tailored for a specific set of customer requirements.
We will review how the integration of a wide variety of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into packages for Mobile applications with higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fanout, Panel Level Fanout with embedded die, and Chip Last Fanout packaging combining low cost materials and process flows. Using these tools and processes, the resulting packaging combinations will only be limited by our imaginations, and our creativity in innovating them.
About Our Speaker:
John Hunt - Director of Engineering, ASE
John is Director of Engineering, Product Promotion, at ASE (US) Inc., and provides technical support for the Introduction, Engineering, Marketing, and Business Development activities for Advanced Wafer Level and Fanout Packaging Technologies at ASE.
John has more than 40 years of experience in various areas of manufacturing, assembly and testing of electronics components and systems, with emphasis on the development of new technologies and processes, with a B.S. from Rutgers and an M.S. from University of Central Florida.
Luncheon and presentations - $30.00 in advance / $35 at door.
Register On-line by April 15th
All IMAPS members who register by end of day April 14th will receive a $5 Starbucks gift card at the door!
President IMAPS AZ Chapter
Please remember: Our new location - Holiday Inn & Suites, SW corner of US 60 and Country Club Dr in Mesa.
4th Minapad conference , organized by IMAPS French Chapter, which will be held in Grenoble on April 21 to 23 ^ Top
Let me please draw your attention on 4th Minapad conference , organized by IMAPS French Chapter, which will be held in Grenoble on April 21 to 23. The technical program is quite rich with 3 keynotes from Georgia Tech, Amkor and Eolane, a panel session from our partner SEMI Europe dedicated to the “Prototyping and small series packaging for SME” and a Distinguished lecture (organized by IEEE CPMT France) on “Microsystems packaging: Past, Present and Future” by Rao Tummala, Georgia Tech USA.
Hope you or one of your colleagues can join us there!
Program & Registration Details:
By E-mail : firstname.lastname@example.org
New England Chapter 42nd Symposium & Expo - "Game of Drones" : Get Registered! ^ Top
"Game of Drones"
The iMAPS New England 42nd Annual Symposium & Expo
The iMAPS New England Symposium & Expo is the leading regional professional forum for the exchange of information on microelectronics and packaging technologies.
Our Society encompasses all engineering disciplines including electronic and thermal design, materials, components, assembly, and testing in extreme environments and much, much more.
The 2015 Technical Chairs, Tom Green of TJ Green Associates and Dmitry Marchenko of Microsemi, have reached out to colleagues in industry and academia to create a Technical Program that will provide a platform for learning about the latest advances in microelectronics and packaging technologies, while also creating an opportunity for professional networking.
Thirty seven presenters set in eight sessions will cover a range of interesting, current topics in microelectronics, assembly and packaging. We extend a special thank you to the companies that continue to support iMAPs New England through their presentations, including Lockheed Martin, Vishay, Globalfoundries, Invensas, and many others.
Tuesday May 5, 2015
7:30 AM to 4:30 PM EDT
Holiday Inn Boxborough Woods
242 Adams Place, Boxborough, MA 01719
This year's session topics include:
• RF/Microwave Innovations Part I and II
• 2.5 / 3D Packaging Technologies
• Wire Bonding and Advanced Interconnection
• Printed Electronics
Our Symposium is made possible by the financial generosity of our Sponsors and Exhibitors - please be sure to visit them in our Exhibit Hall and support their efforts.
For a detailed summary of the Technical Program see our website www.imapsne.org
On May 5th, Registration starts at 7:30AM and the Symposium begins at 8:30AM sharp with the Exhibit Hall opening at 9AM. We look forward to seeing you on Tuesday, May 5th, 2015
Dr. John Blum, iMAPS New England Chapter President
39th International Microelectronics and Packaging IMAPS Poland Conference September 20-23, 2015, Gdańsk, Poland ^ Top
It is a great pleasure to announce that the 39th International Microelectronics and Packaging IMAPS Poland Conference will be held in Gdańsk, September 20-23, 2015.
It is organized by Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics and Gdynia Maritime University, Faculty of Electrical Engineering with participation of Polish Society of Theoretical and Applied Electrical Engineering Department of Gdańsk, Committee on Electronics and Telecommunication of Polish Academy of Science and IMAPS Poland Chapter.
IMAPS Poland 2015 is a professional conference which takes modern electronic, ICT and photonic materials manufacturing and applications as its core. In recent years materials science is have been rapidly developing and its achievements are widely implemented in electronics, ICT and photonics. We intend to provide a forum for the discussion about the latest research in material science.
April 2015 - Abstract submission
15 May 2015 - Abstract acceptance
15 June 2015 - Early bird rate fee
15 June 2015 - Full paper submission
1 September 2015 - Full paper acceptance
20-23 September 2015 - Conference
Conference language is English. Abstracts and full texts of papers should be prepared in English. Researchers and technologists are invited to submit abstract along with authors names, affiliation, paper title, work description and keywords. Authors should submit abstracts in .doc, .odt or .docx format with no more than 1 pages in A4 paper (Times New Roman, 12 pt.). It should clearly indicate the originality of the contribution and relevance of the work.
Gdansk University of Technology
ul. Narutowicza 11/12
ph. +48 58 347 1323