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April 9, 2015
 

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   IMAPS EVENTS
Button LAST CALL For IMAPS 2015 Orlando Abstracts - Now Due April 17 (read more...)

Button Electronic Packaging for Wearable Electronics - Abstracts Due April 17 (read more...)

Button RaMP 2015 (RF/Microwave) Next Week! (read more...)

Button CICMT 2015 Germany (Ceramic Interconnect/Microsystems) In Two Weeks (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Button NEXT WEDNESDAY: METRO Chapter Dinner Presentation on Technology Overview 3D Printers (read more...)

Button NEXT THURSDAY: Join the IMAPS Arizona Chapter for the next Luncheon Featuring a Presentation from ASE (read more...)

Button 4th Minapad conference , organized by IMAPS French Chapter, which will be held in Grenoble on April 21 to 23 (read more...)

Button New England Chapter 42nd Symposium & Expo - "Game of Drones" : Get Registered! (read more...)

Button 39th International Microelectronics and Packaging IMAPS Poland Conference September 20-23, 2015, Gdańsk, Poland (read more...)


   MEMBERSHIP CORNER
Bullet Journal of Microelectronics and Electronic Packaging 1st Quarter 2015 On-Line (read more...)

Bullet Advancing Microelectronics March/April Magazine (3D including 3DIC, 3D Packaging (PoP)) On-Line now  (read more...)

Palomar Technologies

 

  IMAPS Events (view full Web Calendar)
 

LAST CALL For IMAPS 2015 Orlando Abstracts - Now Due April 17    ^ Top
The 48th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2015 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks that span the three days of sessions on: PACKAGING THE INTERNET OF THINGS: LEADING THE RACE FROM TECHNOLOGY TO SYSTEM; INTERPOSERS & 2.5/3D PACKAGING; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED MATERIALS & PROCESSES; MODELING, DESIGN, TEST & RELIABILITY; as well as the Interactive University Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

Track:
PACKAGING THE INTERNET OF THINGS: LEADING THE RACE FROM TECHNOLOGY TO SYSTEM
Topics:
• Hardware-based Security • Counterfeit Avoidance • Wearable devices • Printable Display & Lighting • Automotive Microelectronics: “Infotainment” • 3D printing • Packaging for Drones & Robotics • Packaging Roadmaps • Package Scaling • Printed Electronics & Additive Manufacturing • Sensor Packaging • Medical Device Packaging • Packaging for Medical Implants & Ingestibles • Portable & Patient Monitoring Devices• RFIDs • Thin & Printed Battery Technology • Energy Harvesting • Enabling Technologies for Power Management • MEMS • Gyros & Accelerometers • Membrane & Capacitive Switches • Microfluidics & Bio-MEMS • Miniaturized Sensor Nodes
Track:
INTERPOSERS & 2.5/3D PACKAGING
Topics:
• TSV Materials & Processes • Silicon Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Glass Interposers • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D • Think Thin: Thin IC Packaging For Mobile • 3D Printing (Inkjet & others)
Track:
ADVANCED PACKAGING AND ENABLING TECHNOLOGIES
Topics:
• Panel-based Die Integration • Fan-out Wafer Level Packaging (FOWLP) • Flip Chip Interconnects & Technologies • Wafer Level Packaging • System Integration • Wirebonding & Stud Bumping • Chip Scale Packaging • Wafer Finishing (Bumping, Copper Pillar, Thinning) • Warpage Characterization and Mitigation • RF Devices • Optical Interconnects • Optical MEMS (MOEMS) • LED and Optoelectronics Packaging • Silicon Photonics • High Performance Interconnect & Boards • Novel Interconnections, Fabrication & Analysis Methods• RF and Microwave Packaging• Power Packaging • RFIDs
Track:
ADVANCED MATERIALS & PROCESSES
Topics:
• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Polymer Interposers • Substrate Materials • Ceramic & LTCC Packaging • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films • Pb-Free Solder & ROHS • Advanced 3D Materials
Track:
MODELING, DESIGN, TEST & RELIABILITY
Topics:
• Design for Reliability • Modeling & Design for SI, PI and EMC • Thermal and Thermo-Mechanical Modeling • Testing Methods and Process • Mechanical Modeling and Related Metrology • Design for Manufacturing • Package Reliability Testing • Fine Pitch Probes • 3D Simulation and Modeling • Low-Power Design • High Reliability for Military/Aero Applications • High-rel Drilling/Geo-Thermal • Automotive Electronics • Harsh Environment / High Temperature
 

Industries Represented:
Consumer, Portable and Wireless Biomedical Telecom Defense and Security Computing, and Gaming
Automotive Applications Solar and Alternative Energy
Gas, Drilling & GeoThermal

Please send your 500 word abstract electronically only on/before APRIL 17 using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org.

Submit Abstract(s)

 

Electronic Packaging for Wearable Electronics - Abstracts Due April 17    ^ Top
IMAPS Advanced Technology Workshop on Electronic Packaging for Wearable Electronics will be held at the Doubletree Suites by Hilton in Austin Austin, Texas on June 15-16, 2015. Abstracts must be submitted online on/before April 17: www.imaps.org/wearables.

We tend to be fascinated by the newest technologies to come along in the various electronics markets. The wearables market is no different. We are enamored by the futuristic outfits in Tron to the latest high tech fashion-Google glass. What are the requirements of a typical wearable electronics device? They must be non-restrictive, portable, always be accessible, easily controllable, and have both localized communication and possibly wireless communications capabilities. The various applications must be able to withstand rain, sand and dust, thermal shock, solar radiation (UV exposure), icing, high and low temperatures, fungus growth, water immersion, mechanical shock and electromagnetic (EMC) compatibility. Electronic packaging is the heart of these applications and potential issues. This workshop will address matrials, packaging approaches, applications from commercial to medical, the various environments and what this new market segment needs to do to be successful.

Planned Sessions Include:

    • Packaging Approaches
      • 0201 and smaller passives
      • Advanced Packaging
    • Applications
      • Biometric
      • Hearing Aids
      • Defibrillators
      • Smart Clothing
      • Activity Tracking
      • Lifestyle Computing
      • Security
    • Thermal Management
    • Materials
      • Unique PCB Materials
      • Solders, Conductive Polymers
      • Fabric issues
    • Reliability
    • Environments
    • Markets and Analysis

Those wishing to make a presentation at the Wearables Workshop, please submit a 300-500 word abstract electronically IMMEDIATELY using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org).

All abstracts submitted must represent advanced technology and can be unpublished work. The abstracts should highlight the application area, design, and process or material covered within the automotive industry. Accepted speakers may also submit papers to be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

 

RaMP 2015 (RF/Microwave) Next Week!    ^ Top
IMAPS 2015 RaMP Workshop and Tabletop Exhibition is being held April 16, 2015, at the Weetwood Hall Conference Centre in the United Kingdom. The objective of the RF and Microwave Technical Conference is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging & related technologies.

RaMP 2015 Focus:
Following the sucess of RaMP in Edinburgh in 2012 and San Diego in 2014, IMAPS-UK in partnership with IMAPS-US & IMAPS-Europe is pleased to announce RaMP 2015, a one-day Conference on the topic of Packaging of RF and Microwave devices, hosted at the Weetwood Hall Conference Centre, Leeds, United Kingdom. In addition, there is an “RF Design & Test Workshop” hosted by the University of Leeds and sponsored by Keysight Technologies on the 15th April, which delegates of RaMP can also register to attend.

RF components and systems present significant and unique challenges. Careful considerations over substrate, materials and processes are required in order to meet cost, power, thermal, signal integrity, operation and performance specifications. The continual requirements to improve these parameters as well as the introduction of novel techniques and applications at ever expanding frequency ranges are putting increasing demands on design and packaging engineers.

This seminar will bring together engineering and scientific experts from the worlds of academia and industry to discuss the latest RF and microwave packaging technologies and applications as well as a platform to highlight current commercial issue and needs.

RaMP 2015 Features a Co-located event "RF Design & Test Workshop" on 15 April

Sessions/Exhibits and all RaMP Activities on 16 April

View the TECHNICAL PROGRAM

CICMT 2015 Germany (Ceramic Interconnect/Microsystems) In Two Weeks    ^ Top
IMAPS/ACerS 11th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2015) is being held April 20-23, 2015, at the Fraunhofer Institute Center in Dresden, Germany. Full conference details are online at www.cicmt.org.

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program.

The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, microreactor and sensing functions. Tape casting, thick-film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Schedule:

Monday, April 20, 2015
(afternoon)
Registration and welcome reception

Tuesday, April 21, 2015 Parallel sessions
IKTS laboratory tour
Poster session and finger food

Wednesday, April 22, 2015 Parallel sessions
Guided city tour
Congress dinner in Dresden's historic city

Thursday, April 23, 2015 Parallel sessions until noon
Lunch & wrap up

Full Program & Details Available

 

  Chapter Activities (events listed in chronological order)
 

NEXT WEDNESDAY: METRO Chapter Dinner Presentation on Technology Overview 3D Printers   ^ Top
Technology Overview 3D Printers:
From table top to direct metal printers with applications from design review, prototyping, rapid manufacturing fixtures, figures, injection mold tools, casting and customized mass production

by Drew DaHarb
Sales Engineer CadBlu

Abstract:
3D printing - once a term used for science fiction, star trek and other futuristic endeavors is now a house-hold term and proving to be a cost-effective main-stream manufacturing tool. The 3D printing markets and applications are rapidly expanding from traditional prototyping and product development into the manufacturing, tooling and hi-precision markets on one end as well as the low-end hobbyist market. This rapid growth can be attributed to the decrease in capital expense required to obtain a 3D printer and more importantly to the materials and output (print) quality available today.

With such a wide scope of applications, materials and 3D printers understanding and acquiring the best printer and material for a desired application can be overwhelming. CadBlu Manufacturing the Future with 3D Printing 2.0 presentation (including videos, parts from 3d printers and active discussion) will bring you up to date with the systems, materials and applications that best fit your needs now and into the future.

PowerPoint with videos on multiple 3D printing technologies, sample parts to view/discuss and opportunity to discuss specific applications.

Biography:
Drew DaHarb has over 12 years’ experience in the 3D printing market including sales/support (all technology platforms), rapid manufacturing (manufacturing using 3d printing), rapid prototyping, product development, channel (VAR) development and is very familiar not only with the 3D Systems printers but all of the major manufacturers of 3D printers. He has been directly involved with sales of 3D printers from table top to multi-system manufacturing centers and the development of systems, materials and specialty applications of 3D printing. Currently living in Colorado Drew supports CadBlu’s five office locations (CA-2, CO, NY, MN) and personnel for all industrial and manufacturing applications along with technical support for the dental, casting and jewelry markets.

Logistics and Registration:
Clarion (former Holiday Inn) Ronkonkoma

3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500

Registration/Networking 5:30-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM

Price: Members: $30.00 if Pre-Registered by April 9, 2015
$50.00 after April 9, 2015

Non-Members: $50.00 if Pre-Registered by April 9, 2015
$75.00 After April 9, 2015

Student Members: Free if Pre-Registered by April 9, 2015
$25.00 after April 9, 2015

If you wish to join membership information is available at www.imaps.org

Registration Email: andrew.sanchelli@freqelec.com

Phone: Scott Baldassarre 516-752-2367
There are a limited number of vendor tables available for this event.

NEXT THURSDAY: Join the IMAPS Arizona Chapter for the next Luncheon Featuring a Presentation from ASE   ^ Top
Thursday, April 16, 2015
Holiday Inn & Suites
1600 South Country Club Drive, Mesa, AZ 85210

Registration and exhibits will open at 11:30
Lunch and Presentation from noon to 1pm
Exhibits close at 1:30

Innovation in Fan Out Packaging for Mobile Applications
Presented by: John Hunt Director of Engineering, ASE

Mobile electronics has created the need for ever increasing density and performance in electronics packaging. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging. The packaging industry has responded with a plethora of packaging options, each tailored for a specific set of customer requirements.

We will review how the integration of a wide variety of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into packages for Mobile applications with higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fanout, Panel Level Fanout with embedded die, and Chip Last Fanout packaging combining low cost materials and process flows. Using these tools and processes, the resulting packaging combinations will only be limited by our imaginations, and our creativity in innovating them.

About Our Speaker:

John Hunt - Director of Engineering, ASE
John is Director of Engineering, Product Promotion, at ASE (US) Inc., and provides technical support for the Introduction, Engineering, Marketing, and Business Development activities for Advanced Wafer Level and Fanout Packaging Technologies at ASE.

John has more than 40 years of experience in various areas of manufacturing, assembly and testing of electronics components and systems, with emphasis on the development of new technologies and processes, with a B.S. from Rutgers and an M.S. from University of Central Florida.

Luncheon and presentations - $30.00 in advance / $35 at door.
Register On-line by April 15th

All IMAPS members who register by end of day April 14th will receive a $5 Starbucks gift card at the door!

Jody Mahaffey
President IMAPS AZ Chapter

Please remember: Our new location - Holiday Inn & Suites, SW corner of US 60 and Country Club Dr in Mesa.

4th Minapad conference , organized by IMAPS French Chapter, which will be held in Grenoble on April 21 to 23    ^ Top
Let me please draw your attention on 4th Minapad conference , organized by IMAPS French Chapter, which will be held in Grenoble on April 21 to 23. The technical program is quite rich with 3 keynotes from Georgia Tech, Amkor and Eolane, a panel session from our partner SEMI Europe dedicated to the “Prototyping and small series packaging for SME” and a Distinguished lecture (organized by IEEE CPMT France) on “Microsystems packaging: Past, Present and Future” by Rao Tummala, Georgia Tech USA.

Hope you or one of your colleagues can join us there!

Program & Registration Details:
By E-mail : imaps.france@imapsfrance.org
Online: www.france.imapseurope.org

New England Chapter 42nd Symposium & Expo - "Game of Drones" : Get Registered!    ^ Top
"Game of Drones"
The iMAPS New England 42nd Annual Symposium & Expo

The iMAPS New England Symposium & Expo is the leading regional professional forum for the exchange of information on microelectronics and packaging technologies.

Our Society encompasses all engineering disciplines including electronic and thermal design, materials, components, assembly, and testing in extreme environments and much, much more.

The 2015 Technical Chairs, Tom Green of TJ Green Associates and Dmitry Marchenko of Microsemi, have reached out to colleagues in industry and academia to create a Technical Program that will provide a platform for learning about the latest advances in microelectronics and packaging technologies, while also creating an opportunity for professional networking.

Thirty seven presenters set in eight sessions will cover a range of interesting, current topics in microelectronics, assembly and packaging. We extend a special thank you to the companies that continue to support iMAPs New England through their presentations, including Lockheed Martin, Vishay, Globalfoundries, Invensas, and many others.

Tuesday May 5, 2015
7:30 AM to 4:30 PM EDT

Holiday Inn Boxborough Woods
242 Adams Place, Boxborough, MA 01719

This year's session topics include:
• RF/Microwave Innovations Part I and II
• 2.5 / 3D Packaging Technologies
• Wire Bonding and Advanced Interconnection
• Printed Electronics
• MEMS

Our Symposium is made possible by the financial generosity of our Sponsors and Exhibitors - please be sure to visit them in our Exhibit Hall and support their efforts.

For a detailed summary of the Technical Program see our website www.imapsne.org

On May 5th, Registration starts at 7:30AM and the Symposium begins at 8:30AM sharp with the Exhibit Hall opening at 9AM. We look forward to seeing you on Tuesday, May 5th, 2015

Dr. John Blum, iMAPS New England Chapter President

39th International Microelectronics and Packaging IMAPS Poland Conference September 20-23, 2015, Gdańsk, Poland    ^ Top
It is a great pleasure to announce that the 39th International Microelectronics and Packaging IMAPS Poland Conference will be held in Gdańsk, September 20-23, 2015.

It is organized by Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics and Gdynia Maritime University, Faculty of Electrical Engineering with participation of Polish Society of Theoretical and Applied Electrical Engineering Department of Gdańsk, Committee on Electronics and Telecommunication of Polish Academy of Science and IMAPS Poland Chapter.

IMAPS Poland 2015 is a professional conference which takes modern electronic, ICT and photonic materials manufacturing and applications as its core. In recent years materials science is have been rapidly developing and its achievements are widely implemented in electronics, ICT and photonics. We intend to provide a forum for the discussion about the latest research in material science.

Important Dates:

April 2015 - Abstract submission
15 May 2015 - Abstract acceptance
15 June 2015 - Early bird rate fee
15 June 2015 - Full paper submission
1 September 2015 - Full paper acceptance
20-23 September 2015 - Conference

Conference language is English. Abstracts and full texts of papers should be prepared in English. Researchers and technologists are invited to submit abstract along with authors names, affiliation, paper title, work description and keywords. Authors should submit abstracts in .doc, .odt or .docx format with no more than 1 pages in A4 paper (Times New Roman, 12 pt.). It should clearly indicate the originality of the contribution and relevance of the work.

CONTACT:
Gdansk University of Technology
ul. Narutowicza 11/12
80-233 Gdańsk
ph. +48 58 347 1323
www.imaps2015.eti.pg.gda.pl

  Membership Corner
 

Journal of Microelectronics and Electronic Packaging 1st Quarter 2015 On-Line   ^ Top

Journal of Microelectronics
and Electronic Packaging

(ISSN # 1551-4897)

Volume 12, Number 1
First Quarter 2015



Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth
Joseph M. Juarez Jr., Michael Robinson, and Joel Heebink, Honeywell International Inc.
Polina Snugovsky, Eva Kosiba, Zohreh Bagheri, Subramaniam Suthakaran, Jeffrey Kennedy, and Marianne Romansky, Celestica Inc.

1

Development of a Stress Compensation Layer for 3-D Assembly of Thin Pixel Modules
G. Pares, S. Tomé, and L. Vignoud, Université Grenoble Alpes and CEA Léti - MINATEC
T. McMullen, R. Bates, and C. Buttar, University of Glasgow

29

Radio Frequency Microelectromechanical System-Platform Based on Silicon-Ceramic Composite Substrates
M. Fischer, S. Gropp, J. Nowak, R. Sommer, M. Hoffmann, and J. Müller, Ilmenau University of Technology, Institute for Micro- and Nanotechnologies
B. Capraro, Fraunhofer Institute for Ceramic Technologies and Systems

37

Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled Environment
Anh Nguyen, Kevin Fealey, and Peter Reilly, State University of New York Polytechnic Institute
Gyanaranjan Pattanaik, Alison Gracias, Fred Wafula, Michael Flynn, and Jack Enloe, Atotech USA, Inc.

43

A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices
Lilla Safford Smith, Gordon D. Hoople, and Jim C. Cheng, Department of Mechanical Engineering, University of California
Albert P. Pisano, Jacobs School of Engineering, University of California

49

Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process
Chao Zeng, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu, and Rong An, Harbin Institute of Technology

55

Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology
Rene Schramm, Thomas Reitberger, and Joerg Franke, Friedrich-Alexander University Erlangen-Nürnberg

61

Advancing Microelectronics March/April Magazine (3D including 3DIC, 3D Packaging (PoP)) On-Line now    ^ Top

Advancing Microelectronics

March/April 2015:
Volume 42, No. 2
3D including 3DIC, 3D Packaging (PoP)

The Advancing Microelectronics Vol 42, No 2 (March/April 2015) issue featured four technical articles on: Cost Comparison of Temporary Bond and Debond Methods for Thin Wafer Handling; Pathfinding and Design Optimization of 2.5D/3D Devices in the Context of Multiple PCBs; Underfill Design Using FEM for FCBGA, FC-CSP, and Moving Towards 2.5/3D; and Progress in Fabrication and Test of Glass Interposer Substrates.

download magazine PDF (7.5mb)

 

 

 

 

XYZTEC

Oneida Research Services

2015 Events:

RaMP 2015 (RF & Microwave - UK )
April 16, 2015

CICMT 2015 (Ceramics - Germany)
April 20-23, 2015

New England 42nd Symposium
May 5, 2015

SoCal 2015 (Adv. Packaging)
May 12, 2015

Automotive Microelectronics
June 3-4, 2015

Packaging for Wearable Electronics
June 15-16, 2015

HiTEN 2015 (High Temp. Electronics)
July 6-8, 2015

Emerging Interconnects
August 4-5, 2015

Thermal Management
September 22-24, 2015

Advances in Semicon. Packaging
September 24, 2015

IMAPS 2015 (Orlando)
October 26-29, 2015

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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