|:: Corporate Member News ::
forget HiTEC 2006 – there is still time to reserve a tabletop
booth at this semi-annual event in spectacular Santa Fe, NM (full
2006 is coming in June to Washington, DC. (full
Cookson Electronics’ ALPHA® Vaculoy® SACX™ Has
Rapidly Grown to 46% of the
Company’s Lead-Free Wave Solder
Alloy Sales in Europe (full
Corporation’s NF260 Wins Third Prestigious Award (full
MicroTec Supplies 8" Wafer Bonding Equipment to MiPlaza (full story)
Moves to New Facility (full story)
Announces Strategic Appointments for Asia-Pacific Operations (full story)
More Information ::
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Corporate Fast Links ::
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Corporate Members will have the opportunity to place their logo/link
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You should also identify which URL to link your logo to. If you
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no charge for this service, it is offered as part of the corporate
forget HiTEC 2006 – there is still time to reserve
a tabletop booth at this semi-annual event in spectacular
Santa Fe, NM
being held May 15 - 18, 2006, at the Hilton of Santa Fe in
Santa Fe, New Mexico. Visit http://www.imaps.org/hitec to
learn more about the program and to register today. For
information on exhibiting, please contact Ann Bell, firstname.lastname@example.org or
the premier event addressing the needs of the high temperature
electronics community. Applications for high temperature
electronics include underhood automotive, oil well logging,
geothermal, more electric aircraft, space, industrial sensors,
2006 provides a comprehensive technical program addressing
the applications, and the latest development in devices,
circuits, MEMS, sensors, packaging, power sources, and materials
to address the challenges of these applications. Tabletop
exhibits will complement the technical program by providing
you an opportunity to view the latest products for high temperature
a truly unique opportunity for suppliers, fabricators, and
users to meet and talk about the needs, issues and opportunities
in this exciting and important area. Please
join us in wonderful Santa Fe, New Mexico for HiTEC 2006.
|MASH 2006 is coming in June to Washington, DC.
event not only has tabletop exhibit space available, but
is featuring a stellar
line-up of Keynoters. Just visit www.imaps.org/mash to
view the highlights of this program and reserve your exhibit
information on exhibiting, please contact Ann Bell, email@example.com or
in Military, Aerospace, Spaceborne and Homeland Security
Electronics continue to advance the state-of-the-art
in high reliability electronics packaging. This year’s
technical program consists of a special “Keynote Needs” session
where David Berteau, former Principal Deputy Assistant Secretary
of Defense for Production and Logistics, will address manufacturing
Trends in Electronics Interconnect Technology; Michael Sampson
will discuss NASA’s vision for future packaging requirements;
David Robinson will address methods for device emulation from
the Defense Logistics Agency perspective; and a prognostic
and diagnostic health monitoring methodology presented by Kwok
Tom of the US Army Research Laboratory will initiate the workshop.
This session will be followed by 28 presentations on the latest
military, aerospace, space and homeland security electronic
devices, systems, and applications, with particular emphasis
on materials selection, thermal management, packaging, reliability
and emerging technologies. In addition to this powerful program
we are delighted to have a very special keynote dinner speaker,
Colonel Danny McKnight. Danny was ground forces commander
during the battle in Mogadishu depicted in the movie Black
Hawk Down who mesmerized us in Baltimore two years ago.
Come join us and participate in this exciting event.
|Cookson Electronics’ ALPHA® Vaculoy® SACX™ Has
Rapidly Grown to 46% of the Company’s Lead-Free Wave
Solder Alloy Sales in Europe
Electronics Assembly Materials is pleased to announce that
the sales of its high
reliability ALPHA® Vaculoy® SACX™ now account
for 46% of its Lead-Free bar sales in Europe.
its introduction in early 2004, sales of SACX™ have
grown steadily, and over the last 6 months we have experienced
spectacular growth as our customers are looking for the high
performance, reliability and value they find only in SACX™," said
Gerry Campbell, Cookson Electronics’ Global Product Manager. "The
recent increases in the prices of tin and silver have forced
our customers to look at lower cost alternatives to reduce
the cost burden of moving to Lead-Free processes. SACX™ costs
30% less per kg and represents significant bottom line savings
and an increase in competitive advantage. The strength of this
product is that these cost savings can be realized without
compromising process yield or reliability."
ALPHA® Vaculoy® SACX™ delivers
wave soldering process value by providing SAC305 performance
at 30% lower cost. Its fast wetting speed offers improved
solderability that outperforms all Sn/Cu based alloys. It
provides excellent drainage and minimizes bridging defects.
ALPHA® Vaculoy® SACX™ creates strong, mechanically
sound joints with excellent long-term reliability. It also
minimizes dross generation, resulting in low process maintenance
and reduced product waste. Its process window supports the
use of a wide range of flux technologies.
go to www.cooksonelectronics.com,
for additional information.
|Indium Corporation’s NF260 Wins Third Prestigious Award
Indium Corporation’s NF260 No-Flow Underfill was awarded
the 2006 EM Asia Innovation Award at Nepcon Shanghai, China.
Sponsored by EM Asia Magazine, the Innovation Award recognizes,
rewards, and celebrates excellence in the Asian electronics
industry. Indium’s NF260 No-Flow Underfill has also earned
the Global Technology Award at Productronica in November 2005
and the Vision Award at APEX in February 2006.
NF260 is the world’s
first Reworkable, Air Reflowable, Pb-Free No-Flow Underfill.
This remarkable product delivers
increased reliability one order of magnitude over the leading
competitor and two orders of magnitude over not using an underfill.
CSP reliability is enhanced by addressing joint cracking due
to brittle Pb-Free alloys, and reduced joint size due to miniaturization.
It also provides cost savings and improved performance.
Designed for Pb-Free assembly, NF260 is fully compatible with
the SMT process and offers a wide process window to accommodate
solder reflow and underfill curing. The underfill curing is
completed in one reflow pass and no post-cure is required.
saves money by utilizing existing automated equipment and
by enabling processing in typical Pb-Free reflow profiles.
It promotes excellent wetting, low-voiding, and durability
in thermal cycling. It also provides the necessary strength
to withstand the most rigorous drop tests, including surpassing
endurance expectations, with no failures after more than
450 drop tests. Under similar conditions, unfilled soldered
connections typically fail after fewer than 10 drops.
also available for SnPb applications.
information, please visit www.indium.com.
|SUSS MicroTec Supplies 8" Wafer Bonding Equipment to MiPlaza
MicroTec has announced that Microsystems Plaza (MiPlaza),
a MEMS and Nanotechnology research and development facility
and service provider at the HighTech Campus in Eindhoven,
Netherlands has selected SUSS MicroTec wafer bonding
equipment for the manufacture of Microsystems (MEMS) and
biomedical devices. The two systems, consisting of a BA8
bond aligner and a SB8e wafer bonder, will support the aligned
8" wafer bond processes at the facility. MiPlaza chose
SUSS bonders over alternative systems due to its unsurpassed
precision bond alignment, and high bonding uniformity for
BCB applications with a layer thickness of 1 micron. The
system showed excellent bond force control and temperature
homogeneity, which is often critical to achieving high bond
yields especially on 8" wafers.
market requires flexibility, accuracy and reliability in process
equipment that enables the fabrication of a wide variety of
devices," comments Michael Griesinger, account manager
for MiPlaza at SUSS MicroTec. "Highly accurate aligned
substrate bonding especially plays a significant role throughout
the whole MEMS manufacturing process. We are honoured that
MiPlaza selected SUSS to realize these new and innovative components."
Substrate bonding represents the final step in the manufacturing
process sequence in which multiple wafers or substrates are
attached together using a number of physical and chemical effects.
The SB8e is a semi-automatic, computer-controlled, stand-alone
wafer bonder that can be used to design and fabricate novel
microstructures with a level of process control previously
not available. Representing the latest generation of SUSS substrate
bonders, the system features rigid vacuum-pressure chambers,
upper and lower independent heaters, and wafer stack loading
The bonder can be equipped with tooling and alignment fixtures
that support all known bonding processes. A wide array of semiconductor
materials with wafer and substrate diameters ranging up to
200mm can be accommodated as well.
For more information, please visit www.suss.com.
|Finetech Moves to New Facility
Finetech has announced that
it has relocated to a larger facility.
has moved from Phoenix to a new facility located at 8380
S. Kyrene, Ste. 110, Tempe, AZ 85284. Telephone and
fax numbers will remain the same - 480-893-1630; Fax: 480-893-1632
- as will e-mail and Web site addresses.
The Tempe facility doubles the previous square footage and
includes a dedicated demo room with hands-on training and interactive
demonstrations for customers. The expansion will allow Finetech
to accommodate growing demands for its precise bonding and
|Henkel Announces Strategic Appointments for Asia-Pacific Operations
further accelerate its phenomenal growth in the Asia-Pacific
region, the electronics group of Henkel today announced several
strategic organizational changes designed to position the company
as the region’s top materials supplier and deliver advanced
technology solutions to customers in what has become the geographic
center of choice for high-volume production applications.
among the tactical personnel changes is the appointment of
Dr. Tilo Weiss to the position of Regional
A seasoned electronics industry expert, Dr. Weiss was formerly
President of SusTech, a Henkel joint venture and, since joining
the Henkel business development team 6 years ago, has played
a key role in the advancement of Henkel’s position within
the region. In his new role, Dr. Weiss will be based in Henkel’s
Shanghai, China facility and will have management responsibility
for sales, marketing and technical service.
Heading up the sales efforts throughout Asia will be Roger
Dieu, who was recently named Director, Global Account Business
Development for the electronics group of Henkel. Prior to assuming
his current role, Mr. Dieu was responsible for the direction
of the Greater China business and management of the region.
He has been in China since 1997 and, with his new position,
will relocate to Singapore.
Of course, sales and business development must
be underpinned by superior technical products and unmatched
To support these objectives, Dr. Gary Shi, former Technical
Manager for Henkel’s semiconductor packaging and assembly
liquid products, will relocate to Henkel’s Yantai, China
facility and assume the role of Technical Director. In his
new position, Dr. Shi will be responsible for the expansion
of Henkel’s research, development and engineering functions
to further support the Asia-Pacific customer base, development
of new materials for emerging technical requirements, and facilitation
of seamless technology transfer between Henkel’s Yantai,
China manufacturing operations and other Henkel global facilities.
“The Asia-Pacific region continues to be a very high
growth area for Henkel,” comments Patrick Trippel, President
of the electronics group of Henkel. “These strategic
appointments will only serve to further support our already
strong presence and rapid expansion in the region and deliver
customers with the local support and global resources they
addition to several locations in North America and Europe,
the electronics group of Henkel operates
and applications facilities in Yantai, Yiangsu, and Linyuangong,
China as well as in Isogo, Japan, Seoul, Korea and Singapore.
For more information on Henkel’s global infrastructure
and its complete line of advanced semiconductor and assembly
materials, log onto www.henkelelectronics.com.
Issue 6 ::
April 17, 2006