|:: Corporate Member News ::
Memoriam - Longtime Corporate Member, Ed
Gildein, CEO of Hybrid-Tek (full
Corporation’s Die Bonding and Dispense Assembly Equipment
Now Available with Tri-color Lighting - Red, Green, and Blue (full
in Shenzhen, China Receives Three Business Management Certificates
from BSI (full story)
Expands Presence in Europe (full story)
Thick Film Division Announces Successful Lead Free Gold Thick Film
Product Launch (full story)
Appoints Wilson Industries as Sales Representative (full
Corporation Produces Wave Solder Fluxes In Europe (full story)
Plasma Systems Opens Advanced Plasma Applications and Demonstration
Laboratory in Shanghai, China (full story)
and IMEC to Work Closely on Developing Measurement Tools for the
Latest Technologies (full story)
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Memoriam - Longtime Corporate Member, Ed Gildein, CEO of
long-time friend, associate and active member, Ed Gildein,
passed away on Wednesday, March 29 2006. Ed was a charter
member of IMAPS having joined in 1967. He was CEO of Hybrid-Tek,
Inc. in Clarksburg, NJ, that he co-owned and founded.
contributions to IMAPS were many. He served as the Keystone
Chapter’s President, Vice President, Treasurer, and
Program Chair. He was the General Chair of ISHM, 1983, and
for IMAPS 1997 and Arrangements Chair for IMAPS 2005, all
of which were held in Philadelphia.
the national level, Ed was Mid-Atlantic Regional Director
for four years and on the IMAPS Executive Council as Treasurer.
Ed Gildein, Hybrid-Tek
was honored as an IMAPS Fellow of the Society in 1983 and
in 1990 the Keystone Chapter made him the second recipient
of the Ira Custman Service Award for dedication and service “over
and above” to the Chapter.
who knew Ed loved and admired him. He always was a willing
and congenial partner and contributor to whatever project
was underway. Ed always had a kind word for everyone and
he will be sorely missed by all of us at IMAPS. Ed was a “gentleman” in
every sense of the word.
deepest heartfelt sympathies go out to Ed’s beloved
wife, Dorothy, and his children, grandchildren and his long-time
Gildein was one of the best of us.
Die Bonding and Dispense Assembly Equipment Now Available
with Tri-color Lighting - Red, Green, and Blue
Corporation has announced that its die bonding and dispense
assembly equipment is now available with tri-color, red,
green, and blue lighting. This latest feature has been combined
with programmable lighting intensity and collimated lighting
to enable robust processing of an incredibly wide range of
substrates and packages. Each color’s intensity is
set independently to maximize the contrast in the image.
The new lighting is
available on all new die bonders and epoxy dispensers offered
by Newport. It is also available as an upgrade for most systems
operating in the field.
the illumination wavelength has always been the ultimate
desire for vision processing challenging packages such
as RF headers. Now the user can optimize the mix of colors
for the package or substrate and choose a different combination
for the die. We have found that this dramatically increases
the capability of the vision recognition,” said Dan
Crowley, Director of Sales for Newport Corporation. “The
tri-color programmable intensity lighting solution provides
robust image lighting for even difficult materials such
as thin gold traces on white ceramic substrates.”
Newport systems operate on Windows XP® software, which
provides extensive functionality and flexibility. Newport
die bonders include the MRSI-605 AP, the industry standard
for automatic eutectic and epoxy die bonding and the new
ultra-precision MRSI-M5™ for 5 micron accuracy placement.
The MRSI-175Ag automatic epoxy dispenser features extremely
accurate epoxy control for microwave and microelectronics
|Cookson Electronics’ Site in Shenzhen, China Receives Three Business
Management Certificates from BSI
March 7th, 2006, BSI officially presented three Business
to Cookson Electronics’ executives at their site in Shenzhen,
China. These certificates recognize exceptional performance
in meeting stringent standards for the company’s Quality
Management System (QMS) ISO 9001:2000; Environmental Management
System (EMS) ISO 14001:2004; and, Occupational Health & Safety
Assessment Series OHSAS;18001. Presentations were made by John
Broome, Vice President of Operations and Compliance, Asia-Pacific
for BSI Management Systems.
Cookson Electronics Shenzhen facility is the second of our
Asia-Pacific sites to achieve registration to all three business
management standards. The other site is Cookson Taiwan,” said
Dr. Nicholas Banis, Cookson Electronics’ Director of Global
Quality Assurance. “Richard Sin, our General Manager in
Shenzhen and Eric Kwok, our Asia-Pacific Quality Assurance Director,
were recipients for the Shenzhen presentation. Eric has been
most instrumental in coordinating all of our site certifications
in the Asia-Pacific Region.”
all Cookson Electronics Asia-Pacific sites have achieved
QMS certifications through
BSI (either ISO 9001:2000 and/or
ISO/TS 16949). Sites that have achieved EMS ISO 14001:2004
to date include
Korea, Singapore, Taiwan, and Shenzhen. The sites in India
and Japan are pending EMS certification. All three regions
Europe, and Asia-Pacific) have achieved QMS ISO 9001:2000
regional certification schemes through BSI, attesting to
|CoorsTek Expands Presence in Europe
purchases large Scotland facility to better
serve its European customer base.
Inc., has formally announced the expansion of its European
presence through the acquisition of VZS/Seagoe Advanced Ceramics
of Fife, Glenrothes.
CoorsTek has been manufacturing in the region for over three
decades and serves customers globally from 16 facilities
worldwide, this acquisition enables a significant expansion
of localized manufacturing capabilities and processing
services. Specifically, this facility adds roughly 4000 square
the company’s already substantial 200,000 square meters
of worldwide manufacturing capacity.
increased demand for high-performance ceramic components
in many markets comprising the European Union drove our decision
to expand here,” stated Mark Petty, Executive Vice
President of CoorsTek. “Our mix of technical expertise,
advanced quality systems, and world-class manufacturing
is allowing us
to grow our business worldwide,” continued Petty.
purchase of the plant took place in March, 2005. CoorsTek
has since dedicated teams to upgrade operations
the plant to match the company’s global standards
including the implementation of their OpX™ manufacturing
excellence program, high-purity material integration,
and other operational
|Heraeus Thick Film Division Announces Successful Lead Free Gold Thick
Film Product Launch
Heraeus Inc. Thick Film Division, a subsidiary of the globally
active precious metals and technology
group Heraeus Holding GmbH, announces that its lead free gold
thick film product C5729, experienced the most successful product
launch in the history of the company’s division producing
thick film for the global microcircuit marketplace.
a component of the glass in electronic ceramics may well
be exempted in the current RoHS directive, but Heraeus
believes that where possible lead should be eliminated. C5729
lead free gold thick film was developed under this initiative,
and has swiftly gained credibility by hybrid substrate and
sensor producers in all three major global regions as a superior
wire bondable gold product.
has rapidly surpassed our expectations with respect to shipments
versus other well established gold thick film products,” commented
David Malanga, Global Technical Service Manager. “We
now supply more C5729 than any other single gold thick film
product that we produce at this division. That is a significant
statement given the success of our RoHS-compliant C5756 product
in the automotive industry.”
is both gold and aluminium wire bondable. It can be bonded
light and heavy gage wires of both metallurgies. C5729
far surpasses the Mil STD-883E requirements for 1.0 and 1.25
mil gold wire and 1.25, 8.0, and 10.0 mil aluminium wire.
It performs well on both alumina and the lead-free multilayer
dielectric, IP9217. C5729 is compatible with many Heraeus
lead-free products to create a fully lead-free hybrid circuit.
Appoints Wilson Industries as Sales Representative
Inc. announces that it recently has appointed Wilson Industries
as its Sales Representative
for the areas of Eastern Pennsylvania, Downstate New York,
Long Island, and Delaware.
Wilson Industries celebrates
37 years in providing quality representation in the automated
solutions business. Their core competency
focuses on supporting wire-processing equipment, BGA and SMT
circuit board rework and repair equipment, identification solutions,
component taping systems, component lead forming equipment,
electronic dry cabinets, high quality inspection systems,
and surface mount
Industries is very well established and respected.” said
Rick Howe, Director of Sales, Americas Region for Hover-Davis
Inc.. "Their experience and their product line card
is very complementary to ours, we look forward to working
achieve success in their territory." Roger McAteer,
President of Wilson Industries, states, "Hover-Davis
is a welcome addition to our line card. We have already identified
their technology in our territory."
|Indium Corporation Produces Wave Solder Fluxes In Europe
Indium Corporation has begun manufacturing wave solder fluxes
in its European facility, located in Milton Keynes, England.
This added capability augments the company’s existing
production facility in North America and will improve customer
service to the European consumer.
produces a full line of wave solder fluxes, including leading-edge
formulations designed for Pb-Free applications.
The company features no-clean, residue-free fluxes that accommodate
both Pb-Free and Sn/Pb processes, offering unique advantages
during the industry’s Pb-Free transition.
According to Brian Craig, Indium Corporation’s European
Operations Managing Director, “Adding wave soldering
flux manufacturing to our European operations strengthens
our customer service and support throughout the region. It
also complements the process-related materials we currently
offer, including solder pastes, cored wire, and rework materials.”
|March Plasma Systems Opens Advanced Plasma Applications and Demonstration
Laboratory in Shanghai, China
new laboratory is located within the existing March-China
offices located at 828 Xin
Jin Qiao Road, Pudong, Shanghai 201206, China. The direct telephone
number is: +86 21 5854 2345, and the direct facsimile number
is: +86 21 5854 9150.
manage the new laboratory, March has appointed Mr. Michael
Zhang as Applications Field Service
Engineer. Mr. Zhang will
oversee all aspects of laboratory operations, including product
training, customer demonstrations, applications development
and other laboratory-related activities.
is establishing a strong local presence in China in order
to improve our
ability to serve the Chinese semiconductor,
microelectronics and PCB manufacturing markets,” said
James Getty, Director of Applications at March Plasma Systems. “Establishing
an advanced applications and demonstration laboratory in China
is a key aspect of that initiative. Now, customers in China
have the ability to run samples and do applications development
in real-time, with locally trained engineers and scientists.“
laboratory is equipped with a variety of March plasma processing
systems for processing a wide range of advanced
and microelectronic devices. The use of plasma is an efficient,
cost-effective and environmentally-friendly method of surface
activation and cleaning during the microelectronics manufacturing
process, improving reliability and increasing yield in
both semiconductor and PCB assembly.
|SUSS and IMEC to Work Closely on Developing Measurement Tools for
the Latest Technologies
MicroTec AG has installed the latest 300 mm technology in
wafer probe systems at the
nanoelectronics research center IMEC in Leuven, Belgium. Both
PA300PS ProbeShield® semiautomatic probe systems with ReAlign™ and
ContactView™ technology and PA300 probe systems for RF-noise
and S-parameter measurements have been installed. An agreement
has been made for further collaboration on enhancing 300 mm
probe systems in the following years.
are very pleased to sign this agreement with IMEC, Europe’s
leading independent nanoelectronics research center,” said
Dr. Claus Dietrich, Managing Director of the Test Systems division
at SUSS MicroTec. “This collaboration proves SUSS MicroTec
is offering the latest technology for advanced wafer probing,
like the unique ReAlign and ContactView solutions. Furthermore,
it shows that we continue to set standards in excellent electrical
performance, such as noise and leakage levels, with our cutting-edge
hardware and software solutions.”
another development, SUSS MicroTec will deliver a second
vacuum probe system to
IMEC. The manual system will complement
semiautomatic vacuum system, which is currently being used
to test the reliability of MEMS devices at wafer level. These
systems allow the user to place the device under test in
ultra-high vacuum environments that simulate actual operating
Therefore the device can be tested before the packaging process,
which decreases feedback time for R&D and saves costs.
technologies and devices are on the front line of technology
development, and therefore new measurement challenges
arise continuously. Close collaboration with SUSS MicroTec
will ensure early feedback on possible future needs for wafer-level
testing, and IMEC will explore solutions and future enhancements
together with SUSS.
Issue 5 ::
April 3, 2006