:: Corporate Member News ::

:: New Market Entry - Centerline Launched by Long-Time IMAPS Member (full story)

:: G. BOPP & Co AG, SWITZERLAND Acquires UTILDI AB of SWEDEN (full story)

:: Editors’ Choice Best Product Award Presented to Asymtek For Semiconductor Manufacturing Excellence (full story)

:: Riv, Inc. Turns 20 (full story)

:: SSEC Announces New Director of Process Engineering (full story)

:: NuSil Technology Introduces Low Outgassing, Thermal Interface Material (full story)

:: StratEdge Introduces Low Cost Hermetic Semiconductor Packages for Switch Applications (full story)

:: Gel-Pak Launches New Interactive Website! (full story)

:: Palomar Technologies Wins Editors’ Choice Award for Model 3500-II Automatic Component Placement Cell (full story)
:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.
:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

RIV, Inc.
Deweyl Tools
NuSil Silicone Technology

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

New Market Entry - Centerline Launched by Long-Time IMAPS Member

Founded in October 2005 - Centerline Technologies has been established by Hugh Muffoletto, to meet the changing needs of the advanced materials processing community. Our goal is to provide a world class resource, to develop sophisticated manufacturing processes, to produce materials with exceptional quality, delivery, and value.  Centerline Technologies capabilities include lapping, polishing, laser machining, diamond sawing, edge/diamond machining, tumbling and a filled via planarity process.

For more information, please visit  www.centerlinetech-usa.com.
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G. BOPP & Co AG, SWITZERLAND Acquires UTILDI AB of SWEDEN

G. Bopp USA, corporate office and warehouse for G. Bopp & Co. AG is pleased to announce the acquisition of Utildi AB of Sweden by G. Bopp & Co., AG, Zurich.  This acquisition solidifies a longstanding business relationship between Bopp and Utildi.

G. Bopp + Co. AG, one of the world’s leading producers of precision woven metal meshes for the most diverse industrial applications, continues an expansion curve in Europe and worldwide with the acquisition of Utildi AB, one of the Bopp’s strongest European representatives.   

Utildi AB, specializing in stainless steel mesh and fabrications, also operates a stretching service for the local market. Bopp’s newly formed daughter company, Bopp Utildi AB, will open up the entire Scandinavian market for Bopp precision products.

For more information, please visit www.bopp.com.
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Editors’ Choice Best Product Award Presented to Asymtek For Semiconductor Manufacturing Excellence

Asymtek received the prestigious Editors’ Choice Best Product Award, presented annually by Semiconductor International magazine, for developing a product that is truly making a difference in semiconductor manufacturing, Asymtek’s Axiomä dispensing system. Asymtek received the award at a ceremony held July 12, 2006 in San Francisco, California. 

The Axiom series offers precise, automated dispensing control for in-line semiconductor package and printed circuit board assembly. While highly configurable to meet specific customer requirements, two standard configurations are available for SMT applications and advanced electronics packaging and semiconductor assembly. The Axiom system builds upon Asymtek’s 20-plus years of experience and intellectual property. “We are proud to receive this distinguished award,” stated Bob Ciardella, Asymtek president. “Axiom customers were interviewed regarding its importance to their manufacturing processes. Winning the award acknowledges our commitment to customer satisfaction, quality, and continuous improvement.”

 

 Asymtek Receives Editors' Choice Award
"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, editor-in-chief of Semiconductor International. "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market.
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Riv, Inc. Turns 20

Riv Inc. - Thick Film Screens - Is Proud to announce our 20th Anniversary! Since 1986, Riv has supplied you, the Microelectronics Industry, with outstanding quality and service.  Riv’s  long list of dedicated customers has made this milestone possible. The Company looks forward to sharing the next 20 in the Microelectronics Industry.

For more information, please visit www.rivinc.com.
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SSEC Announces New Director of Process Engineering

In its continuing commitment to helping customers meet their processing goals, Solid State Equipment Corporation has appointed Vinh Thanh Nguyen Director of Process Engineering.  Nguyen will be responsible for providing expertise and support to customers utilizing SSEC application technologies.  This level of support is expected to improve and optimize customers’ processes for the best results and highest yields, all at lowest cost of system ownership.

Mr. Nguyen brings to the position an impressive background in semiconductor equipment and wafer processing, in manufacturing, engineering, and customer relationships.
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NuSil Technology Introduces Low Outgassing, Thermal Interface Material

NuSil Technology - a cutting-edge manufacturer of silicone-based materials for healthcare, aerospace, electronics and photonics - has introduced EPM-2493 to its line of electronic packaging materials (EPMs).

This low-viscosity, thermal interface material was designed to meet the challenges of the high-temperature and high-stress operating conditions in electronic packaging. The material's low outgassing property is ideal for situations, such as electro-optic systems, in which contamination is a concern. EPM-2493's low viscosity provides users an easy-to-dispense material that flows easily through today's dimensionally intricate electronic configurations.

"We launched NuSil's line of electronic packaging materials earlier this year, with a focus on low outgassing materials," said Brian Nash, vice president of Marketing and Sales. "EPM-2493 presents a low-viscosity alternative within our thermal interface material product line."

NuSil's line of EPMs was developed to address contamination issues in today's dense electronic systems. Both manufacturing and operating environments can cause drastic temperature cycling, resulting in encapsulant embrittling or outgassing. NuSil's EPMs are designed to perform exceptionally in these situations.
                                     
More information is available at www.nusil.com.

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StratEdge Introduces Low Cost Hermetic Semiconductor Packages for
Switch Applications

StratEdge introduces the G2420M-1 discrete semiconductor hermetic package for broadband applications.  The package has seven leads (four on one side, one each on three sides) perfect for single pole, double throw switch applications.  They can be mounted on the board in drop-in or surface mount configurations.

StratEdge’s G2420M-1 is a glass/ceramic walled package with a 0.205 x 0.245 inch (5.21mm x 6.22mm) body and a cavity of 0.105 x 0.145 inch (2.67 x 3.68mm).  It comes with an ASTM F-15 alloy base for up to 0.5 Watt devices and it can be supplied with a copper composite insert or base for higher power devices.  The package is constructed using a glass-to-metal seal process, resulting in a rugged and reliable package.  The MIL-STD-883 hermetic seal provides enhanced reliability for the semiconductor device and offers protection from the environment.

 StratEdge Introduces Low Cost Hermetic Semiconductor Packages...
 

StratEdge provides assembly services to package semiconductor devices.  The assembly process includes eutectic or epoxy die attach and passive component attach with automatic wire bonding.  Further assembly services include lidding, lead trimming, labeling, and bulk packaging.  An HP 8510C network analyzer is available for small signal electrical testing.

The packages are lead-free and meet Requirement on Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) compliance. Typical pricing is $5.24 for quantities of 10,000.  ASTM F-15 alloy lids with AuSn preforms can also be provided.  Lead time is stock to eight weeks. 

For more information contact e-mail C.Krawiec@StratEdge.com.
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Gel-Pak Launches New Interactive Website!
Gel-Pak, the leading manufacturer of device shipping and handling carriers has launched a new and improved website (www.gel-pak.com).  The new website is extremely easy to navigate and contains a significant amount of new product information combined with several new interactive tools and features as described below.
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Palomar Technologies Wins Editors’ Choice Award for Model 3500-II Automatic Component Placement Cell

Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell.  Presented annually by Semiconductor International magazine, the award honors products that are making a difference in semiconductor manufacturing.  Palomar Technologies received the award in a ceremony held July 12, 2006 during the SEMICON West trade show in San Francisco, California.  This is the second consecutive year, and the third time, that Palomar has won this award.

Palomar Technologies Wins Editors' Choice Award...
 

The Model 3500-II is designed for fully automatic, high accuracy, precision microelectronics assembly. The flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area.  Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-II sub-micron axis resolution yields typical placement accuracies of better than ±12 micron (0.5 mil), 3 sigma.  Applications include flip chip, stacked die, chip-on-board, fine pitch surface mount, multi-chip modules, microwave modules, and hybrid microcircuits.

Palomar's team, including some of its most experienced engineers, consistently improves this multi-functional, multi-dimensional, flexible tool to push the limits on speed and accuracy.  The Model 3500-II represents the latest development in Palomar’s long history of manufacturing automatic placement systems.  Beginning with the Model 2500, the technology has grown and evolved into what is now the dynamic and highly customizable Model 3500‑II that Palomar continues to improve.  A new generation system, the Model 3500-III is ready for introduction.

"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, Editor-in-Chief of Semiconductor International.  "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive, and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market."
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:: Issue 13 ::
August 1 , 2006