:: Corporate Member News ::

:: GBC Announces 2006 Marketing Forum Speakers (full story)

:: Sefar Opens New Screen-Making Facility in MN (full story)

:: Asymtek Announces Change To Its Executive Management Team (full story)

:: Kester and Vitronics Soltec Complete Successful Lead-Free Seminars (full story)

:: Centerline’s Web Site Offers Charts for Engineers (full story)

:: JPSA Introduces ‘Swiss Army Knife’ of Excimer Laser Workstations, IX-250 (full story)

:: Palomar Technologies’ Latest Automatic Die Bonder Offers Increased Precision and Accuracy (full story)

:: AI Offers Flexible Circuit Material for High Frequency Applications and Beyond (full story)

:: nScrypt Dispensing Equipment with Smart Pump™ Technology Provides Solutions for Tough PCB Applications (full story)

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

DS&A Thermal
Sefar USA
G. BOPP & Co. AG

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.


GBC Announces 2006 Marketing Forum Speakers

The Global Business Council has announced that it has lined up two prominent speakers for the 2006 Marketing Forum that will be held on Wednesday, October 11, 2006, at the San Diego Convention Center from 5:45 PM – 7:15 PM. The Forum, entitled “Industry Insights on Market  Dynamics & Challenges for the Supply Chain” will feature presentations on:

BioMedical -  David Cassack, MedTech;
RF/Wireless – Earl Lum, EJL Wireless Research; and
Microelectronics in Military and Aerospace - TBD.

The Forum will be followed by a Networking Reception.

The GBC Marketing Forum began at IMAPS 2000 in Boston and has proved, annually, to be one of the best attended sessions at the Symposium.  Last year in Philadelphia, it was “standing room only”. For more on the GBC Marketing Forum at IMAPS 2006, visit http://www.imaps.org/imaps2006/gbc.htm.

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Sefar Opens New Screen-Making Facility in MN

Sefar Printing Solutions, a world leader in both mesh weaving and fabricated screens for precision screen printing applications, is pleased to announce the opening of their new facility in Arden Hills, MN. This new 24,000 square foot screen-making facility will also serve as home to Sefar's Technical and Marketing Center.

Sefar, established in 1830, provides their customer base with the combined industry experience and technical expertise of the former MEC, HST, Rigsby and Seri-Max screen-making enterprises, offering service from five screen fabrication locations in the US, 13 world-wide.  

For more information, go to: www.sefar-screens.com.


Sefar
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Asymtek Announces Change To Its Executive Management Team

Asymtek, a Nordson company has announced a series of executive management changes that maintain continuity in the organization’s leadership needed for long-term success for the precision dispensing company. The organizational changes include:

Robert L. Ciardella is transitioning from his presidential duties at Asymtek and will act as an advisor to the company. Under his leadership, Asymtek has become a leading supplier of precision automated dispensing equipment for the semiconductor, medical, automotive and electronic packaging industries since he co-founded the company in 1983.

John Byers has been promoted to president of Asymtek, succeeding Ciardella. He will report to Andy Dunn, vice president of Nordson Corporation’s Advanced Technology business segment. Byers joined Nordson in 1994 as engineering manager for the Electronics Systems business and was subsequently promoted to lead that business. Byers has also managed Asymtek’s worldwide technical support organization and served as business unit manager of its Conformal Coating Group. In 2001, Byers was promoted to director of Supply Chain Management for Nordson Corporation and in 2003, was named director of Corporate Development. Since November 2005, Byers has served as business unit director for Asymtek’s Spectrum Business Group.

Alec Babiarz has been promoted to president, Business Development for Asymtek, also reporting to Dunn. Babiarz will continue to oversee Asymtek’s sales and marketing functions, working closely with Byers.

Martin Stone will continue to serve as vice president of Operations for Asymtek. He will also continue to lead the Technical Support, Engineering Services groups and manufacturing fabrication operations.

Greg Hartmeier has been promoted to vice president, Business Units, reporting to Byers. In this role, he will lead the Spectrum Business Group and continue overseeing Supply Chain Management, Logistics and the Spares Group. Since joining Asymtek in 1989, Hartmeier has held positions of increasing responsibility in operations functions. Most recently, he served as business unit director for the Century Business Group.

Greg Wood has been promoted to vice president, Sales, reporting to Babiarz. Wood is currently responsible for sales in the Americas and, in his new role, will add global account management to his responsibilities.

Sherry DeLoach has been promoted to vice president, Finance. DeLoach was previously director of Finance. DeLoach will report to Byers. DeLoach will continue to lead Asymtek’s Finance, Customer Service and Information Systems groups.

Tom Ratledge has been promoted to vice president, New Product Development. Ratledge joined Asymtek in 1995 as technical manager. He has also served as director of Engineering. Throughout his career at Asymtek, he has played a key role in developing new product platforms, software and dispensers. In addition to having overall responsibility for all new product development projects and strategy, Ratledge will continue to lead the flat panel display venture team and the Common Modules Group.
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Kester and Vitronics Soltec Complete Successful Lead-Free Seminars

Kester and Vitronics Soltec, both premier companies within the electronics industry, successfully hosted a series of lead-free seminars throughout June 2006 in the Los Angeles, Chicago and Boston areas.

The free technical sessions were designed to help the North American industry get answers to their lead-free assembly questions. The one-day seminars were technical in nature to help attendees make the transition to lead-free and RoHS easier and reliable. The series compiled the experiences gained by Kester and Vitronics Soltec throughout the past five years, and offered the tools to make lead-free a reality in a company, or to reduce defects and increase production yields in companies that already are lead-free.

This series is another example of how Kester and Vitronics Soltec are working together to help the industry make a smooth transition to lead-free. Both companies have extensive experience in this technology and have teamed to present invaluable knowledge to the North American electronics assembly industry. Each is proactive in assisting the electronics industry to a seamless lead-free transition. By working together, the industry will benefit from comprehensive, technical-based information.

For more information, Kester’s Web site may be found at www.kester.com.
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Centerline’s Web Site Offers Charts for Engineers

Centerline Technologies has updated our web site. We have included a unit conversion chart, materials properties chart as well as material specification sheet on alumina, AlN, BeO, Fused Silica, and Sapphire. These charts are a guide to engineers and purchasing professions in the design and procurement of thin and thick film circuit substrates.

To see the charts, please visit www.centerlinetech-usa.com.

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JPSA Introduces ‘Swiss Army Knife’ of Excimer Laser Workstations, IX-250

It’s the “Swiss Army Knife” of excimer laser workstations, the new IX-250 from J P Sercel Associates (JPSA). Compact, highly accurate, and extremely flexible with up to 12 axis of motion, the IX-250 is a universal excimer laser micromachining system with performance and capacity. It offers 250mm x 200mm travel (for processing > 6” wafers) and operates across the full range of excimer wavelengths, including vacuum UV (VUV) wavelengths of 157nm and 193nm, short-wavelength UV currently used in many emerging technology applications such as processing sensitive polymers, very high resolution and sub-micron processing, and more.

JPSA

The IX-250 is a Class 1, industrial-grade workstation that can accommodate virtually any excimer laser, from full size, high-power excimers coupled externally (as shown in photo) to mini-excimer lasers that are mounted in the system’s lower cabinet. Its extreme flexibility allows the widest range of excimer processing including massively parallel hole drilling, medical device manufacturing, microvias and sensors. Its precise yet flexible beam delivery system (BDS) is mounted to a stable granite base to ensure repeatable processing. The BDS features large-aperture optics for utilization of large excimer beams and can accommodate beam shaping modules such as beam profilometers, dosage control, mirror mounts, homogenizers, mask imaging systems, and more. These, in combination with 12 axis motion capability from its server stepper motor control system and high-quality, high precision cameras capable of micron-scale imaging, make the IX-250 an extremely, accurate, reliable, and versatile system.

The IX-250 is designed to meet CE requirements. The beam delivery system can be configured differently to suit individual excimer materials processing application requirements. Options include machine vision alignment and part handling

For more information, visit www.jpsalaser.com.

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Palomar Technologies’ Latest Automatic Die Bonder Offers Increased Precision and Accuracy

Palomar Technologies presents the latest version of its award-winning automatic die bonder, the Model 3500-III.  Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area.  Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.

Palomar

The 3500-III is capable of performing automated eutectic die attach utilizing backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets.  Palomar’s patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control.  Palomar’s pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.

Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-III’s sub-micron axis resolution yields typical placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications. 

With the 3500-III, placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms.  Relative-to-die placement algo­rithms place the die so that the second, third, and each die or sub­strate thereafter is placed relative to the final location of the last placed component rather than the package.  This provides greater accuracy from component to com­ponent.  It also controls the subsequent wire length and position, ensuring that the wires are parallel and the lengths are the same, factors im­portant for high frequency electri­cal performance.

The machine base is a honeycomb core optical table that provides vibration damping and thermal settling response superior to granite.  Its work area is the largest available.  The cantilever design permits unobstructed, open access on three sides for set-up.  Soft touchdown or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as gallium arsenide. An 8-position turret head can rapidly change tools on the fly without a space and time-consuming tool dock assembly.   Because it is constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.  

The 3500-III employs an infrared light curtain around the entire open perimeter of the assembly cell.  This safety curtain sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation.  When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 milliseconds) shorts the inputs to the digital servo driven motors, bringing all motion to a near instant stop.

The system uses a Windows XP™ operating system, employing Cognex Corporation’s latest Series 8000 gray-scale pattern recognition systems.  The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics, and calibration. The new, high-visibility, flat screen displays on the 3500-III greatly improve the unit’s ergonomics.  It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system solutions.  From wafer to eutectic die attach, handling options are fully programmable.

“The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available,” said Palomar Technologies president, Bruce Hueners.

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AI Offers Flexible Circuit Material for High Frequency Applications and Beyond

Choosing an ideal flexible circuit substrate for high frequency application is a daunting task. Polyester melts at high temperature making them unsuitable for soldering; polyimide is costly and absorbs moisture causing unwanted signal attenuation. AI Technology’s Coupler is an answer to these common problems in widely used flexible circuit materials. Coupler is flexible thermoset material with ultra low moisture absorption and high temperature tolerance. It can withstand up to temperature range of 250 to 300 degrees Celsius for lead-free soldering. At much lower cost than polyimide based materials, AI Technology’s Coupler enables large-scale solar energy and high frequency applications that were once foreboding due to high cost.

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nScrypt Dispensing Equipment with Smart Pump™ Technology Provides Solutions for Tough PCB Applications

nScrypt, Inc. has the answer to common dispense problems in PCB manufacturing. Combining their new Smart Pump™ with the Model 150 or Model 300 Series dispensing equipment allows for conformal dispensing on imperfect surfaces. The system actually maps out the area on which material will be dispensed within microns and then places the material to spec. Whether dispensing solder for 01005 components or solder bumping die, the Smart Pump™ does the thinking for you.

Precise.  Using the patented Smart Pump™, the systems dispense materials from 1 to 1M cps. The servo-controlled pump will dispense dots or lines as small as 50µm in diameter with tight volumetric control. The pump offers dynamic dispense control - the ability to change pump software parameters as the material properties change. In addition, the Smart Pump™ offers a continuous flow rate with needles up to 1 mm inner diameter. With custom tips, it can handle applications such as dispensing RLC networks directly on PCBs, or underfilling hard to reach areas.

Conformal.  Using Grid Mapping and Path Mapping, no matter what the surface profile, the nScrypt solution will dispense accurately in the z dimension. If a PCB is warped or a tray holds boards at different heights, there is no need to move the device via a pick and place to another location.

Reconfigurable.  Flexible and ready for future applications, each system is capable of being reconfigured to meet changing requirements. The dispense valves, handling system, vision, lighting, and graphical user interface as well as parts of the motion platform can all be changed to meet new requirements. The Smart Pump™’s small valve footprint allows for ganging an array of valves together for parallel processing (currently capable of ganging three valves with potential of up to 10 in Q4 2006).

Available.  The Model 150 and Model 300 Series products with Smart Pump™ technology are available now to be built to end-customer specifications. and chemical/ pharmaceutical industries through precision material manipulation, mixing, and processing. nScrypt's micro-dispensing system was recognized as one of the top 100 products introduced in 2003 by R&D Magazine. It was also awarded the 2004 Frost and Sullivan Product Leadership Award. The nScrypt Model 150TE is introduced in the June 2006 issue of DISCOVER Magazine, in an article entitled, Grow Your Own Organs, by Alex Stone.  For more information, visit www.nScryptInc.com

 

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:: Issue 14 ::
August 15, 2006