The next Corporate Bulletin will be sent the week of January 15, 2007.
:: Corporate Member News ::

:: Nordson Corporation Acquires Dage Holdings, Ltd. (full story)

:: Indium Corporation Receives Fourth Frost & Sullivan Award (full story)

:: Kulicke & Soffa New Copper Capillary Ensures Greater 2nd Bond Quality for More Stable Mass Production (full story)

:: Asymtek Products Now Used for Wafer Level Jetting (full story)

:: New Nano Silver Powder from Ferro Offers Customized, Cost-effective Material to Enable Advanced Technologies (full story)

:: Device Packaging Conference and Exhibition (full story)

:: Global Business Council’s Spring Meeting (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Nordson Corporation Acquires Dage Holdings, Ltd.

Nordson Corporation has announced that it has signed a definitive agreement to acquire Dage Holdings, Ltd., a leading manufacturer of testing and inspection equipment used in the semiconductor and printed circuit board industries. Dage, headquartered in the United Kingdom, employs more than 200 people and had revenues of approximately $59 million during the 12-month period ending October 31, 2006. Terms of the purchase were not disclosed.

Dage’s bond testing and digital X-Ray systems are used to analyze the integrity of electronic connections in semiconductor packages and printed circuit board assemblies. Consumer demand for more features and higher performances from electronic devices has dramatically increased the number and complexity of electronic connections on chips and printed circuit boards. Dage’s test equipment, particularly the digital X-Ray systems, is critical for ensuring quality and process control during the manufacturing of today’s high-tech electronic equipment.

“The purchase of Dage fits Nordson’s strategy of acquiring companies with above-average growth in markets currently served by Nordson companies,” said Edward P. Campbell, chairman and chief executive officer. “Over the three-year period ending April 30, 2006, Dage revenues and operating profit grew at annual rates of 24 percent and 69 percent, respectively. These growth rates are nearly identical to those of Nordson’s Advanced Technology Systems segment, which since 2003 has grown revenues and operating profit at annual rates of 23 percent and 59 percent, respectively.”

Campbell added, “Dage’s operating margins during the first half of its fiscal 2007 were 21 percent. At current rates of growth and profitability, we expect Dage to be accretive to Nordson’s fiscal year 2007 earnings per share.”

Campbell went on to say, “Dage’s growth potential is driven by increasing consumer demand for high performance and feature rich capabilities in today’s electronic devices, such as MP3 players, cellular phones, PDAs, digital cameras and game consoles. This acquisition will add high-growth opportunities to our Advanced Technology Systems segment by continuing to strengthen our presence in high-tech, high-growth industries, such as area array packaging, which have fueled the above-market growth we have seen in this segment over the past year.”
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Indium Corporation Receives Fourth Frost & Sullivan Award

Indium Corporation has received the 2006 Frost & Sullivan Global SMT Solder Paste Customer Value Enhancement Award. The award, presented at a ceremony held November 15, 2006 in San Antonio, Texas, USA, is the company’s fourth received from Frost & Sullivan. Previous honors were in 1998 and 2000 for Engineering Customer Focus, and in 2003 for Product Innovation.

The Frost & Sullivan Customer Value Enhancement Award is presented to the company that demonstrates outstanding achievement and superior performance in the ability to expand their customer base, while maintaining the existing install base, by using more innovative value creation and enhancement strategies than their competitors. Indium Corporation was chosen to receive the award based on an in-depth analysis of market competitors, as well as interviews with companies that make up the SMT soldering materials industry.

Upon presenting the award to Indium Corporation, Deepa Mathew, research analyst, Frost & Sullivan said, “Frost & Sullivan presents the 2006 Global SMT Solder Paste Customer Value Enhancement Award to Indium Corporation, a global supplier of electronics assembly materials with an impressive range of products from solder paste and flux, to high grade Indium.  The company focuses on a select customer group who are reputed technology and performance leaders.  Its experience with lead-free solder has made it an obvious and safe choice for assemblers who have been refining their assembly processes to conform to the deadline for adhering to RoHS. Ample resources and facilities located around the globe, together with well-qualified groups of personnel and strong field sales staff, help the company win over multinational companies, as well as those that command a strong presence in the local geography. Indium Corporation’s stress on technology and being in constant touch with its customers has provided the company with a definite edge over the competition.”
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Kulicke & Soffa New Copper Capillary Ensures Greater 2nd Bond Quality for More Stable Mass Production

Expanding upon the capabilities of its copper capillary called CuPRA, Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) has developed the CuPRAplus™ that supports highly consistent and stable fine wire 2nd bonds, while maintaining the quality of the overall wire bonding process.  By ensuring both 1st and 2nd bond quality during fine copper wire bonding, the CuPRAplus Copper Capillary offers a more stable mass production process.

“The formation of a fine wire 2nd bond in fine copper wire bonding has been a constant obstacle, mainly due to frequent tail bond break failures, inconsistent 2nd bond strength and an unstable bonding process window,” notes Jack Belani, Vice President, Marketing and Business Units at K&S,    “With its unique design and properties, K&S’ CuPRAplus Copper Capillary provides for increased 2nd bond pull strength for a more stable and consistent quality bond throughout a process.”

CuPRAplus Copper Capillary works together with K&S’ iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire.  While K&S’ original CuPRA capillary offered superior bonding performance comparable to gold bonds on various pad materials, the CuPRAplus takes fine copper wire bonding a step forward by ensuring both a quality 1st and 2nd bond for superior process control and productivity. 

“The CuPRAplus addresses fine copper wire bonding process challenges by ensuring 2nd bond quality and integrity along its lifetime,” notes Yair Alcobi, K&S Bonding Tools Director of Marketing.  “Easy to implement on any existing bonding platform, the CuPRAplus has outperformed conventional capillary designs when tested on numerous applications — from fine pitch wire bonding to low pin count devices.”

For more information, please visit

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Asymtek Products Now Used for Wafer Level Jetting

Ensures cleanliness and reliability during laser scribing

Asymtek announced that its jet dispensers can be used for wafer level jetting.  Historically, dispensing products have been used in the “back-end” part of semiconductor packaging during assembly and test.  Asymtek has targeted jetting applications in processes further upstream during semiconductor manufacturing.  Jet dispensing fluid materials onto wafers ensures cleanliness and reliability during the process of laser scribing.  This and other jetting applications are currently in production with a clean room version Axiom™ X-1020 platform in class 100 clean rooms.

Asymtek’s DispenseJet® DJ-9000, used on the Axiom platform, utilizes a non-contact method to deliver the fluid and includes process control to ensure that repeatable amounts of material are precisely deposited without touching the wafer.  In laser scribing, a fluid is dispensed onto the wafer prior to scribing.  The fluid deposition keeps particles and debris, which are generated by the laser, from contaminating the wafer.  Laser scribing also prevents delamination which can result when 300mm wafers are fabricated with low-K dielectric materials.  When delamination occurs, it is difficult to process the wafers on traditional dicing equipment.  Jetting is also a fast and easy way to deposit the fluid.
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New Nano Silver Powder from Ferro Offers Customized, Cost-effective Material to Enable Advanced Technologies

A new nano silver powder from Ferro Corporation offers cost-efficient performance and high-volume availability that can enable broader commercialization of advanced technologies such as radio frequency identification (RFID), flexible displays, and printed, flexible circuits.  Ferro launched Nano Silver 7000-95 at Printed Electronics USA 2006, held in Phoenix, AZ, Dec. 5–6.

Ferro controls particle synthesis of the nano silver material via chemical precipitation, which allows its surface chemistry to be tailored to match customers’ needs to optimize specific ink systems.  This produces conductive inks, pastes, and adhesives with controlled rheology and viscosity for finer, sharper line definition and lower deposition weight.  Silver provides good conductivity at significantly lower cost compared to palladium or gold, and the 250 Toz batch size of 7000-95 offers a stable supply for high-volume applications. 

Nano Silver 7000-95 is an enabling material for fine-line flexible circuits, which allow product designers more versatility and greater freedom to incorporate electronics into broader applications than previously possible with rigid silicon structures.  The mass-produced printed technology puts circuits on paper and polymers, and has lower processing costs than semiconductor technology.  This can help drive widespread commercialization of RFID for inventory control throughout the retail industry and can foster adoption of electronic paper for e-books, thin-film batteries, flexible displays, and organic light-emitting diodes.  The silver powder also has applications in conductive surface mount adhesives and inks for connecting lines for denser circuits on cards and boards in smaller, faster electronic devices.

The unique properties of Nano Silver 7000-95 offer advantages in non-electronic applications as well.  Silver kills odor-causing bacteria and neutralizes ammonia.  Nano Silver 7000-95 increases these activities, making it ideal for emerging applications such as antimicrobial coated textiles for performance apparel, infection-resistant medical devices, and glazes for sanitary ware that permanently inhibit odors and stains without chemical cleaners.

The average particle size of Ferro’s Nano Silver 7000-95 is 60 nm, and surface area is about 10 m2/gm.  Ferro’s chemical precipitation process synthesizes silver, gold, palladium, platinum, copper, and nickel particles with controlled sizes ranging from 10 nm to more than 20 microns.  Particle synthesis also controls morphology, internal structure, surface chemistry, and impurities.  Worldwide technical support assists customers with on-site development and manufacturing.

Nano Silver Powder 7000-95 from Ferro Electronic Material Systems provides uniform particles with an average size of 60 nm and surface area of ~ 10 m2/gm.

For more information, please visit

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Device Packaging Conference and Exhibition

Exhibit space is still available at Device Packaging 2007, but it is filling fast.  For the best possible spot, please go to and send in your booth reservation today. 

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Global Business Council’s Spring Meeting

The Global Business Council’s Spring 2007 Meeting will immediately precede the Device Packaging Conference and will offer expert advice and opinions on a variety of technical applications including the business outlook for 2007. See for more information.

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:: Issue 21 ::
December 15, 2006

National Training Center