Adchem Corporation, a leading manufacturer of innovative, pressure-sensitive adhesive tape systems, introduces its new 353M Double-Coated Acrylic Adhesive Tape System. 353M is formaldehyde-free and combines the quick-stick properties of rubber-based systems with the temperature performance of acrylic systems. Engineered for a wide-range of industrial tapes for substrate-bonding applications, 353M is ideal for low surface energy materials and foams such as cross-linked polyethylene, low perms, ethers and esters.

Part of Adchem’s new 300 Adhesive Series, 353M maximizes performance and optimizes economics by incorporating a differential caliper coating of 1.7 mils on the exposed side and 1.3 mils on the liner side and typical peel values of 72 oz. per inch width on the exposed side and 64 oz. per inch on the wide on the liner side. Several liner options are available including 55 lb. densified Kraft, 74 lb. polycoated paper, 12 point board and a 2-mil PET liner.

For additional information, please visit www.adchem.com.

AIM Appoints Global Tech Sales & Services as Manufacturers’ Representative in Mexico
AIM is pleased to announce the appointment of Global Tech Sales & Services as manufacturers’ representative for AIM’s complete line of solders and related assembly materials in southern and central parts of Mexico. Global Tech Sales & Services forms yet another link in the global sales and technical support of the AIM line of assembly and fabrication products.

In 1997 AIM opened the first manufacturing facility for electronic-grade solder materials within Mexico. Today, AIM-Soldadura de Mexico in Cd. Juarez services a significant part of the growing electronics assembly industry of Mexico.

Todd Fielitz has been appointed OEM Account Manager for DeWeyl Tool, and will be based in Arizona. Todd brings 18+ years of experience in semiconductor and microelectronic assembly packaging technology and technical sales to his new position.

In making the announcement, David Pasfield, DeWeyl Tool's Director of Sales & Marketing, stated that "Todd's considerable experience on the manufacturing floor as well as on the side of selling assembly products, in particular his familiarity with wire and die bonding equipment, will be a real asset to our company. We look forward to the benefit of his experience and skills and welcome him to the DeWeyl Tool family."

The elevated temperatures of lead-free wave soldering processes reduce the mechanical strength of adhesives. In order to overcome poor hole fill and wetting, the contact time on the solder wave is often increased and the wave shape more turbulent. This has an additional impact on the adhesive’s performance. Especially where non VOC-free, means alcohol-based fluxes, are in use the chemical resistance of adhesives used in lead-free processes needs to be significantly higher.

“With the deadline to Go-Lead-free now less than 9 months away, manufacturers around the world are currently optimizing their processes for effective operation in these conditions,” comments Matthias Brachmann, Application Engineer Europe, Henkel. “Lead-free is already having a significant impact on a range of materials, including Surface Mount Adhesives (SMA). Ultimately, SMAs need to be able to withstand considerably greater levels of thermal and chemical stress in order to prevent chip loss and component movement. Following Henkel’s recent lead-free evaluation trials, the Loctite Chipbonder range is currently being well received by manufacturers managing the transition to lead-free, whilst seeking to maintain optimal high speed assembly processes.”

The results of the recent trials showed that Loctite 3609 is ideal for use in general purpose high speed dispensing, boasting a high wet strength and long machine on stencil life. Loctite 3616 was proven to be primed for high speed printing, whilst Loctite 3621 was revealed as being the top-of-the-range choice for dispense jetting. Meanwhile, Loctite 3629 low temperature cure SMA for dispensing and ProFlow printing was shown to reduce manufacturing costs by curing at 120°C instead of 150°C and saving temperature sensitive components at the same time. An additional feature is that Loctite 3629 turns fluorescent when uncured for cure visibility. “In combination, the lead-free compatible Loctite Chipbonder range presents Henkel customers with Surface Mount Adhesives for every manufacturing environment,” concludes Matthias Brachmann.

The Semiconductor Feeding Solutions Group of Hover-Davis Inc., the leader in design and manufacturing of component delivery systems for the circuit board assembly industry, presents the latest addition of its Direct Die Feeding product line, the DDf Ultra. The DDf Ultra is capable of feeding a wide range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.

As a complement to the DDf, which has been an industry leading die feeding solution for the past four years, the performance of DDf Ultra is optimized around the handling of small flip chips. Upon release, the DDf Ultra is capable of feeding die down to 0.5 mm sq. with a throughput exceeding 6,000 die/hour with smaller die sizes and higher throughputs planned.

Roland Heitmann, Director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”

Indium Corporation introduces WF-9942, a powerful new Wave Solder Flux that offers three important features:

• It is No-Residue and No-Clean.
• It works in both mixed-technology and through-hole applications.
• It addresses the Pb-Free transition question, as it can be used with both Pb-Free and SnPb solder
alloys.

Wave-Solder Flux WF-9942’s wide process window offers excellent solderability, superior hole fill, and reduced solder balling on all surface finishes. This formulation’s tremendous thermal stability accommodates the increased temperatures used in the Pb-Free wave soldering process.

Indium Corporation Product Manager, Leo Devine, said, “WF-9942 is a great resource for people facing the Pb-Free soldering transition. They can now purchase one flux that satisfies their cumulative no-clean, mixed-technology, and Pb-Free/SnPb requirements. This truly compliments the complex requirements that the market faces in these times.”

Kevin brings to this position broad operations experience from the EMS and OEM manufacturing segments, as well as a comprehensive understanding of the service needs of our customer base and our operational capabilities.