|:: Corporate Member News ::
Anter Corporation Develops New Multi-functional Dilatometer (full
Dr. Ning-Cheng Lee appointed to CPMT Board of Governors (full
Editors’ Choice Best Product Award Presented to Kulicke & Soffa
For Semiconductor Manufacturing Excellence (full
Henkel Awarded Honorary Doctorate (full
:: LG Electronics
DS Division (CD-Rom) Approves the Use of Cookson Electronics’ ALPHA® Vaculoy® SACX™ Lead-Free
Wave Solder Alloy (full story)
:: SUSS MicroTec
Named #1 Supplier in 2006 (full
:: Did you know
More Information ::
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Anter Corporation Develops New Multi-functional Dilatometer
Corporation has developed a very flexible dilatometer for
high throughput thermal expansion (CTE) measurements. Using
a modular design, multiple furnaces can test a wide variety
of materials over a temperature range of –150 to 1200oC.
Up to 4 independent samples can be tested at the same time
with unattended operation, including overnight runs, for
high return on investment.
conventional cryogenic and high temperature furnaces for
standard sample sizes according to ASTM methods, a unique
furnace is available to test plate-type samples of low thermal
conductivity, like polymers and composites, providing direct
contact with the heating/cooling surface to reduce thermal
lag during temperature ramping.
easy-to-use WindowsTM-based operating and data analysis software
does not require highly skilled operators or extensive training.
The instrument’s small footprint requires minimal bench
space. And as with all Anter dilatometers, modern absolute
digital displacement transducers provide long-stroke, stable,
linear, calibration-free performance without the need for
a controlled-temperature environment or an external cooling
Dr. Ning-Cheng Lee appointed to CPMT Board of Governors
Vice President of Technology, Dr. Ning-Cheng Lee, has been
appointed to the IEEE Components, Packaging and Manufacturing
Technology (CPMT) Society Board of Governors.
Dr. Lee leads the Indium Corporation team of technology experts.
He was named SMTA Member of Distinction in 2002, received the
Soldertec Global Lead-Free Solder Award in 2003, and most recently
received the 2006 CPMT Exceptional Technical Achievement Award.
Dr. Lee’s credits also include service as an SMTA board
member, liaison to the Taiwan SMTA chapter, coordinator and
chair of the entire 2005 Nepcon Shanghai technical program,
and author of two books and over 100 technical papers.
Dr. Lee, a world-renown electronics assembly materials expert,
has extensive experience in the development of solders, fluxes,
high-temperature polymers, encapsulates for microelectronics,
underfills, and adhesives. His current research interests cover
advanced materials for interconnects, and packaging for electronics
and optoelectronics applications, with emphasis on both high
performance and low cost ownership.
Best Product Award Presented to Kulicke & Soffa
For Semiconductor Manufacturing Excellence
a product that is truly making a difference in semiconductor
manufacturing, Kulicke & Soffa Industries received the prestigious
Editors’ Choice Best Product Award, presented annually
by Semiconductor International magazine, for its Maxum Ultra
Wire Bonder. In a ceremony to be conducted on July 12 in San
Francisco, Semiconductor International will announce 20 winners
whose products are making a difference in semiconductor manufacturing.
higher productivity, the Maxum Ultra is capable of processing
today’s most complex packaging applications
including stacked die, multi-tier packages, low-k dielectric
materials and ultra-fine pitch and long/low shapes. Incorporating
numerous technology advancements, this high-performance wire
bonder processes devices 10% faster than its predecessor – the
industry-leading Maxumplus? - as well as market competition.
Engineered for customers who want greater throughput and finer
pitch down to 35 microns, the wire bonder offers bond placement
accuracy of + 2.5 µm accuracy at 3 sigma. Wire cycle
time is 60 msec for a standard loop, based on 2.5 mm wire length,
0.25 mm loop height and 10 msec first and second bond times.
“The Maxum ultra provides a real performance advantage
over other wire bonding technologies, “ states Christian
Rheault, K&S Vice President, IC Ball Bonders. “Its
many technological advancements make it the only choice for
today’s complex packaging applications.”
"Advances in semiconductor technology are only possible
because of the kinds of products being honored in this year's
Editors' Choice Best Product Awards program," said Pete
Singer, Editor-in-Chief of Semiconductor International. "Chipmakers
rely on these products to create electronics that are smarter,
smaller, faster, less expensive and more reliable. We congratulate
the people and the companies that have had the insight and
fortitude to bring these products to the market."
Henkel Awarded Honorary Doctorate
Heinrich Heine University of Duesseldorf (Germany) has awarded
Vice Chairman of the Shareholders’ Committee of Henkel
KGaA, an honorary doctorate in recognition of both his exceptional
professional achievements and his services to the university’s
In awarding the
doctorate to Christoph Henkel, the Vice-Dean of the Economics
Faculty of Duesseldorf University, Prof. H.
Jörg Thieme, described the recipient both as a man of
science and an energetic supporter of entrepreneurial initiative.
Exceptional achievements in science or practice and a close
relationship with the Economics Faculty are prerequisites for
the granting of an honorary doctorate of the Duesseldorf Heinrich
Heine University. Henkel fulfilled both conditions in an outstanding
way, Thieme said in his speech.
Christoph Henkel's achievements in science and practice are
many and varied. Since 1994, he has established a number of
successful companies. The many initiatives that he has promoted
include the foundation of various companies and partnerships
in the hotel sector, the establishment of a property fund and
the establishment and entrepreneurial management of a portfolio
of direct shareholdings in the biomedical and high-tech segments.
Since 1989 Christoph
Henkel served on the boards of several companies such as
The Clorox Company (USA), Loctite Corporation
(USA) and Head N.V. (Netherlands). Henkel is currently a member
of the Board of SulphCo Inc. (USA). However, the prime focus
of his work lies in the Shareholders’ Committee of Henkel
KGaA, which he joined as an ordinary member in 1991. Since
1994, he has served this committee as vice chairman, and since
2004 he has also been chairman of its Finance Subcommittee.
Christoph Henkel is also chairman of the Dr. Jost Henkel Foundation.
This charitable foundation established in 1958 supports gifted
young people as they continue their studies at universities,
polytechnics and similar institutions of higher education.
He is also chairman of the Konrad Henkel Foundation. The Konrad
Henkel Award is bestowed annually on the most talented graduates
of the Economics Faculty of the University of Duesseldorf.
Electronics DS Division (CD-Rom) Approves the Use of Cookson Electronics’ ALPHA® Vaculoy® SACX™ Lead-Free
Wave Solder Alloy
Assembly Materials is pleased to announce approval of its
high reliability ALPHA® Vaculoy® SACX™ lead-free
wave solder alloy by LG Electronics DS Division (CD-ROM).
approval from LG Electronics DS Division, adds to the significant
momentum that SACX™ is achieving in the highly competitive
lead-free alloy market,” said Gerry Campbell, Cookson
Electronics’ Global Product Manager. “As leading
OEM companies such as LG continue to drive the reduction
in the total cost of their Lead-Free assemblies, we see
a continuation of the trend of customers moving away from
SAC305 to SACX™. The use of SACX™ alloy in
the wave solder process significantly reduces the cost
of solder materials while maintaining process yield and
ALPHA® Vaculoy® SACX™ delivers
wave soldering process value by providing SAC305 performance
at 30% lower cost. Its fast wetting speed offers improved
solderability that outperforms all Sn/Cu based alloys. It
provides excellent drainage and minimizes bridging defects.
ALPHA® Vaculoy® SACX™ creates strong, mechanically
sound joints with excellent long-term reliability. It also
minimizes dross generation, resulting in low process maintenance
and reduced product waste. Its process window supports the
use of a wide range of flux technologies.
information about ALPHA® Vaculoy® SACX™, go
|SUSS MicroTec Named #1 Supplier in 2006
MicroTec AG is pleased to announce that VLSI Research Inc
has named SUSS MicroTec the number one supplier of material
handling equipment based on VLSI Research’s annual
Customer Satisfaction Survey on Chip Making Equipment.
The survey’s respondents represent 95% of the world’s
VLSI reported that SUSS MicroTec received the highest scores
in six of the thirteen ratings categories. Those six included
criteria such as after-sales support and field-engineering
support, as well as build quality and commitment to supporting
customer needs. This marks the eleventh consecutive year
that SUSS MicroTec has been included in the 10 BEST lists,
and the ninth time SUSS has been in first place on one of
“This award shows that SUSS MicroTec’s customers
are not only satisfied with our test solutions, but also
receive excellent support for every SUSS product they have,” said
Dr. Michael Harz, Sales Manager for Test Systems at SUSS
MicroTec. “We will continue in our commitment to supporting
our customers’ needs by providing the innovative products
and high-quality service that they have come to expect from
For more information, please visit www.suss.com.
|Did you know that…
If you reserve booth space at IMAPS 2006,
you will receive:
• A 6’ draped table and 2 chairs – free
of charge – if you want them;
Product and Services listings in the 2007 issues of Advancing
Microelectronics – taken from the Final Program;
Participation in a contest to win a free of charge 10’x10’ inline
booth rental at IMAPS 2007 – San Jose, CA.
visit www.imaps2006.org, reserve your IMAPS 2006 booth space
and you will receive
details about the above new “perks”.
Issue 12 ::
July 17, 2006