|:: Corporate Member News ::
NETZSCH Promotes John Hill to Sales Manager (full
:: Xradia Announces
New X-ray Solutions for Advanced Semiconductor Packaging (full
Polysciences Announces the 2006-2007 Catalog is Now Available
for Laboratory and Chemical Industry Research Professionals (full
:: NuSil Opens
First Tech Support Office in Asia (full
:: Remtec Introduces
Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount (full story)
:: SUSS MicroTec Introduces the IZI Probe® Card (full
:: IPC Certifies 23 Cookson Electronics’ Applications Engineers (full
:: IPS Group to Represent Indium Corporation in Southwestern United
:: Henkel Takes Top Spot Among DAX-listed Companies with Investor Relations
Award for Financial Communications (full
More Information ::
Only news about IMAPS Corporate Members will be published in this
Corporate Bulletin. Please send your electronic press releases
to Ann Bell, firstname.lastname@example.org,
before the first
month to be considered for publishing in this bulletin.
:: For advertising
opportunities, please contact Ann Bell at email@example.com or
:: To have your
company logo included in an upcoming "Fast Links," contact
Brian Schieman at firstname.lastname@example.org or
:: For comments and questions about this e-mail newsletter, please
contact Brian Schieman at email@example.com or 202-548-8715.
Corporate Fast Links ::
below to learn more about this issue's featured corporate members.
Corporate Members will have the opportunity to place their logo/link
in the "Fast Links" section. To have your company logo
included in an upcoming "Fast Links," email your logo
as a JPEG or GIF to Brian Schieman at firstname.lastname@example.org.
You should also identify which URL to link your logo to. If you
have questions, contact Brian at 202-548-8715. There is
no charge for this service, it is offered as part of the corporate
NETZSCH Promotes John Hill to Sales Manager
Fine Particle Technology, LLC has promoted John M. Hill to
sales manager, mid-Atlantic region. He will manage all aspects
of NETZSCH customer relationships in Pennsylvania, New Jersey,
Maryland, Delaware, West Virginia, and southern New York.
is responsible for growing the customer base throughout those
states for NETZSCH’s grinding division. He will
be the key point of contact for NETZSCH customers from the
initial meeting, through the purchasing process, including
any lab trials, and in post-sale support, with the primary
objective of increasing customers’ profitability.
to his promotion, Hill was laboratory manager for NETZSCH’s
Grinding and Dispersion Group. In that position, he developed
dispersion and milling processes for products in the paint,
ink, pharmaceutical, ceramics and other industries, and processes
for dry powder size reduction and classification for mineral,
toner, and ceramics industries, among others.
Hill was employed by Nashua Corporation, Nashua, NH, first
as a process development engineer and then as project
engineer. While there, he participated in a multimillion-dollar
expansion of grinding and dispersion capacity for the manufacture
of thermal paper coatings.
holds both bachelor of science and master of science degrees
in chemical engineering from
|Xradia Announces New X-ray Solutions for Advanced Semiconductor Packaging
Xradia, Inc. hasannounced
the sale of three of its MicroXCTTM 3D Transmission X-ray
Microscopes, to semiconductor manufacturers
for advanced packaging process development and failure analysis.
Combining spatial resolution below 1.5µm and feature
recognition of 500nm, with full 3D tomography capability, the
MicroXCTTM is ideally suited to the engineering and failure
analysis of next-generation semiconductor packages, including
multi stacked die and flip-chip architectures. Two of the systems
are being deployed to fabs in the US for advanced package development
and the third is headed to Asia where it will be used to examine
ball grid arrays.
MicroXCTTM 3D Transmission x-ray
system sales validate the importance of high-resolution x-ray
tomography as a critical new analytical tool for semiconductor
manufacturing,” said Dr. Wenbing Yun, founder and President
of Xradia. “3D x-ray microscopy enables the non-destructive
investigation of design features or process defects, thereby
lowering development costs and speeding time to market, “said
Yun. “The ROI of Xradia’s new x-ray microscope
system was evident from the very first sample images,” said
My Nguyen, senior researcher at Altera Corporation, one of
the new system customers. “We are able to image features
of interest not otherwise observable with other techniques.
No sample prep means enormous cost savings and fast turn
around time,” said Nguyen.
3D x-ray tomography provides critical new imaging capability
for semiconductor packaging, including C4 ball grid arrays,
stacked die, solder bumps and packaging interconnects. Defects
such as solder non-wet, cracks, voids, delamination, opens
and shorts are readily imaged. New applications are also
emerging for RoHS lead-free development and vias in ceramic
packaging. Xradia also manufactures microscope systems with
sub 50nm resolution for chip and die-level applications.
information, please visit www.xradia.com.
|Polysciences Announces the 2006-2007 Catalog is Now Available for Laboratory
and Chemical Industry Research Professionals
Inc. has released its updated 2006-2007 product catalog featuring
and technical information. The new catalog details Polysciences’ broad
product offering for chemical industry research professionals,
including a section focused on materials for electronics applications.
catalog lists over 3,000 off-the-shelf products that are
used by lab technicians, chemists, scientists
and engineers in the fields of histology, microscopy, polymer
chemistry, and life sciences. These products include fine and
specialty chemicals, certified and fluorescent dyes, electrophoresis
reagents, magnetic and non-magnetic particles, particle kits,
microspheres, monomers, and polymers. To receive your free
copy, visit www.polysciences.com.
|NuSil Opens First Tech Support Office in Asia
NuSil Technology announces that
it has opened its first technical support office in Asia.
This office will specialize in the areas of optoelectronics
and electronic packaging, served by the company's Lightspan
products and its line of low-outgassing electronic packaging
materials respectively. T.Y. Lim, the application engineer
heading the office in Penang, Malaysia, will support all of
NuSil's customers, distributors and representatives in Asia.
According to a NuSil representative, Asia has always been
a significant site for electronics manufacturing, and the company
noticed recent growth in the Asian optoelectronics industry.
NuSil has found success in its dedication to providing on-site
technical support, as evidenced by the significant growth of
its European operation since it opened in 1993. NuSil determined
Asia as the logical next step in building a global infrastructure
to serve its customers.
"The business in Asia has reached a critical mass, and
we realized it was time to open a technical support office
to service the region," said Brian Nash, vice president
of Marketing and Sales. "We are at a point where we need
a presence in Asia, and we found the right person to offer
superior service to this important part of the world."
Lim has worked in the electronic/optoelectronic industry for
several years as an R&D engineer and in technical support
and sales. He has an MSc in Advanced Technology Manufacturing
from the University of Portsmouth in England.
The Asia Field Office is located at 9-1 Tingkat Bukit Jambul,
Bukit Jambul Indah, 11950, Penang, Malaysia. For more information,
Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount
Inc. has introduced new, leadless ceramic SMT hermetic
packages for direct PCB mount. Remtec leadless SMT chip
carriers, with unique wrap-around interconnections, plugged
via holes, hermetic-filled vias and integrated passives,
are now available in their fully hermetic (to 10-8) version.
specifications of hermetic SMT packages are very similar
to those of non-hermetic products. Plugged via holes with
low resistance (less than 1 milliohm) provide for low RF
losses below .1dB at 4 GHz. Wraparounds and plugged vias
are excellent for ground and signal connections; the SMT
enclosures can operate from DC to 32 GHz. High thermal
conductivity of vias (greater than 200 W/M x °C) results
in a low thermal resistance path providing excellent thermal
management. Depending on die size and ceramic base thickness,
thermal resistance of 1-2 °C/W and lower can be achieved.
technology with its ductile structure of plated copper
over thick film on ceramic, results in minimizing solder
joint stresses during assembly of ceramic packages to PC
boards. Therefore, Remtec’s leadless ceramic SMT
packages with wraparounds for a direct PCB mount can be
fabricated in sizes from .15 to .75 in. square.
general, packages are available in the following configurations.
Most common are SMT leadless ceramic substrates with hermetic
via plugs and hermetically soldered (brazed) ring frames;
after component assembly, customers may weld a lid. Also,
a ceramic ring frame hermetically attached with a low temperature
sealing glass is an option. In addition, some customers choose
hermetic SMT substrates to which they solder either five-sided
metal covers or open ring frames. The performance specifications
of all configurations are the same. Integrated resistors,
capacitors and inductors can often be incorporated into these
packages to reduce size and increase integration levels.
|SUSS MicroTec Introduces the IZI Probe® Card
|The only repairable
RF probe card with IZI Probe technology
MicroTec AG has announced the newest member of its renowned
IZI Probe® family, the IZI Probe Card. This
new solution integrates the unique IZI Probe technology
into an RF probe card specifically designed for production
As RF and microwave devices become more complex and their
operating frequencies increase, there is a significant need
to extract scattering parameters (s-parameters) on the production
floor. These s-parameters describe the performance of the
device under test (DUT) and provide critical feedback for
the manufacturing process. To extract the s-parameters in
production test, manufacturers typically use RF probe cards,
which are expensive and difficult, if not impossible, to
The IZI Probe Card from SUSS is the first
RF probe card that integrates the unique, MEMS-manufactured
of the IZI Probe. The IZI Probe Card can test up to 32
RF channels, and when configured with the Multi IZI Probe,
and DC signals can be tested using one probe card. Long,
independent contact springs ensure the best contact with
the DUT, overcoming troublesome variations in pad height.
In addition, the PCB carrier board is customizable to accommodate
SMD’s and other designs.
“The IZI Probe Card is completely repairable”,
said Steffen Schott, HF Product Manager at SUSS MicroTec
Test Systems. “The probes can be replaced quickly
and easily when needed. And due to the IZI Probe contact
the lifetime of the IZI Probe Card is guaranteed for more
than 1 million contact cycles on aluminum pads. These two
traits effectively increase the return on investment for
the IZI Probe Card.”
For more information, please visit www.suss.com.
Certifies 23 Cookson Electronics’ Applications Engineers
Assembly Materials global team of 23 applications engineers
were trained and certified as IPC
Specialists in May. This important training will ensure that
the company’s experienced applications team will be
able to support product implementations at customer sites,
and be able to accurately interpret adherence to core industry
standards for circuit assembly.
“At Cookson Electronics, we are focused on helping
our customers meet their electronic assembly objectives by
providing them with innovative assembly products and the
highest possible level of technical assistance,” said
Steve Brown, Director – Global Applications Technology. “We
train and certify our field applications engineers to the
IPC Standards which are used globally by our customers. This
is especially important as they transition to lead-free processes
in response to the RoHS requirements.
The standards covered in depth during the IPC-executed training
session were IPC J-STD-001 Requirements for Soldered Electrical
and Electronic Assemblies and IPC-A-610D Acceptability of
Group to Represent Indium Corporation in Southwestern United
Corporation has announced that the IPS Group has become their
in the Southwestern United States. The IPS Group is responsible
for sales and support of Indium’s solder paste, fluxes,
spheres, epoxies, underfills, solder preforms, solder wire,
ribbon, foil and ingots throughout Texas, Oklahoma, Louisiana
The IPS Group was started in 2003. The managing partners, Arthur
Roberts and Bill Majure, have a combined 35 years of experience
in the electronics industry. According to Tony Przano, Area
Sales Manager for Indium Corporation, “The IPS Group
has a proven record of sales success and will be a great asset
to the Indium Corporation in the Southwest.” For more
information on the IPS Group, visit www.theipsgroup.com.
Indium Corporation is a three-time Frost & Sullivan Award-winning
supplier of electronics assembly materials, including solder
pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill
materials, die-attach materials, and more. The company is also
the world’s premiere supplier of commercial grade and
high-purity indium. Factories are located in the USA, the United
Kingdom, Singapore, and China. Founded in 1934, the company
is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com.
|Henkel Takes Top Spot Among DAX-listed Companies with Investor Relations
Award for Financial Communications
|At the 2006 Investor
Relations Awards organized by the German business magazine
Capital, Henkel came first in the category of DAX-listed companies.
The consumer goods and technologies company improved its standing
by one further position compared to the previous year. Lothar
Steinebach, Executive Vice President Finance of Henkel KGaA,
accepted the award at the ceremony held in Frankfurt on June
on the prize, Steinebach said: “This
award demonstrates that our pro-active and transparent
communications enjoy significant confidence within the
capital market. We regard it as both welcome recognition
and an incentive
to carry on improving. We will continue to further improve
our Investor Relations activities.“
Organized by Capital and the DVFA – the German Association
for Financial Analysis and Asset Management – this
annual ranking of the work carried out by the investor
relations departments of listed corporations has been
a regular feature since 1997. Henkel has continually
its standing in recent years, reaching ninth in 2003
and then moving up from fourth in 2004 to second in 2005.
criteria upon which the award is based are transparency,
continuity, target group orientation and financial reporting
Issue 11 ::
July 5, 2006