:: Corporate Member News ::

:: NETZSCH Promotes John Hill to Sales Manager (full story)

:: Xradia Announces New X-ray Solutions for Advanced Semiconductor Packaging (full story)

:: Polysciences Announces the 2006-2007 Catalog is Now Available for Laboratory and Chemical Industry Research Professionals (full story)

:: NuSil Opens First Tech Support Office in Asia (full story)

:: Remtec Introduces Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount (full story)

:: SUSS MicroTec Introduces the IZI Probe® Card (full story)

:: IPC Certifies 23 Cookson Electronics’ Applications Engineers (full story)

:: IPS Group to Represent Indium Corporation in Southwestern United States (full story)

:: Henkel Takes Top Spot Among DAX-listed Companies with Investor Relations Award for Financial Communications (full story)

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.


NETZSCH Promotes John Hill to Sales Manager

NETZSCH Fine Particle Technology, LLC has promoted John M. Hill to sales manager, mid-Atlantic region. He will manage all aspects of NETZSCH customer relationships in Pennsylvania, New Jersey, Maryland, Delaware, West Virginia, and southern New York.

Hill is responsible for growing the customer base throughout those states for NETZSCH’s grinding division. He will be the key point of contact for NETZSCH customers from the initial meeting, through the purchasing process, including any lab trials, and in post-sale support, with the primary objective of increasing customers’ profitability.

Prior to his promotion, Hill was laboratory manager for NETZSCH’s Grinding and Dispersion Group. In that position, he developed dispersion and milling processes for products in the paint, ink, pharmaceutical, ceramics and other industries, and processes for dry powder size reduction and classification for mineral, toner, and ceramics industries, among others.

Previously, Hill was employed by Nashua Corporation, Nashua, NH, first as a process development engineer and then as project engineer. While there, he participated in a multimillion-dollar expansion of grinding and dispersion capacity for the manufacture of thermal paper coatings.

Hill holds both bachelor of science and master of science degrees in chemical engineering from Syracuse University.

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Xradia Announces New X-ray Solutions for Advanced Semiconductor Packaging

Xradia, Inc. hasannounced the sale of three of its MicroXCTTM 3D Transmission X-ray Microscopes, to semiconductor manufacturers for advanced packaging process development and failure analysis. Combining spatial resolution below 1.5µm and feature recognition of 500nm, with full 3D tomography capability, the MicroXCTTM is ideally suited to the engineering and failure analysis of next-generation semiconductor packages, including multi stacked die and flip-chip architectures. Two of the systems are being deployed to fabs in the US for advanced package development and the third is headed to Asia where it will be used to examine ball grid arrays.


MicroXCTTM 3D Transmission x-ray

“These system sales validate the importance of high-resolution x-ray tomography as a critical new analytical tool for semiconductor manufacturing,” said Dr. Wenbing Yun, founder and President of Xradia. “3D x-ray microscopy enables the non-destructive investigation of design features or process defects, thereby lowering development costs and speeding time to market, “said Yun. “The ROI of Xradia’s new x-ray microscope system was evident from the very first sample images,” said My Nguyen, senior researcher at Altera Corporation, one of the new system customers. “We are able to image features of interest not otherwise observable with other techniques. No sample prep means enormous cost savings and fast turn around time,” said Nguyen.

High resolution 3D x-ray tomography provides critical new imaging capability for semiconductor packaging, including C4 ball grid arrays, stacked die, solder bumps and packaging interconnects. Defects such as solder non-wet, cracks, voids, delamination, opens and shorts are readily imaged. New applications are also emerging for RoHS lead-free development and vias in ceramic packaging. Xradia also manufactures microscope systems with sub 50nm resolution for chip and die-level applications.

For more information, please visit www.xradia.com.

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Polysciences Announces the 2006-2007 Catalog is Now Available for Laboratory and Chemical Industry Research Professionals

Polysciences, Inc. has released its updated 2006-2007 product catalog featuring expanded product and technical information. The new catalog details Polysciences’ broad product offering for chemical industry research professionals, including a section focused on materials for electronics applications.

Polysciences’ 2006-2007 catalog lists over 3,000 off-the-shelf products that are used by lab technicians, chemists, scientists and engineers in the fields of histology, microscopy, polymer chemistry, and life sciences. These products include fine and specialty chemicals, certified and fluorescent dyes, electrophoresis reagents, magnetic and non-magnetic particles, particle kits, microspheres, monomers, and polymers. To receive your free copy, visit www.polysciences.com.

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NuSil Opens First Tech Support Office in Asia

NuSil Technology announces that it has opened its first technical support office in Asia.

This office will specialize in the areas of optoelectronics and electronic packaging, served by the company's Lightspan products and its line of low-outgassing electronic packaging materials respectively. T.Y. Lim, the application engineer heading the office in Penang, Malaysia, will support all of NuSil's customers, distributors and representatives in Asia.

According to a NuSil representative, Asia has always been a significant site for electronics manufacturing, and the company noticed recent growth in the Asian optoelectronics industry. NuSil has found success in its dedication to providing on-site technical support, as evidenced by the significant growth of its European operation since it opened in 1993. NuSil determined Asia as the logical next step in building a global infrastructure to serve its customers.

"The business in Asia has reached a critical mass, and we realized it was time to open a technical support office to service the region," said Brian Nash, vice president of Marketing and Sales. "We are at a point where we need a presence in Asia, and we found the right person to offer superior service to this important part of the world."
Lim has worked in the electronic/optoelectronic industry for several years as an R&D engineer and in technical support and sales. He has an MSc in Advanced Technology Manufacturing from the University of Portsmouth in England.

The Asia Field Office is located at 9-1 Tingkat Bukit Jambul, Bukit Jambul Indah, 11950, Penang, Malaysia. For more information, visit www.nusil.com.

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Remtec Introduces Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount

Remtec Inc. has introduced new, leadless ceramic SMT hermetic packages for direct PCB mount. Remtec leadless SMT chip carriers, with unique wrap-around interconnections, plugged via holes, hermetic-filled vias and integrated passives, are now available in their fully hermetic (to 10-8) version.

The performance specifications of hermetic SMT packages are very similar to those of non-hermetic products. Plugged via holes with low resistance (less than 1 milliohm) provide for low RF losses below .1dB at 4 GHz. Wraparounds and plugged vias are excellent for ground and signal connections; the SMT enclosures can operate from DC to 32 GHz. High thermal conductivity of vias (greater than 200 W/M x °C) results in a low thermal resistance path providing excellent thermal management. Depending on die size and ceramic base thickness, thermal resistance of 1-2 °C/W and lower can be achieved.

PCTF technology with its ductile structure of plated copper over thick film on ceramic, results in minimizing solder joint stresses during assembly of ceramic packages to PC boards. Therefore, Remtec’s leadless ceramic SMT packages with wraparounds for a direct PCB mount can be fabricated in sizes from .15 to .75 in. square.

In general, packages are available in the following configurations. Most common are SMT leadless ceramic substrates with hermetic via plugs and hermetically soldered (brazed) ring frames; after component assembly, customers may weld a lid. Also, a ceramic ring frame hermetically attached with a low temperature sealing glass is an option. In addition, some customers choose hermetic SMT substrates to which they solder either five-sided metal covers or open ring frames. The performance specifications of all configurations are the same. Integrated resistors, capacitors and inductors can often be incorporated into these packages to reduce size and increase integration levels.
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SUSS MicroTec Introduces the IZI Probe® Card
The only repairable RF probe card with IZI Probe technology

SUSS MicroTec AG has announced the newest member of its renowned IZI Probe® family, the IZI Probe Card. This new solution integrates the unique IZI Probe technology into an RF probe card specifically designed for production test.

As RF and microwave devices become more complex and their operating frequencies increase, there is a significant need to extract scattering parameters (s-parameters) on the production floor. These s-parameters describe the performance of the device under test (DUT) and provide critical feedback for the manufacturing process. To extract the s-parameters in production test, manufacturers typically use RF probe cards, which are expensive and difficult, if not impossible, to repair.

The IZI Probe Card from SUSS is the first RF probe card that integrates the unique, MEMS-manufactured contact technology of the IZI Probe. The IZI Probe Card can test up to 32 RF channels, and when configured with the Multi IZI Probe, RF and DC signals can be tested using one probe card. Long, independent contact springs ensure the best contact with the DUT, overcoming troublesome variations in pad height. In addition, the PCB carrier board is customizable to accommodate SMD’s and other designs.

“The IZI Probe Card is completely repairable”, said Steffen Schott, HF Product Manager at SUSS MicroTec Test Systems. “The probes can be replaced quickly and easily when needed. And due to the IZI Probe contact technology, the lifetime of the IZI Probe Card is guaranteed for more than 1 million contact cycles on aluminum pads. These two traits effectively increase the return on investment for the IZI Probe Card.”

For more information, please visit www.suss.com.

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IPC Certifies 23 Cookson Electronics’ Applications Engineers

Cookson Electronics Assembly Materials global team of 23 applications engineers were trained and certified as IPC Specialists in May. This important training will ensure that the company’s experienced applications team will be able to support product implementations at customer sites, and be able to accurately interpret adherence to core industry standards for circuit assembly.

“At Cookson Electronics, we are focused on helping our customers meet their electronic assembly objectives by providing them with innovative assembly products and the highest possible level of technical assistance,” said Steve Brown, Director – Global Applications Technology. “We train and certify our field applications engineers to the IPC Standards which are used globally by our customers. This is especially important as they transition to lead-free processes in response to the RoHS requirements.

The standards covered in depth during the IPC-executed training session were IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610D Acceptability of Electronic Assemblies.

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IPS Group to Represent Indium Corporation in Southwestern United States
Indium Corporation has announced that the IPS Group has become their representative in the Southwestern United States. The IPS Group is responsible for sales and support of Indium’s solder paste, fluxes, spheres, epoxies, underfills, solder preforms, solder wire, ribbon, foil and ingots throughout Texas, Oklahoma, Louisiana and Arkansas.

The IPS Group was started in 2003. The managing partners, Arthur Roberts and Bill Majure, have a combined 35 years of experience in the electronics industry. According to Tony Przano, Area Sales Manager for Indium Corporation, “The IPS Group has a proven record of sales success and will be a great asset to the Indium Corporation in the Southwest.” For more information on the IPS Group, visit www.theipsgroup.com.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

For more information about Indium Corporation visit www.indium.com.

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Henkel Takes Top Spot Among DAX-listed Companies with Investor Relations Award for Financial Communications
At the 2006 Investor Relations Awards organized by the German business magazine Capital, Henkel came first in the category of DAX-listed companies. The consumer goods and technologies company improved its standing by one further position compared to the previous year. Lothar Steinebach, Executive Vice President Finance of Henkel KGaA, accepted the award at the ceremony held in Frankfurt on June 21.

Commenting on the prize, Steinebach said: “This award demonstrates that our pro-active and transparent financial communications enjoy significant confidence within the capital market. We regard it as both welcome recognition and an incentive to carry on improving. We will continue to further improve our Investor Relations activities.“

Organized by Capital and the DVFA – the German Association for Financial Analysis and Asset Management – this annual ranking of the work carried out by the investor relations departments of listed corporations has been a regular feature since 1997. Henkel has continually improved its standing in recent years, reaching ninth in 2003 and then moving up from fourth in 2004 to second in 2005. The criteria upon which the award is based are transparency, continuity, target group orientation and financial reporting quality.

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:: Issue 11 ::
July 5, 2006