FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world’s leading wafer level bumping company.

This synergistic partnership couples FCI’s cost-effective, high volume, ultra-fine pitch wafer bumping capabilities and 2D Wafer Level CSP package portfolio with Engent’s leadership in advanced surface mount and flip chip assembly technology. The flexible technology platform emerging from this partnership supports a broad range of ultra-high volume integrated circuit packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.

Bob Forcier, CEO of FlipChip International, said “We are excited about our alliance with Engent since it enables our customers to realize the cost and miniaturization benefits of 3D stacking over traditional 2D packaging. It fits perfectly with our Product and Technology Roadmaps.”

Dan Baldwin, CEO of Engent, said “Our customers require both dense integration and high performance in a small form factor. Our alliance with Flip Chip International brings together a world class solution to this packaging challenge. 3D wafer level integration truly enables our customer’s next generation products.

Ted Tessier, Sr. VP Engineering of FlipChip International, said, “The acceptance of WLCSP packaging technologies over the past few years has been unprecedented. The only way to go is up! This strategic alliance is a key step forward for both FCI and Engent in providing the industry with a quantum leap in packaging efficiency and flexibility”.

FlipChip International, LLC is a privately-held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. Flip Chip International, LLC is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for the life science, renewable energy and homeland security markets.

Engent is a provider of advanced electronic manufacturing and technology services. Engent leverages its world-class facilities, highly experienced and educated team to provide solutions to a sophisticated client base which shorten a product’s time to market and which enable products to be manufactured at high volumes.

For further information, please visit www.flipchip.com.

Indium Corporation’s WS-366 is a high-viscosity, water-soluble interconnect flux that offers high yields in the BGA bumping process. Designed for Pb-Free, Sn/Pb, and high lead containing applications, it has excellent solderability and cleanability.

WS-366 has a wide process temperature window and can be used in printing, dipping, and pin transfer deposition processes. In addition to BGA bumping, it can be used in flip-chip applications and board level attachment. Since WS-366’s residue is soluble in room temperature water, it is ideal for use wherever a water-soluble flux with excellent cleanability is desired.

WS-366 is available in cartridges, jars and syringes.

 

Kyocera America, Inc. has announced the following promotions:

Steve Bowen, formerly Executive Account Manager, has been promoted to District Sales Manager for the newly established Phoenix District Sales Office, responsible for managing the office’s sales activities and personnel.

Tony Soldano, formerly Executive Account Manager has been promoted to District Sales Manager for the newly established East Fishkill District Sales Office, responsible for managing the office’s sales activities and personnel.

Antonio Pagkalinawan, formerly Sales Engineer has been promoted to District Sales Manager of the New Jersey District, responsible for managing the office’s sales activities and personnel.

Josh Castleberry, formerly Sales Engineer has been promoted to Sales Product Manager for Electro-Optical (EO) products, responsible for EO sales in the U.S.

Keith Fujii, formerly Layer Division Program Manager, has been promoted to Layer Division Design Manager.

Nancy Platon, formerly Sr. Senior Staff Accountant, has been promoted to Manager of Accounts Payable and General Ledger.

Richard Sabo, formerly Junior Accountant has been promoted to Staff Accountant and assumed the additional responsibilities of Import Administration.

SUSS MicroTec has announced that it has received an order for an ABC200 automated production wafer bonding system from Freescale Semiconductor.

Freescale recently added the MMA7261Q low-g X,Y and Z accelerometer for consumer markets to its' existing family of automotive inertial products. Among the growing uses of these MEMS sensors are GPS systems, free-fall protection for disk drives, camcorder stability control and gaming devices.