:: Corporate Member News ::

:: Bonding Source LLC has Introduced a New Concept for Epoxy and Wire Purchasing (full story)

:: FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies (full story)

:: Remtec’s Large Size Leadless SMT Ceramic Packages for Direct PCB Mount Provide Reliable, Low Cost Solution in a Broad Frequency Range (full story)

:: Interconnect Flux Offers High Yields in BGA Bumping Process (full story)

:: Kyocera America, Inc. Announces Promotions (full story)

:: Freescale Orders Production Wafer Bonding System from SUSS MicroTec (full story)

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Rayma Gollopp at corporatemembers@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Rayma Gollopp at corporatemembers@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Rayma at 202-548-8711. There is no charge for this service, it is offered as part of the corporate membership benefits.


Bonding Source LLC has Introduced a New Concept for Epoxy and Wire Purchasing

Bonding Source LLC, a reseller of specialty materials, enters the microelectronics and RF/Microwave market with a family of epoxies and bonding wire. Bonding Source will be providing immediate delivery of electrically conductive and non-conductive pastes and films manufactured by Ablestik, Emerson & Cuming and Epoxy Technology. Epoxy film pre-forms will be available with a lead-time of one week. An array of gold bonding wire and ribbon manufactured by SPM will be available for immediate delivery. Bonding Source will offer next day delivery of epoxy paste syringes, film sheets, and spools of wire/ribbon so customers do not have to pay high minimum lot charges or scrap limited shelf life material. Scott MacKenzie, president of Bonding Source says; “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery, and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day. It’s like having your own –40c freezer and wire stock down the hallway.

Visit Bonding Source at www.bondingsource.com.

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FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies

FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world’s leading wafer level bumping company.

This synergistic partnership couples FCI’s cost-effective, high volume, ultra-fine pitch wafer bumping capabilities and 2D Wafer Level CSP package portfolio with Engent’s leadership in advanced surface mount and flip chip assembly technology. The flexible technology platform emerging from this partnership supports a broad range of ultra-high volume integrated circuit packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.

Bob Forcier, CEO of FlipChip International, said “We are excited about our alliance with Engent since it enables our customers to realize the cost and miniaturization benefits of 3D stacking over traditional 2D packaging. It fits perfectly with our Product and Technology Roadmaps.”

Dan Baldwin, CEO of Engent, said “Our customers require both dense integration and high performance in a small form factor. Our alliance with Flip Chip International brings together a world class solution to this packaging challenge. 3D wafer level integration truly enables our customer’s next generation products.

Ted Tessier, Sr. VP Engineering of FlipChip International, said, “The acceptance of WLCSP packaging technologies over the past few years has been unprecedented. The only way to go is up! This strategic alliance is a key step forward for both FCI and Engent in providing the industry with a quantum leap in packaging efficiency and flexibility”.

FlipChip International, LLC is a privately-held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. Flip Chip International, LLC is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for the life science, renewable energy and homeland security markets.

Engent is a provider of advanced electronic manufacturing and technology services. Engent leverages its world-class facilities, highly experienced and educated team to provide solutions to a sophisticated client base which shorten a product’s time to market and which enable products to be manufactured at high volumes.

For further information, please visit www.flipchip.com.

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Remtec’s Large Size Leadless SMT Ceramic Packages for Direct PCB Mount Provide Reliable, Low Cost Solution in a Broad Frequency Range

Remtec’s proprietary Plated Copper on Thick Film (PCTF®) technology permits the design and manufacture of leadless ceramic chip carriers and packages larger than .75 inch on a side. These packages, with unique wrap-around interconnections, plugged via holes, hermetic-filled vias and integrated passives, provide improved electrical and thermal performance at lower cost for high circuit/ power density applications.

PCTF technology with its ductile structure of plated copper over thick film on ceramic, results in minimizing solder joint stresses during assembly of ceramic packages to PC boards. Therefore, Remtec’s leadless ceramic SMT packages with wraparounds for a direct PCB mount can be .75 X .75” in size or larger.

Wrap-around interconnections also eliminate use of leads and additional interface boards thus further reducing cost. In addition, they ensure low inductance package connections and can operate at frequency range above 32 GHz. These robust and reliable connections are ideal for SMT soldering and allow simple visual inspection and high assembly yields.

Plugged hermetic via holes with low resistance (less than 1 milliohm) provide for low RF losses below .1dB at 4 GHz and are excellent for ground and signal connections. Also, high thermal conductivity of vias (greater than 200 W/M x °C) results in low thermal resistance path providing excellent thermal management. Depending on a die size and ceramic package thickness, thermal resistance of 1-2 °C/W and lower can be achieved.

Plugged hermetic vias assure package integrity and reliability. They also allow the creation of fully hermetic Integral Substrate Packages (ISP) which is surface mountable.

Integrated resistors, capacitors and inductors can be often incorporated into SMT packages to reduce size and increase integration level.

In addition, Remtec packages are compatible with all standard interconnect assembly techniques including soldering, high temperature die attach, welding and wire bonding. Low tooling and fast turnaround time permit microcircuit designers to bring custom SMT packages into production quicker and with lower engineering costs.

For more information, please visit www.remtec.com.

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Interconnect Flux Offers High Yields in BGA Bumping Process

Indium Corporation’s WS-366 is a high-viscosity, water-soluble interconnect flux that offers high yields in the BGA bumping process. Designed for Pb-Free, Sn/Pb, and high lead containing applications, it has excellent solderability and cleanability.

WS-366 has a wide process temperature window and can be used in printing, dipping, and pin transfer deposition processes. In addition to BGA bumping, it can be used in flip-chip applications and board level attachment. Since WS-366’s residue is soluble in room temperature water, it is ideal for use wherever a water-soluble flux with excellent cleanability is desired.

WS-366 is available in cartridges, jars and syringes.

 

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Kyocera America, Inc. Announces Promotions

Kyocera America, Inc. has announced the following promotions:

Steve Bowen, formerly Executive Account Manager, has been promoted to District Sales Manager for the newly established Phoenix District Sales Office, responsible for managing the office’s sales activities and personnel.

Tony Soldano, formerly Executive Account Manager has been promoted to District Sales Manager for the newly established East Fishkill District Sales Office, responsible for managing the office’s sales activities and personnel.

Antonio Pagkalinawan, formerly Sales Engineer has been promoted to District Sales Manager of the New Jersey District, responsible for managing the office’s sales activities and personnel.

Josh Castleberry, formerly Sales Engineer has been promoted to Sales Product Manager for Electro-Optical (EO) products, responsible for EO sales in the U.S.

Keith Fujii, formerly Layer Division Program Manager, has been promoted to Layer Division Design Manager.

Nancy Platon, formerly Sr. Senior Staff Accountant, has been promoted to Manager of Accounts Payable and General Ledger.

Richard Sabo, formerly Junior Accountant has been promoted to Staff Accountant and assumed the additional responsibilities of Import Administration.

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Freescale Orders Production Wafer Bonding System from SUSS MicroTec

SUSS MicroTec has announced that it has received an order for an ABC200 automated production wafer bonding system from Freescale Semiconductor.

Freescale recently added the MMA7261Q low-g X,Y and Z accelerometer for consumer markets to its' existing family of automotive inertial products. Among the growing uses of these MEMS sensors are GPS systems, free-fall protection for disk drives, camcorder stability control and gaming devices.

 

"Silicon wafer bonding is a critical wafer level packaging technology for Freescale and a key enabling technology for the mass production of cost effective MEMS accelerometers. We chose SUSS MicroTec because of their demonstrated ability to deliver truly automated production wafer bonders to the MEMS industry", said Hemant Desai, MEMS Development Manager at Freescale.

"We are extremely pleased to win the production wafer bonder order at Freescale. It clearly shows that MEMS production customers need high productivity, automated wafer bonding solutions and the SUSS ABC200 cluster tool is certainly the most advanced system in the market today"; said Michael Kipp, General Manager, SUSS MicroTec Wafer Bonder Division located in Waterbury, Vermont, USA.

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:: Issue 9 ::
June 1, 2006