|:: Corporate Member News ::
Bonding Source LLC has Introduced a New Concept for Epoxy and
Wire Purchasing (full
International and Engent Announce Strategic Alliance to Develop
and Deploy 3D Wafer Level CSP Technologies (full
Large Size Leadless SMT Ceramic Packages for Direct PCB Mount
Provide Reliable, Low Cost Solution in a Broad Frequency Range (full
Flux Offers High Yields in BGA Bumping Process (full
:: Kyocera America,
Inc. Announces Promotions (full story)
Orders Production Wafer Bonding System from SUSS MicroTec (full story)
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Source LLC has Introduced a New Concept
for Epoxy and Wire Purchasing
Source LLC, a reseller of specialty materials, enters the
microelectronics and RF/Microwave market with a family of
epoxies and bonding wire. Bonding Source will be providing
immediate delivery of electrically conductive and non-conductive
pastes and films manufactured by Ablestik, Emerson & Cuming
and Epoxy Technology. Epoxy film pre-forms will be available
with a lead-time of one week. An array of gold bonding wire
and ribbon manufactured by SPM will be available for immediate
delivery. Bonding Source will offer next day delivery of
epoxy paste syringes, film sheets, and spools of wire/ribbon
so customers do not have to pay high minimum lot charges
or scrap limited shelf life material. Scott MacKenzie, president
of Bonding Source says; “We decided to start this new
concept in providing specialty materials because we were
always frustrated with how long it took to get a quote, lead-times
on delivery, and minimum charges. In our manufacturing business,
a 4-6 lead-time on material isn’t acceptable to our
customers. Also, we were constantly buying more epoxy than
we could use up before the expiration date. Every year we
were tossing out or reclaiming thousands of dollars worth
of epoxy and wire. We thought that there must be other microelectronics
and RF/Microwave companies experiencing the same pain, and
approached the epoxy and wire manufacturers with the idea.
They have been fully supportive, and the response from the
industry has been tremendous. Bonding Source takes all the
risk by purchasing the epoxy and wire, and the customers
just call up and get what they need the next day. It’s
like having your own –40c freezer and wire stock down
Source at www.bondingsource.com.
|FlipChip International and Engent Announce Strategic Alliance to Develop
and Deploy 3D Wafer Level CSP Technologies
International and Engent today announced a strategic alliance
the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies
for highly integrated stacked die packaging applications.
This technology has the possibility of enabling packaging solutions
that are quicker to market and lower cost than System-On-Chip
alternatives. Engent is a prominent leader in 3D flip chip
assembly and FlipChip International is the world’s
leading wafer level bumping company.
partnership couples FCI’s cost-effective,
high volume, ultra-fine pitch wafer bumping capabilities
and 2D Wafer Level CSP package portfolio with Engent’s
leadership in advanced surface mount and flip chip assembly
The flexible technology platform emerging from this partnership
supports a broad range of ultra-high volume integrated circuit
packaging applications including Silicon on Silicon, GaAs
on Silicon and SiGe on Silicon as well as 3D integration
integrated passive device technologies and MEMS devices for
System in a Stack solutions.
CEO of FlipChip International, said “We
are excited about our alliance with Engent since it enables
to realize the cost and miniaturization benefits of 3D stacking
over traditional 2D packaging. It fits perfectly with our
Product and Technology Roadmaps.”
CEO of Engent, said “Our customers require
both dense integration and high performance in a small
form factor. Our alliance with Flip Chip International brings
together a world
class solution to this packaging challenge. 3D wafer
level integration truly enables our customer’s next
Sr. VP Engineering of FlipChip International, said, “The
acceptance of WLCSP packaging technologies over the
past few years has been unprecedented. The only way to go
strategic alliance is a key step forward for both FCI
and Engent in providing the industry with a quantum leap
in packaging efficiency
International, LLC is a privately-held supplier of products
for the wafer bumping and
wafer scale packaging
semiconductor market. Flip Chip International, LLC
is a wholly owned subsidiary of RoseStreet Labs LLC,
and services for the life science, renewable energy
and homeland security markets.
is a provider of advanced electronic manufacturing and technology
Engent leverages its world-class
highly experienced and educated team to provide
solutions to a sophisticated client base which shorten a
time to market and which enable products to be
manufactured at high
information, please visit www.flipchip.com.
Large Size Leadless SMT Ceramic Packages for Direct PCB Mount
Provide Reliable, Low Cost Solution in a Broad Frequency Range
Remtec’s proprietary Plated
Copper on Thick Film (PCTF®) technology permits the design
and manufacture of leadless ceramic chip carriers and packages
larger than .75 inch on a side. These packages, with unique
wrap-around interconnections, plugged via holes, hermetic-filled
vias and integrated passives, provide improved electrical and
thermal performance at lower cost for high circuit/ power density
PCTF technology with its ductile structure of plated copper
over thick film on ceramic, results in minimizing solder joint
stresses during assembly of ceramic packages to PC boards.
Therefore, Remtec’s leadless ceramic SMT packages with
wraparounds for a direct PCB mount can be .75 X .75” in
size or larger.
Wrap-around interconnections also eliminate use of leads and
additional interface boards thus further reducing cost. In
addition, they ensure low inductance package connections and
can operate at frequency range above 32 GHz. These robust and
reliable connections are ideal for SMT soldering and allow
simple visual inspection and high assembly yields.
via holes with low resistance (less than 1 milliohm) provide
for low RF losses below .1dB at 4 GHz and
are excellent for ground and signal connections. Also, high
thermal conductivity of vias (greater than 200 W/M x °C)
results in low thermal resistance path providing excellent
thermal management. Depending on a die size and ceramic package
thickness, thermal resistance of 1-2 °C/W and lower can
Plugged hermetic vias assure package integrity and reliability.
They also allow the creation of fully hermetic Integral Substrate
Packages (ISP) which is surface mountable.
Integrated resistors, capacitors and inductors can be often
incorporated into SMT packages to reduce size and increase
In addition, Remtec packages are compatible with all standard
interconnect assembly techniques including soldering, high
temperature die attach, welding and wire bonding. Low tooling
and fast turnaround time permit microcircuit designers to bring
custom SMT packages into production quicker and with lower
For more information, please visit www.remtec.com.
Offers High Yields in BGA Bumping Process
Corporation’s WS-366 is a high-viscosity, water-soluble
interconnect flux that offers high yields in the BGA bumping
process. Designed for Pb-Free, Sn/Pb, and high lead containing
applications, it has excellent solderability and cleanability.
has a wide process temperature window and can be used in
printing, dipping, and pin transfer deposition processes.
In addition to BGA bumping, it can be used in flip-chip
applications and board level attachment. Since WS-366’s
residue is soluble in room temperature water, it is ideal
for use wherever a water-soluble flux with excellent cleanability
is available in cartridges, jars and syringes.
|Kyocera America, Inc. Announces Promotions
America, Inc. has announced the following promotions:
Steve Bowen, formerly
Executive Account Manager, has been promoted to District
Sales Manager for the newly established
Phoenix District Sales Office, responsible for managing the
office’s sales activities and personnel.
formerly Executive Account Manager has been promoted to
District Sales Manager for the newly established
East Fishkill District Sales Office, responsible for managing
the office’s sales activities and personnel.
formerly Sales Engineer has been promoted to District Sales
Manager of the New Jersey District, responsible
for managing the office’s sales activities and personnel.
Josh Castleberry, formerly Sales Engineer has been promoted
to Sales Product Manager for Electro-Optical (EO) products,
responsible for EO sales in the U.S.
Keith Fujii, formerly Layer Division Program Manager, has
been promoted to Layer Division Design Manager.
Nancy Platon, formerly Sr. Senior Staff Accountant, has
been promoted to Manager of Accounts Payable and General
Richard Sabo, formerly Junior Accountant has been promoted
to Staff Accountant and assumed the additional responsibilities
of Import Administration.
|Freescale Orders Production Wafer Bonding System from SUSS MicroTec
SUSS MicroTec has announced that it has received an order
for an ABC200 automated production wafer bonding system from
Freescale recently added the MMA7261Q low-g X,Y and Z accelerometer
for consumer markets to its' existing family of automotive
inertial products. Among the growing uses of these MEMS sensors
are GPS systems, free-fall protection for disk drives, camcorder
stability control and gaming devices.
wafer bonding is a critical wafer level packaging technology
for Freescale and a key enabling technology for the mass
production of cost effective MEMS accelerometers. We chose
SUSS MicroTec because of their demonstrated ability to deliver
truly automated production wafer bonders to the MEMS industry",
said Hemant Desai, MEMS Development Manager at Freescale.
are extremely pleased to win the production wafer bonder
order at Freescale. It clearly shows that MEMS production
customers need high productivity, automated wafer bonding
solutions and the SUSS ABC200 cluster tool is certainly the
most advanced system in the market today"; said Michael
Kipp, General Manager, SUSS MicroTec Wafer Bonder Division
located in Waterbury, Vermont, USA.
Issue 9 ::
June 1, 2006