Bundy & Company, M&A Advisors and Business Brokers, is pleased to offer for sale a thick film manufacturing company located in the mid-Atlantic region. The modern 17,000 square foot facility offers laser cutting, thick film printing, etchable thick film, precision laser trimming, and specialty processes, and is currently serving a variety of customers in the imaging, instrumentation, and defense industries. The company excels in a quick-turn, high quality environment, and prides itself on solving complex problems for its customers with flexible, turn-key services.

For further information contact mark@bundyandcompany.com.

Strength and stiffness of steel at one third the density.

CPS Corporation has introduced its new end effectors for automated wafer fabrication machinery. Made from CPS’ metal matrix composite, AlSiC (aluminum silicon carbide), the end effectors have the strength and stiffness of steel at one third the density.

CPS’ end effectors are more cost-effectively manufactured. They offer a lower inertial response, higher stiffness and higher strength than more traditional end effector materials, such as Stainless Steel, Molybdenum, graphite composites, and ceramic. This makes them both ideal for the robotics and automation industries as well as hermetic vacuum compatible.

Norwood, MA. May 12, 2006. Remtec’s proprietary Plated Copper on Thick Film (PCTF®) technology permits the design and manufacture of leadless ceramic chip carriers and packages larger than .75 inch on a side. These packages, with unique wrap-around interconnections, plugged via holes, hermetic-filled vias and integrated passives, provide improved electrical and thermal performance at lower cost for high circuit/ power density applications.

PCTF technology with its ductile structure of plated copper over thick film on ceramic, results in minimizing solder joint stresses during assembly of ceramic packages to PC boards. Therefore, Remtec’s leadless ceramic SMT packages with wraparounds for a direct PCB mount can be .75 X .75” in size or larger.

Wrap-around interconnections also eliminate use of leads and additional interface boards thus further reducing cost. In addition, they ensure low inductance package connections and can operate at frequency range above 32 GHz. These robust and reliable connections are ideal for SMT soldering and allow simple visual inspection and high assembly yields.

Plugged hermetic via holes with low resistance (less than 1 milliohm) provide for low RF losses below .1dB at 4 GHz and are excellent for ground and signal connections. Also, high thermal conductivity of vias (greater than 200 W/M x °C) results in low thermal resistance path providing excellent thermal management. Depending on a die size and ceramic package thickness, thermal resistance of 1-2 °C/W and lower can be achieved.

Plugged hermetic vias assure package integrity and reliability. They also allow the creation of fully hermetic Integral Substrate Packages (ISP) which is surface mountable.

Integrated resistors, capacitors and inductors can be often incorporated into SMT packages to reduce size and increase integration level.

In addition, Remtec packages are compatible with all standard interconnect assembly techniques including soldering, high temperature die attach, welding and wire bonding. Low tooling and fast turnaround time permit microcircuit designers to bring custom SMT packages into production quicker and with lower engineering costs.

For more information, please contact www.remtec.com.