|:: Corporate Member News ::
Indium’s Interconnect Flux Offers High Yields in BGA Bumping
:: Bundy & Company
offers Thick Film Manufacturing Company for Sale (full
SUSS MicroTec Announces Completion of Initial C4NP Reliability
:: CPS Introduces
New Metal Matrix Composite End Effectors (full
Large Size Leadless SMT Ceramic Packages for Direct PCB Mount Provide
Reliable, Low Cost Solution in a Broad Frequency Range (full story)
More Information ::
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Corporate Bulletin. Please send your electronic press releases
to Ann Bell, firstname.lastname@example.org,
before the first
month to be considered for publishing in this bulletin.
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opportunities, please contact Ann Bell at email@example.com or
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company logo included in an upcoming "Fast Links," contact
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contact Brian Schieman at email@example.com or 202-548-8715.
Corporate Fast Links ::
below to learn more about this issue's featured corporate members.
Corporate Members will have the opportunity to place their logo/link
in the "Fast Links" section. To have your company logo
included in an upcoming "Fast Links," email your logo
as a JPEG or GIF to Brian Schieman at firstname.lastname@example.org.
You should also identify which URL to link your logo to. If you
have questions, contact Brian at 202-548-8715. There is
no charge for this service, it is offered as part of the corporate
Interconnect Flux Offers High Yields in BGA Bumping Process
Corporation’s WS-366 is a high-viscosity, water-soluble
interconnect flux that offers high yields in the BGA bumping
process. Designed for Pb-Free, Sn/Pb, and high lead containing
applications, it has excellent solderability and cleanability.
WS-366 has a wide process temperature window and can be used
in printing, dipping, and pin transfer deposition processes.
In addition to BGA bumping, it can be used in flip-chip applications
and board level attachment. Since WS-366’s residue
is soluble in room temperature water, it is ideal for use
wherever a water-soluble flux with excellent cleanability
is available in cartridges, jars and syringes.
For more information, please visit www.indium.com.
|Bundy & Company
offers Thick Film Manufacturing Company for Sale
Bundy & Company, M&A
Advisors and Business Brokers, is pleased to offer for sale
a thick film manufacturing company
located in the mid-Atlantic region. The modern 17,000 square
foot facility offers laser cutting, thick film printing, etchable
thick film, precision laser trimming, and specialty processes,
and is currently serving a variety of customers in the imaging,
instrumentation, and defense industries. The company excels
in a quick-turn, high quality environment, and prides itself
on solving complex problems for its customers with flexible,
For further information contact email@example.com.
|SUSS MicroTec Announces Completion of Initial C4NP Reliability Testing
MicroTec has announced today that initial reliability testing
with IBM for
300mm lead free C4NP solder bumped wafers has been completed
successfully. SUSS is currently building a high volume manufacturing
C4NP tool set for IBM in preparation for production use.
stands for Controlled Collapse Chip Connection - New Process
and is the next generation of wafer bumping technology developed
by IBM. Pioneered by IBM, C4NP is a breakthrough in wafer solder
bump technology, a semiconductor packaging technique that places
pre-patterned solder balls onto the surface of a chip. These
bumps ultimately carry data from individual chips to the rest
of a computing system. C4NP is a simple and cost-effective
alternative to the expensive and difficult electroplating
process. Bulk solder
is injection molded into glass molds and subsequently transferred
from mold to wafer in a single step. C4NP combines the simplicity
and cost effectiveness of solder paste printing with the fine
pitch capabilities of electroplating and is a key enabler of
300mm lead-free solder bumping.
this reliability testing, 300mm wafers were bumped with SnCu
and SnAg solders using
a 200 micron pitch with 1.3 million
per wafer test vehicle. 14.7 mm square chips were joined
to organic buildup chip carriers and subjected to the following
a. JEDEC moisture level 3 preconditioning
b. Shock and vibration
c. Deep thermal cycling (-55 to + 125 C)
d. HAST and THB moisture stressing
e. High temperature storage
h. Construction analysis
i. Alpha emissions
No failures were attributed to the C4NP process.
For more information, please contact firstname.lastname@example.org.
|CPS Introduces New Metal Matrix Composite End Effectors
and stiffness of steel at one third the density.
has introduced its new end effectors for automated wafer
fabrication machinery. Made from CPS’ metal
matrix composite, AlSiC (aluminum silicon carbide), the end
effectors have the strength and stiffness of steel at one
third the density.
effectors are more cost-effectively manufactured. They
offer a lower inertial response, higher stiffness and
higher strength than more traditional end effector materials,
such as Stainless Steel, Molybdenum, graphite composites,
and ceramic. This makes them both ideal for the robotics
and automation industries as well as hermetic vacuum compatible.
CPS’ unique QuickCast™ process, the manufacturer
is able to integrate functional components, such as fiber
optic feeds, wafer shoes, and location pins, into the end
effector during production. The CPS AlSiC near and net-shape
fabrication process both produces the composite material
as well as fabricates the product geometry, resulting in
a cost-effective product and that allows for rapid prototyping.
effectors may be coated with functional coatings including
Ni plating, anodization, and Teflon impregnated anodization.
All CPS parts are custom-made to meet customer specifications.
information, please visit www.alsic.com.
Large Size Leadless SMT Ceramic Packages for Direct PCB Mount
Provide Reliable, Low Cost Solution in a Broad Frequency Range
Norwood, MA. May
12, 2006. Remtec’s proprietary Plated
Copper on Thick Film (PCTF®) technology permits the design
and manufacture of leadless ceramic chip carriers and packages
larger than .75 inch on a side. These packages, with unique
wrap-around interconnections, plugged via holes, hermetic-filled
vias and integrated passives, provide improved electrical
and thermal performance at lower cost for high circuit/ power
PCTF technology with its ductile structure of plated copper
over thick film on ceramic, results in minimizing solder
joint stresses during assembly of ceramic packages to PC
boards. Therefore, Remtec’s leadless ceramic SMT packages
with wraparounds for a direct PCB mount can be .75 X .75” in
size or larger.
Wrap-around interconnections also eliminate use of leads
and additional interface boards thus further reducing cost.
In addition, they ensure low inductance package connections
and can operate at frequency range above 32 GHz. These robust
and reliable connections are ideal for SMT soldering and
allow simple visual inspection and high assembly yields.
Plugged hermetic via holes with low resistance (less than
1 milliohm) provide for low RF losses below .1dB at 4 GHz
and are excellent for ground and signal connections. Also,
high thermal conductivity of vias (greater than 200 W/M x °C)
results in low thermal resistance path providing excellent
thermal management. Depending on a die size and ceramic package
thickness, thermal resistance of 1-2 °C/W and lower can
Plugged hermetic vias assure package integrity and reliability.
They also allow the creation of fully hermetic Integral Substrate
Packages (ISP) which is surface mountable.
Integrated resistors, capacitors and inductors can be often
incorporated into SMT packages to reduce size and increase
In addition, Remtec packages are compatible with all standard
interconnect assembly techniques including soldering, high
temperature die attach, welding and wire bonding. Low tooling
and fast turnaround time permit microcircuit designers to
bring custom SMT packages into production quicker and with
lower engineering costs.
For more information, please contact www.remtec.com.
Issue 10 ::
June 15, 2006