:: Corporate Member News ::

:: Device Packaging Conference Exhibit Hall is Sold Out (full story)

:: CPS Introduces Revolutionary Metal Matrix Composite (full story)

:: New Low-Voiding, Lead-Free Solder Material from Henkel Delivers Advantages for Fine-Pitch Applications (full story)

:: Indium Corporation Wins 2006 Vision Award (full story)

:: QUIK-PAK Introduces New Encapsulation Options (full story)

:: Remtec Develops Proprietary Process To Produce RoHS Compliant, Low Cost Metalized Ceramic (LCMC) Substrates Not Containing High Cost Palladium (full story)

:: More Information ::

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Rayma Gollopp at corporatemembers@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Ferro Electronic Material Systems
SEFAR Printing Solutions, Inc.
Hybrid-Tek, Inc

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," contact Rayma Gollopp at corporatemembers@imaps.org or 202-548-8711.

Device Packaging Conference Exhibit Hall is Sold Out

We are pleased to announce that the 2nd Annual International Conference and Exhibition on Device Packaging has filled the Exhibit Hall to “brimming.”

We are proud that these companies chose Device Packaging ’06 to showcase their products and services.

Arizona State University
Azimuth Electronics, Inc.
CAD Design Software
CMC Interconnect Technologies
Cyber Technologies USA
DuPont Company
EKC Technology
Flip Chip International, LLC
GPD Global
Gryphics, Inc.
Hesse & Knipps, Inc.
Indium Corporation of America
L. Gordon Packaging
MicroFab Technologies, Inc.
NAMICS Technologies, Inc.
Natel Engineering, Inc.
NorCom Systems, Inc.
NuSil Technology
Optical Metrology Innovations
Orthodyne Electronics
Pac Tech USA
Palomar Technologies, Inc.

Phoenix Analysis and Design    Technologies
Photonics Spectra Magazine/Laurin    Publishing
Sikama International, Inc.
Surface Technology Systems Ltd.
TDK Corporation of America
Teledyne Microelectronic Technologies
Utz Technologies, Inc.
West-Bond, Inc.
Xradia, Inc.
Zeland Software, Inc.
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CPS Introduces Revolutionary Metal Matrix Composite

A Solution for High Brightness LED Thermal Management
CPS Corporation offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite ideally suited for thermal management solutions for high brightness LEDs. AlSiC has been tested and meets the requirements of the Restriction of Hazardous Substances Directive (RoHs compliant) of the European Parliament.

AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio.

Meeting the increased thermal behavior requirements for high brightness LEDs, AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC’s high thermal conductivity effectively dissipates heat that can influence LED brightness, efficiency, color, and efficacy and product life time.

The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions. The un-restricted geometry of AlSiC enables the cost-effective inclusion of design features such as cavities, pedestals and alignment features. The unique casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

For more information, please visit www.alsic.com.

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New Low-Voiding, Lead-Free Solder Material from Henkel Delivers Advantages for Fine-Pitch Applications

Continuing to lead the industry with innovative products for lead-free manufacturing, the electronics group of Henkel has announced the development of yet another advanced solder material for today’s Pb-free process requirements. Multicore® LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5mm and 0.4mm. As lead-free manufacturing becomes the norm as opposed to the exception, the ability to reliably process finer pitched devices within Pb-free parameters will be vital. Henkel has anticipated this requirement and has delivered a material solution that addresses the emerging needs of the dynamic electronics market.

Different from competitive products, Multicore LF328 has been formulated to deliver low voiding in BGA joints, which is a characteristic that delivers tremendous production advantages. With superior performance over a wide range of reflow profiles and long abandon time capabilities, Multicore LF328 gives assemblers of advanced electronic devices the flexibility they require when running lead-free processes. The material also provides an outstanding tack force to resist component movement during high speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers superior humidity resistance. These factors, along with the material’s excellent soldering activity on a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper, enable manufacturers to confidently incorporate Multicore LF328 into their lead-free production processes.

In addition to its exceptional process performance, Multicore LF328 also helps lower manufacturing costs and maximizes production efficiencies. The material produces safe residues, which eliminate the need for cleaning, and its post-reflow low color residues simplify the visual inspection process.

For more information, please visit www.electronics.henkel.com.

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Indium Corporation Wins 2006 Vision Award
Indium Corporation’s NF260 No-Flow Underfill earned the 2006 Vision Award at the APEX show in Anaheim, CA. Sponsored by SMT Magazine, the Vision Award recognizes innovativeness, cost effectiveness, speed/throughput improvements, quality contributions, ease of use, maintainability/repairability, and environmental responsibility. This is the second award for Indium’s NF260 No-Flow Underfill, having previously won the Global Technology Award at Productronica in 2005.

NF260 is the world’s first Reworkable, Air Reflowable, Pb-Free No-Flow Underfill. This remarkable product delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over not using an underfill. It also provides cost savings and improved performance.

Designed for Pb-Free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing. The underfill curing is completed in one reflow pass and no post-cure is required. NF260 reduces costs when compared to capillary flow underfills, and also achieves higher yields.

What sets this product apart is its impressive durability in thermal cycling (>2,500 cycles with no failures) and in thermal shock testing. NF260 surpassed endurance expectations, with no failures after more than 450 drop tests. Under similar conditions, unfilled soldered connections typically fail after fewer than 10 drops.
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QUIK-PAK Introduces New Encapsulation Options

Quik-Pak has announced several new options for prototype plastic IC packaging, including remolding, marking, partial open cavity, frames, and clear encapsulant.

Remolding is Quik-Pak’s patented process for prototype encapsulation that maintains the package original JEDEC dimensions. This ensures the plastic prototype device will fit into test sockets and are compatible with automated handling equipment. With the marking option, remolded ICs are pad printed with the customer’s logo and/or part number.

The partial open cavity option is proving useful to IC Design Engineers who need post-assembly access to the die for focused ion beam (FIB), uV erasure, testing, etc. Encapsulation protects the bonded wires, but leaves the die exposed.

Quik-Pak’s proprietary frames enable package modification. Frames can be manufactured to create a non standard open cavity plastic package to accommodate MEMS devices, custom lids and frames.

Clear encapsulant is offered with assembly in either open-cavity plastic or ceramic packages. Advantages of clear encapsulant include ease of wire bonding verification, visual sample of assembled products, replacing x-ray for wire length and other measurements, low dielectric constant, and it is suitable for infrared or visual light transmission application, such as light emitting diodes or optical sensors.

These new options join Quik-Pak’s established encapsulation offerings, which include the epoxy glob-top, the open cavity (no encapsulant), and removable plastic lids. All are available now.

For more information, please visit www.icproto.com.

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Remtec Develops Proprietary Process To Produce RoHS Compliant, Low Cost Metalized Ceramic (LCMC) Substrates Not Containing High Cost Palladium
Remtec Inc. has developed a new, proprietary process for manufacturing cost effective ceramic circuits metalized with nickel-gold plated silver thick films. These versatile, high performance metalized ceramic substrates are an economic substitute for currently used expensive thick film materials containing platinum-palladium and are RoHS compliant.

These new Low Cost Metalized Ceramic (LCMC) substrates, manufactured by a proprietary process which combines thick film processing with Ni-Au plating, are available at a price 25-30% lower than commonly used Pd-Pt-Ag substrates. In addition, the new LCMC substrates offer a number of significant performance advantages.

Performance wise, the most important advantage of the new LCMC circuits is the significant reduction of solder leaching typical of conventional thick film substrates. Solder leaching is especially damaging when using lead free soldering processed at temperatures of 260°C or higher. The LCMC substrates assure more reliable solder connections required for RoHS compliance and can withstand multiple SMT reflow solder cycles and repairs without any noticeable solder leaching.

The tracks resistivity of these substrates (1-2 m?/square) is vastly improved, at least, by a factor of 10 and the substrates can be used in thermally demanding applications up to 170°C continuous operation temperature. Pattern definition can be held to .004” line and spaces; also, Remtec’s LCMC ceramic panels can be fabricated in a 5 x 7” large format.

Combining various thick film metals and selective gold plating techniques results in achieving different types of surface finish. Therefore, the same metalized ceramic substrate yields 2 – 4 µinch gold finish for SMT soldering and welding, 30 – 50 µinch gold finish, which is excellent for gold wire bonding and 100 µinch of gold for brazing and eutectic die attach.

All the features of Remtec’s Plated Copper on Thick Film (PCTF®) technology - multilayers, integrated resistors, plugged via holes, wraparounds and plated thru holes - are also available with the new LCMC products.

Remtec’s new, low cost RoHS compliant LCMC metalized ceramic substrates are currently used for miniature dc/dc converters, sensors, attenuators, RF resonators and filters, low pass filters and other components.

For more information, please visit www.remtec.com.

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:: Issue 3 ::
March 1, 2006