Device Packaging Conference Exhibit Hall is Sold Out

A Solution for High Brightness LED Thermal Management
CPS Corporation offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite ideally suited for thermal management solutions for high brightness LEDs. AlSiC has been tested and meets the requirements of the Restriction of Hazardous Substances Directive (RoHs compliant) of the European Parliament.

AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio.

Meeting the increased thermal behavior requirements for high brightness LEDs, AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC’s high thermal conductivity effectively dissipates heat that can influence LED brightness, efficiency, color, and efficacy and product life time.

The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions. The un-restricted geometry of AlSiC enables the cost-effective inclusion of design features such as cavities, pedestals and alignment features. The unique casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

For more information, please visit www.alsic.com.

Continuing to lead the industry with innovative products for lead-free manufacturing, the electronics group of Henkel has announced the development of yet another advanced solder material for today’s Pb-free process requirements. Multicore® LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5mm and 0.4mm. As lead-free manufacturing becomes the norm as opposed to the exception, the ability to reliably process finer pitched devices within Pb-free parameters will be vital. Henkel has anticipated this requirement and has delivered a material solution that addresses the emerging needs of the dynamic electronics market.

Different from competitive products, Multicore LF328 has been formulated to deliver low voiding in BGA joints, which is a characteristic that delivers tremendous production advantages. With superior performance over a wide range of reflow profiles and long abandon time capabilities, Multicore LF328 gives assemblers of advanced electronic devices the flexibility they require when running lead-free processes. The material also provides an outstanding tack force to resist component movement during high speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers superior humidity resistance. These factors, along with the material’s excellent soldering activity on a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper, enable manufacturers to confidently incorporate Multicore LF328 into their lead-free production processes.

In addition to its exceptional process performance, Multicore LF328 also helps lower manufacturing costs and maximizes production efficiencies. The material produces safe residues, which eliminate the need for cleaning, and its post-reflow low color residues simplify the visual inspection process.

For more information, please visit www.electronics.henkel.com.

Quik-Pak has announced several new options for prototype plastic IC packaging, including remolding, marking, partial open cavity, frames, and clear encapsulant.

Remolding is Quik-Pak’s patented process for prototype encapsulation that maintains the package original JEDEC dimensions. This ensures the plastic prototype device will fit into test sockets and are compatible with automated handling equipment. With the marking option, remolded ICs are pad printed with the customer’s logo and/or part number.

The partial open cavity option is proving useful to IC Design Engineers who need post-assembly access to the die for focused ion beam (FIB), uV erasure, testing, etc. Encapsulation protects the bonded wires, but leaves the die exposed.

Quik-Pak’s proprietary frames enable package modification. Frames can be manufactured to create a non standard open cavity plastic package to accommodate MEMS devices, custom lids and frames.

Clear encapsulant is offered with assembly in either open-cavity plastic or ceramic packages. Advantages of clear encapsulant include ease of wire bonding verification, visual sample of assembled products, replacing x-ray for wire length and other measurements, low dielectric constant, and it is suitable for infrared or visual light transmission application, such as light emitting diodes or optical sensors.

These new options join Quik-Pak’s established encapsulation offerings, which include the epoxy glob-top, the open cavity (no encapsulant), and removable plastic lids. All are available now.

For more information, please visit www.icproto.com.