|:: Corporate Member News ::
Packaging Conference Exhibit Hall is Sold Out (full
Introduces Revolutionary Metal Matrix Composite (full story)
Low-Voiding, Lead-Free Solder Material from Henkel Delivers
Advantages for Fine-Pitch Applications (full story)
Corporation Wins 2006 Vision Award (full story)
Introduces New Encapsulation Options (full
Develops Proprietary Process To Produce RoHS Compliant, Low Cost
Ceramic (LCMC) Substrates Not Containing High Cost Palladium (full story)
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Conference Exhibit Hall is Sold Out
are pleased to announce that the 2nd Annual International
Conference and Exhibition on Device
Packaging has filled the Exhibit Hall to “brimming.”
are proud that these companies chose Device Packaging ’06
to showcase their products and services.
|Arizona State University
Azimuth Electronics, Inc.
CAD Design Software
CMC Interconnect Technologies
Cyber Technologies USA
ESEC USA, Inc.
Flip Chip International, LLC
| Hesse & Knipps, Inc.
Indium Corporation of America
L. Gordon Packaging
MicroFab Technologies, Inc.
NAMICS Technologies, Inc.
Natel Engineering, Inc.
NorCom Systems, Inc.
Optical Metrology Innovations
Pac Tech USA
Palomar Technologies, Inc.
Analysis and Design Technologies
Photonics Spectra Magazine/Laurin Publishing
Sikama International, Inc.
Surface Technology Systems Ltd.
TDK Corporation of America
Teledyne Microelectronic Technologies
Utz Technologies, Inc.
Zeland Software, Inc.
|CPS Introduces Revolutionary Metal Matrix Composite
for High Brightness LED Thermal Management
CPS Corporation offers AlSiC (Aluminum Silicon Carbide), a metal
matrix composite ideally suited for thermal management solutions
for high brightness LEDs. AlSiC has been tested and meets the
requirements of the Restriction of Hazardous Substances Directive
(RoHs compliant) of the European Parliament.
AlSiC enables a tailored coefficient of thermal expansion
(CTE), offering compatibility with various electronic devices
and assemblies. Unlike traditional housing materials, the
isotropic CTE value of AlSiC can be adjusted for specific
applications by modifying the Al-metal/SiC-particulate ratio.
Meeting the increased thermal behavior requirements for high
brightness LEDs, AlSiC also exhibits a high thermal conductivity
that results in extremely efficient thermal dissipation.
Coupled with its superior CTE matching, AlSiC’s high
thermal conductivity effectively dissipates heat that can
influence LED brightness, efficiency, color, and efficacy
and product life time.
AlSiC near and net-shape fabrication process both produces
composite material and fabricates the product
geometry, resulting in a cost-effective product and allowing
rapid prototyping for high volume advanced thermal management
solutions. The un-restricted geometry of AlSiC enables the
cost-effective inclusion of design features such as cavities,
pedestals and alignment features. The unique casting process
enables integration of very high thermal conductivity inserts
(>1000 W/mK) or cooling tubes for more advanced thermal
For more information, please visit www.alsic.com.
Low-Voiding, Lead-Free Solder Material from Henkel Delivers
Advantages for Fine-Pitch Applications
lead the industry with innovative products for lead-free
manufacturing, the electronics group of Henkel
has announced the development of yet another advanced solder
material for today’s Pb-free process requirements. Multicore® LF328
is a halide-free, no-clean, lead-free solder paste designed
for high volume stencil printing applications with CSP lead
pitches of 0.5mm and 0.4mm. As lead-free manufacturing becomes
the norm as opposed to the exception, the ability to reliably
process finer pitched devices within Pb-free parameters will
be vital. Henkel has anticipated this requirement and has delivered
a material solution that addresses the emerging needs of the
dynamic electronics market.
competitive products, Multicore LF328 has been formulated
to deliver low voiding in BGA joints, which
is a characteristic that delivers tremendous production advantages.
With superior performance over a wide range of reflow profiles
and long abandon time capabilities, Multicore LF328 gives
assemblers of advanced electronic devices the flexibility
they require when running lead-free processes. The material
also provides an outstanding tack force to resist component
movement during high speed placement, allows a fast print
speed with low print pressure to minimize board warpage and
offers superior humidity resistance. These factors, along
with the material’s excellent soldering activity on
a wide range of surface finishes including Ni/Au, Immersion
Sn, Immersion Ag and OSP copper, enable manufacturers to
confidently incorporate Multicore LF328 into their lead-free
In addition to its exceptional process performance, Multicore
LF328 also helps lower manufacturing costs and maximizes
production efficiencies. The material produces safe residues,
which eliminate the need for cleaning, and its post-reflow
low color residues simplify the visual inspection process.
For more information, please visit www.electronics.henkel.com.
|Indium Corporation Wins 2006 Vision Award
Corporation’s NF260 No-Flow
Underfill earned the 2006 Vision Award at the APEX show in Anaheim,
CA. Sponsored by SMT Magazine, the Vision Award recognizes innovativeness,
cost effectiveness, speed/throughput improvements, quality contributions,
ease of use, maintainability/repairability, and environmental
responsibility. This is the second award for Indium’s NF260
No-Flow Underfill, having previously won the Global Technology
Award at Productronica in 2005.
NF260 is the world’s first Reworkable, Air Reflowable,
Pb-Free No-Flow Underfill. This remarkable product delivers increased
reliability one order of magnitude over the leading competitor
and two orders of magnitude over not using an underfill. It also
provides cost savings and improved performance.
Designed for Pb-Free assembly, NF260 is fully compatible with
the SMT process and offers a wide process window to accommodate
solder reflow and underfill curing. The underfill curing is completed
in one reflow pass and no post-cure is required. NF260 reduces
costs when compared to capillary flow underfills, and also achieves
What sets this product apart is its impressive durability in
thermal cycling (>2,500 cycles with no failures) and in thermal
shock testing. NF260 surpassed endurance expectations, with no
failures after more than 450 drop tests. Under similar conditions,
unfilled soldered connections typically fail after fewer than
Introduces New Encapsulation Options
Quik-Pak has announced several new options for
prototype plastic IC packaging, including remolding, marking,
partial open cavity, frames, and clear encapsulant.
Remolding is Quik-Pak’s patented process for prototype
encapsulation that maintains the package original JEDEC dimensions.
This ensures the plastic prototype device will fit into test
sockets and are compatible with automated handling equipment.
With the marking option, remolded ICs are pad printed with
the customer’s logo and/or part number.
The partial open cavity option is proving useful to IC Design
Engineers who need post-assembly access to the die for focused
ion beam (FIB), uV erasure, testing, etc. Encapsulation protects
the bonded wires, but leaves the die exposed.
proprietary frames enable package modification. Frames can
be manufactured to create a non standard open cavity
plastic package to accommodate MEMS devices, custom lids and
Clear encapsulant is offered with assembly in either open-cavity
plastic or ceramic packages. Advantages of clear encapsulant
include ease of wire bonding verification, visual sample of
assembled products, replacing x-ray for wire length and other
measurements, low dielectric constant, and it is suitable for
infrared or visual light transmission application, such as
light emitting diodes or optical sensors.
These new options
join Quik-Pak’s established encapsulation
offerings, which include the epoxy glob-top, the open cavity
(no encapsulant), and removable plastic lids. All are available
For more information, please visit www.icproto.com.
|Remtec Develops Proprietary Process To Produce RoHS Compliant, Low
Cost Metalized Ceramic (LCMC) Substrates Not Containing High
|Remtec Inc. has developed a new, proprietary process
for manufacturing cost effective ceramic circuits metalized with
nickel-gold plated silver thick films. These versatile, high
performance metalized ceramic substrates are an economic substitute
for currently used expensive thick film materials containing
platinum-palladium and are RoHS compliant.
These new Low Cost Metalized Ceramic (LCMC) substrates,
manufactured by a proprietary process which combines thick
film processing with Ni-Au plating, are available at a price
25-30% lower than commonly used Pd-Pt-Ag substrates. In addition,
the new LCMC substrates offer a number of significant performance
Performance wise, the most important advantage
of the new LCMC circuits is the significant reduction of
solder leaching typical of conventional thick film substrates.
Solder leaching is especially damaging when using lead free
soldering processed at temperatures of 260°C or higher.
The LCMC substrates assure more reliable solder connections
required for RoHS compliance and can withstand multiple SMT
reflow solder cycles and repairs without any noticeable solder
The tracks resistivity of these substrates
(1-2 m?/square) is vastly improved, at least, by a factor
of 10 and the substrates can be used in thermally demanding
applications up to 170°C continuous operation temperature.
Pattern definition can be held to .004” line and spaces;
also, Remtec’s LCMC ceramic panels can be fabricated
in a 5 x 7” large format.
Combining various thick film metals and selective
gold plating techniques results in achieving different types
of surface finish. Therefore, the same metalized ceramic
substrate yields 2 – 4 µinch gold finish for
SMT soldering and welding, 30 – 50 µinch gold
finish, which is excellent for gold wire bonding and 100 µinch
of gold for brazing and eutectic die attach.
All the features of Remtec’s Plated Copper
on Thick Film (PCTF®) technology - multilayers, integrated
resistors, plugged via holes, wraparounds and plated thru
holes - are also available with the new LCMC products.
Remtec’s new, low cost RoHS compliant
LCMC metalized ceramic substrates are currently used for
miniature dc/dc converters, sensors, attenuators, RF resonators
and filters, low pass filters and other components.
For more information, please visit www.remtec.com.
Issue 3 ::
March 1, 2006