IMAPS 2006 (San Diego) is Rapidly Selling Out of Exhibit Space

Even though IMAPS 2006 is rapidly selling out of exhibit space – there are still a few good spots left. Just visit www.imaps2006.org and view the Interactive Floor Plan, choose your booth and reserve it at the same location.

For information on exhibiting, please contact Ann Bell, abell@imaps.org or 202-548-8717. IMAPS 2006 is being held October 8-12, 2006, at the San Diego Convention Center in San Diego California.

The Direct Products Division of Hover-Davis will be led by Roland Heitmann, with the clear objective of further strengthening its global market position as “The Feeder Company.” The Direct Products Division will be sharply focused on the development, manufacturing, marketing and support of intelligent tape, label, tray, and direct die feeders for the broadest possible range of electronic assembly platforms. The charter of this division will be to continue to provide best-in-class products and services to directly support the needs of end users, while expanding OEM partnerships. “The separation of this activity from our Universal OEM business will provide the necessary focus, autonomy and integrity to allow Hover-Davis to maximize its potential in the general and specialty feeder market segment,” stated Direct Products Division General Manager, Roland Heitmann.

Cookson Electronics Assembly Materials is pleased to announce the launch of its ALPHA® OM-338 PT lead-free no-clean solder paste. This new product offers unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.

"Lead-free pastes have an inherent difficulty with pin test yields. Thanks to our global market intelligence gathering, it looks to be a very promising innovation," said Mitch Holtzer, Cookson Electronics' Global Product Manager. "ALPHA® OM-338 PT is targeted to both EMS and OEM customers using in line circuit testing. OM-338PT was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield."

ALPHA® OM-338 PT lead-free no-clean solder paste is the right product for electronics manufacturers who are currently dissatisfied with their lead-free paste selection, or who have yet to make a decision as the RoHS compliance deadline of July 1, 2006 approaches. In addition to excellent pin testability with virtually no residue on pins, OM-338 PT offers high print speeds (up to 150mm/second, on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and excellent low voiding and anti-slumping characteristics. For additional information go to www.newalphaproducts.com.

A 15-year industry veteran, Buckley has held a variety of development and engineering roles at several electronics industry materials firms. In these positions, he has assisted with the formulation and engineering support for conductive inks, dielectric films and leadframe die attach materials. Most recently, Buckley served as Senior Technical Service Engineer for Henkel in support of leading packaging customers’ die attach processes.

“When developing die attach materials, there are a tremendous amount of variables that must be considered to ensure maximum reliability,” says Zhiwei Cai, Director of Global Product Management for Henkel. “Multiple adhesion surfaces and coatings applied to those surfaces can be difficult to characterize, so a very in-depth knowledge of chemical interactions and optimal material sets is essential for effective management of this critical Henkel product line. Michael’s immense practical industry experience and broad knowledge of chemistry applications makes him the perfect candidate to take on this role.”

Henkel’s die attach product line is unique among its competitors, both for its broad range and patented chemistry advantages. The company’s proprietary BMI (Bis-Maleimide) chemistry delivers increased throughput by enabling curing time efficiencies and allows adhesion to pre-plated surfaces, while its PTFE-filled pastes provide robust process advantages for stacked die applications, where fragile devices must be protected.