|:: Corporate Member News ::
2006 (San Diego) is Rapidly Selling Out of Exhibit Space (full
Establishing Direct Products Division – Co-founder John Hover
to Retire (full
Electronics' New ALPHA® OM-338 PT Lead-Free Solder Paste
Delivers Best-in-Class Pin Testability (full
:: Henkel Appoints
Global Product Manager for Die Attach (full
More Information ::
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IMAPS 2006 (San Diego) is Rapidly Selling Out of Exhibit Space
though IMAPS 2006 is rapidly selling out of exhibit space – there
are still a few good spots left. Just visit www.imaps2006.org and view the Interactive Floor Plan, choose your booth and
reserve it at the same location.
information on exhibiting, please contact Ann Bell, firstname.lastname@example.org or
2006 is being held October 8-12, 2006, at the San Diego
Convention Center in San Diego California.
Establishing Direct Products Division – Co-founder John
Hover to Retire
Direct Products Division of Hover-Davis will be led by Roland
Heitmann, with the clear objective of
further strengthening its global market position as “The
Feeder Company.” The Direct Products Division will be
sharply focused on the development, manufacturing, marketing
and support of intelligent tape, label, tray, and direct die
feeders for the broadest possible range of electronic assembly
platforms. The charter of this division will be to continue
to provide best-in-class products and services to directly
support the needs of end users, while expanding OEM partnerships. “The
separation of this activity from our Universal OEM business
will provide the necessary focus, autonomy and integrity to
allow Hover-Davis to maximize its potential in the general
and specialty feeder market segment,” stated Direct
Products Division General Manager, Roland Heitmann.
catalyst for this corporate realignment is John Hover’s
decision to retire from Hover-Davis. "We are saddened
that John has decided to transition out of the business," said
Roland Heitmann, "however, we wish him a healthy and
happy retirement, and are glad he will now be able to enjoy
his numerous outside interests. He will remain close for
support and guidance, as we continue to build upon his accomplishments.
John has truly made a major contribution to our industry,
and has had a strong positive influence on all of us."
|Cookson Electronics' New ALPHA® OM-338 PT Lead-Free Solder Paste
Delivers Best-in-Class Pin Testability
Electronics Assembly Materials is pleased
to announce the launch of its ALPHA® OM-338 PT
lead-free no-clean solder paste. This new product offers unparalleled
pin testability, while allowing high print speeds and delivering excellent throughput and yield.
pastes have an inherent difficulty with pin test
yields. Thanks to our global market intelligence gathering,
it looks to be
a very promising innovation," said Mitch Holtzer, Cookson
Electronics' Global Product Manager. "ALPHA® OM-338
PT is targeted to both EMS and OEM customers
using in line circuit testing. OM-338PT was
developed to reduce the number of false negatives
recorded when pin probes are used, resulting in
increased throughput and yield."
PT lead-free no-clean solder paste is the right product for
electronics manufacturers who are currently dissatisfied
with their lead-free paste selection, or who have yet to
make a decision as the RoHS compliance deadline of July 1,
2006 approaches. In addition to excellent pin testability
with virtually no residue on pins, OM-338
PT offers high print speeds (up to 150mm/second, on 12 mil squares and 10 mil
circles), compatibility with both Rheopump and Pro-Flow, electrical reliability
(passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding
excellent joint appearance, and excellent low voiding and anti-slumping characteristics.
For additional information go to www.newalphaproducts.com.
|Henkel Appoints Global Product Manager for Die Attach
in a series of recent strategic personnel appointments designed
to leverage the company’s vast intellectual
capital and further solidify its standing as the world’s
leading materials supplier and developer, the electronics group
of Henkel recently announced the promotion of Michael Buckley
to Global Product Manager for Die Attach.
15-year industry veteran, Buckley has held a variety of development
and engineering roles at several electronics industry materials
firms. In these positions, he has assisted with the formulation
and engineering support for conductive inks, dielectric films
and leadframe die attach materials. Most recently, Buckley
served as Senior Technical Service Engineer for Henkel in
support of leading packaging customers’ die attach
developing die attach materials, there are a tremendous amount
of variables that must be considered to ensure maximum reliability,” says
Zhiwei Cai, Director of Global Product Management for Henkel. “Multiple
adhesion surfaces and coatings applied to those surfaces
can be difficult to characterize, so a very in-depth knowledge
of chemical interactions and optimal material sets is essential
for effective management of this critical Henkel product
line. Michael’s immense practical industry experience
and broad knowledge of chemistry applications makes him the
perfect candidate to take on this role.”
die attach product line is unique among its competitors,
both for its broad range and patented chemistry advantages.
The company’s proprietary BMI (Bis-Maleimide) chemistry
delivers increased throughput by enabling curing time efficiencies
and allows adhesion to pre-plated surfaces, while its PTFE-filled
pastes provide robust process advantages for stacked die
applications, where fragile devices must be protected.
Issue 8 ::
May 15, 2006