:: Corporate Member News ::

:: Kulicke & Soffa Closes Purchase of Alphasem (full story)

:: Indium Corporation Expands Sales Efforts in France with New Distributor (full story)

:: Asymtek Names Frank Wang to Position of General Manager, China (full story)

:: Hesse & Knipps Reveals Benefits of New Heavy Wire Bonder (full story)

:: Five Star Technologies Named Nanotech Startup with World’s “Top Commercial Viability” (full story)

:: Northeast Announces Laboratory Upgrade (full story)

:: NuSil Technology Introduces One-Part Glop-Top for Electronic Packaging Applications (full story)

:: Quik-Pak Announces Installation of Wafer Dicing Saw (full story)

:: First Level Inc. has formed a collaboration with SMT Manufacturing Group, LLC (full story)

:: Dr. Peter Barnwell to lead Barry into Europe (full story)

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Hesse & Knipps
Circuit Solutions

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

Kulicke & Soffa Closes Purchase of Alphasem

Kulicke & Soffa Industries, Inc. has closed the previously announced purchase of Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International, Inc., a subsidiary of Dover Corporation. The purchase price was $27.1 million in cash, after a working capital adjustment and subject to further post closing adjustments.

Scott Kulicke, K&S chairman and chief executive officer, commented on the acquisition, “We had identified die bonding equipment as a natural growth path for K&S. The Alphasem purchase is the most attractive way for us to enter that market. Alphasem has good position in the die bonder market, serving a wide range of applications. Their line of products fulfills the market needs for leading edge technology and cost efficient solutions across a variety of package types.”

He concluded, “This acquisition is a step forward in our strategy to extend our core products and technologies. K&S is enthusiastic about entering the die bonder market. We believe this acquisition will bring real value to the Company and to our shareholders, as we expand the K&S role in the semiconductor assembly process.”

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Indium Corporation Expands Sales Efforts in France with New Distributor

Indium Corporation announced an expansion of its sales efforts in France with the addition of Accelonix Group, its newest distributor.  Accelonix is responsible for selling Indium Corporation’s extensive line of Semiconductor Packaging Assembly Materials, Engineered Solders, and Materials for Wafer and Chip Bumping, as well as Solder Pastes, Fluxes, Cored Wire, and Underfills for non-PCB assembly.
Accelonix Group is located in France and has been introducing, selling, and supporting products in the French electronics market since 1984.  Their expertise and high-performance technical team have given them the essential support and service strengths required by today’s electronics assembly industry.  
According to Alan Fairbairn, Market Development Manager for Indium’s European Engineered Solders business, “Accelonix has extensive knowledge of the microelectronics business in France, covering all market and application sectors.  I have the highest regard for their expertise and professionalism and welcome them as an integral part of the European sales team.”

For more information, please visit www.indium.com.
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Asymtek Names Frank Wang to Position of General Manager, China

Asymtek China business has grown over 400% in the past two years

Asymtek, has announced that Frank Wang has been named to the position of General Manager, China.  Wang is responsible for all facilities, operations, sales, and support services for Asymtek’s dispensing products and systems in China.  In the past two years, Asymtek has expanded in China from 2 employees and one office to 13 employees and three offices plus two applications labs with a third lab expected to open next year.  Business in China has grown more than 400% in the past two years.

Wang has 20 years of experience in the semiconductor capital equipment, electronics, and industrial automation industries.  He joined Asymtek in 2004 as China Regional Business Manager.  Prior to Asymtek, Wang held positions in business operations, product sales and marketing, and technical support at multinational companies in the United States and Europe including Applied Materials and Siemens.  He has a BSE from China University of Mining and Technology (CUMT) and an MBA from American Intercontinental University.

“Asymtek is the leader in the China dispensing market,” said Frank Wang.  “I am very confident that with our quality and innovative dispensing technology and strong application and customer support we will continue to grow.”
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Hesse & Knipps Reveals Benefits of New Heavy Wire Bonder

Hesse & Knipps, Inc., announces that the company will soon release its newest product, the BONDJET BJ910 Heavy Wire Bonder.

The BONDJET BJ910 will provide users with enhanced process monitoring capabilities including wire deformation, ultrasonic current and non-destructive pull- and shear testing. The new bonder will be the only heavy wire bonder available with an integrated pull- and shear test feature to provide real time quality feedback and eliminate the need for additional bond test equipment. The BJ910, with first shipments to customers planned for early 2007, will also offer:

  • A patent-pending electronic toolkit that greatly improves the reliability of bondhead setup utilizing an inspection camera and graphical alignment guides for the wedge, wire guide, wire and knife
  • A large work area that enables multi-lane handling solutions, eliminating indexing time.

“We are excited about the upcoming launch of our next generation heavy wire bonder,” said Joseph Bubel, president of Hesse & Knipps, Inc. “This is a state-of-the-art machine that addresses customer requirements in a market that has waited for these types of technical advancements for quite some time.”


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Five Star Technologies Named Nanotech Startup with World’s “Top Commercial Viability”

Five Star Technologies has been named the nanotechnology startup with the “top commercial viability” by Lux Research, Inc. (www.luxresearchinc.com).  Lux Research, a leading analyst research firm, reached its conclusion after studying a group of 136 venture-capital-backed companies around the world with significant nanotechnology capabilities.

The report said that Five Star Technologies’ high number of applications on the market, and attractive price/performance improvements over traditional materials, are primary reasons that Five Star Technologies leads the commercial viability category.  That category, the report said, measures how able companies are at taking their science projects from the lab to the factory and the marketplace.

“We’re gratified, but not surprised at Lux Research’s conclusions,” says Tim Fahey, vice president, business development for Five Star. “As we are discovering from our joint tests with customers, Five Star’s ability to customize a wide range of particles to either the micron or nanoscale and then maintain them in stable dispersions, is genuinely unique.  This capability, which allows customers to economically produce circuit features with greater detail and precision, is essential for current and future generations of a wide range of microelectronics products.” 

“At the recent IMAPS show in San Diego, we formally introduced to the entire industry the advantages that we have been delivering to customers in semiconductor packaging.  The translation of our unique dispersions into enhanced thermal and electrical performance has attracted a lot of attention.”

“Similarly, we also experienced tremendous interest at the IMI conference on printable electronics and displays.  Clearly, producers of various types of flat panel displays are frustrated by the high cost and processing problems they experience with “nano-inks.”  The fact that Five Star can deliver sub-micron dispersions and inks that meet today’s line-width targets and are process-stable, affordable and deliverable in metric-ton quantities, got everyone’s attention.”

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Northeast Announces Laboratory Upgrade

Northeast Electronics Corporation announces the recent purchase and installation of a Perkin-Elmer Optima 2100 DV ICP-OES.  Inductively Coupled Plasma–Optical Emission Spectrometer is a significant improvement over traditional AA (Atomic Absorption) methods of elemental analysis.

This new hardware upgrade enables Northeast personnel to rapidly monitor and control plating bath contents to PPB (parts per billion) accuracy.  An additional benefit of this instrumentation adds significant capability to Northeast’s environmental program.  Waste water analysis is enhanced in terms of speed and accuracy.

Northeast Electronics, founded in 1961, is a full-service manufacturer of glass-to-metal hermetic seals.  These seals have found applications spanning a multitude of disciplines within the electronics industry. 

For more information, visit us on the web at http://www.northeast.com.

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NuSil Technology Introduces One-Part Glop-Top for Electronic Packaging Applications

NuSil Technology announces the addition of EPM-2411-2, a low outgassing, one-part, silicone glop-top, to its line of electronic packaging materials (EPMs).

NuSil's EPM-2411-2 is designed for the encapsulation of chip packages in devices where outgassing-related contamination poses a problem. This product exhibits the low stress and wide operating temperature ranges that are characteristically associated with silicone-based materials.

"We constantly look for ways to increase the efficiency of our products in customers' production and assembly lines," said Brian Nash, vice president of Marketing and Sales. "This one-part material eliminates the time-consuming process associated with mixing a traditional two-part system and is ready to go out of the box."

EPM-2411-2 is stored and shipped frozen in 3cc and 30cc syringes, as well as 3- and 6-oz. tubes. For more information, please contact NuSil Technology directly at 805-684-8780 or visit www.nusil.com/glop_top.

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Quik-Pak Announces Installation of Wafer Dicing Saw

Quik-Pak, a division of Delphon Industries, has announced the installation of a new 200mmm Disco Automatic Wafer Dicing Saw in it’s recently expanded facilities in San Diego.  The new in-house capability complements Quik-Pak’s existing rapid turn IC assembly service offerings, which include die bonding, gold ball wire bonding, remolding and marking/branding.  Quik-Pak is also the largest supplier of open cavity plastic packages, which allow IC designers to insert new die in existing production packages for design verification, testing and customer samples.

“The addition of this top-of-the-line dicing equipment will allow Quik-Pak to further reduce prototype turn times for our customers – enabling us to receive a wafer in the morning and ship completely assembled components that same day,” stated Quik-Pak General Manager, Steve Swendrowski.  

The new dicing service can either be utilized as part of Quik-Pak’s turn-key packaging and assembly process for fabless semiconductor companies or as a stand-alone service for customers with internal assembly capability.

For further information, please visit moreinfo@icproto.com.


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First Level Inc. has formed a collaboration with SMT Manufacturing Group, LLC

The arrangement will expand services to our customers by adding the capability for SMT-High volume production.

First Level Inc. provides Electronic Manufacturing Services (EMS) specializing in miniaturization of Microelectronic Packaging & precision placement assembly of surface mount components. Applications include Electronic Sensors, Optoelectronics, LCD, Microwave, Medical Devices, Light Engines, Aerospace, Hybrid/Custom Modules. Expertise in Flip Chip, Die Bonding and Wire Bonding Techniques.

SMT Manufacturing provides quick turn /high volume.delivery of SMT(fine pitch) board assemblies. Capabilities include SMT or thru- hole RoHS( Lead Free) processing, chip on board, Conformal coating, Wire Harness/Wiring and electrical testing. Expertise in RF/Microwave assembly.


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Dr. Peter Barnwell to lead Barry into Europe

Dr. Peter Barnwell has been appointed as European Business Manager for Barry Industries. Peter will be based in the UK with responsibility for the sales and marketing activity throughout Europe.

Welcoming Peter, Richard Barry, Barry Industries President said, “Peter Barnwell brings a wealth of experience to the Barry team having had a long and successful career in the microelectronics packaging and contract electronics manufacturing industries.  He has a unique background combining design, manufacturing, and business management.  He worked for several years in the industry in the USA, with a particular involvement in microwave technologies and in 2002/2003 was President of the International Microelectronics and Packaging Society (IMAPS) based in Washington DC.  This unusual blend of commercial and technical expertise provides an excellent fit with the Barry strategic business plan.”

In accepting the appointment, Peter commented, “I welcome this opportunity to develop the Barry business within Europe.  There is a strong European industry in telecommunications and RF related activities which will be ideally addressed by the Barry solutions based technologies and manufacturing resources.  This technically driven and supported capability will provide an outstanding solution to our customer’s needs."


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:: Issue 19 ::
November 15, 2006

National Training Center