:: Corporate Member News ::

:: New Owners at Accu-Tech (full story)

:: AdTech Ceramics Provides Technical Solutions for Multi-Layer Ceramic Package Requirements (full story)

:: SSEC Announces New Technical Support Manager (full story)

:: Aerotech Gantry Systems (full story)

:: Avure Technologies, Inc. Taps Top Executives for Global Team (full story)

:: Compunetics Installs State of the Art Plating Line (full story)

:: Welcome to the World of High-Performance Ceramics from CeramTec (full story)

:: Blue29 Now Offers Advanced Low-cost Electroless Films for Packaging Applications (full story)

:: CDS Announces the Release of Version 7.4 (full story)

:: Indium Corporation Assists Special Olympians (full story)

:: Finetech to Showcase High Accuracy Bonder at IMAPS 2006 (full story)

:: Datacon’s (now BE Semiconductor) Multi-Chip Die Bonder (full story)

:: Gannon & Scott announces the following: (full story)

:: H.C. Starck Develops Thermal Management Components for HB-LEDs and Laser Diodes (full story)

:: MicroScreen Introduces Quick Ship Program for Thick Film Screens (full story)

:: Newport Corporation Exhibits the 5 Micron MRSI-M5 Assembly Work Cell at IMAPS 2006 (full story)

:: Alphasem AG Appoints New Country Manager Americas (full story)

:: Polese is now Plansee Thermal Management Solutions (full story)

:: Gate Leakage Testing from Silicon Cert Ltd. (full story)

:: “MicrobondGecko” – Leadfree Die-Attach Adhesive for Power Devices from Umicore (full story)

:: IC Interconnect Announces Expansion of Offering (full story)


:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Mini Systems Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

New Owners at Accu-Tech

Accu-Tech Laser Processing has new ownership due to the retirement of long time President and owner, Jim Byrum.  Accu-Tech, a leader in drilling, cutting and scribing of all types of metals, ceramics and plastics, plus printed circuit board micro via drilling and skiving, has been acquired by Roger Underwood and Mike Gericke.  The majority of the staff will remain under the new leadership.  Mike and Roger invite you to stop by and meet them at booth #442 in San Diego this October.

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AdTech Ceramics Provides Technical Solutions for Multi-Layer Ceramic Package Requirements

AdTech’s special material capabilities include HTCC, AlN, LTCC and chemical milling with a variety of materials. Product capabilities include custom advanced packages, high frequency feedthroughs, power dissipation packages, custom pin grid arrays, microwave packages with design assistance, and multichip modules, substrates and packages. Additional material and technology capabilities include Injection Molding, Pt Cofire Ceramics and HD Alumina.

For more information, please visit www.adtechceramics.com.


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SSEC Announces New Technical Support Manager

As part of its continuing commitment to comprehensive support for the needs of its customers, Solid State Equipment Corporation has promoted Ramey Youssef to become Technical Support Manager.  In this new position, Ramey will be responsible for providing rapid, technical resolutions to customers, in addition to project management responsibilities.  

Mr. Youssef brings an industry background to the job, with experience in device fabrication, including a formal education in Chemical Engineering.  At SSEC, Ramey has been intensively involved in system configuration, construction, and service, building intimate familiarity with the products and our customers’ needs and priorities.  He has both the technical proficiency and managerial capability to provide rapid solutions for SSEC’s valued customers.

For further information, please visit www.ssecusa.com.

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Aerotech Gantry Systems

Aerotech gantry systems utilize our own brushless linear servomotors to meet the needs of a variety of gantry customers from assembly, electronic assembly, and electronic manufacturing to vision systems and industrial automation. These industrial robots are available in models from low-cost modular linear actuators assembled in a gantry configuration with matching motion control and drives, to sophisticated gantry models with the largest travel, highest speed, and highest acceleration available. Aerotech has over 30 years of experience in brushless linear motor design, motion controllers, and drives that permits us to offer a complete gantry solution that perfectly fits your gantry application.

For more information, please visit www.aerotech.com.

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Avure Technologies, Inc. Taps Top Executives for Global Team

Avure has announced the addition of four executives to its worldwide management team.  The additions bring a complement of highly experienced and talented leadership at a time of surging growth for the company and reflect its commitment to a strong future of global expansion, according to Pat Adams, Avure’s President and Chief Executive Officer.

“Since The Gores Group acquired Avure Technologies late last year, we have been on a worldwide search for an executive team to take Avure to the next level.  Building on our long-standing world-class technical expertise and customer focus, the addition of these key individuals will enable Avure to rapidly seize current and emerging market opportunities,” says Adams. 

According to Adams, these individuals were selected due their individual commitment to excellence, their unique experience in growing global companies and their understanding of the key elements needed for Avure to help our customers be more successful.

Steve Johnson, Chief Financial Officer is responsible for Avure’s financial strategy, including acquisitions/divestitures, liquidity, and risk management.  Johnson joins Avure from The Gores Group, where he was vice president finance, and responsible for day-to-day financial oversight of several companies within the private equity group’s $400 million fund.  Prior to Gores, Johnson was director of acquisition analysis and integration for First Data Corporation and corporate transaction services manager, Accenture.  He began his career in banking, in capital markets.  Johnson studied at Collegio Mayor de San Agustin in Madrid, Spain and holds a Bachelor of Science degree in Economics from the Boston College.

Robert Cain, Senior Vice President of Operations, will oversee Avure operations worldwide, Cain comes to Avure from Ecco Corporation where he was vice president of operations in charge of streamlining business processes and implementing lean manufacturing practices.  Prior to that time, he held the position of president of the European Division for SCP Global Technologies, where he also held the posts of vice president special projects and vice president of engineering.  He held positions as operations manager at Morrison Knudsen’s locomotive division and at The Boeing Company.  Cain has a Master of Business Administration from City University, Bellevue, Washington, with understudy in Engineering.

Anthony Orelli, Vice President of Global Sales is responsible for unifying Avure’s sales strategy and expanding the company’s global representation.  Orelli was tapped for the top sales position because of his sales experience in capital equipment and his expertise in opening multiple markets.  Before joining Avure, Orelli was managing director of Antor Associations, a consulting group that specializes in developing strategies and identifying new markets for small companies.   Fluent in English, French, German and Italian, Orelli has spent a significant portion of his career living and working in Europe.  Prior to Antor, Orelli worked as vice president of sales, marketing and strategic development for Micromatic Textron, as general manager of commercial operations for Leitz, Dea, Brown & Sharpe, general manager for Europe for Ingersoll Rand, general manager for Europe for Anorad, and vice president for Europe for Flow Systems; all four posts in Europe.  Orelli has a Masters in Engineering Management from New York University, and a Bachelor of Engineering, Industrial Engineering, from New York University.

Glenn Hewson, Vice President of Global Marketing is responsible for the development and execution of Avure’s product and go-to-market strategy, and strategic alliances.  Hewson has more than 19 years experience in product line development, marketing and business development in high technology, process and manufacturing markets.   Before joining Avure, Hewson worked for Select Business Solutions as Vice President of Worldwide Marketing and Strategic Partnering where he was responsible for product line management, marketing strategy and corporate development.   Prior to Select, he was Area Vice President of Marketing and Business Development for SMB at Peregrine Systems, now Hewlett Packard.  Hewson began his carrier at IBM.  His career spans mature companies, start-ups, coordinated business units and global organizations. He has a Bachelor of Business Administration from Southern Methodist University in Dallas, Texas with concentrations in finance and accounting.


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Compunetics Installs State of the Art Plating Line

Compunetics is pleased to announce the installation of a Model 990D Electroless Copper Processing System.  This system is manufactured by Chemcut Corp of State College, Pa and uses chemistry from Attotech USA.

The Model 990D system, a conveyorized horizontal electroless  copper plating line is approximately 46 feet long and 6 feet wide. It can process a wide variety of substrates with the highest reliability, from standard FR-4 laminates to exotic polyimide and Teflon based rigid and flexible materials.  It allows seamless processing of ultra thin double sided and rigid panels  (up to a thickness of 0.300”). It is built to target the most demanding technologies (such as microvias and high aspect ratio holes) within the same operating framework.

One of the most remarkable features of the new 990D line is it’s integral real time process controls.  All process  stations are equipped with automatic bleed and feed systems to help maintain the chemistry at peak performance.

The installation of the line started in June and the setup of its process controls has been ongoing for the past few months. As of this date the line is running in a production mode under engineering supervision.  It is building high quality products and meeting the challenging SPC goals defined by Compunetics as part of the acceptance criteria.

Compunetics is pleased to exhibit at the 2006 IMAPS show in San Diego in booth # 1008.  A wide variety of very high density interconnect products will be on display.

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Welcome to the World of High-Performance Ceramics from CeramTec

CeramTec specializes on the development, the production and distribution of innovative products made from ceramic materials. Major markets include the electronics, telecommunications, automotive, medical, machinery, metalworking, electrical and chemical industries. With a turnover of 300 Mio Euro in 2005, 2900 employees world-wide at 13 production sites in Europe, USA and Asia CeramTec is an international leading supplier of high-performance ceramics with over a century of experience and tradition.

The CeramTec division Electronics Applications produces Rubalit® and Alunit® substrates for hybrid and micro-electronics, power electronics as well as for thick- and thin-film technology, also metallized. Production processes range from dry pressing, lasering, stamping and/or metallizing, depending on the application. Further products are metallized substrates for SMD inductivities and Ceramic tapes for LTCC applications and ZrO2 tapes. The division also makes ceramic cores as upstream products for use in high-performance and precision resistors.

For more information please visit www.ceramtec.com.

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Blue29 Now Offers Advanced Low-cost Electroless Films for Packaging Applications

Proven in 45-nm BEOL wafer-fab applications, Blue29’s electroless deposition systems now deliver advanced Co and Ni alloy films for packaging applications, including UBM stacks, RDL passivation, wire bond barriers and more.  Customized Co alloys offer better barrier performance while electroless deposition provides up to 50% cost savings over patterned films.  For more information, stop by at IMAPS 2006 - San Diego (#320) or visit us at www.blue29.com.

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CDS Announces the Release of Version 7.4

CAD Design Software releases the latest version of their leading-edge circuit layout tools for the IC packaging, RF/Microwave, Hybrid/MCM, and PCB layout industries, incorporating advanced interoperability capabilities.

 Two years in development, Version 7.4 is the largest and most extensive expansion of CAD Design Software’s high-end EDA tools and is the culmination of extensive collaborative relationships with many industry leaders in the U.S., Japan, and Asia in the Semiconductor Packaging, Hybrid/MCM, IC Test, and RF/Microwave fields.

“Because of our ongoing partnership with the top industry leaders, we have not only been able to rapidly implement enhancement requests, but have been able to jointly develop new layout solutions for emerging technologies as well as create previously unavailable 3D manufacturing verification systems. This has resulted in our most advanced and expanded 3D layout solutions for leading-edge IC packaging, IC Test, RF, and MCM layout”, said Gordon Jensen, president of CAD Design Software. 

More robust, sophisticated algorithms for faster processing and CAD Design Software’s award-winning Bond Wire Optimization and 3D design tools are among the hundreds of enhancements and improvements that help reduce design time, improve overall time-to-market, and verifiably improve yields.

CAD Design Software‘s Version 7.4 is unsurpassed in features, functions, and most of all, flexibility. CAD Design Software leads the EDA industry with the most rapid development and implementation of new tools for emerging high-end new technologies for its customers. This has resulted in many industry firsts, including Stacked Die, 3D design, automated IC package routing, co-development and design-for-manufacture (DFM) platforms.

Version 7.4 is available now from CAD Design Software and its channel partners. For more information visit us at www.cad-design.com.

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Indium Corporation Assists Special Olympians

Indium Corporation participated in the Special Olympics Airlift, which provides transportation to over 1,500 athletes from all over the country to the 2006 US National Games in Ames, Iowa, USA.  In a well-coordinated effort synchronized by the Cessna Corporation, 235 volunteer Cessna Citations transported the athletes to Iowa for the start of the games, then back home again after the closing ceremonies.

Thanks to dedicated volunteers and pilots, Chuck Valuckas and John Ferriter, Indium Corporation donated its business jet to ensure that athletes were delivered safely to and from the games.

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Finetech to Showcase High Accuracy Bonder at IMAPS 2006

FINETECH announces that it will highlight the Fineplacer® Lambda in booth 724 at the upcoming IMAPS 2006 trade show and exhibition, scheduled to take place, October 10-12, 2006, in San Diego, Calif.

The manual version of the system (on display at IMAPS) is used for the most sophisticated die-attach tasks, such as bonding of flip chips, micro electro mechanical components (MEMS), micro opto-electro mechanical components (MOEMS) and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy on the manual system is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V model. Additionally, the system can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system. 

A significant feature of the manual configuration is the FA7 heating plate, which offers the following benefits: 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per second; excellent thermal conductivity; very low thermal expansion; programmable up to 400°C; and optional heated inert gas integration.

The automated configuration of the Lambda provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.   Advantages of this version include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.

Applications for the Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, adhesive technologies, and MEMS/MOEMS placement.
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Datacon’s (now BE Semiconductor) Multi-Chip Die Bonder

Datacon, the world’s leading supplier of advanced packaging equipment, is entering the growing memory chip market with its bonders. Booming multimedia applications like the iPod have led to a booming demand for NAND flashes. To expand their capacity, leading manufacturers of NAND flashes have opted for the memory chips produced in stacked die technology for the 2200 evo from Datacon. At the same time a technology shift is under way in classic DRAM memory, as higher clock frequencies call for a change in packages to flip chip technologies – a core competence of the high-tech company’s 8800 FC Quantum.

Datacon’s twin-head multi-chip die bonder 2200 evo is used in NAND flash production to eject the delicate thin dies. The high yield of more than 99.95% combined with the high precision and high throughput make the machine the ideal choice for the high-volume production of the stacked-die packages.

DRAM memory chips – as used by the billion, for example, in PCs and servers – will in future be in a state of flux, shifting away from the present BOC packages and toward flip chip packages, which are necessary for the highest clock frequencies. One of the major memory producers in the world market has recently evaluated the dual-head flip chip bonder 8800 FC for this, while another of the big players in the DRAM market is already using Datacon equipment for prototypes and pilot production.

Apart from the unparalleled speed, what tips the balance in favor of the 8800 FC bonder is the extremely impressive yield, which reached 100% in two out of three test series! The 8800 FC achieves this through excellent reliability in flux application and bin sorting – naturally with 300mm wafers, as favored in DRAM production.

Helmut Rutterschmidt, President & CEO of Datacon Technology GmbH, comments: “So our equipment is capturing a typical mass market – further proof that Datacon machines offer our customers the lowest cost of ownership. Datacon is the first choice for both high volume and customized applications."

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Gannon & Scott Announces the Following:

Gannon & Scott’s Phoenix, AZ, facility successfully completed the CHWMEG facility review program.  CHWMEG, Inc. is a non-profit trade association comprised of 165 members and 199 affiliate companies committed to efficiently managing the waste management aspects of their environmental stewardship programs.  These programs are based on reducing environmental liability related to the wastes they inherently generate while striving to reduce, recycle or reuse the wastes associated with their operations.

This accomplishment emphasizes Gannon & Scott’s continued commitment to the well being of our employees, customers and the environment.

Joseph O. Peixoto joined Gannon & Scott as General Manager for both our Cranston, RI and Phoenix, AZ, facilities.  He will report directly to the CEO and has over 20 years of precious metals refining experience and 5 years of ferrous and non-ferrous metal recycling experience. 

Joe’s addition to our management team is another step in the continued growth and expansion of Gannon & Scott as a leader in the precious metals refining industry.

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H.C. Starck Develops Thermal Management Components for HB-LEDs and Laser Diodes

H.C. Starck develops and manufactures thermal management components for HB-LEDs (High Brightness LEDs) and laser diodes, such as MoCu composites, Cu/Mo/Cu laminates, and plated Mo-flat products.  The reliability and efficiency of semiconductor devices can be improved by maximizing the thermal conductivity of the heat dissipating components, while matching their coefficients of thermal expansion (CTE) to those of the diodes.  Specialty coatings with Ni, Au, Ag, Ru, Rh, Pt are available for solder-wetting, etch-resistance, protective layers, and electrical contacts.  Additional products under development provide enhanced thermal conductivity along the z-axis (through-thickness) and the unique capability to tailor excessive heat dissipation along localized hot spots, using a special, patent pending process developed by H.C. Starck.

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MicroScreen Introduces Quick Ship Program for Thick Film Screens

MicroScreen announces the introduction of its Quick Ship Program for thick film screens.   In order to accommodate the critical requirements of our customers for quick-turn,  MicroScreen stocks screens  – either stretched, presensitized, or fully exposed with production patterns.

When completed, the screens are placed into an inventory and released as our customers need them.  The program benefits both our customer and MicroScreen.

Under the Quick Ship Program, screen orders placed by 11 AM are shipped the same day.

According to Kathy Jenczewski, MicroScreen’s General Manager, “the Quick
Ship Program provides screens to our customers, not when they get them, but when they want them”.

In addition to screens, MicroScreen manufactures laser cut stencils for printing
solder paste on p.c. boards.

Visit MicroScreen at Booth 614 - IMAPS 2006, San Diego, California

To learn more about MicroScreen products, please visit www.microscreen.org.


Screens being prepared for Quick Ship Program

Quick Ship Program Screen Stock Ready for Same Day Shipment!

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Newport Corporation Exhibits the 5 Micron MRSI-M5 Assembly Work Cell at IMAPS 2006

Newport Corporation has announced the introduction of the MRSI-M5 Assembly Work Cell.  This 5-micron system provides advanced assembly solutions for complex epoxy die attach, eutectic and flip chip bonding.  Flexible by design, the MRSI-M5 delivers an industry-leading combination of accuracy, speed and reliability.  The MRSI-M5 is targeted to end users in the semiconductor and electronic packaging markets, including manufacturers of microwave modules, RF circuits, MEMS, advanced semiconductor packages, multi-chip modules, hybrid devices and photonic packages.

The entire machine base is formed of a cast polymer composite specifically engineered for its thermal stability and vibration dampening properties.  The MRSI-M5’s large work area can accommodate a multitude of waffle packs, Gel-Paks, wafers and feeders.  For example, the work area is large enough to hold a eutectic stage, sixty waffle packs, ten tape feeders and a conveyor.  The system’s fully automatic material handling conveyor operates in-line or cassette-to-cassette.

“We are excited about exhibiting the Newport MRSI-M5 and its new capabilities.   We offer our customers 5 micron accuracy, a large work area, high speed and exceptional reliability,” said Dan Crowley, director of sales for Newport’s advanced packaging products.  “Today’s packaging and assembly customers are looking for the next-generation of assembly solutions from an established, stable equipment provider like Newport, which delivers global support, process experience and manufacturing expertise.”  

Advanced features include “feather touch” force control combined with closed-loop-force feedback to provide the ability to handle delicate devices, such as GaAs and InP, without damage to internal die features.  In addition, the MRSI-M5 achieves extremely high accuracy with the industry’s most sophisticated vision and programmable lighting capability.  This is combined with 360 degree orientation and pattern matching for vision processing of the most challenging die and substrate materials.

The system operates on Windows® software, which provides extensive functionality and flexibility.  The database allows simple manipulation and offline programming.  The MRSI-M5 incorporates CAD download; automatic program selection based on the bar code of an incoming boat; full traceability and network connectivity, thereby ensuring high tool productivity. 

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Alphasem AG Appoints New Country Manager Americas

Alphasem AG appoints Walter Gisler as Country Manager Americas in an effort to increase the company’s US presence and to focus on emerging semiconductor assembly applications and technologies.

Walter Gisler has been named Country Manager Americas for Alphasem AG, headquartered in Berg, Switzerland, which belongs to the Dover group. In his new position, Gisler will be responsible for intensifying the company’s North American market presence. In addition to that and in concert with the overall company direction, he will be focusing on the expansion of the company into new and emerging technologies. Gisler brings more than 10 years of wide ranging semiconductor market and application expertise to Alphasem.

Prior to joining Alphasem, Walter Gisler held various management positions, in both Europe and North America, at one of the world’s leading semiconductor backend equipment manufacturers. Most recently, he served as Business Manager for Die Attach, Flip Chip and Advanced Packaging at that company’s North American subsidiary in Phoenix, AZ.

Walter Gisler has an educational background from both his native Switzerland and the United States. He graduated from the School of Engineering at HTA Lucerne, Switzerland, with a BS in Electrical Engineering specializing in control systems and received his MBA from the W.P. Carey School of Business at Arizona State University specializing in high technology entrepreneurship.

For further information please visit www.alphasem.com.
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Polese is now Plansee Thermal Management Solutions

Polese Company, Inc. is about to see another milestone in its 15 year history.  Following our 2003 acquisition by Schwarzkopf Holding Corporation, Mrs Hilde Schwarzkopf is transferring her 100% ownership in SHC to Plansee SE, Ruette Austria.  The transfer makes the company a regular subsidiary of Plansee.

On this occasion we will begin doing business as Plansee Thermal Management Solutions (PTMS).  The registered, legal name of the company will remain Polese Company Inc.  but will adopt the new name in our day to day operations.  The new name serves several purposes: it clearly identifies/ with this company to Plansee, the largest manufacturer of refractory metals.  The latter end of the name represents our commitment to providing engineered solutions

This fall, Plansee will introduce a new logo to redefine its broad image as an innovative, global, customer focused company.  We will adopt the new logo immediately.

Finally, following the relocation of our administrative office our address will change from 10121 Carroll Canyon Road to 10113 Carroll Canyon Road, San Diego CA  92131.

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Gate Leakage Testing from Silicon Cert Ltd.

Silicon Cert. Ltd. has announced the addition of Electro-Thermally Induced Gate Leakage (GL) testing to its extensive list of service offerings.  GL, the application of a high electric field to a plastic encapsulated integrated circuit (IC) in a high temperature environment, is a test required by the Automotive Electronics Council (AEC) for the series of qualification stress tests found in standard AEC-Q100.  With this latest offering, Silicon Cert becomes one of the few test laboratories within the USA to offer GL testing.  

Please visit us at IMAPS 2006 Booth #821 for details or visit our web-site at www.SiliconCert.com.

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“MicrobondGecko” – Leadfree Die-Attach Adhesive for Power Devices from Umicore

Today Umicore is known globally as one of the most innovative manufacturers of high-quality materials for semiconductor chip bonding. The exceptional know-how in the manufacturing and processing of these critical materials has given Umicore a unique opportunity to become the undisputed leader in the development and application of specialized Die-Attach materials. The excellent quality of the products ensures process-reliable and, consequently, more economical mounting of high-performance components. Continuous innovations underpin high standards and provide a continuously improving quality.

The combination of metals expertise coupled with strong chemical capabilities have made Umicore a world leader in the production of these Die-Attach materials. With that basis Umicore was in the position to develop a new product that could be considered as a break through in the microelectronic industry.

The worlds first Die-Attach Adhesive for power devices – totally lead free – a substitute for high temperature lead containing soft solders.

This adhesives series can be processed like conventional high-lead containing solders. In comparison to joints made out of solder pastes, adhesives exhibit strong advantages like a very low void rate, a high adhesion strength and an outstanding interface quality. A high thermal fatigue resistance and therefore a high reliability of the package will be achieved.

MicrobondGecko – A perfect drop-in solution. Easy to apply, by using the existing dispensing equipment. 

World premiere from October 10 – 12, 2006 at the IMAPS Exhibition in San Diego

Postershow on October 11, 2006 from 08:30 – 11:30 AM

Visit our booth no. 929.

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IC Interconnect Announces Expansion of Offering

IC Interconnect has dedicated the last eight years to customer service in the electronics packaging industry.  We started in 1998 by offering contract wafer bumping services.  From these beginnings we have grown to include pad resurfacing for high temperature wire bond, turn key back-end bare die processing from laser mark to die sort, and smart card module assembly of flip chip die onto flex 35mm substrate.

The depth and breadth of these combined experiences have made it attractive to some of our customers to have ICI take on a greater responsibility in a variety of areas that are either outside their core competency or are beyond the limits of their in-house resources. These responsibilities range from engineering, to customized manufacturing, to supply chain management.

The emergence of the fabless semiconductor and fab-lite models have given rise to a new way of doing business.  It is more important than ever to work with companies that have the resources and expertise with board level packaging and testing, qualifying and handling bare die, or the supply chain management required to bring your product to market.
IC Interconnect is introducing a new service that allows you to take advantage of our experience in the packaging field.  ICI can fill the role as your packaging department for an entire project, or as a short term supplement to your existing packaging department resources. We’re here to help.

Manufacturing Services                                  

• Wafer bumping (Flip chip/WLCSP)                   
• I/O pad resurfacing                                        
• Wafer inspect                                                                                                                             
• Backside laser mark                                       
• Saw                                                             
• Die sort into tape and reel                                                                       

Project Management Services
• System level mechanical FEA modeling
• Quality system development
• Wafer and assembly level qualification testing and failure analysis
• Packaging application notes and data sheets
• Subcon selection and qualification
• Supply chain management
• Device packaging design check

For more information, please visit www.icinterconnect.com.

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:: Issue 17 ::
October 3, 2006

National Training Center