:: Corporate Member News ::

:: Global Business Council's Spring 2007 Program - Analysts, Forecasts and Industry Experts (full story)

:: Cyber Technologies Adds New Features to CyberScan (full story)

:: Asymtek’s Conformal Coating Technology Adds Reliability to Medical Electronics (full story)

:: Quik-Pak Announces Installation of Wafer Dicing Saw (full story)

:: Industry’s First Video Ads Released by Indium (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Asymtek - A Nordson Company
AZ Electronic Materials
Cyber Technologies

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Global Business Council's Spring 2007 Program - Analysts, Forecasts and Industry Experts

The Global Business Council’s (GBC) Spring 2007 Conference has the information you need to be informed about the microelectronic and electronic packaging industry’s business climate now and in the near future. The Conference is being held in sunny Scottsdale, AZ, on March 18 & 19, 2007. This GBC Conference immediately precedes the IMAPS Device Packaging Conference, at the same location.

For complete Conference information, visit
http://www.imaps.org/programs/gbc07spring.htm and register On-Line.

Sunday, March 18, 2007
12:00 Noon – GBC Golf Tournament
(Bus leaves at 11:00 AM returns at 5:00 PM)
McCormick Ranch Golf Club -- Scottsdale, AZ

$150 per golfer
3:00 PM – Registration Opens

5:00 PM – Welcome Reception and Dinner co-sponsored by The Microelectronics Foundation

6:30 PM - Keynote Address
Wall Street’s Perspective of the Growth in Semiconductors
Satya Chillara,
Senior Research Analyst, Pacific Growth Equities

Monday, March 19, 2007
7:00 AM – Registration Opens

7:30 AM – Continental Breakfast

8:00 AM – Opening Remarks
Laurie Roth, GBC Co-Chair

8:15 AM
State-of-the-art Technology Integration
Trends and 3-D Wafer-Level Integration

Brandon Prior, Prismark Partners

9:00 AM
iNEMI Roadmaps - A Blueprint for Industry Collaboration

Chuck Richardson, iNEMI

9:45 AM - Break

10:15 AM
DuPont’s Advanced Materials Pipeline for
the Device Packaging Industry

Phil Thomas, Global Technology, DuPont Electronic Technologies

11:00 AM
Application Specific Packaging Trends and
Business Implications

Lee Smith, Amkor Technologies

12:00 noon - 1:00 PM - Lunch

1:00 PM
Semiconductor Industry Update

Brian Matas, Vice President, IC Insights

1:45 PM
RF Devices

Mike Shields, Consultant

2:30 PM
Automotive Electronics: Do you have any business being there?

Randy Frank, Randy Frank & Associates

3:15 PM - Break

3:45
Current and Future Microelectronics Packaging for Implantable Medical Devices

Peter C. Tortorici, Ph.D., Medtronic Microelectronics Center

4:30 - Closing Remarks & Adjourn

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Cyber Technologies Adds New Features to CyberScan

Cyber Technologies recently added several new features to its family of CyberScan Vantage Measurement Systems.

Scan CT Suite 7.1, the latest version of the Company’s 2D and 3D profiling software, includes a number of new measurement and data handling capabilities. Operating on Windows XP Professional, Scan CT Suite 7.1 features roughness algorithms developed to ISO EN 13565 and EN 11562 standards. Other new features include Automatic Edge Detection, user-created Macros, and more flexible results recording techniques. In addition, multiple scans can be combined in one worksheet for comparing/contrasting data. The new capabilities of Scan CT 7.1 can also be found in Version 3.1 of the company’s AScan Automated Application Software, to be released simultaneously with the new Scan CT Suite.

Hardware on the CyberScan Vantage has also been improved to eliminate mechanical noise and vibration, providing a machine accuracy down to 20 nanometers (0.02µm/ 0.0000008”).


Cyber Technologies’ CyberScan Vantage Systems can accept a number sensor types and models, with resolutions to 0.01µm (0.0000004”) and ranges up to 8 mm (0.315”).  Cyber Technologies’ clients rely on these systems for microelectronics & semiconductor inspection, MEMs fabrication, and advanced materials processing.

Cyber Technologies is the recognized leader in lased-based, high-resolution 3D inspection for microelectronics, worldwide.  Our world-class clients rely on our CyberScan Vantage Systems for inspection of:

  • Substrate Flatness
  • Bump and Ball Coplanarity
  • Wire Bond Loop Height
  • Film and Paste Thickness & Volume
  • Transparent Materials Deposition
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Asymtek’s Conformal Coating Technology Adds Reliability to Medical Electronics

Protects Circuitry in Implantable Devices such as Pacemakers

Asymtek, improves the reliability of implantable medical devices by supplying equipment to apply conformal coating materials that protect the electronics inside the devices.  Jetting conformal coating materials onto the electronics in life-saving medical devices, such as pacemakers and defibrillators, protects the electronic circuitry from moisture, dust, chemicals, solvents and other types of environmental contaminants. Conformal coating also dampens the effects of mechanical and thermal stresses, vibrations, and electrical noise that can impair the functioning of the devices.

Asymtek’s SC-400 PreciseCoat™ Conformal Coating Jet enables the application of coating materials to highly selective areas, especially on small substrates, devices, or substrates with high-component density where there are tight tolerances between coated and uncoated areas.  Delivery of the coating is so accurately controlled that only the part of the device that needs coating is protected, without the need to mask any surrounding areas.  It is a clean process, which is especially important in the manufacture of sensitive implantable medical devices.


“When assembling something as critical as a pacemaker, medical device manufacturers do the utmost to make their products reliable,” said Jim Klocke, senior business development manager of Asymtek.  “Applying conformal coating to the electronics in these devices provides extra assurance that they will be reliable and perform as designed.”  Using a needle design with non-contact jetting action and fast pulse-width modulated control, the SC-400 jet delivers small volumes and precision control of the conformal coating material for line widths down to 1.5 millimeters (0.06 inch) wide.  Film thicknesses of 15 micrometers are achievable when using solvent-based materials.  Acrylics, silicones, urethanes, UV-cure, and water-based materials with a viscosity range of 1 to 850 centipoise (cps) can be jetted.

For more information, please visit www.asymtek.com.

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Quik-Pak Announces Installation of Wafer Dicing Saw

Quik-Pak has announced the installation of a new 200mm Disco Automatic Wafer Dicing Saw in its recently expanded facilities in San Diego.  The new in-house capability complements Quik-Pak’s existing rapid turn IC assembly service offerings, which include die bonding, gold ball wire bonding, remolding and marking/branding.  Quik-Pak is also the largest supplier of open cavity plastic packages, which allow IC designers to insert new die in existing production packages for design verification, testing and customer samples.

“The addition of this top-of-the-line dicing equipment will allow Quik-Pak to further reduce prototype turn times for our customers – enabling us to receive a wafer in the morning and ship completely assembled components that same day,” stated Quik-Pak General Manager, Steve Swendrowski.  

The new dicing service can either be utilized as part of Quik-Pak’s turn-key packaging and assembly process for fabless semiconductor companies or as a stand-alone service for customers with internal assembly capability.

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Industry’s First Video Ads Released by Indium

The Indium Corporation has broken new ground by producing the first video advertisements in the electronics assembly industry. In keeping with the company’s advanced marketing efforts, which include the industry’s first blogs, these video ads represent an entirely new way to communicate with the market.
 
The new campaign, titled “We Know SMT Inside and Out”, consists of a series of five video ads that humorously depict dedicated Indium engineers putting themselves through actual SMT equipment – in the quest for better process understanding.  A new ad will be released every few weeks.
 
Rick Short, Indium’s Marcom Director said, “We are continually seeking fresh new ways to deliver our message. The industry has exhausted the novelty of traditional print advertising, direct mail, brochures, and exhibits.  It seems to be the perfect time to combine humor with video, and to tie it all together with a simple, concise message.”

The first ad in the series can be seen at:

·      www.indium.com/videos/ads
·      www.pcb007.com/video/indiumad.htm

EMS007 Publisher Steve Gold, a member of the video ad production team, said, “We congratulate Indium on their creativity and vision. These groundbreaking video commercials take full advantage of all the Internet has to offer. EMS007 is proud to have helped raise the stakes when it comes to using video as a marketing tool.”


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:: Issue 24 ::
February 15, 2007

National Training Center