AI Technology
:: Corporate Member News ::

:: Enerdyne Solutions and Indium Corporation of America Sign Agreement (full story)

:: Eskling Appointed President of Struers (full story)

:: Kester’s Kurt Rajewski Promoted to Global Product Manager (full story)

:: Hesse & Knipps to Demonstrate Three Bonding Technologies on Two BONDJET Models at Semicon West 2007 (full story)

:: Wedge Emulation on a Ball Bonder from Palomar Technologies Maximizes Bonding Speed for High Density Packages (full story)

:: Quantum Leap Packaging Appoints Roger Kuroda Senior VP of Manufacturing (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Enerdyne Solutions
Mentor Graphics
Ed Fagan Inc., Special Purpose Alloys

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Enerdyne Solutions and Indium Corporation of America Sign Agreement

Indium Corporation and Enerdyne Solutions announced plans to collaborate their efforts in manufacturing, selling, and supporting Enerdyne Solutions’ unique Indigo™ metal thermal interface material (mTIM) to the electronics manufacturing industry. Their memorandum of understanding provides a roadmap and terms of additional agreements that build on proven laboratory results, customer evaluations, and the companies’ ongoing relationship. Further terms were not disclosed.

The Indigo™ mTIM solves the critical problem of removing excess heat from electronic components. It provides more than twice the performance of the best available thermal greases and poly-solder hybrids in use today. The combination of superior cooling and modest cost makes the Indigo™ mTIM an ideal solution for critical applications including chip packaging in desktop computers, servers, workstations, game consoles, and other devices.

Enerdyne President Chris Leyerle noted that both companies are experienced with the thermal management industry and the competitive landscape, and are both bringing significant intellectual property and potential customers to the relationship. “We are enormously pleased to be working with Indium,” commented Leyerle. “Their expertise in metals and high-volume manufacturing, and their position as the world’s leader in metal-based TIMs, make them an ideal partner in realizing the enormous market potential of this product.”

Ross Berntson, Indium Corporation’s Solder Products Business Unit Vice President said, “Enerdyne’s Indigo™ metal TIM is a world-class product. It fits perfectly into Indium Corporation’s manufacturing capabilities as well as into our product suite. Customers expect leading-edge products and performance from Indium. Indigo™ mTIM compliments this perfectly.”

Heat is fatal to electronics performance, and the problem of mitigating that heat is an increasingly disruptive and expensive problem for the electronics industry. The problem has become more acute primarily as a result of the increasing miniaturization of electronics and the competitive advantages of denser packaging. Efforts to reduce power consumption have not kept pace, and the result is a relentless increase in heat flux density (the ratio of heat dissipation to unit area).

Enerdyne Solutions develops and commercializes electronics cooling products and technologies. The Company has used its multi-disciplinary scientific expertise and experience to generate multiple patents and thermal products characterized by higher performance at reduced cost, as well as enabling overall solutions that are lighter, smaller, and quieter. Products include the Indigo™ thermal interface material, Polara™ heat spreaders, a Peltier-assisted semiconductor technology ideal for hot spot mitigation; and PermaFrost™ thermoelectric devices, well-suited for solid-state cooling, heating, and power generation.  For more information on Enerdyne Solutions visit or email

Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, thermal interface materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium.  Factories are located in the USA, the United Kingdom, Singapore, and China.  Founded in 1934, the company is ISO 9001 registered.  For more information on Indium Corporation visit or email
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Eskling Appointed President of Struers

Struers A/S announced the appointment of Anders Eskling as the new President for Struers Inc. (US).  Mr. Eskling, most recently served as the Director of Sales and as a member of the Executive Management Group for Struers Sales Worldwide in Copenhagen, Denmark.  He brings a wealth of knowledge and understanding to his new position. 

During a recent Struers Worldwide Sales & Marketing Meeting, (June 2007) held in Shanghai, China, Mr. Eskling expressed his thoughts on joining the Struers Inc. team.  “I welcome the opportunity to work with such a fine group of dedicated individuals, the future holds much promise,” Anders Eskling, June 2007.


Mr. Eskling joined Struers in Copenhagen, Denmark in March 1994 as a Product Specialist.  Strong skills and abilities in technical and application areas helped him to advance rapidly.  In addition, he holds a Mechanical Engineering degree from the University Copenhagen, Denmark. 

Mr. Eskling’s practical know-how and experience combined with theoretical skills in sales and marketing contributed to his promotion as Sales Manager for Struers A/S in October 1997.  As a Sales Manager, Mr. Eskling played a key role in implementing new strategies and adding to Struers success.  He was responsible for dealing with countries worldwide, as well as third party dealers. 

Mr. Eskling is a proven leader and will continue a successful tenure with Struers in his new role as President of Struers Inc.
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Kester’s Kurt Rajewski Promoted to Global Product Manager

Kurt joined Kester in 1990 and has held several positions within the Quality, Marketing and Finance departments. He was appointed as the Manager of Financial Planning & Analysis in 2005 after several years as a significant contributor to the Marketing function.  Kurt obtained his B.S in Industrial Engineering from Iowa State University and his MBA from the University of Chicago’s Graduate School of Business.

In his new position, Kurt will report directly to Roger Savage, president/CEO of Kester, and will be responsible for all aspects of product line management, including product marketing, pricing, new product development coordination and promotions.  Kurt will work with the sales teams internationally to assist the growth initiatives with target customers. Additionally, he will be responsible for the metals and preforms areas of Kester’s product line.

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Hesse & Knipps to Demonstrate Three Bonding Technologies on Two BONDJET Models at Semicon West 2007

Hesse & Knipps GmbH Semiconductor Equipment, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, announces that it will show two of its advanced bonder models – two BONDJET BJ820s and one BONDJET BJ920 – demonstrating three different applications, at SEMICON West 2007, taking place at the Moscone Convention Center in San Francisco, July 17 through 19. The demonstrations will take place in booth # 7131 in West Hall, Level 1.

Demonstration #1: BONDJET BJ820 thin wire bonding (45 degree wire feed angle)
Demonstration #2: BONDJET BJ820 ribbon bonding (89 degree wire feed angle)
Demonstration #3: BONDJET BJ930 heavy wire bonding

The BONDJET BJ820 offers the flexibility for both high speed round wire and deep access ribbon and wire bonding, handling all applications in a single platform – RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminum or gold wire or ribbon. Machine capabilities include:

  • Constant loop height and wire length
  • 10μm or better loop repeatability
  • Capability to maintain parallel loops within mixed reference system
  • Ribbon bonding from 6μm x 35μm to 25μm x 250μm
  • 12.5μm to 85μm diameter wire bonding
  • Auto teach for linear applications, reducing programming time

The BONDJET BJ920 heavy wire bonder fulfills the most demanding user requirements from automotive to leadframe applications, and is the only heavy wire bonder available with integrated pull and shear test. High speed and accuracy, the largest bonding area of any heavy wire bonder on the market today, and other advanced features meet customer requirements and greatly enhance productivity. The in-booth demonstration will highlight:  

  • Bondhead integrated pull & shear tests
  • VC920 control technology which eliminates vibration issues
  • Fast “Active” cutter system
  • E-Box: reproducible setup system for cutter, wire guides and bond wedges
“These machines perform well across the board for challenging wire bonding and ribbon bonding applications,” said Joe Bubel, president of Hesse & Knipps, Inc. “We look forward to presenting our BJ820 and BJ920 capabilities first-hand to the attendees of Semicon West.”
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Wedge Emulation on a Ball Bonder from Palomar Technologies Maximizes Bonding Speed for High Density Packages

Palomar Technologies announces its new wedge emulation technology for low-profile interconnects, fine pitch, running-stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages.  Wedge emulation uses Palomar Technologies’ Model 8000 ball bonder to maximize the bonding speed, reliability, and reduced keep-out space of a ball bonder for high density packages that previously required a wedge bonder.  Using a specially developed chain bonding stitch-stitch interconnect, this technique bonds 7 to12 wires per second instead of the 1-2 wires per second you get with a wedge bonder.

Software allows the user to program an interconnect beginning with a stitch instead of ball, as in wedge bonding, and complies with the visual standards defined per Mil-Std-883, Method 2017.  Since there is no ball, the user can use a wire other than gold, such as aluminum or copper, for the interconnect.  This truly makes the ball bonder a viable and flexible alternative to a wedge bonder.

“There is little debate that ball bonding is faster and more robust,” said Don Beck, applications engineering manager for Palomar Technologies.  “However, due to a need for low profile interconnects or fine pitch, wedge has continued to dominate key market segments.  Wedge bonding is also typically used when a design requires a running stitch interconnect or die to die bonding.  With Palomar’s new wedge emulation technology, these processes can now be achieved on Palomar’s Model 8000 ball bonder.  With the high cost of capital equipment, the need to conserve manufacturing floor space, reduced personnel, efforts to streamline operations, and increased time-to-market pressures, being able to perform almost all bonding operations on a ball bonder is an advantage.  By adding chain bonding to a ball bonder, manufacturers can support applications that require higher frequencies and denser packages without sacrificing throughput and yield.”

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Quantum Leap Packaging Appoints Roger Kuroda Senior VP of Manufacturing

Quantum Leap Packaging, Inc. (QLP) is pleased to announce the appointment of Roger Kuroda, Ph.D. as Senior Vice President of Manufacturing.

"QLP is in the midst of ramping manufacturing and moving several products into production. Roger brings a deep manufacturing and engineering background necessary to lead QLP’s manufacturing strategy,” said CEO David Grooms. "Roger will have a leadership role in accelerating our manufacturing ramps and satisfying our customer demand.  His appointment will have significant impact on QLP’s expansion."

Kuroda brings to QLP years of experience in the semiconductor packaging industry as well as other advanced technologies. He has held senior positions in manufacturing, engineering and R&D where he had responsibility for design, assembly and packaging. Prior to QLP, Roger was VP of Engineering at XCOM Wireless, responsible for designing RF MEMS devices, foundry management, project management and developing and qualifying new assembly and packaging.  He was also VP of Manufacturing and Technology at Shellcase, responsible for wafer level packaging for optical sensors and micro camera modules.  Previously, Kuroda was Flip Chip Packaging Division Manager and R&D Center Manager at Kyocera America, where he was responsible for developing new packages for customers.  Roger started his career at TRW Inc. where he held several positions in thick film production, program and proposal management.

Kuroda has a B.S. in Applied Physics from UC Davis with specialties in Material Science and Chemistry, a M.S. and Ph.D. from the University of Southern California in Physics, and has numerous publications and patents.

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View the Corporate Bulletin Archives

:: Issue 34 ::
July 16, 2007

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