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:: Corporate Member News :: |
:: Metalor Technologies USA will upgrade to ISO/TS-16949 (full
story)
:: Palomar’s Matrix LED Assembly Capabilities Enable Packaging of Brighter LED Modules Dan Evans to present paper on Matrix LED Assembly at IMAPS International Conference (full
story)
:: IMAPS Says “Thank You” to our 2007 Device Packaging Exhibitors (full
story)
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::
Corporate Fast Links :: |
Click
below to learn more about this issue's featured corporate members.
All IMAPS
Corporate Members will have the opportunity to place their logo/link
in the "Fast Links" section. To have your company logo
included in an upcoming "Fast Links," email your logo
as a JPEG or GIF to Brian Schieman at bschieman@imaps.org.
You should also identify which URL to link your logo to. If you
have questions, contact Brian at 202-548-8715. There is
no charge for this service, it is offered as part of the corporate
membership
benefits. |
::
More Information :: |
::
Only news about IMAPS Corporate Members will be published in this
Corporate Bulletin. Please send your electronic press releases
to Ann Bell, abell@imaps.org,
before the first
or fifteenth
of
every
month to be considered for publishing in this bulletin.
:: For advertising
opportunities, please contact Ann Bell at abell@imaps.org or
202-548-8717.
:: To have your
company logo included in an upcoming "Fast Links," contact
Brian Schieman at bschieman@imaps.org or
202-548-8711.
:: For comments and questions about this e-mail newsletter, please
contact Brian Schieman at bschieman@imaps.org or 202-548-8715.

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Metalor Technologies USA will upgrade to ISO/TS-16949 |
Metalor’s commitment to ISO/TS 16949 certification offers the following customer benefits:
- Improved product and process quality
- Improved on-time delivery and Customer Satisfaction
- Greater emphasis on quality improvements
- ISO/TS 16949 also satisfies automotive mandates by the International Automotive Task Force body on a global basis, when complemented by fulfillment of customer-specific requirements
TS 16949 requires a process-based and metrics-driven approach, with emphasis on continuous improvement. This means that Metalor knows, understands and practices a business philosophy that is committed to quality. This philosophy never settles for “good enough” and understands the dynamics and interactions that exist between the various processes that make up the quality management system. Secondly, the added requirements of TS 16949, although prescriptive in nature, are based on proven techniques that further enhance an organization’s ability to achieve high quality levels in not only the challenging automotive sector, but in other market sectors that Metalor customers participate in as well.
The TS 16949 system will be certified and fully implemented by November, 2008. |
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Palomar’s Matrix LED Assembly Capabilities Enable Packaging of Brighter LED Modules Dan Evans to present paper on Matrix LED Assembly at IMAPS International Conference |
Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announced that Dan Evans, senior scientist, will present a paper titled High Brightness Matrix LED Assembly Challenges and Solutions at the Scottsdale, Arizona IMAPS International Conference and Exhibition on Packaging, on Tuesday, March 20, 2007. Evans will present Palomar’s findings that show that certain matrix LED packaging technologies can produce brighter LED modules.
Mr. Evans’ paper will feature a brief overview of market applications and package options, using a case study to highlight challenges encountered and available solutions for producing matrix LED packages. Pulse heat eutectic die attach and wire chain bonding are some of the technologies that will be explored for application to matrix LED assembly.
“Solid State Lighting is pervasive and will continue to grow in popularity as performance and costs mature,” said Evans. “Products include camera phone flashes, televisions, display backlighting, automotive lighting, architectural lighting, and others still in development. Reaching performance and cost targets will require continuous improvements in LED devices and packaging to extract ever increasing lumens per watt. Several of the new products use a matrix of LED devices packaged together. These matrix LED packages present challenges for both die attach and wire bonding compared to single die packages. We have found that some of the die attach and wire bonding techniques and technologies that have been used in other industries and applications can be adapted for LED assembly." |
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IMAPS Says “Thank You” to our 2007 Device Packaging Exhibitors |
We really appreciate the support of the following exhibitors and corporate members of IMAPS:
AdTech Ceramics |
Advanced Chemical Etching, Ltd. |
AI Technology |
AkcroMetrix LLC |
ALLVIA |
Amkor technology, Inc. |
Arizona State University |
Asymtek |
AZ Electronic Materials USA Corp. |
Bennington Microtechnology Center |
Boschman Technologies |
Centrotherm Technologies |
Chalman Technologis |
Chip Supply, Inc. |
CMC Interconnect Technologies |
Compunetics |
Cyber Technologies USA |
Datacon Technology GmbH |
DuPont Electronic Materials |
E-Globaledge America |
EKC Technology |
EV Group |
F&K Delvotec |
Finetech |
Geib Refining Corp. |
GPD Global |
HEI, Inc. |
Hesse & Knipps |
Interconnect Systems |
L. Gordon |
Lambda Technologies |
MicroChem Corp. |
MicroConnexx Corp. |
MicroFab Technology, Inc. |
MJS Design |
Myachi Unitek |
NAMICS |
National Nuclear Securities |
Orthodyne |
Pac Tech USA |
Palomar Technologies, Inc. |
Panasonic Factory Solutions Company |
Phoenix Chapter - IMAPS |
Photonics Spectra/Laurin Publishing |
Precision Process Equipment, Inc. |
Protavic America, Inc. |
Quantum Leap |
Sertek |
Sikama International, Inc. |
Starfire Systems |
Struers |
Surfect Technologies, Inc. |
SUSS MicroTec |
Task Microelectronics |
Technic |
Teledyne Microelectronics |
West Bond, Inc. |
Yole Development/Micronews |
Zeland Software, Inc. |
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Issue 26 ::
March 15, 2007




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