AI Technology
:: Corporate Member News ::

The next IMAPS Corporate Bulletin will be issued on December 3, 2007 due to the schedule of IMAPS 2007

:: Palomar Technologies Presents Two Papers at IMAPS 2007: ”High Brightness LED Packaging” and “Gold to Gold Flip Chip Interconnect” (full story)

:: Kyzen to Present during IMAPS 2007 (full story)

:: RNT Strengthens Sales Team with Addition of Seasoned Vice President (full story)

:: Cookson Electronics Announces the Expansion and Grand Opening of its New Cookson Electronics India Research Centre in Bangalore (full story)

:: Indium Corporation Announces New Sales Channel for Eastern North America (full story)

:: ISI Delivers Custom Mixed Pitch Interconnect in 3 Weeks (full story)

:: NanoDynamics Establishes Joint Venture with Shell Technology Ventures (full story)

:: Endicott Interconnect Technologies' Wire Bond Product Launched into Space (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Technical Materials Inc.
Interconnect Systems Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Palomar Technologies Presents Two Papers at IMAPS 2007: ”High Brightness LED Packaging” and “Gold to Gold Flip Chip Interconnect”

40th IMAPS Symposium Held November 11 to 15, 2007 in San Jose, California

Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronic assembly, will present High Brightness Matrix LED Assembly Challenges and Solutions by Daniel D. Evans, Jr., Palomar’s senior scientist.  Philip Couts, TDK Corporation of America, will present Gold Stud Bumping for High Density Flip Chip Interconnect, co-authored by Mr. Evans. The IMAPS symposium will be held November 11 to 15, 2007 in San Jose, California.

The presentation High Brightness Matrix LED Assembly Challenges and Solutions details research that shows how pulsed heat eutectic die attach and wire chain bonding used in matrix LED assembly are used to maximize the power and light [lumens] from high power LED matrices. A matrix of LED devices is packaged together for applications such as camera phone flashes, televisions, display backlighting, and automotive and architectural lighting.  Reaching performance and cost targets requires continuous improvements in LED devices and packaging to extract every possible lumen per watt.

The paper Gold Stud Bumping for High Density Flip Chip Interconnect details a robust flip chip solution using the Gold to Gold Interconnect (GGI) process for device packaging companies.  The GGI process is a high precision interconnect method for flip chip die attach that uses the same thermosonic techniques used in gold wire bonding.  Compared to gold wire bonding, GGI flip chip can reduce the device package area 50% to 70%, improves electrical performance, and is a clean, lead-free process and a cost effective solution for low to medium I/O devices.

The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.  The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts.  IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.

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Kyzen to Present during IMAPS 2007

Kyzen Corporation announces that it will present at the 2007 IMAPS Conference and Exhibition, scheduled to take place November 11-15, 2007, at the McEnery Convention Center in San Jose, CA.

Mike Bixenman, Kyzen’s chief technology officer, will present “Removing Water Soluble Flux Residue under High Lead Flip Chip Die.” The paper will be given during the Systems/Design Track on Wednesday, November 14, 2007, from 1:30-4:55 p.m.

Mike’s presentation will focus on successfully removing water-soluble flux residue under flip chip die. Faster processing speeds drive the demand for advanced packages that improve response and performance. Area-array packages are moving to larger die size with increased number of solder bumps under the die. Many Class II and III circuit assemblies that integrate advanced packages on their board designs remove flux residue after the soldering operation. As the I/O and die size increase, the ability to penetrate, flow and dissolve flux residue under the die becomes increasingly difficult. The purpose of the paper is to report data findings focused on improving the cleaning performance under high-lead flip chip die. Advanced packaging houses are using water-soluble paste flux to attach high-lead bumps to the substrate. The desired objective is to remove flux residue using high-pressure spray impingement and hot DI-water. The problem is that the high reflow temperatures char the flux residue making the residues increasing difficult to clean. Engineered cleaning fluids, at low concentrations have been shown to improve cleaning efficacy under the die. Mike will further discuss the importance of engineered cleaning fluids.

For more information on Kyzen’s IMAPS presentation, visit


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RNT Strengthens Sales Team with Addition of Seasoned Vice President

Mike O’Neill Brings over 20 Years of Sales Experience to Fast Growing Industry

Reactive NanoTechnologies, Inc. (RNT), has announced the addition of Mike O’Neill as Vice President of Sales. With over 20 sales years experience and a solid track record of market development in the electronic materials, microelectronics and packaging industries, O’Neill will be responsible for global sales strategy and key account management.

Prior to joining RNT, O’Neill served in Sales and Global Business Management roles for Heraeus Inc., Circuit Materials Division, a leading supplier of traditional and advanced thick film materials for hybrid circuit and passive component applications.  During his tenure, O’Neill significantly increased sales in each assignment for Heraeus. Prior to Heraeus, O’Neill served in Business Development and Territory Management roles at DuPont, where he also was successful in developing new sales for the company’s electronic materials market segment. O’Neill currently serves as Vice President of Membership for IMAPS, the International Microelectronics and Packaging Society, where he has successfully increased membership and led an increase in sponsorship program participation by 100% during the past two years.

“Interest in and demand for NanoFoil is exploding across a wide variety of industries.” noted Joe Grzyb, CEO of RNT “ With his expansive industry experience and proven track record developing new markets and building market share, O’Neill will be a key asset for RNT as we continue to expand our sales efforts domestically and abroad.”

O’Neill will be based in the company’s Hunt Valley, Maryland corporate headquarters. 

About RNT
Headquartered in Hunt Valley, Maryland, RNT develops and manufactures NanoFoil to precisely control the instantaneous release of heat energy for reaction initiation and joining applications that current technology can not effectively or economically address. RNT has also developed its patented NanoBond® joining process to ensure the benefits of NanoFoil® are maximized.

Commercial distribution of NanoFoil® for joining and energetics applications is taking place from RNT’s onsite manufacturing facilities. RNT has also signed licensing agreements with a number of Fortune 500 Companies.  Its breakthrough technology is currently in use for large area joining applications such as thin film sputtering target bonding and microelectronics component joining for thermal management performance improvement. RNT will be exhibiting at IMAPS 2007 November 13-15 in San Jose and will display its component joining capabilities, including LED systems packaging applications.

 For more information please visit  
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Cookson Electronics Announces the Expansion and Grand Opening of its New Cookson Electronics India Research Centre in Bangalore

Cookson Electronics is once again demonstrating its ongoing commitment to breakthrough research and development with the opening on October 23, 2007, of its state-of-the-art Research Centre in Bangalore, India.  This new, 32,000 sq. ft. facility is an integral part of Cookson’s global research commitment which consists of scientific exploration in four research and development centres located in the United States, Japan, Singapore and India. 

Reinforcing its Asia growth strategy, Cookson Electronics was the first electronic assembly materials company to establish an R&D facility in India.  This facility was located on the campus of the Indian Institute of Science (IISc) in Bangalore. 


“Several years ago our Company made a strategic decision to establish an R&D center in Bangalore and develop a close relationship with the Indian Institute of Science. Over the last three years we have expanded our investment in people and equipment, and thus outgrown our space and are now very happy to have this new, larger R&D facility,” said Steven Corbett, President and CEO of Cookson Electronics.  “This is extremely important to our continued growth in Asia.  Currently, 60% of our Assembly Materials business is derived from the Asia/Pacific Region. It is critical in our business that our research and development be close to our customers so we can respond quickly to new product development opportunities.”

“Our talented people at the Research Centre, many with Ph.Ds from premier institutes in India in diverse areas of chemistry and materials, will apply their skills to the development of technologies that will advance electronic assembly processes and products worldwide,” said Dr. Bawa Singh, V.P. of Technology and Chief Technology Officer with Cookson Electronics Assembly Materials.  “In particular, we will be more involved in semiconductor manufacturing and packaging materials, and renewable energy, including solar technologies.  We are building a strong foundation in nano-technology-based materials that will allow our customers to achieve paradigm shifts in their product performance.”

“Our new R&D Centre in Bangalore will be part of India’s broad-based growth in electronics and photovoltaics, while also providing exceptional technical support to the entire Asia-Pacific Region,” said Raji Koshy, General Manager, Cookson India Private Ltd.  “Our customers located in India will continue to have access to our ISO-certified manufacturing facility in Chennai and will now benefit from our world-class R&D.”

The Cookson Electronics India Research Centre will continue to leverage its strategic collaboration with the Indian Institute of Science, India’s foremost research and teaching institution for science and technology.

In the rapidly growing Asia/Pacific region, Cookson Electronics operates product application support facilities in Taiwan, Shenzhen, and Shanghai China, in addition to its four global R&D centers.

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Indium Corporation Announces New Sales Channel for Eastern North America

Indium Corporation has named Simcona Electronics Corporation as its newest sales channel partner. Simcona covers the eastern part of North America from Montreal to Miami, focusing primarily on distribution of solder bar, flux-cored wire, and wave solder fluxes.
With warehouses in New York and Ontario, Simcona has been servicing OEMs since 1962, focusing primarily on regional distribution of electro mechanical products.
According to Indium Corporation’s Regional Sales Manager, Jeff Anweiler, “Simcona’s attention to customer service, extensive industry experience, and overall business philosophy fully compliments Indium’s sales efforts. We look forward to the partnership and support as we continue to improve the availability and service of our products on the eastern seaboard.”
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets.  Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science.  With facilities in the PRC, Singapore, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
For more information about Indium Corporation visit

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ISI Delivers Custom Mixed Pitch Interconnect in 3 Weeks

ISI’s HiLoTM Flexible Interconnect System for board-to-board and or mezzanine card applications, can be designed in 48 hours, delivering sample parts in 2 weeks and full-scale production in 3 weeks.

The system is compatible with high-speed designs, with the 1dB loop-thru bandwidth measured at 9.3 GHz.  The height of a mated pair can be as low as 3mm.

Interconnect Systems is currently shipping pin fields and socket sets with more than 2000 I/O.  Contact pitch is typically 1.27 or 1.0 mm, and custom pitches are available. 


The product was named for the Highs, the Lows, and the Flexibility that today’s industry requires.

Test reports of Contech Research and Gigatest Labs are available upon request.

The HiLo system is flexible in that a customer can array the I/O in any pattern, and have sample parts in two weeks for less than $1000 NRE. 

The HiLo Flexible Interconnect is priced as low as $0.02/contact per mated set in production volumes.

For more information visit

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NanoDynamics Establishes Joint Venture with Shell Technology Ventures

NanoDynamics Inc. announces the recent formation of a joint venture with Shell Technology Ventures Fund 1 B.V. to develop new materials and products expected to improve exploration and production efforts in the international oil and gas industry.  The joint venture, Epik Energy Solutions, L.L.C., capitalizes on NanoDynamics’ capabilities in nanomaterial synthesis and product engineering, in applications ranging from solar energy conversion, energy storage, lightweight  wear-resistant materials and water purification to enhanced down-hole and  construction materials and taggants.

“Epik Energy Solutions will leverage the technology, materials, and process capabilities of NanoDynamics, with the guidance and industry knowledge of Shell Technology Ventures Fund 1 B.V., to address several of the ongoing challenges in the global oil and gas industry,” said Keith Blakely, NanoDynamics C.E.O.  “This joint initiative will target the application of nanomaterials and nano-enabled products to improve a broad range of exploration and production issues.  With the rapidly increasing demand for energy across the globe, it is all the more important to examine ways of improving fuel extraction and processing methods through advanced materials and technologies.”

“Shell Technology Ventures Fund 1 identifies and collaborates with promising entrepreneurial companies to develop step-change, field-hardened products and services for the oil and gas industry,” said Oliver Capon, C.F.O. of Kenda Capital B.V.  “Epik Energy Solutions capitalizes on NanoDynamics’ leading-edge technologies and valuable academic and industry relationships, to further  propel this aim.”

The initial board of directors of Epik Energy Solutions consists of Keith Blakely, NanoDynamics’ C.E.O., Oliver Capon, Kenda Capital’s C.F.O., and Matthew Bell, GEODynamics’ vice president – technology and experienced completions engineer.

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Endicott Interconnect Technologies' Wire Bond Product Launched into Space

Endicott Interconnect Technologies, Inc. has announced that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space.  They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system. 

The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center.  Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites.  The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.

EI assisted Northrop Grumman’s Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages. 

"The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,” explains Kim Blackwell, Microelectronics Packaging Product Manager at EI.  “This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI’s wire bond PBGA organic materials, packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.” 

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View the Corporate Bulletin Archives

:: Issue 41 ::
November 1, 2007

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