AI Technology
:: Corporate Member News ::

:: BI Technologies Appoints New Product Marketing Manager for Hybrid Microcircuit Business Unit (full story)

:: Brad King Joins StratEdge as Senior Account Manager (full story)

:: Palomar Technologies Features High Throughput Automated Gold Bumping (full story)

:: CoorsTek Receives Colorado Top Company Award for 2007 (full story)

:: Precision Process Equipment Establishes Tech Center in Boise Idaho (full story)

:: Indium’s Dr. Lasky to Present at the International Lead-Free Conference in Berlin (full story)

:: Leaders in 3D Packaging Equipment Announce Seminar Series on Integrated Process Solutions (full story)

:: Asymtek/Nordson Opens New Facility in Chennai, India (full story)

:: Lord Corporation Announces Advancements In Flip Chip Underfill Technology For Lead-Free Component Packaging (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

LORD Corporation
CoorsTek
NEXX Systems

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


BI Technologies Appoints New Product Marketing Manager for Hybrid Microcircuit Business Unit

TT electronics BI Technologies Electronic Components Division has hired Chuck Nelson as product marketing manager of their hybrid microcircuit business unit.  Joining BI Technologies’ experienced applications engineering staff, Mr. Nelson will be responsible for supporting the existing customer base as well as promoting new business growth.

“Chuck has extensive experience in hybrid process engineering, hybrid manufacturing, technical sales and marketing,” said Brian Kane, director of product development for BI Technologies Electronic Components Division. “With his broad background and expansive knowledge of the industry, we are confident Chuck will contribute to successfully meeting our customers’ needs.”

Mr. Nelson previously worked in ceramic electronic packaging with NTK and Kyocera. He was also employed with BI Technologies earlier in his career in the engineering and production departments.

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Brad King Joins StratEdge as Senior Account Manager

StratEdge, announces the appointment of Brad King to the position of senior account manager.  Responsibilities include sales and application support for StratEdge’s high performance semiconductor packages, filters, and assembly and test services.

King has twenty-five years experience providing electronic products and services to the industrial, automotive, and government marketplace.  He has held senior level positions in sales and marketing and business development at companies such as California Amplifier (CalAmp)/Vytek, Indyme Electronics, and Dynatech Wireless Technologies.

King has a B.A. in Marketing from the University of Cincinnati.  He is a Dale Carnegie trained sales professional, has been the air talent for two radio stations in the San Diego area, and served as a San Diego and Imperial County Boy Scouts of America Eagle Scout Mentor.

 

“Joining StratEdge is exciting on both personal and professional levels. To be chosen as part of the StratEdge team is a high point in my 25 years of electronics sales.  StratEdge has new product offerings, a new manufacturing facility, and a rapidly growing assembly business, a great combination,” said Brad King.

“Brad is a consummate communicator.  He has the wonderful ability to decipher the product requirements of our customers and translate those needs to ensure that expectations are met,” said StratEdge VP of North American sales Casey Krawiec.  “He has experience in the fields of electronics, especially with microwave and RF, which are the fields of particular interest to our customers.”

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Palomar Technologies Features High Throughput Automated Gold Bumping

Model 8000 for high throughput automated gold ball bumping .

The model 8000 represents the latest advances in gold ball bumpers, incorporating leading-edge mechanical design, control architecture, and graphical user interface to provide the highest net throughput and flexibility of any comparable tool on the market today. 

Palomar’s single process co-planar gold bumper is the only gold bumper that can produce planarized gold bumps in one step.  The 8000 uses a unique bond-head motion (patented dual Z-axis with rotary motion) to form precise gold bumps by repeatably shearing the wire off the top of the bump without leaving a tail.  This allows the formation of flat bumps, eliminating the need for a secondary coining process.  Set-up time and fixturing are minimized by "soft tooling" achieved with Windows®-based software, which enables changes in ball array, position, and shapes to match the desired attach process.

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CoorsTek Receives Colorado Top Company Award for 2007

Technical ceramics manufacturer selected as leader in manufacturing excellence Denver, Colorado, September 18, 2007 – CoorsTek, Inc., a global technical ceramics manufacturer, received the Colorado Top Company Award for its excellence in financial performance, manufacturing, and community involvement at the awards ceremony for the 20th Annual Top Company competition. Presented by Peter deSilva, President and CEO of UMB Financial Corporation and Sandy Rothe, Managing Partner, Deloitte, the award was received by John K. Coors, President, CEO, and Chairman of CoorsTek, Inc.

“CoorsTek employees dedicate themselves on a daily basis to make a measurable difference in their local communities and the world,” said John K. Coors. “Having this effort recognized by some of Colorado’s top business leaders is a great honor for all of us,” he continued.

Ann Trujillo, co-anchor of KMGH’s Channel 7 News Team, emceed the event and pointed out several achievements as Coors approached the stage including the company’s increase in sales of 57%, labor efficiency increase of 19%, and reduction of waste by 30% over the past three years. She also pointed out the company contributions to The Children’s Museum of Denver, American Heart Association, and money raised for relief efforts during Katrina disaster.

 


“John K. Coors, center, accepts Top Company Award from Peter deSilva (left), President and CEO of UMB Financial Corporation and Sandy Rothe (right), Managing Partner, Deloitte.” Photo courtesy of Phil Mumford, ColoradoBiz Magazine.

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Precision Process Equipment Establishes Tech Center in Boise Idaho

Precision Process Equipment, a designer and manufacturer of custom plating and wet processing equipment, has opened a technical center in Boise Idaho.  “Opening this office in Boise will allow us to broaden our reach to the West and the Far East” says Doug Stewart, Vice President of Sales and Marketing, adding that “operations in Boise will focus on the marketing needs of Precision Process as well as function as the focal point of the strategic partnership, Process Partners International, formed with China based manufacturer PAT.”

Precision Process Equipment, headquartered in Niagara Falls NY, provides custom equipment solutions for many technologies including; Semiconductor, Solar Power, RFID, MEMS, Flexible Displays, Medical Devices, Automotive and Aero Space.

Learn more at: www.precisionprocess.com.
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Indium’s Dr. Lasky to Present at the International Lead-Free Conference in Berlin

Indium Corporation’s Senior Technologist, Dr. Ronald C. Lasky, Ph.D., will present on WEEE and RoHS compliance at the upcoming IPC/JEDEC International Lead-Free Conference in Berlin, Germany on October 4-5, 2007. Dr. Lasky’s presentation, “A Procrastinator’s Guide to Rapid WEEE and RoHS Compliance”, will provide examples, tools and recommendations on developing a Pb-free and RoHS compliant assembly in a minimum amount of time. While addressing the entire SMT process, the workshop will provide a planning checklist to create a rapid implementation plan.

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 20 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures.

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Leaders in 3D Packaging Equipment Announce Seminar Series on Integrated Process Solutions

NEXX Systems, Surface Technology Systems (STS), and SUSS MicroTec today announced they will collaborate with Fraunhofer IZM to demonstrate integrated process solutions for 3D wafer level packaging. As a first action, a series of seminars has been scheduled from October 26 to November 7, 2007. The seminars will be held in Singapore, Japan, China, Korea, and Taiwan and are targeted at packaging industry professionals involved in 3D packaging applications.

The seminars will cover optimization of integrated process solutions from the point of view of performance and cost. Leading edge total process solutions for 3D wafer level packaging will be demonstrated by combining the expertise of STS in deep reactive ion etch (DRIE) for via fabrication, NEXX Systems in PVD and Electrodeposition for lining and filling of vias, and SUSS MicroTec in wafer bonding and photolithography. Fraunhofer IZM will complement these strengths with their extensive expertise in 3D wafer level packaging, acting as both a consultant and active participant in the integration of process solutions.

More detailed information is available at www.3dintegration.org.
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Asymtek/Nordson Opens New Facility in Chennai, India

Asymtek announces the opening of its new technical support and sales office in Chennai, India. Because India has become a fast-growing region for the electronics assembly industry and is host to many of Asymtek’s existing customers, Asymtek established the new facility to support the area’s expanding markets and offer local support.  The new office is co-located with parent company Nordson Corporation, and provides on-site equipment service, training and applications assistance.

Newly-appointed Regional Sales Manager, Mr. N. Shivakumar, is responsible for Chennai’s operations, including applications engineering, sales and service for Asymtek’s complete line of dispensing and conformal coating products. He also oversees the region’s distributor network and works closely with Asymtek’s regional sales managers and technical support departments.

Shivakumar has over 13 years of experience in sales and business development in India, including five years in capital equipment sales. He has a Bachelor of Engineering Degree from Pune University and an MBA from the Indira Gandhi National Open University.

 


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Lord Corporation Announces Advancements In Flip Chip Underfill Technology For Lead-Free Component Packaging

LORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry – has announced the commercialization of two new capillary flow, flip chip underfill encapsulants that are compatible with lead-free solder alloy processing conditions.

As the demand for flip chip integrated circuits continues to increase, coupled with the legislation to limit or eliminate the use of lead in electronics, the demand for high-performance underfill encapsulants that are compatible with lead-free alloy solder reflow conditions continues to increase. LORD Corporation’s new lead-free compatible ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required. When anhydride based flip chip underfills are not desired, use LORD Corporation’s new anhydride-free flip chip underfill, ME-541. These material solutions are compatible with lead-free applications and pass JEDEC 3 requirements with peak solder re-flow temperatures up to 245-degrees-Celsius.

 

“Attaining lead-free reflow compatibility is not the only hurdle faced by underfills,” said Lynn Yanyo, Sales and Marketing Director for the LORD Electronic Boards and Components Industry Group. “Flip chip packages targeted for high-performance applications are rapidly increasing in functionality, complexity, size and I/O density. To ensure their reliable performance, an underfill encapsulant is needed to eliminate the failures caused by stress generated during flip chip operating cycles. The underfills also must be easy to apply and therefore must offer rapid and fault-free flow into the decreasing gap sizes and through the densely populated interconnect arrays under today’s flip chip ICs.”

The new underfill materials from LORD are engineered to quickly flow into gaps less than 25 microns with minimal filler settling and no voiding, encapsulating the fully populated interconnect arrays with a reliable layer of protective polymer. Thermal shock and cycling reliability testing has shown that flip chips under-filled with LORD Corporation’s newest materials are suitable for many flip chip applications including the harsh environments found in the automotive industry. 

Flip chips are used as central processors in computers and as application-specific, integrated circuits in a variety of consumer, automotive and industrial applications. LORD Corporation’s expanded flip chip underfill product line offers potential solutions to a variety of OEM and ESM underfill users. LORD works synergistically to develop custom-designed solutions within the customer’s processes and performance requirements.      

With headquarters in Cary, N.C., USA, and sales in excess of  $630-MM, LORD Corporation is a privately-held company that designs, manufactures and markets devices and systems to manage mechanical motion and control noise and vibration; formulates, produces and sells general purpose and specialty adhesives and coatings; and develops products and systems utilizing magnetically responsive technologies. With manufacturing in nine countries and offices in more than 15 major business centers, LORD Corporation employs more than 2,400 worldwide. Visit www.lord.com for more information. 
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:: Issue 39 ::
October 1, 2007

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