AI Technology
:: Corporate Member News ::

:: Natel Engineering Acquires Focused MIC Product Lines of Raytheon Company (full story)

:: F&K Delvotec’s Wire Bonder 64/66000 G5 Wins Two Awards (full story)

:: IRC Partners with Semi Dice as Worldwide Distributor of Wire Bondable Resistors, Capacitors and Passive Networks (full story)

:: Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract (full story)

:: GORE™ Protective Vents Improve Product Life for Telecommunications Equipment (full story)

:: EFD® Introduces a No-Drip, SAC305 Solder Paste Formulation (full story)

:: Recent Growth Boosts Protean’s Reputation as Technical Marketing Resource (full story)

:: Rohm and Haas Purchases Coating Cluster from SUSS MicroTec for Resist and Spin-on Dielectric Qualification (full story)

:: Unitek Benchmark Introduces a Camera and Monitor System for Lid Alignment for the Sm8500 Seam Sealer (full story)

:: Asymtek’s Jet Dispensing Precisely and Accurately Dispenses Catalyst Ink on Fuel Cell Membranes (full story)

:: Cyber Technologies Appoints Chalman (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Natel Engineering Acquires Focused MIC Product Lines of Raytheon Company

Natel Engineering is pleased to announce the acquisition of equipment and related assets associated with the manufacturing of specified microwave integrated circuits (MICs) from the Space and Airborne Systems (SAS) unit of Raytheon Company located in El Segundo, California.  The MICs are used in SAS’s Tactical Radar and Electronic Warfare products.  Concurrent with the acquisition, Natel and Raytheon entered into a long term exclusive supplier agreement for the MICs as well as a preferred supplier agreement for related MICs.  Purchasing MICs will allow SAS to better leverage supplier expertise in manufacturing and focus on its engineering support. Work that will remain in the Solid State Microwave (SMM) area in El Segundo are MIC space and prototype work, hybrid prototype support, and circulator work. The transaction is a positive development for both parties, with SAS divesting a non-core product and Natel strengthening its position as a RF/Microwave manufacturer.

NATEL Engineering Co., founded in 1975, provides microelectronics experience with advanced capabilities for a wide range of products and industries, including fully automated assembly of t/r modules, hybrids, MCM, and chip-on-board products.  NATEL holds and maintains industry specific certifications such as ISO 9001:2000, AS9100b and MIL-PRF-38534 (DSCC) and operates in manufacturing facilities that include 30,000 square feet of advanced clean room area.  NATEL is a pioneer and proven innovator in the manufacture of products for fiber optics, optoelectronics, space, defense, medical, and the RF/Microwave industries.  To learn more about NATEL, please   visit the Web at
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F&K Delvotec’s Wire Bonder 64/66000 G5 Wins Two Awards

Dr. Farhad Farassat, President of F&K Delvotec Bondtechnik GmbH Ottobrunn, has two good  reasons to celebrate;  a full order book and a special award for F&K’s latest wire bonder model 64/66000 G5. The Editors' Choice Best Product Award is an annual contest held by Semiconductor International to find and reward the products that reflect the level of excellence necessary to be successful in the semiconductor industry today. The award was presented to a delighted Dr. Farassat during this year’s Semicon West exhibition in San Francisco.

For more information about the Editor’s Choice Best Product Award please go to:


The benefits of a customer oriented organisation have paid off for F&K Delvotec. For many years Sensata Technologies, the leading supplier of sensors, has been using wire bonding systems supplied by F&K Delvotec Bondtechnik GmbH. The close relationships established in quality assurance and new product development as well as production-effective equipment and excellent customer support earned F&K Delvotec the Sensata Technologies Supplier Excellence Award 2006. The award reflects outstanding performance and continuous improvement in supplying materials, equipment and services in 2006. Nominees are evaluated on six criteria: cost, environmental responsibility, technology, responsiveness, assurance of supply and quality (CETRAQ).

For more information about the Sensata Technologies Supplier Excellence Award 2006 please go to

For more information about  F&K Delvotec, please visit

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IRC Partners with Semi Dice as Worldwide Distributor of Wire Bondable Resistors, Capacitors and Passive Networks

Providing design engineers with worldwide means of sourcing their comprehensive range of wire bondable resistive devices, TT electronics IRC Advanced Film has franchised Semi Dice as a distributor for their wire bondable product offering. Available on both silicon and ceramic substrates, IRC offers wire bondable precision resistors, voltage divider networks, resistor network arrays, chip capacitors, chip resistor and capacitor circuits, and multi-tap chip resistor networks.

 “With their extensive experience in bare die distribution, Semi Dice is well positioned and uniquely qualified to distribute our wire bondable products on a worldwide level,” said Steve Wade, director of sales and marketing for IRC Advanced Film Division.  “This partnership will contribute to successfully meeting our customers’ needs with both technical service and product delivery.”

“With our knowledge of the semiconductor industry and IRC’s commitment to product development and customer service, we anticipate continued success for our broad customer base, as well as both organizations,” said Dan Cormack, CEO of Semi Dice, Inc.

IRC’s wire bondable devices are being specified for use in hybrid modules, implantable medical electronics and other battery-operated miniature devices.

The wire bondable components utilize IRC’s proprietary TaNFilm® and TaNSil® processes which produce an ultra-stable self-passivating tantalum nitride resistance element that provides exceptional stability, power dissipation and precision.

For more information, please visit

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Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract

Endicott Interconnect Technologies, Inc. has announced today that it has been awarded an initial, multi-year production contract to supply printed circuit boards to Raytheon Company’s Space and Airborne Systems.  The boards are used in the Common Integrated Processor (CIP) of the F-22 Raptor.

The F-22 Raptor, utilizing stealth technology, was originally envisioned as an air superiority fighter, but is also equipped for ground attack, electronic warfare and signals intelligence roles. The CIP is the “brains” of the avionics system and provides a fully integrated, flexible and expandable architecture for performing communications, navigation, identification, electronic warfare, radar, and sensor fusion functions.


After extensive review of technologies and manufacturing capabilities, EI was selected by Raytheon’s McKinney, TX and El Segundo, CA locations.  “Our continued progression of yield improvement for these products made complex by the need for dual metallurgy and the stringent requirements surrounding this specification coupled with our meeting the performance and reliability demands led to our win of this program,” stated Eric Hills, Director of Military and Defense Programs at EI. 

“This is a significant win because it represents our first contract for production in the aerospace and defense segment for Raytheon.  From our initial engagements, we have made the commitment to deliver unparalleled customer service and technical support providing the quality and manufacturability Raytheon requires for its products,” commented EI President and CEO, James J. McNamara.  “I’m very proud of the EI team for contributing to Raytheon’s success and it’s our intention to continue doing so for many years to come.”

For more information, please visit
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GORE™ Protective Vents Improve Product Life for Telecommunications Equipment

W. L. Gore & Associates, Inc., offers the Polyvent/M12 Protective Vent as a solution for equalizing pressure in telecommunications equipment exposed to severe weather conditions. Extreme temperature fluctuations cause strong pressure differentials inside the equipment housing and put stress on the housing’s seals. This stress can damage the seals, causing corrosion and leaking, ultimately resulting in equipment failure. Available in both plastic and metal, the Polyvent/M12 vent allows air and gases to flow freely in and out of equipment housings, virtually eliminating the stress and damage on housing seals. At the same time, GORE™ Protective Vents shield the sensitive WiMAX electronics from harsh environmental contaminants, such as rain, snow, salt, and sand. Installing GORE™ Protective Vents ensures longer product life and minimizes the need for extensive maintenance. These vents are currently being used in cooling filters, bay-station cabinets, mesh-access boxes, antenna heads, power amplifiers, and tower-mounted equipment, just to name a few. 


According to Cindy Marra, W. L. Gore & Associates applications engineer, “In an industry that is changing as rapidly as the WiMAX industry is, having easy access to the equipment is essential. Utilizing a vented housing allows equipment to be upgraded with ease, simplifying service and maintenance.  In turn, by using GORE™ Protective Vents in their housings, many industry leaders have realized that they are increasing the integrity of their components, without worrying about compromising the reliability of their signal.”

The Polyvent/M12 high-airflow GORE™ Protective Vent is offered in plastic or metal.  It provides water protection to meet IP66 for water jets, IP 67 for 30 minutes of water submersion, and IP 69K for high-pressure spray, ensuring the highest protection against water entry in any harsh environment. For extremely rugged environments, the metal version of this vent is the best solution. Not only does the metal vent have an explosion rating approval, it can withstand temperature fluctuations from -40°C to 125°C. Like all GORE™ Protective Vents, the Polvent/M12 vent meets hazardous substance thresholds specified in EU Directive 2002/95/EC (Restriction of Hazardous Substances or “RoHS”).

For more information, please visit

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EFD® Introduces a No-Drip, SAC305 Solder Paste Formulation

Engineered Fluid Dispensing that increase throughput, improve yields, and reduce soldering production costs.

EFD, Inc., a subsidiary of Nordson Corporation (NASDAQ: NDSN) introduces a new no-drip, SAC305 solder paste dispensing formulation for mechanical soldering.  This lead-free, no-clean formulation is excellent for gap filling and application on vertical surfaces. 

The new formulation was created to help customers solder a perfect joint around a heat tube (or heat sink) container.  Research found that competitors’ formulations would drip down the container during the reflow process and create an insufficient solder joint.  In contrast, EFD’s no-drip formulation wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper to produce perfect solder joints. 

For more information, please visit


Figure 1:  Example of insufficient solder joint due to flux dripping

Figure 2:  Example of insufficient wetting around heat tube.

Figure 3:  Example of quality solder joint using EFD’s No-Drip SAC305NC.

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Recent Growth Boosts Protean’s Reputation as Technical Marketing Resource

Protean Marketing is currently reflecting on an extremely successful six months, having secured no less than five high profile contract wins during this period. Commissioned by technical specialists around the globe, the integrated marketing expert’s successful Brands by Design philosophy is currently driving technology businesses across a variety of market sectors.

Starting the year with a high profile appointment by technology leader in hand soldering assembly and rework solutions, OK International, Protean is now working to grow this brand in the global electronics production arena. The Protean team followed up this success by winning the prestigious Marantz Business Electronics account, expanding their electronics focus into the arena of Automated Optical Inspection. As a relatively new division of an established brand, Marantz Business Electronics appointed Protean to capitalise on its growing recognition in key international markets.

Early 2007 also saw Protean add engineering solutions provider AB Precision to its portfolio. Working across a range of industries including defence, medical and automotive, ABP appointed the Protean team to rebuild its website; updating and developing the brand across all four business units. More recently, Protean was handed responsibility for the marketing of Santa Clara-based EMS provider, NBS Design. Also beginning this partnership with a complete website rebuild, Protean is now engaged in marketing and strategic communications across all aspects of the NBS business. Protean’s successful form has continued unabated with its latest appointment by P3 Medical to provide strategic consultancy on brand development and product positioning.

According to company director Richard Heimsch, Protean’s recent success is indicative of B2Bs’ increasing recognition of two factors: the importance of strong branding and the economic value of outsourcing this specialist competence. “One reason why Brands by Design has been such a successful business growth formula is because it employs an integrated internal as well as external development approach. As a team, we enjoy deploying our unique skills and experience to develop positive and sustainable global brand identities for our clients. We’re delighted to welcome these new business partners and look forward to building on this success as the rest of the year unfolds.”

For more information, please visit
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Rohm and Haas Purchases Coating Cluster from SUSS MicroTec for Resist and Spin-on Dielectric Qualification

SUSS MicroTec has announced it has received the first order for its new Gamma XPress coat / develop cluster from Rohm and Haas Electronics Materials, a world leader in the development and manufacture of electronic materials for the semiconductor markets. The system from SUSS MicroTec will be used by Rohm and Haas Electronic Materials to develop, characterize and optimize photodielectrics and both thick and thin photoresists. The SUSS Gamma XPress was chosen over alternative equipment due to its superior thick resist processing capability and its bridge tool design that permits concurrent handling of wafers with different sizes without mechanical changeover.

Thick resists and photodielectrics are enabling technologies for volume production in wafer level packaging, 3D Integration and MEMS, representing some of the main markets for both companies. The system is scheduled for installation in late 2007 at Rohm and Haas’ photoresist manufacturing site in Nigata, Japan.

“Bringing leading edge technology like InterVia™ photoresists and photodielectrics to market requires our development labs to work with next generation processing equipment”, says Mike Toben, Global R&D Director for Rohm and Haas Electronic Materials, Packaging and Finishing Technologies “Our goal in selecting a new coating cluster was finding a system with the combination of high throughput and state-of-the-art control, and we believe we have found that with the new Gamma XPress. The SUSS MicroTec tool will significantly enhance our R&D and customer modeling capabilities.”

“We are honored that Rohm and Haas, one of the leading photoresist manufacturers, has decided to qualify its innovative resist solutions on a coat/develop system from SUSS MicroTec" comments Rolf Wolf, managing director for SUSS Micro Tec’s lithography division. “With the Gamma XPress SUSS MicroTec has developed a new advanced coating cluster that combines efficient processing with flexible production setup, helping our customer to minimize the cost of ownership for the tool.”

For more information, please visit

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Unitek Benchmark Introduces a Camera and Monitor System for Lid Alignment for the Sm8500 Seam Sealer

Unitek Benchmark, a division of Miyachi Unitek Corporation, has introduced a camera and monitor system which greatly improves alignment of lids placed manually.  The camera, which captures an image of the lid and mating part, can be mounted to an SM8500 seam sealer for a complete accurate lid tacking and sealing system.    Once the lid is aligned, the SM8500 lid hold down fixture is used to hold the lid in place during tacking.   Additional features and benefits include:

  • Camera zoom enables quick setup for different lid sizes
  • Monitor can be placed inside or outside a glovebox where ever most convenient for user
  • A clear black and white magnified image is displayed on monitor. 
  • Camera stand easily adjusts to different heights if needed
Miyachi Unitek designs and manufactures a full range of resistance welding and reflow soldering power supplies, heads, monitors and accessories for both large scale and fine spot applications requiring precision metals joining, lasers and laser systems for welding and marking, and hermetic sealing systems, glove boxes and environmental enclosures.  The company offers applications and process development support at no charge.  Miyachi Unitek may be found on the internet at


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Asymtek’s Jet Dispensing Precisely and Accurately Dispenses Catalyst Ink on Fuel Cell Membranes

Highly selective jet eliminates need for masking

Asymtek introduces two coating/dispensing technologies for applying catalyst inks onto membranes in electrode assemblies of proton exchange and direct methanol fuel cells.  Pulse spray coating technology provides quick large area coverage, allowing for uniform film thicknesses.  DispenseJet technology deposits the ink with a uniform thickness and density so lines and patterns are smooth, even, and the same consistency throughout.  The consistent and precision application of the ink increases the porosity of the film so fuel and byproducts can pass through the membrane efficiently.

Asymtek offers fuel cell manufacturers two types of application technologies for increased dispensing flexibility: spray coating and discrete dot dispensing.  Spray coating is for large areas, for controlled thicknesses, and even film thicknesses.  Discrete dot dispensing is used for specific patterns with high edge definition and exact film build up of highly volatile inks.  Asymtek has a multiple array of coating and dispensing technologies for catalyst inks, polymer electrolytes, gasketing, and sealing depending on the application.

Asymtek's DispenseJet® DJ-9000 is ideal for precise dispensing of dots of a wide range of fluids, including conductive adhesives like the silver epoxy shown here.

Catalyst inks are very expensive because of the platinum content.  With the Asymtek jet, the ink is deposited precisely where it is programmed to be placed, so there is limited waste.  The jet deposits discrete dots in whatever pattern is desired without masking.  Asymtek’s closed-loop system measures the exact amount of fluid that’s deposited.  Process controls and Asymtek’s Easy Coat(R) for Windows XP(R) (ECXP) software regulate the volume, size, shape, and viscosity of the dot.

Selective spray coating is a highly selective method of jetting materials and enables fluid to reach locations not possible with other applicators.  Dot sizes to 1.2mm (0.05 in.) are possible as well as thinner film builds of 5µm.  Jetting is fast, up to 500mm/sec (20 in/sec), because there is no Z-axis motion. The system is so accurate that it eliminates the need for masking.  The system is easy to disassemble and maintain.
Discrete jet dispensing allows material application in tight spaces as small as 175 microns with final dot diameters as small as 200 microns.  Shot volumes of 1.0 nanoliter are possible and the jet stream size can be as small as 50 microns.  Fluids from 1 to 250,000 mPa (cps) can be jetted.  As with coating, this is a very fast system. The system jets "on the fly" with no stopping between dots required at a rate of 200 dots per second.

“The success of the catalyst ink depends 50% on its chemistry and 50% on its application,” said Jim Klocke, Asymtek senior business development manager.  “While most application methods use spray technology, the catalyst inks may vary in thickness and density. With Asymtek’s jet dispensing, all those problems are eliminated and the ink is deposited precisely, with uniform thickness and density."

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Cyber Technologies Appoints Chalman

Cyber Technologies USA is pleased to announce the appointment of Chalman Technologies, Inc. (CTI) as their representative for Arizona, New Mexico and the Mexican border.

As a twenty-year old company, CTI has garnered an excellent reputation as an engineering-oriented manufacturers' representative organization experienced in semiconductor, fiber optic, and other microelectronics technologies. CTI specializes in materials and equipment for those industries, including assembly, rework, & test equipment, as well as materials for electronic assembly. Ronald C .Chalman founded CTI in 1986 with over 40 years of thermal and substrate materials experience in the industry. Keith Chalman has accumulated 18 years of bonding, die attach and test equipment training and service.

Cyber Technologies is the recognized leader in lased-based, high-resolution 3D inspection for microelectronics, worldwide.  Our world-class clients rely on our CyberScan Vantage Systems for inspection of:

  1. Substrate Flatness
  2. Bump and Ball Coplanarity
  3. Wire Bond Loop Height
  4. Film and Paste Thickness & Volume
  5. Transparent Materials Deposition

For more information, please visit

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View the Corporate Bulletin Archives

:: Issue 38 ::
September 18, 2007

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