AI Technology
:: Corporate Member News ::

:: Quantum Leap Packaging Adds Second Manufacturing Site (full story)

:: Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification (full story)

:: Gannon & Scott Announces Representation in Mexico (full story)

:: Pb Free Overglazes from Heraeus TFD (full story)

:: IMAPS 2007 GBC Marketing Forum -- Lighting Your Path to the Future - A View of Three Key Markets Driving Packaging: Flat Panel Displays, LED, and
IC Opportunities and Analysis
(full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Sikama International, Inc.
Endicott Interconnect Technologies
Research In Motion

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Quantum Leap Packaging Adds Second Manufacturing Site

Quantum Leap Packaging, Inc. has announced today that it has added a second manufacturing site in Poway, California. 

QLP plans to manufacture in its new Poway site by early 2008. The new 18,000 square foot facility will provide QLP with much needed capacity to support growing demand and provide product service and support to its Wilmington, Massachusetts facility.

“We are pleased to expand our manufacturing capabilities and support our products' rapid growth,” said David Grooms, CEO of QLP. “Our Poway site brings us closer to our customers, ensures that our customers’ orders are delivered on time, and satisfies our need for a second manufacturing site.”

QLP has experienced significant growth in both its power amplifier packages and hermetic air cavity packages since developing HermeTechTM, the industry's first true plastic hermetic package.  QLP achieved this long sought design and manufacturing breakthrough by combining QLP's innovative QuantechTM material, engineering design and proprietary process technology.

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Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification

The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $19M contract modification to existing work for additional multi-chip module (MCM) assemblies and equipment in support of a high reliability, high performance computing application.

The MCM’s result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM’s.

"This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.

For more information, please visit

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Gannon & Scott Announces Representation in Mexico

Gannon & Scott announces the appointment of Recuperado de Plasticos y Servicios Para Reciciaje, S.C. (RPS) as Consultant and Sales Representative in Mexico.

Mr. Luis Soltero, Principal Representative for RPS, founded the business in 2005 focusing on the plastic scrap market. Born in Guadalajar, Jaliso, Mexico, Mr. Soltero is a graduate Industrial Engineer with a Masters of Business Administration from Technologico de Monterey Campus Guadalajara. He has 16 years experience in manufacturing, most notably with IBM in the areas of Purchasing, Materials Planning, Quality Engineering, New Product Development and Global Accounts.

"We are very enthused about the appointment of RPS and in particular look forward to our relationship with Luis Soltero” said Ken Dionne, Chief Executive Officer of Gannon & Scott.

“Mr. Soltero’s knowledge of the electronics industry environment will provide significant opportunities for Gannon & Scott” said Mr. Dionne, “but equally as important, our expertise and service will provide significant benefits to area customers”.
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Pb Free Overglazes from Heraeus TFD

Lead free products are here to stay.  With the RoHS directive in place and new legislation pending, Heraeus TFD has continued to develop environmentally friendly hybrid thick film and passive component metallizations.

One area of focus in the Heraeus TFD Pb free product development plan has been overglazes. IP9035A and IP9036A have come into their own as Pb and Cd free overglazes.  IP9035A fires at 500°C for use as a green, protective resistor overglaze.  The lower firing temperature means less resistance shift of the resistor from refiring.  IP9036A fires at 620°C and is used as a green, protective overglaze for components that need to withstand plating processes.

In addition to these two overglazes, three other products have been developed.  The first is IP9036BLACK, which is a black version of IP9036A.  IP9037 is a high temperature, lead free, acid resistant overglaze.  Similar to the IP9036A, in that it shows no degradation in plating baths, IP9037 fires at 850°C and can operate at temperatures upwards of 550°C. IP9037 can withstand Ni plating solutions in the pH range of 4-5, as well as alkaline solutions with a pH of ≤9. This makes IP9037 a product that is especially attractive for LTCC and chip component applications.

The other new lead and cadmium free overglaze is IP9038.  IP9038 fires at 500°C, but was designed with a Pb free frit system that shows no degradation of the fired structure when used with activated or mildly activated flux during soldering.

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IMAPS 2007 GBC Marketing Forum -- Lighting Your Path to the Future - A View of Three Key Markets Driving Packaging: Flat Panel Displays, LED, and IC Opportunities and Analysis

Marketing Forum - Global Business Council (GBC)

“Lighting Your Path to the Future”
A View of Three Key Markets Driving Packaging: Flat Panel Displays, LED, and IC Opportunities and Analysis

Wednesday, November 14, 2007
5:15 PM - 6:45 PM
San Jose Convention Center
Exhibit Hall Theater  


Howard Imhof, Metalor Technologies USA;
Laurie Roth, Laurie S. Roth Marketing

This GBC-Marketing Forum is a free-of-charge business session to all IMAPS 2007 attendees who wish to participate. Speakers will discuss market trends, supply chain opportunities and insights into current and emerging technology.

GBC Keynote/Lighting Your Path to the Future
George Craford CTO/Philips Lumileds

Current Semiconductor Forecast and Leading Indicators
Risto Puhakka, President/VLSI Research

FPD TV Electronic Supply Chain & Emerging Opportunities
David Barnes, VP Strategic Analysis/DisplaySearch

Networking Reception: 6:45 pm – 7:30 pm
J3 in the San Jose Convention Center

Visit for more information on IMAPS 2007 and the GBC Marketing Forum.

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View the Corporate Bulletin Archives

:: Issue 37 ::
September 4, 2007

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