AI Technology
:: Corporate Member News ::

:: Kyocera America, Inc. Announces Executive Promotions (full story)

:: AIM Nominated by SMT in 16th Annual VISION Awards Competition (full story)

:: BI Technologies Develops Compact Surface Mount Power Inductor (full story)

:: Kulicke & Soffa Introduces Next-Generation Wire Bonders at SEMICON China (full story)

:: Lambda Offers 20W addition to its popular PCB mountable AC-DC Power Supplies (full story)

:: Torrey Hills Technologies, LLC Opens New Production Facility in China (full story)

:: March Plasma Systems Announces FP64 Plasma System for Flexible PCB Manufacturing Applications (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Lambda Technologies
Kulicke & Soffa Industries, Inc.
L Gordon Packaging

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Kyocera America, Inc. Announces Executive Promotions

Gary Lee, Kenji Aonuma Gain Vice-President Responsibilities

Kyocera America, Inc. has announced two executive-level promotions to take effect April 1, 2008.

Gary Lee, currently National Product Manager, Organic Product Sales, will be promoted to Vice President, Organic Product Sales. Lee will be responsible for expanding Kyocera’s North American business in semiconductor package products based on organic and plastic material technologies. He joined Kyocera in January 2000 and has more than 25 years of experience in microelectronics, including management positions in sales and manufacturing.

Kenji Aonuma, currently General Manager, International Sales Division, Semiconductor Components Group, at Kyocera Corporation of Kyoto, Japan, will transfer to Kyocera America, Inc. and assume new responsibilities as Vice President, Asia Ceramic Products Sales. In his new role, Aonuma will be responsible for North American sales of ceramic-based semiconductor package products made by Kyocera business units in Asia. Aonuma joined Kyocera in 1979 and has held sales management positions both in Japan and the United States, including 10 years of prior service with Kyocera America, Inc. 

The promotions give Kyocera America, Inc. executive-level positions responsible for North American Products; Asia Ceramic Products; and Organic Products, underscoring the company’s commitment to continued growth through customer-first practices.
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AIM Nominated by SMT in 16th Annual VISION Awards Competition

AIM is pleased to announce that they have been selected as a finalist in two categories for this year’s SMT VISION Awards.  Instituted in 1991, the SMT VISION Awards honor the products and technologies that have shaped the PCB manufacturing industry over the past year.

Nominees for the SMT VISION Awards are evaluated on their ability to meet a significant industry challenge, creative application of a new or existing technology, overall quality and consistency of performance, economic merits, and throughput characteristics.  Products are judged specifically on their innovation, cost-effectiveness, speed/throughput improvements, quality, ease of use, maintainability/reparability, and environmental responsibility. 

AIM was selected for NC257 Lead-Free No-Clean Solder Paste and One-Step Underfill 688. 

NC257 is a lead-free no-clean solder paste, designed to improve the throughput and increase the efficiency of the most advanced SMT applications.   NC257 has proven to greatly reduce or eliminate solder defects such as “head and pillow”, voiding under micro-BGAs and solder beading by discrete components, thus reducing costly rework. 

One-Step Underfill 688 is a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and micro-BGA assemblies.  The results are fewer process steps and increased throughput.  Additionally, the One-Step Underfill 688 can be used in mixed alloy solutions, such as a lead-free BGA on a tin lead board.

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BI Technologies Develops Compact Surface Mount Power Inductor

Providing design engineers with a compact power device in a cost-efficient package, TT electronics BI Technologies has developed a tight DCR surface mount power inductor. Designated the HM69T Series, the inductor measures just 7.4mm x 7.2mm, with a height of 5.0mm.

"The compact footprint makes the HM69T Series inductor ideally suited for space-saving designs, including those applications with limited printed circuit board space," said David Smolik, director of product development for BI Technologies.  "Coupled with a tight DCR tolerance of ±3% and cost-efficient packaging, the inductor is specified for high volume power supply applications, such as voltage regulators and power circuits for central processing units."

The HM69T surface mount power inductors feature inductance values of 90nH, 100nH and 150nH, with rated DC current of 57A, 52A and 27A, respectively. DCR tolerance is to ±3%, with typical DCRs of 0.298m<ohm>. Operating temperature ranges from -40°C to +125°C, with a maximum temperature rise of +40°C.

Typical pricing for the HM69T Series inductor is approximately $0.48 to $0.63 each depending on volume and package size.  Lead times are from 12 to 14 weeks.

For more information about the HM69T Series surface mount power inductor, contact BI Technologies at sales@bitechnologies.com.
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Kulicke & Soffa Introduces Next-Generation Wire Bonders at SEMICON China

Kulicke & Soffa Industries, Inc. (“K&S”) introduces two next-generation wire bonders at SEMICON China, in Shanghai.  The first is the new IConnPS High Performance Wire Bonder, which will replace the current market-leading Maxumultra.  The name IConnPS comes directly from its function of IC inter-Connect.  It offers the highest performance in wire bond packaging assembly, with features that address the advanced product roadmaps of K&S customers including:

  • +/- 2.0um accuracy for sub-35um ultra fine pitch requirements
  • New advanced looping processes
  • Automatic Self-Teaching Bond Integrity Test System (Auto BITS)
  • Programmable Focus Optics for complex stacked die packages

The second bonder being announced is the new ConnXPS High Speed Wire Bonder, which replaces the Maxumelite.  The ConnXPS is engineered to provide unsurpassed throughput for manufacturing lower pin count ICs and LEDs, in the Cost Performance part of the assembly market.  Its features include:

  • +/- 3.0um accuracy
  • Look ahead vision algorithms to align and bond simultaneously
  • Programmable Red/Blue Illumination

The PS superscript in both these Wire Bonders means they will be part of the Company’s new Power Series product line.  This series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market. The Power Series will also be represented by a new product line symbol  - a form of the Chinese Character “Li”, which means Power and Strength throughout Asia.  

Common features for both the IConnPS and ConnXPS  include:

  • Larger 80mm Bondable Area and Advanced Motion Control System
  • Dual Frequency Transducer
  • Programmable Power Supply System

Scott Kulicke, Chairman and CEO of K&S, explains that, “These next generation wire bonders are the most thoroughly tested products in our history, so they are ready for production right out of the box.   In addition to the accuracy, looping, and reliability tests, we ran customers’ Maxumultra bond programs directly on IConnPS with excellent results.  We confirmed the bonding and looping quality at the increased speed.”

 

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Lambda Offers 20W addition to its popular PCB mountable AC-DC Power Supplies

Lambda has unveiled its latest series of compact pcb-mountable 20-watt AC-DC power supplies. The single output ZPSA20 series accepts a wide input voltage range, has a low profile (0.79“) and industry standard footprint (2 x 3.5“), making it an ideal choice for applications such as computer peripherals, datacom, telecom, point-of-sale equipment, LED signs and lighting, video/audio routers and test & measurement equipment.

These 20-watt pcb-mountable supplies are available with the most popular output voltages including 3.3V, 5V, 9V, 12V, 15V, or 24VDC. The outputs are floating so they can be used as either a positive or negative polarity. Typical efficiencies are up to 82%. These models are rated for operation in a convection cooled environment from 0°C up to 70°C with derating. A green LED is provided as an indicator that the power supply is on. Other standard features include overvoltage and short-circuit protection.

To maximize design-in flexibility, Lambda is offering these supplies as either an open-board configuration with Molex input/output connectors, or as a "/P“ version with pins for PCB mounting.

Accepting a wide input voltage range of 85-264VAC, the ZPSA20 series is ready for use globally with no further configuration or input selection. Its industry standard footprint makes it an ideal choice as a drop-in replacement for existing supplies, while its low profile means that it can be installed in the most compact of applications. The ZPSA20 has global safety agency approvals per UL/CSA/EN60950-1; meets conducted and radiated EMC requirements of EN55022-B/FCC Class B (without additional filtering or components) and meets EN61000-4 immunity specs for greater reliability. All supplies carry the CE Mark and are RoHS compliant.

The ZPSA20 series is available now with prices starting at $12.50 each in 1000 piece quantities. More information is available at Lambda’s website: http://www.lambdapower.com.

To view the ZPSA Series datasheets please go to: http://www.lambdapower.com/products/zpsa-series.htm.

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Torrey Hills Technologies, LLC Opens New Production Facility in China

Located in the Yixing Sci & Tech Industrial Park, a popular business development park that is close to major highways and metropolitan areas, the plant is quickly expanding its annual production capacity and actively seeking international certifications for its quality management.

This 8800 square-foot facility specializes in the production of microelectronics packaging components, materials and related equipment.

It is outfitted with state-of-the-art production equipment and supported by a highly qualified research and development team with rich experience in the field of microelectronics.

“It is great news for both our customers and our shareholders,” said President Ken Kuang. “We now have a specifically trained workforce to optimize production on our cutting-edge automated equipment. Our shareholders are going to see much faster return on investments."

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March Plasma Systems Announces FP64 Plasma System for Flexible PCB Manufacturing Applications

March Plasma Systems has announced today that it has released the FP64 plasma system for advanced flexible printed circuit board (PCB) production.  The target application for the FP64 plasma system is inner-layer preparation and treatment for improved bonding and adhesion. 

“The FP64 plasma system is a breakthrough in performance and price for flexible PCB plasma processing applications,” said Peter Bierhuis, President of March Plasma Systems.  “The system enables advanced flexible PCB manufacturing.  As the market expands from traditional rigid PCBs to flexible panels, it opens up new segments of PCB fabrication, with higher production efficiencies and lower costs than ever before.” 

“The FP64 plasma system was specifically designed for today’s high-density PCB fabrication facilities,” Mr. Bierhuis continued.  “The FP64 platform is completely self-contained and requires minimal floor space.  The vacuum pump, plasma chamber, control electronics, radio frequency (RF) generator, and matching unit are housed in a single, safety-interlocked enclosure.  Front-opening panels allow for convenient access to interior components.  The vacuum pump is also positioned on rollers for easy maintenance.” 

A variety of system options are available to ensure that the FP64 plasma system meets a wide range of customer processing requirements. 

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View the Corporate Bulletin Archives

:: Issue 49 ::
April 1, 2008

Ticona Engineering Polymers

Oneida Research Services

Compex Corp.

National Training Center