AI Technology
:: Corporate Member News ::

:: DuPont Microcircuit Materials Highlights New Developments at Printed Electronics Europe (full story)

:: New HD Alumina With Straight Through Vias for Thin Film Applications from AdTech (full story)

:: Precision Process Equipment’s China Rep and Excellite FSP (full story)

:: Lambda’s Unique "Power City" Speeds Search for Power Products by Applications (full story)

:: BI Technologies Offers Integrated Control and Power Handling Hybrid Solutions (full story)

:: C-MAC MicroTechnology upgrades test house with new solderability testing capability (full story)

:: Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc. (full story)

:: Pennwell Names Key Additions to Editorial And Sales Staff (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PA & E, Inc.
Crane Aerospace and Electronics
FEI Company

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


DuPont Microcircuit Materials Highlights New Developments at Printed Electronics Europe

New developments in inks and imaging for the printed electronics industry was presented by DuPont new market development lead Dr. Kerry Adams as part of DuPont Microcircuit Materials¹

³We¹re pleased to address the topic of new materials that will benefit this industry as it grows,² said Adams.  ³For over 40 years, MCM has successfully developed inks suitable for use in a wide array of applications, with an even wider range of processes and substrates.  Because DuPont has expertise in material science, precision patterning and substrates, we¹re uniquely positioned to help customers create solutions to meet their needs in printed electronics.²

 

Dr. Adams¹ presentation on Wednesday, April 9 provided an in-depth view of materials commercially used in the printed electronics industry as well as those currently in development by DuPont for a variety of markets.  Key areas include:

· Thin film Photovoltaics (PV) ­ low temperature curing inks suitable for front-side grid and bus-bar conductors for thin film technologies such as CI(G)S, Cd Te, DSSC, organic and amorphous silicon;

· Electroluminescent (EL) Displays ­ a full system of compatible inks for printing EL lamps for signage, backlights, automotive lighting and decorative lighting;

· Biosensors ­ gold, silver, carbon and custom ink formulations for working and reference electrodes;

· RFID - Printed antennae using DuPont MCM silver inks, with widespread usage in ticketing, ski passes, automotive antennae, e-passports and luggage labels;

· Membrane Touch Switches (MTS) and Interconnects ­ full range of silver, carbon and UV dielectric inks;

· Smart Packaging ­ next generation flexographic inks;

· Printed Batteries ­ carbon, silver and other custom compositions for printed batteries;

DuPont MCM¹s range of functional low-temperature curing inks for printed electronics applications employ various advanced resin chemistries enabling a variety of adhesion, flex and thermal properties and compatibility with a broad range of substrates, including paper, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), FR4 and transparent conductive oxides.  The active phase of each ink is designed with each specific end application in mind, to ensure the correct conductive, resistive or dielectric properties.  DuPont MCM¹s wide range of ink vehicle systems is suitable for screen print, flexo, gravure, photo-imaging, pad printing and other processing techniques. New ink-jet formulations are also under development.

Materials for printed electronics from DuPont Imaging Technologies and DuPont-Teijin Films will also be discussed, with an emphasis on advanced films that are optimised for dimensional stability, cleanliness and surface smoothness.
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New HD Alumina With Straight Through Vias for Thin Film Applications from AdTech

AdTech Ceramics has designed a product line that combines thin film substrate qualities (5 micro inch or better surface finish) with multilayer HTCC structure and straight through hermetic vias, with the practicality of multilayer co-fire alumina. Demonstrated programs have included flip chip, copper metallization and cavities.

AdTech has 30+ years of multilayer ceramic (MLC) manufacturing and 15+ years of AlN multilayer technology experience, and offers microwave modeling & design and developmental partnerships.

For more information on AdTech’s new HD Alumina technologies or other electronic ceramic packaging capabilities, please visit www.AdTechCeramics.com or e-mail sales@AdTechCeramics.com.

 

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Precision Process Equipment’s China Rep and Excellite FSP

Process Partners International, the partner effort between Precision Process Equipment and PAT, has expanded their team to include Sidney Qiu, Sales & Service Engineer now located in Shenzhen City Mainland China.  +86 13510083568 sqiu@processpartnersinternational.com

Precision Process also introduces the Excellite FSP: A New Dimension for Flexible Substrate Plating Technology.  Ever increasing demands for HDI production processes call for innovative, future-oriented solutions. The Excellite FSP is a roll-to-roll, continuous strip, electroplating and wet processing system designed principally for flex circuits, RFID, and solar cells while having a variety of other electronics and metal finishing applications. View the full brochure at http://www.processpartnersinternational.com/pdfs/ PPE_FlexibleSubstrate_RFIDBrochure.pdf.

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Lambda’s Unique "Power City" Speeds Search for Power Products by Applications

Lambda has expanded its online power-products search engine to include an easy to use Search-by-Application called "Power City". When selected, the user sees a pictorial of a typical town with hot links to places where power supplies and DC-DC converters are used. For example, within Power City there is a hospital (medical applications), a factory (industrial/automation), a radio tower (RF amplifiers/satellite communications) and a military base (Mil/COTS applications), to name a few. In all, there are nine (9) application specific hot spots within Lambda’s Power City. When the user clicks on a hot spot, all of the power products that are designed for that application appear as photos with a brief description. To get more detailed information (i.e., datasheet, instruction manual); the customer just clicks on the product photo that comes closest to their needs.

David Norton, VP of Marketing for Lambda Americas, thought of this concept based on feedback he received from Lambda’s customers, sales people and representatives. "Often times I was told that Lambda’s existing search features such as our Model Number Search, Parametric Search (specs) and Visual Search (product photos) worked very well, but, there seemed to be a need for a quick way for the user to find ‘application-specific’ power products,“ said David Norton. "For example, our clients asked for a faster way to find all of the power products that related to Medical or Industrial applications. So, it came to me that a pictorial of a small town with buildings/graphics and hot links to the associated application for our power products would be a great way to make searching easier for our clients."

In early March 2008, Lambda went online with its unique "Power City“ selection aid, which can be accessed by going to: http://www.lambdapower.com/products/applications.htm. "Already we have received rave reviews from our customers and associates about how easy and effective this new search feature has proven to be," commented Mr. Norton.

More information about Lambda Americas is available at Lambda’s website: http://www.lambdapower.com.

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BI Technologies Offers Integrated Control and Power Handling Hybrid Solutions

Providing power electronics design engineers with a high power, thermally efficient hybrid solution, TT electronics BI Technologies has combined its small signal and power hybrid technologies to develop an integrated control and power handling hybrid solution. While conventional assemblies require larger packaging to provide adequate thermal management, BI technologies' hybrid module combines thermally conductive ceramic substrates with discrete components or bare die through the use of vacuum low flow die attach, providing a smaller, more efficient solution than comparable products.

"With comprehensive in-house design, layout, manufacture and test capability, including environmental testing, along with the ability to combine both power and control electronics into one module, we are able to provide our customers with the hybrid designs required to suit any applications," said Chuck Nelson, product manager for BI Technologies.

Typical applications for the custom hybrid modules include motor drives, power amplifiers and power conversion. The hybrid module is capable of handling power to 100A, with a voltage rate of 1000V.

For more information about BI Technologies' hybrid microcircuit products and capabilities, visit: http://www.bitechnologies.com/products/microcircuits.htm.

 

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C-MAC MicroTechnology upgrades test house with new solderability testing capability

C-MAC’s UK-based testing expertise expanded to meet upgraded IEC 68, MIL-STD 883 and MIL-STD 202 test methods for electronics in military applications

C-MAC MicroTechnology, has announced the enhancement of its leading Laboratory Suitability accredited testing facility with significant investment in new solderability testing capability.

Component failure at board level is often attributed to solder joint faults. C-MAC’s new solderability testing capability provides reassurance for component manufacturers and users by reducing the risk of faults leading to improved yields and reliability.

The  new solderability test process works by dipping a component’s terminations into a tin lead solder amalgam at 245°C for five seconds. This is performed under strictly controlled rates of immersion and emersion to ensure that the solder covers 95% of the surface area. This guarantees that the component can be properly attached to the circuit board it is intended for.

 This new service joins C-MAC’s wide range of ISO 17025 accredited test methods which include; temperature cycle, thermal shock, high humidity, salt mist, salt corrosion, high and low temperature storage and insulation resistance, which have been a key element of C-MAC’s test services for many years.

C-MAC’s test house allows the rigorous testing of printed circuit board assemblies, hybrid modules and other electronic components employed in harsh environments, such as satellites, automotive applications and military aircraft.  It is one of the few UK facilities used by C-MAC and other companies to ensure that components manufactured in Europe meet the stringent requirements of IEC 68, MIL-STD 883 and MIL-STD 202 test methods.

Paul Hill, General Manager, commented; “Our investment in the new solderability testing capability is further indication of C-MAC’s commitment to maintaining the highest standards.   As a leading European test facility we will continue to meet industry standards to ensure our products and our customer’s products are rigorously tested to the highest level”.
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Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

The Center for Advanced Microelectronics Manufacturing (CAMM) located at the Endicott Interconnect Technologies, Inc. facility was inaugurated on Monday, March 31st, in a ceremony attended by business, political and community leaders.  Dr. Mark Poliks, Director of Research and Development at EI and Technical Director of the CAMM hosted the event.  A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format.  These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.

 

Plans for the CAMM were initiated in 2005 when the United States Display Consortium (USDC) selected Binghamton University to manage this new initiative.  The USDC provided $12 million in equipment to establish the CAMM, which is hosted by Endicott Interconnect Technologies and draws collaborative resources from Cornell University.

“Endicott Interconnect Technologies is proud to have a leadership role in the creation and development of this center that began with the first discussions with the USDC, the winning proposal written with Binghamton University and continues each day as a unique working partnership,” stated Poliks.

From this initial collaboration, the CAMM has grown into a facility that consists of a 10,000 square foot area and clean room. It includes an integrated roll-to-roll flexible electronics prototype manufacturing line, and an associated microfabrication laboratory. CAMM facilities also include a precision lithography stepper, vacuum coaters, and an in-line defect inspection capability.

“Endicott Interconnect is very proud to serve as host to the CAMM.  Our unique working partnerships with both Binghamton University and Cornell University have resulted in a truly impressive facility that offers the opportunity to develop new technology and manufacturing capability for low-cost, high function electronic systems on flexible substrates.  This technology will be the backbone of tomorrow’s electronics, fueling job growth in the U.S. and in our industry,” commented Jay McNamara, President and CEO at Endicott Interconnect Technologies.

Currently, most advanced electronics components are produced on silicon or quartz wafers, or on plates of specialized glass in a “batch” process that has been the backbone of the integrated circuit (IC) and flat panel display (FPD) industries. A R2R process, which integrates electronics on flexible plastic means, in theory, that components can be produced more efficiently, at higher yields and at a lower cost than is common practice today and opens up potential new application areas for flexible electronics.  

Under Professor Bahgat Sammakia, Director of Binghamton University’s New York State Center of Excellence in Small Scale Systems Integration and Packaging Center, of which the CAMM is an integral component, and Poliks, the facility will evaluate equipment and materials developed under the auspices of USDC, industry and its own research and development program that will be further developed into a fully-integrated prototype manufacturing line. The CAMM will also provide large-scale testing whereby academic and industrial research groups can test their work for manufacturing applicability without the high costs and risks typically associated with such activities. 

Equipment is accessible to both the University community and private industry, which participates in the CAMM through paid membership fees and funded research programs. CAMM’s corporate members include Endicott Interconnect Technologies, General Electric, Kodak, Corning Incorporated, Texas Instruments, Plastic Knowledge and Samsung Electronics Company. Additional partners and supporters include the National Aeronautics and Space Administration, the Army Research Laboratory, and New York State Foundation for Science, Technology and Innovation.

 

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Pennwell Names Key Additions to Editorial And Sales Staff

Industry Veteran, Peter Singer, is Named Editor-In-Chief of Solid State Technology; Franchise Also Expands by Investing in Additional Sales Staff

David Barach, group publisher at PennWell's Technology Group, today announced that Peter Singer has been named Editor-in-Chief of Solid State Technology. Singer was formerly Editor-in-Chief of Semiconductor International where he has worked for more than 25 years. Barach also announced the addition of two new sales positions in California's Silicon Valley.

Singer will oversee the print and online editorial operations of Solid State Technology, WaferNews, and Microlithography World, including e-newsletters, e-show dailies, webcasts and "on the scene" videos. "It's exciting to be working for a company that has the foresight to invest in the future even during difficult economic conditions," says Singer. "People are looking for a single authoritative source of information on semiconductor manufacturing and related industries, and that's where Solid State Technology has always excelled."

"Pete Singer is a proven 'all-star' in this industry," says Barach. "Not only is he well-liked by myriad individuals in the dynamic, global semiconductor market, but he possesses the kind of rich experience and earned a level of credibility that precious few editors have achieved. We are thrilled to have Pete join the proud Solid State Technology team and feel he will bring significant value to the table," Barach adds.

"Solid State Technology has been a genuine leader for more than 50 years, with the highest circulation of any semiconductor manufacturing magazine and the best penetration into major semiconductor manufacturers," Barach says. "Along with global partners and robust online media vehicles, SST has the largest global footprint, including Solid State Technology CHINA/Advanced Packaging, Solid State Technology TAIWAN/Advanced Packaging, Nikkei Microdevices JAPAN, and Semiconductor & FPD Monthly KOREA

Solid State Technology also announced the addition of two new sales representatives to cover Silicon Valley and the Western U.S. Both Wayne Wiggins and Peter Sienkiewicz have a wealth of experience and talent successfully representing top-notch business-to-business high-tech media franchises. "We are most pleased to include Wayne and Pete to the Solid State Technology sales team", says Barach. "This is an important investment that both PennWell and Solid State Technology are making—one that will expand our coverage as well as better serve the needs of the still powerful client base in Silicon Valley," Barach states.

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View the Corporate Bulletin Archives

:: Issue 50 ::
April 15, 2008

Ticona Engineering Polymers

Oneida Research Services

Compex Corp.

National Training Center