Draper Laboratory
:: Corporate Member News ::

:: RNT Announces Certification Program for NanoBond® Process Technology (full story)

:: ASYS Opens Office in Hillsboro, Oregon (full story)

:: Torrey Hills Technologies, LLC Appoints PSI as New Representative in Texas (full story)

:: Multiple Design Wins for BI Technologies' Robust Rotary Potentiometer (full story)

:: Hesse & Knipps to Introduce Wire Bonder for Solar Market (full story)

:: PEPS® II – TMC’s New Precision Electronic Positioning System For Pneumatic Vibration Isolators Improves Height Control and Settling Time (full story)

:: Asymtek’s New DispenseJet® DJ-9500 is up to Ten Times Faster than Needle Dispensers in High-Volume Underfill and LED Silicone Applications (full story)

:: Palomar Technologies Achieves Management Buy-out (full story)

:: Tessera Announces Fifth Annual Technology Symposium Series (full story)

:: SUSS MicroTec Delivers Coat/Develop Cluster to Replisaurus Technologies (full story)

:: Anne Poncheri joins Silicon Cert, Ltd., as Quality Manager (full story)

:: IMAPS 2008 Golf Classic - Notes on the Alpine Country Club (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Tessera
ASYS Group
Palomar Technologies

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


RNT Announces Certification Program for NanoBond® Process Technology

Program creates industry standard for use of NanoFoil® in sputter target bonding

Reactive NanoTechnologies, Inc. (RNT), has announced that it has created a certification program for the use of its NanoBond® technology for sputter target bonding. The NanoBond® Certification Program involves a combination of training and audits for NanoBond® licensees’ equipment, practices, and procedures.

“The NanoBond® Certification Program creates a common process platform for NanoBond® licensees,” stated Joseph A. Grzyb, CEO of RNT.  “Our licensees have asked us to create such a certification program. The program assures that these bond shops will offer a statistically consistent and high-yield NanoBond® process that will meet the quality needs of their customers.  Our goal is to be able to apply this certification standard throughout the entire sputter target bonding industry”.

NanoBond® is used to bond sputter targets to backing plates at room temperature, allowing the end user to enjoy higher sputter rates, improved yield and increased sputter tool uptime. The NanoBond® process enables the use of higher temperature, lead-free solders creating a stronger and more reliable bond. Problems that have traditionally plagued bonded targets such as warping, arcing, de-bonding, and cracking are significantly reduced or eliminated by the use of RNT’s NanoBond® process technology. The NanoBond® process is available for license and is currently in use to bond metal and ceramic oxide sputter targets for a variety of thin film deposition applications in North America, Europe, and Asia

For more information please visit www.rntfoil.com.
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ASYS Opens Office in Hillsboro, Oregon

ASYS Inc., with its Regional Head Quarter for the Americas located in Atlanta, GA announced that it opened a second office on the West coast in Hillsboro, OR

ASYS opened a new support location on the West coast to complement the existing office in Atlanta. “With major projects being installed in Oregon we felt we should provide better response times to our customers. That being said, we are pleased to officially announce that our new office is up and running. Two service and application engineers are located on site and we are stocking spare parts for all of our major metallization equipment.”, says Markus Wilkens, General Manager of ASYS Inc. “We are also expanding our base in Atlanta as we are installing multiple metallization lines in the US, this year alone rated at more than 200MW annual capacity.”
The new location is: ASYS Inc., 4660 NE Belknap Ct., Suite 201K, Hillsboro, OR 97124, USA

For more information on ASYS, call (+1) 770 246 9706.

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Torrey Hills Technologies, LLC Appoints PSI as New Representative in Texas

Torrey Hills Technologies, LLC, announces today the expansion of its sales representation network by appointing PSI, a manufacturer’s representative firm in Texas, for its full range of microelectronic packaging related products and industrial belt furnaces.

PSI, headquartered in Richardson, Texas, was formed in 1990 and specializes in microelectronic components, services and machines. The president of PSI, Jim Pinac, has been in sales as a representative or regional sales manager since 1978. Jim also worked for Texas Instruments for 14 years. He has a BSEE from Louisiana State University and a MSEE from Southern Methodist University. Jim Pinac can be contacted by telephone at 972-644-5090 or by e-mail at psitx@sbcglobal.net

“We are extremely pleased to have PSI as our new representative in Texas. We believe that our shared passion for the industry, expertise in technology and knowledge of the territory will benefit both parties, as well as our customers in this important market,” said Ken Kuang, president of Torrey Hills Technologies.

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Multiple Design Wins for BI Technologies' Robust Rotary Potentiometer

Providing design engineers with a robust, long-life device suitable for multiple applications, TT electronics BI Technologies' Model P270 27mm rotary potentiometer has been specified for use by manufacturers in industrial, commercial, audio and heavy equipment markets. Since production began nearly a year ago, BI has been awarded four major design wins with the versatile rotary potentiometer.

 

"The multi-purpose design of the P270 device lends itself for use in heavy-duty equipment as well as light panel applications," said Alain Leon, variable products applications engineer for BI Technologies.

"With the extended life cycle to 1 million rotations and multiple design options including package sealing, and center-tap and two gangs for redundancy, the potentiometer is ideal for applications ranging from electric guitars to industrial lifts."

Recent design wins for the P270 potentiometer include industrial scissor lifts to raise and lower platforms and heavy duty welders; custom-built scooter controls with special short angle and sealing elements to protect against harsh environments; throttle assemblies in vehicles, directional speed controls for forklifts, and material handling equipment; and a win with a premier guitar manufacturer due to the potentiometer's superior rotational consistency and custom non-linear tapers.

The Model P270 rotary potentiometer features a resistance range of 1Kohm to 1Mohm and standard tolerance to ±10%. Power ratings are 2W at 70°C, with a maximum input voltage of 500Vdc and dielectric strength of 1000VAC. Operating temperature range is -55°C to +120°C. BI Technologies will produce devices outside these specifications to meet customer requirements.

Typical pricing for the Model P270 potentiometer ranges from $4.00 to $6.00 each. Samples are available within 2-3 weeks and production lead time is 4-5 weeks.

For more information, please visit  http:://www.bitechnologies.com/products/panel_pots_sg.htm.
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Hesse & Knipps to Introduce Wire Bonder for Solar Market

Hesse & Knipps, announces that it will soon introduce a new wire bonder dedicated to the needs of the solar market in producing CPV (concentrated photovoltaic) cells.

The new BondJet 820 CPV will offer all of the advanced features of the company’s Bondjet BJ 820 wedge bonder, in addition to an extended table travel of 900mm x 350mm and expanded X axis travel via the use of intelligent automation.
The BONDJET BJ820 platform is an industry benchmark for wire bonding, offering the fastest wiring speed, largest work area and greatest axis accuracy available.

Other significant machine capabilities include:

  • 12.5μm to 85μm diameter wire bonding
  • Ribbon bonding from 6μm x 35μm to 25μm x 250μm
  • Constant loop height and wire length
  • Maintains parallel loops within mixed reference system
  • Auto teach for linear applications, reducing programming time

 “The bonding speed and flexibility of the 820 platform, coupled with the extended bonding area, will lend itself very well to the CPV marketplace as well as other markets requiring such extended travels,” states Joseph S. Bubel, president of Hesse & Knipps, Inc.

For more information, call +1 (408) 436-9300 or email info@hesse-knipps.us.

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PEPS® II – TMC’s New Precision Electronic Positioning System For Pneumatic Vibration Isolators Improves Height Control and Settling Time

Technical Manufacturing Corporation (TMC) introduced the PEPS® II digital, non-contacting, Precision Electronic Positioning System for pneumatic vibration isolators earlier this month at Semicon West 2008. PEPS II improves isolator height control and settling time, leading to increased yield of semiconductor manufacturing equipment by providing a better, faster, more cost-effective approach to payload position control in response to motorized XY stage motion. PEPS II is also used in precision laboratory environments that demand optimum noise performance and platform stability.

 

PEPS II improves and builds on TMC’s patented PEPS® technology. With the addition of a new digital controller, PEPS II is easier to use, offers more features, and has an improved user interface. By eliminating the mechanical height control valves and sensing linkage normally found in conventional mechanical height control systems, PEPS II is able to provide better vibration isolation by eliminating vibration paths. Additionally, by eliminating the mechanical linkage, wear is reduced, particulate generation eliminated, and long-term position repeatability optimized. An optional “VX” feature incorporates inertial vibration sensors for active damping of the vertical isolator resonance. PEPS II is compatible with all TMC pneumatic vibration isolation systems including the Gimbal Piston™, CSP® and MaxDamp® air isolators.

TMC designs and manufactures precision vibration isolation systems for sensitive research and manufacturing processes worldwide. The ISO 9001:2000-certified company’s products are industry standards in semiconductor manufacturing, life sciences and photonics and also used in academic, industrial and military research.

For more information, please visit www.techmfg.com.

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Asymtek’s New DispenseJet® DJ-9500 is up to Ten Times Faster than Needle Dispensers in High-Volume Underfill and LED Silicone Applications

Asymtek, a Nordson company (Nasdaq:NDSN) introduces its new DispenseJet® DJ-9500 fluid jetting valve for high-speed underfill applications and jetting silicone for LEDs. The DJ-9500’s flexible pneumatic design can jet a wide variety of fluids up to 10 times faster than existing needle type dispensers, even with abrasive fluids.  The new design enables compatibility with a wider range of fluid types, and opens the process window to allow a robust jetting solution.  DJ-9500 users will benefit from improved fluid control, better repeatability, increased flexibility, and a lower cost of ownership.

The DJ-9500 controls fluid break-off at the nozzle tip for clean and consistent dots and line patterns on the substrate. Because the DJ-9500’s hardware lasts longer and offers better fluid control, a lower cost of ownership is achieved. The new long-life needle assembly lasts 5 to 10 times longer than other tested needle assemblies. Enhanced temperature controls maintain the fluid at a consistent viscosity for high throughput applications.
Jetting is an automated, non-contact process that dispenses fluids quickly, cleanly, accurately, and reliably into places where other dispensing methods can’t reach. The DJ-9500, like Asymtek’s award-winning DispenseJet DJ-9000, features Asymtek’s patented “jetting-on-the-fly” (U.S. Patents 5,711,989 and 5,505,777) “dot on dot,” (U.S. Patent 5,747,102) and Calibrated Process Jetting™ (U.S. Patent 6,173,864).

For more information, please visit www.asymtek.com.

 

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Palomar Technologies Achieves Management Buy-out

Palomar Technologies, announces that Palomar management has bought out the original investor group that spun the company out of Hughes Aircraft in 1995.  Local management, already with Palomar for many years, now owns the company.

“This is a very positive step forward for Palomar.  We are financially self-sufficient with an awesome team of employees and the latest technologies in precision interconnect for microelectronic assembly.  All of our current operations, products, and services will continue unchanged, so there will be no effect on our customers worldwide.  Going forward, having local ownership will enable us to act quickly to take advantage of opportunities in our space,” said Bruce Hueners, Palomar Technologies president and CEO.

For more information, please visit palomartechnologies.com.

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Tessera Announces Fifth Annual Technology Symposium Series

Industry Leaders to Gather at Events in Taiwan, Japan and California to Discuss Integration and Convergence in Mobile Devices

Tessera Technologies, Inc. (Nasdaq: TSRA), a leading provider of miniaturization technologies for the electronics industry, today announced its fifth annual technical symposium series.

The Tessera Technology Symposiums will be held in Hsinchu City, Taiwan on September 23, 2008; Tokyo, Japan on September 25, 2008; and San Jose, Calif. on January 26, 2009. The symposiums' theme, "The Power of Integration,” will provide a forum for Tessera executives to join industry leaders to discuss issues, technologies and business opportunities in consumer electronics.

The symposiums will feature guest speakers from industry-leading consumer electronics manufacturers and OEMs, as well as market research firms.  During the event, Aptina, Asia Optical, Samsung, Toshiba and a senior analyst from market research firm IDC will discuss topics including:

  • The Future of Imaging in Converged Mobile Devices
  • Transforming Mobile Devices Through High-End Imaging
  • Integration Challenges of Converged Devices
  • Enhancing Camera Phone Performance

"These symposiums will offer an executive forum to discuss the latest trends in the mobile electronics marketplace, including mobile device convergence, high-end imaging and optics and advances in cell phone cameras,” said Michael Bereziuk, COO, Tessera. "For our fifth annual event series, we have assembled some of the foremost industry experts from around the world to discuss technologies that are transforming the future of mobile devices.”

For more information, please visit www.tessera.com.

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SUSS MicroTec Delivers Coat/Develop Cluster to Replisaurus Technologies

SUSS MicroTec, supplier of innovative solutions for the 3D, MEMS, Advanced Packaging and Nanotechnology markets, announced today that it has shipped and successfully installed a Gamma coating cluster at Replisaurus Technologies, a provider of a revolutionary metallization technology called “ElectroChemical Pattern Replication” (ECPR™), which offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. The modular coat/bake/develop cluster from SUSS represents the latest generation technology in high volume production spin coating. Gamma systems are designed to maximize performance at the lowest cost of ownership, while delivering consistently uniform results for a variety of applications such as thin and thick resists, BCB, dielectrics or high topographies.

Replisaurus will use the Gamma for applications related to its proprietary ECPRÔ process, a fab-friendly, environmentally-clean metallization process technology, which has extremely fast plating rates. The ECPRÔ process combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution.  ECPRÔ is targeted at key growth markets such as integrated passives, copper pillars and 3D integration.

"Replisaurus chose SUSS MicroTec to support us with superior coater and developer technology as SUSS is clearly the leader in this market. The SUSS Gamma system meets our high performance requirements by delivering consistently uniform results for a variety of challenging materials, said James Quinn, CEO of Replisaurus Technologies.

“Replisaurus has been devoted to developing production processes for the advanced Packaging and 3D integration market", commented Rolf Wolf, general manager of SUSS MicroTec Lithography Division. “We are excited to support their enabling technology with our Gamma system.”

For more information, please contact:  brigitte.wehrmann@suss.com.

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Anne Poncheri joins Silicon Cert, Ltd., as Quality Manager

Silicon Cert, Ltd. (SCL) is pleased to announce that Anne Poncheri has recently joined SCL as Quality Manager.   Anne will be replacing the retiring Charles Lessig who held that position since 1999.

Anne will be responsible for maintaining SCL’s Quality Management System, including ISO 9001:2000 certification and Defense Logistics Agency, DSCC Commerical Laboratory Suitability.

Ms. Poncheri was most recently Quality & Engineering Manager at Tyco Electronics’ Reading, PA facility.  She holds a B.S. in Applied Mathematics from Carnegie Mellon University, Pittsburgh, PA.

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IMAPS 2008 Golf Classic - Notes on the Alpine Country Club

IMAPS GOLFERS - ALPINE Country Club

Gary Hemphill and I had the opportunity to tour the golf course in Cranston, RI, via the cart path this week prior to meeting with the pro to finalize arrangements for our November 3rd outing.

You are going to enjoy this golf course, and it is a once in a lifetime opportunity to play a private CC that otherwise you would have to play with a member.

The golf course will play about 6400 yards, par 72 with a slope of 127 configured for our tournament.  It is a traditional course with wide fairways off the tees and becomes progressively tighter as you approach the greens.  The greens all slope from back to front, so you want to be below the hole if possible. Many greens are protected by sand traps in the front; there is one hole where the tee shot is over water (bring SCUBA gear), and other holes with water adjacent to the rough. Mature trees, both pine and leafy, line most holes; however, there is no underbrush and there seems to be space to recover from an errant shot. There is a 200 yard par (3) – you may want to carry your “hybrid.”  There is also an “Eisenhower tree” in the middle of the fairway on one of the par 4 holes.

We will have a new feature this year – you will be able to purchase “Mulligans” (do overs) for $10 each; they can not be used for puts.  Each player in your foursome must use two of their drives in a scramble format.

Many of you may have questions about the weather on November 3rd.  I did as well and checked historical weather data for Zip Code 02921.  Average daily high temperature is 57 degrees Fahrenheit and nightly low temperature is 38 degrees Fahrenheit.  The golf pro termed early November golf as “sweater weather.”

Gary Hemphill and I look forward to a great fall golf outing with all of you.

IMAPS Providence Golf Co-Chairs
Howard Imhof, Metalor

Gary Hemphill, Technic

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View the Corporate Bulletin Archives

 

:: Issue 56 ::
August 4, 2008

Oneida Research Services

Compex Corp.

National Training Center