Draper Laboratory
:: Corporate Member News ::

:: RNT Demonstrates Solar and FPD Gen 10 Bonding Capabilityr (full story)

:: Newport Introduces Its New Magnetic Base Beam Block Tool Holder (full story)

:: Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract (full story)

:: Henkel Launches Breakthrough Self-filleting Die Attach Technology (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Sikama
Henkel International
Newport

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


RNT Demonstrates Solar and FPD Gen 10 Bonding Capability

Reactive NanoTechnologies, Inc. (RNTl®,  has announced the successful demonstration of its NanoBond® process and technology for bonding Generation 10 sputtering targets used in the fast growing Solar Photovoltaic and Flat Panel Display (FPD) industries.  The demonstration was done on an aluminum target measuring 3400mm x 218mm and resulted in greater than 98% bond coverage as measured by ultrasonic inspection.  This demonstration proves RNT as a valued additional source for this cutting edge technology to existing and future customers. The bond was executed in RNT’s Hunt Valley facilities and the process is now being transferred to licensees of the NanoBond® process throughout Asia.

“This is a significant achievement and statement of our commitment to these important markets,” commented Joe Grzyb, RNT’s CEO.  “RNT continues, along with its customers and partners, to exploit the significant benefits of our NanoBond® process in delivering a superior-performing, bonded sputter target to the manufacturing floor.”

NanoBond® provides superior bond uniformity and high temperature performance resulting in demonstrable benefits to the end users of sputter targets.  Today, NanoBond® is the solution of choice for providers and users of sputter targets in the FPD, semiconductor, magnetic media and solar industries.
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Newport Introduces Its New Magnetic Base Beam Block Tool Holder

Newport Corporation has announced the new BB-L magnetic-base beam block tool holder.  The BB-L is a multi-function accessory for the lab, combining the features of a beam blocker and beam aligner with a ball driver tool holder.

According to Rick Sebastian, Product Line Manager for Newport, "We are pleased to introduce our new BB-L magnetic base beam lock tool.  It combines the features of beam block with the convenience of a tool holder, and because of this versatility and utility, we believe that the BB-L tool will prove to be an invaluable accessory to any scientific research lab or production environment.”

The front surface of the BB-L has a grid pattern of 0.25-in squares which can be used as a reference for aligning or leveling an optical beam. Numbers are printed on the edge of the grid pattern indicating height, in inches, above the table surface. Promoting eye safety, unused or stray beams can be easily blocked using the BB-L. Two sets of four holes (eight in total) are provided in the top for mounting various sizes of ball drivers either English or metric. Made from black-anodized aluminum alloy its design also incorporates a 3-element magnetic base to allow quick and stable placement on to the stainless steel surface of an optical table. For permanent mounting, the base has a slot for fastening to an optical table.

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Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract

Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application. 
 
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
 
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
 
“The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.

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Henkel Launches Breakthrough Self-filleting Die Attach Technology

Further advancing the capabilities of modern die attach technology, Henkel has developed and made commercially available a line of new Ablestik® brand die attach materials known as self-filleting die attach.  The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and much less costly alternative to die attach films.

Today’s device technologies have dictated the need for much thinner die in packages with tighter geometric tolerances.  For these applications, conventional die attach pastes can be hard to control, with uniform bondlines and complete wetting becoming more and more difficult to achieve. These challenges are what have proliferated the use of die attach films, which are effective but can cost as much as 50% more than traditional die attach pastes. 

To address these issues and respond to industry requirements for a cost-effective alternative to film-based materials, Henkel has designed a breakthrough die attach paste technology that utilizes capillary force to control flow and deliver complete wetting.  Unlike conventional die attach materials that rely on complicated, precise dispense patterns in combination with die placement force to encourage flow, determine bondline thickness and promote wetting, Ablestik brand self-filleting pastes use capillary function to control these critical process parameters through  dispense volume and spacer technology. 

“Self-filleting die attach technology is arguably one of the biggest advancements in die attach paste materials in recent years,” states Robert Palmer, Henkel Global Product Manager for Die Attach Adhesives.  “Modern devices are dictating much thinner die with bondline thicknesses pushing 5 microns.  These packages simply cannot be assembled with conventional pastes and, until recently, die attach films were the only option.  Self-filleting die attach adhesives make packaging these delicate devices possible without requiring changes to current equipment sets or process steps and deliver a lower total cost of use than die attach film.”

Employing traditional automatic dispense technology, a dot of Ablestik self-filleting material is deposited and the die gently placed.  The capillary force of the material then draws it out to the edge of the die where it forms a small fillet.  No excessive placement force is required, which eliminates die damage while also allowing for extremely tight process control.

“Ablestik self-filleting materials are providing customers more package design latitude with a material that fits into their existing manufacturing processes,” concludes Palmer.  “Plus, they are doing so at a cost that is much more palatable than that of film.”

Currently, Henkel’s Ablestik materials are available in three formulations:  Ablestik AAA3300™ non-conductive paste for die to substrate laminate-based devices; Ablestik AAA3320™ non-conductive material for die to die attachment, including same size, pyramidal and orthogonal die stack packages, and; Ablestik 3900™ conductive adhesive designed for die to substrate leadframe packages.

For more information on Henkel’s Ablestik brand self-filleting die attach adhesives or any of the company’s advanced semiconductor packaging materials, call 949-789-2500 or log onto the website at www.henkel.com/electronics

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View the Corporate Bulletin Archives

 

:: Issue 64 ::
December 15, 2008

Oneida Research Services

Compex Corp.

National Training Center