March Plasma Systems Promotes Scott D. Szymanski to Global Marketing Manager

March Plasma Systems announced today that Scott D. Szymanski has been promoted to Global Marketing Manager.  In this position, Mr. Szymanski will expand key customer alliances, strengthen partnerships with material and equipment suppliers, and develop future plasma product offerings tailored to all of March’s strategic markets. 

“Mr. Szymanski will be responsible for managing plasma product market requirements, as well as promoting our strategic business segments worldwide.  He brings over 12 years of experience working at capital equipment companies,” said James Getty, Director of Applications at March Plasma Systems.  “During this time of exciting market growth for March Plasma Systems, we are extremely pleased to have him fill this key role.” 

In addition to his extensive industry experience, Mr. Szymanski holds a Bachelor of Science degree in Mechanical Engineering from the University of California Los Angeles (UCLA), and a Master of Business Administration degree from the University of Phoenix. 

See the March web site for more details: www.marchplasma.com.

Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System from DuPont Microcircuit Materials

Removing Ruthenium Provides Lower Cost and Improved Image for Plasma Display Panel Manufacturers

DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the adoption of the newest DuPont™ Fodel® 8th Generation (8G) photoimageable thick-film pastes by Matsushita Electric Industrial Co. (MEI).  MEI utilizes the technology in its latest line of Panasonic VIERA® Plasma televisions, which feature full high-definition resolution and superior image quality.  DuPont™ Fodel® 8G pastes are used in the metallization of the plasma display panel (PDP) front bus electrodes in order to improve image quality and achieve substantial cost savings through dramatically reduced precious metal content.  MEI is a world leader in flat panel TV technology with the largest global market share in the plasma TV market.

"DuPont™ Fodel® 8G is yet another example of how DuPont Microcircuit Materials supports PDP manufacturers such as MEI in introducing process simplifications and cost reductions that achieve more attractive price targets for larger TV sizes that are competitive with LCDs," said Walt Cheng, global business director, DuPont Microcircuit Materials.

The DuPont™ Fodel® 8G photoimageable thick film system is ideally suited for 42” and greater full high-definition PDPs which require exceptionally high resolution, yet must remain cost effective to manufacture.  Fodel® technology provides a simple, high yield and highly scaleable process for fine-line patterning of conductor lines on plasma glass panels.  The 8G system completely replaces the ruthenium pyrochlore-based black pigments used in previous generations of the Fodel® system with a novel and proprietary black pigment system based entirely on lower cost metals.  This has been accomplished while simultaneously improving the overall system’s performance including resistivity, blackness, processing margin and latitude and cycle time

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.  EI, Surescan Corp. and Huron employee and corporate gifts totaled more than $117,000 for 2007.   

MicroScreen Appoints Representative for Southern California, Arizona and New Mexico

MicroScreen announces the appointment of Chalman Technologies
as our exclusive agent for Southern California, Arizona, and New Mexico.

Under the direction of Ron Chalman, they will be responsible for the sales and service of MicroScreen screens and stencils.  MicroScreen’s screens are used in thick film printing  while our laser cut stencils are used for printing solder paste onto p.c.boards.

For additional information, please visit info@microscreen.org.

Indium Corporation’s Technology Experts Presenting at APEX

Three of Indium Corporation’s technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.

Dr. Lee will present a professional development course entitled:

He will also participate in two technical conferences:

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

He will also present at the technical conference,

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at www.indium.com/drlasky.

Tim Jensen has a Bachelor’s Degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines.  Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Quik-Pak Announces Installation of Ultra-Fine Pitch Wire Bonder

Quik-Pak has announced the installation of a new Maxμm ultraTM Wire Bonder, the latest high performance automatic system offered by industry leader Kulicke & Soffa.   This new wire bonder incorporates technological advancements that enable highly accurate assembly of integrated circuits with ultra-fine pitch down to 35 microns.
This new system complements Quik-Pak’s existing I.C. assembly equipment and broadens assembly capability to address the latest in advanced package and device designs.

“As I.C. designs continually increase in complexity and decrease in feature size, the Maxμm ultraTM will enable us to meet the increased demands of our customers with ultra-fine pitch, stacked or multiple die and chip-on-board applications, “ stated Steve Swendrowski, Quik-Pak’s General Manager.

Quik-Pak offers open cavity plastic packages and complete prototype assembly services, including wafer backgrinding, dicing,  pick & place, wirebonding, remolding and marking for design verification, testing and customer samples.

SUSS MicroTec AG appoints new VP Sales

SUSS MicroTec has appointed Thomas Breser to the position of Vice President Sales.

Thomas Breser comes to SUSS with almost 20 years international experience within the semiconductor industry. He has held positions in general management, sales management, business development, product planning and strategic marketing.