AI Technology
:: Corporate Member News ::

:: March Plasma Systems Promotes Scott D. Szymanski to Global Marketing Manager (full story)

:: Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System from DuPont Microcircuit Materials (full story)

:: Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions (full story)

:: MicroScreen Appoints Representative for Southern California, Arizona and New Mexico (full story)

:: Quik-Pak Announces Installation of Ultra-Fine Pitch Wire Bonder (full story)

:: SUSS MicroTec AG appoints new VP Sales (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Amkor Technology
Brewer Science
DuPont Electronic Technologies

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

March Plasma Systems Promotes Scott D. Szymanski to Global Marketing Manager

March Plasma Systems announced today that Scott D. Szymanski has been promoted to Global Marketing Manager.  In this position, Mr. Szymanski will expand key customer alliances, strengthen partnerships with material and equipment suppliers, and develop future plasma product offerings tailored to all of March’s strategic markets. 

“Mr. Szymanski will be responsible for managing plasma product market requirements, as well as promoting our strategic business segments worldwide.  He brings over 12 years of experience working at capital equipment companies,” said James Getty, Director of Applications at March Plasma Systems.  “During this time of exciting market growth for March Plasma Systems, we are extremely pleased to have him fill this key role.” 

In addition to his extensive industry experience, Mr. Szymanski holds a Bachelor of Science degree in Mechanical Engineering from the University of California Los Angeles (UCLA), and a Master of Business Administration degree from the University of Phoenix. 

See the March web site for more details:

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Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System from DuPont Microcircuit Materials

Removing Ruthenium Provides Lower Cost and Improved Image for Plasma Display Panel Manufacturers

DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the adoption of the newest DuPont™ Fodel® 8th Generation (8G) photoimageable thick-film pastes by Matsushita Electric Industrial Co. (MEI).  MEI utilizes the technology in its latest line of Panasonic VIERA® Plasma televisions, which feature full high-definition resolution and superior image quality.  DuPont™ Fodel® 8G pastes are used in the metallization of the plasma display panel (PDP) front bus electrodes in order to improve image quality and achieve substantial cost savings through dramatically reduced precious metal content.  MEI is a world leader in flat panel TV technology with the largest global market share in the plasma TV market.

"DuPont™ Fodel® 8G is yet another example of how DuPont Microcircuit Materials supports PDP manufacturers such as MEI in introducing process simplifications and cost reductions that achieve more attractive price targets for larger TV sizes that are competitive with LCDs," said Walt Cheng, global business director, DuPont Microcircuit Materials.

The DuPont™ Fodel® 8G photoimageable thick film system is ideally suited for 42” and greater full high-definition PDPs which require exceptionally high resolution, yet must remain cost effective to manufacture.  Fodel® technology provides a simple, high yield and highly scaleable process for fine-line patterning of conductor lines on plasma glass panels.  The 8G system completely replaces the ruthenium pyrochlore-based black pigments used in previous generations of the Fodel® system with a novel and proprietary black pigment system based entirely on lower cost metals.  This has been accomplished while simultaneously improving the overall system’s performance including resistivity, blackness, processing margin and latitude and cycle time

"We see the complete elimination of ruthenium precious metal in the new Fodel® 8G paste system as a major step change that will help our customers become even more competitive in the future,” said Cheng.
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Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.  EI, Surescan Corp. and Huron employee and corporate gifts totaled more than $117,000 for 2007.   

“We have all witnessed the vital work of our local United Way and have seen the real difference they make in our community,” commented James J. McNamara, President and CEO of EI.  “My congratulations and thanks to every contributor to the 2007 campaign as well as those who volunteered their time and talent in coordinating this effort and those who participated in the annual Day of Caring,” he added.
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MicroScreen Appoints Representative for Southern California, Arizona and New Mexico

MicroScreen announces the appointment of Chalman Technologies
as our exclusive agent for Southern California, Arizona, and New Mexico.

Under the direction of Ron Chalman, they will be responsible for the sales and service of MicroScreen screens and stencils.  MicroScreen’s screens are used in thick film printing  while our laser cut stencils are used for printing solder paste onto p.c.boards.

For additional information, please visit

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Indium Corporation’s Technology Experts Presenting at APEX

Three of Indium Corporation’s technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.

Indium Corporation will also be exhibiting at the show at booth #747.


Dr. Lee will present a professional development course entitled:

  • Achieving High Reliability for Lead-Free Solder Joints – Material Considerations
    Sunday, March 30, 8:30am – 4:30pm

He will also participate in two technical conferences:

  • Future Lead-Free alloys – Meeting Challenges of Miniaturization
    Wednesday, April 2, 10:15am – 11:45am
  • Compliant and Creep Resistant SAC+Al (Ni) Alloy
    Thursday, April 3, 9:00am – 10:00am

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.


Dr. Lasky will be present a professional development course:
  • Rapid RoHS Assembly Development for Large and Small Boards in an RoHS Environment
    Monday, March 31, 8:30am – 4:30pm

He will also present at the technical conference,

  • Assembly of Large PWBs in an RoHS 5, RoHS 5.5, and RoHS 6 Environment
    Wednesday, April 2, 9:00am – 10:00am

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at

Tim Jensen will present at the technical conference,
  • Improving Pb-Free Reflow Coalescence through Consistently High Solder Paste Transfer Efficiency
    Tuesday, April 1, 1:30pm – 3:00pm

Tim Jensen has a Bachelor’s Degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines.  Tim is a member of the SMTA and participates actively in several IPC standards development committees.

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Quik-Pak Announces Installation of Ultra-Fine Pitch Wire Bonder

Quik-Pak has announced the installation of a new Maxμm ultraTM Wire Bonder, the latest high performance automatic system offered by industry leader Kulicke & Soffa.   This new wire bonder incorporates technological advancements that enable highly accurate assembly of integrated circuits with ultra-fine pitch down to 35 microns.
This new system complements Quik-Pak’s existing I.C. assembly equipment and broadens assembly capability to address the latest in advanced package and device designs.

“As I.C. designs continually increase in complexity and decrease in feature size, the Maxμm ultraTM will enable us to meet the increased demands of our customers with ultra-fine pitch, stacked or multiple die and chip-on-board applications, “ stated Steve Swendrowski, Quik-Pak’s General Manager.

Quik-Pak offers open cavity plastic packages and complete prototype assembly services, including wafer backgrinding, dicing,  pick & place, wirebonding, remolding and marking for design verification, testing and customer samples.

For further information, contact
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SUSS MicroTec AG appoints new VP Sales

SUSS MicroTec has appointed Thomas Breser to the position of Vice President Sales.

Thomas Breser comes to SUSS with almost 20 years international experience within the semiconductor industry. He has held positions in general management, sales management, business development, product planning and strategic marketing.

“The challenges of selling a diverse product portfolio into a global marketplace require a great deal of coordination. Thomas will work closely with the product divisions and our regional sales teams to further improve the efficiency of our sales force and increase our revenue” said Dr. Stefan Schneidewind CEO of SUSS MicroTec AG.
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View the Corporate Bulletin Archives

:: Issue 46 ::
February 15, 2008

Ticona Engineering Polymers

Oneida Research Services

Compex Corp.

National Training Center