AI Technology
:: Corporate Member News ::

:: Asymtek Celebrates its 25th Anniversary (full story)

:: Cookson Electronics’ Engineered Products Group Launches “First-Time-Right” NPI Stencils Initiative (full story)

:: AdTech Ceramics Offers High Reliability Chemically Milled Products (full story)

:: AIM Announces National Sales Manager Personnel Addition (full story)

:: Hesse & Knipps Presents Most Flexible and Fastest Wedge Bonder for Both Ribbon and Wire Bonding (full story)

:: SVTC Technologies Selects Processing Tools from SUSS MicroTec Equipment Enables MEMS Development (full story)

:: Gore Introduces Online Builder for Specifying Ultra High Density Interconnects (full story)

:: Lambda’s 300W & 600W Power Supplies Deliver 300% Peak Power (full story)

:: Indium Corporation Expands Sales Network in Western USA and Promotes Greg Hayes (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Quantum Leap Packaging, Inc.
Umicore
Thermal Transfer Composites

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Asymtek Celebrates its 25th Anniversary

Asymtek, a Nordson company  announces the twenty-fifth anniversary of its founding.  Established in 1983, Asymtek has become a leader in providing automated precision fluid dispensing and conformal coating systems worldwide.  Asymtek’s systems are known for technology leadership in dispensing, closed-loop process controls, and patented processes in jetting and coating.  Customers include the leaders in semiconductor packaging and printed circuit board assemblers in a wide range of industries.  The company celebrated the anniversary on June 6, 2008 at its all-employee meeting.

Asymtek was founded by Robert Ciardella, Alec Babiarz, and Philip Maiorca, who worked together at Hewlett-Packard in research and development of computer peripheral products, including ink jet printers. They identified what is now called “benchtop automation” and aimed their efforts at the electronic assembly and semiconductor packaging markets.  Their first benchtop motion system was sold in 1984.  A year later a dispense head was added and the first automated dispenser was created.  A major breakthrough came in 1992 when Asymtek released its patented jetting technology.  Jetting has now become the standard in dispensing and has enabled many of the microelectronics and emerging technologies we have today.

Over the years, Asymtek earned many industry awards that recognize its dispensing innovations and customer service. These include Intel’s Supplier Continuous Quality Improvement Awards (5 consecutive years), Circuits Assembly’s Service Excellence Awards (5 consecutive years), SMT and SMT China’s Vision Awards (2 consecutive years), Global Technology Awards from Global SMT & Packaging magazine (3 consecutive years), Advanced Packaging Awards, EM Asia’s Innovation award, Semiconductor International’s Editors’ Choice Awards for Best Product (two consecutive years), EP&P’s Excellence in Electronics Manufacturing Awards, and the Milton Kiver Award.  (For a complete list, see: http://www.asymtek.com/news/awards.htm).

Asymtek still manufactures its products in the United States and stays competitive by adopting lean concepts for both manufacturing and non-manufacturing departments, using common platforms and software, encouraging employee ideas, and by focusing on technology and total cost-of-ownership rather than compromising product or service quality.  Asymtek is also known as a great place to work, due in part to its strong, defined company values that permeate the organization.  Seven employees have been with the company for 20 years or more, and over 70 employees have worked at Asymtek for more than ten years.

Byers believes that in the next 10 to 25 years Asymtek will continue its growth in markets like solar and fuel cells and develop increasingly different types of products than its core base of SMT and packaging electronics.  “Asymtek will still be investing in technology and worldwide intellectual property far into the future,” he stated.  Babiarz sees a demand for even faster dispensing in increasingly smaller amounts as end products need smaller, more precise amounts of fluid dispensed.  He also believes that Asymtek will grow with the materials industry. “Technology and innovation will continue to drive Asymtek,” said Babiarz, now Asymtek’s president of new business development. “With the support and global infrastructure of Nordson, we look forward to the next 25 years.”
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Cookson Electronics’ Engineered Products Group Launches “First-Time-Right” NPI Stencils Initiative

Cookson Electronics Assembly Materials is launching its “First-Time-Right” NPI (New Product Introduction) Stencils Initiative for its ALPHA® branded “Engineered Products” (stencils) product line, with the goal of helping electronics assemblers and prototyping houses engaged in NPI assembly activity to reduce their NPI cycle times.

“NPI is a critical business process in launching new products.  With the dramatic increase in electronics product diversity and compression in product lifetimes, it is critical for the OEMs, ODMs and EMSs to have a streamlined NPI process that is able to meet the short cycle time requirements for Function Verification, Prototyping, Manufacturing Readiness and Multi-Facility Rollout,” said Ravi Bhatkal, Cookson Electronics’ Vice President and General Manager, Engineered Products.

One of the key elements of meeting short NPI cycle time requirements is the ability to design the stencil correctly, produce it “First-Time-Right” and have prompt delivery of the stencil for use.

 

Cookson Electronics’ Engineered Products Group helps the NPI community by:

  • Engaging with the customer early in the design process, to understand customer requirements.
  • Supporting the design effort by providing Cookson’s design recommendations, that are based on Cookson’s deep knowledge of the printing process, that enables the right paste volume to be deposited in the right place, consistently.
  • Automated application of pre-programmed customer and OEM/Product-specific design rules through Cookson’s patented DIMENSIONS® system, that reduces the possibility of CAD errors in applying design modifications.
  • Application of DIMENSIONS® system to apply one set of design rules at multiple sites globally (via both pre-programmed and continuous addition of new design rules).
  • Providing Cookson’s PCB Scaling Service that can optimize the stencil to better correct for board stretch.  Scaling of the stencil design to the corresponding PCB, thus reducing defects and rework, and improving first pass yield in the NPI process.
  • Regular monitoring and control of the positional accuracy of Cookson’s lasers, to provide accurate and consistent stencil quality.
  • Providing stepped stencils and unique aperture designs developed by Cookson to allow single stencils designed for broad range of deposit volumes to provide the right paste volume where needed.
  • Providing fast turnaround of the stencils from one of our 12 strategic global locations.
  • Providing ALPHA® Global Technical Service and Support, and Cookson’s deep technical knowledge of the printing process, to help implement our stencils in the field and troubleshoot if necessary, enabling the customer achieve higher first pass yields and faster implementation.
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AdTech Ceramics Offers High Reliability Chemically Milled Products

Chattanooga, Tennessee-based AdTech Ceramics, specializing in advanced technical ceramic solutions in a variety of materials, offers high quality chemically milled products in Kovar, Alloy 42, Stainless and Spring Steel.

AdTech's product capabilities include gold plated step lids for seam seal applications, lead frames, seal rings and other applications. Products can be supplied as etched, or with Ni/Au plating for seam welding applications. Metal thickness range is .002" to .040" with tolerances to .001" design dependent.

AdTech Ceramics has 30+ years of multilayer ceramic (MLC) Manufacturing and 15+ years of AlN Multilayer technology experience, and offers microwave modeling & design and developmental partnerships.

For more information on AdTech's chemical milling capabilities, AdTech for a copy of its new Chemical Machining Guidelines data sheet, via www.AdTechCeramics.com.

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AIM Announces National Sales Manager Personnel Addition

Cd. Juarez, Mexico - AIM is pleased to announce the hiring of Lauro Montalvo as National Sales Manager, Mexico.  He will be based out of AIM’s Cd. Juarez, Mexico office and can be reached at + 52 656 630 0032 or lmontalvo@aimsolder.com.

Lauro will promote AIM’s full-line of solder assembly materials to the electronics assembly industry throughout Mexico.  He will also be responsible for managing and coordinating promotional, sales and support activities throughout the country.

Lauro, who holds a degree in Electronics, brings over sixteen years of experience in soldering technologies to AIM.  Lauro has worked as a SMT Process Engineer with such organizations as Delphi Electronics.  Lauro’s experience, and the advantages offered by AIM-Soldadura de Mexico, the first solder paste and liquid flux production facility located within Mexico, are further assurance that AIM’s customers throughout Mexico will continue to receive unparalleled service and expert support.

For more information, visit AIM on the web at www.aimsolder.com.

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Hesse & Knipps Presents Most Flexible and Fastest Wedge Bonder for Both Ribbon and Wire Bonding

Hesse & Knipps, manufacturers the BONDJET BJ820 which  is a high-speed, fully automatic wedge bonder that offers the ultimate in flexibility for both high-speed round wire and deep access ribbon and wire bonding.  It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon.  The fastest wedge bonder on the market, BONDJET BJ820 offers bond speeds up to 7 wires/second. 

With axis repeatability of 1μm at a balanced encoder resolution of 20nm, the BONDJET BJ820 provides increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter.  A highly versatile 12” x 16.1” work area can serve as two or more smaller stations for efficient handling of smaller products or substrates.  Coupled with intelligent automation solutions, parallel bond stations in one work area can eliminate significant indexing time, resulting in 60% greater throughput than competing machines.

“The BONDJET BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology,” notes Joseph Bubel, President, Hesse & Knipps, Inc.  “Combining its high bonding speeds, large work area and intelligent automation solutions, the wedge bonder offers the potential for the highest throughput on the market.”

Other significant machine capabilities include:

  • 12.5μm to 85μm diameter wire bonding
  • Ribbon bonding from 6μm x 35μm to 25μm x 250μm
  • Constant loop height and wire length
  • Maintains parallel loops within mixed reference system
  • Auto teach for linear applications, reducing programming time

“The BONDJET BJ820 defines the benchmark in the industry by offering the fastest wiring speed, largest work area and greatest axis accuracy among its competition,” summarizes Bubel.

With a footprint of only 720 x 1250 mm, the BONDJET BJ820 can be easily integrated into existing floor plan configurations or new concepts. For more information on the BONDJET BJ820, email us at info@hesse-knipps.us or refer to our web site at:
http://www.hesse-knipps.com/index.php?myELEMENT=Bondjet+BJ820+Beschreibung.

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SVTC Technologies Selects Processing Tools from SUSS MicroTec Equipment Enables MEMS Development

SUSS MicroTec, Inc announces a suite of processing tools that enable new generations of micro-electromechanical systems (MEMS) has been selected for SVTC Technologies’ facility in Austin, Texas.

As a key supplier to SVTC, SUSS also will provide joint development and support for processes and tooling.

The SUSS toolsets at SVTC include manual and automated platforms to perform lithography and bonding - two of the critical process steps in the creation of MEMS devices. SVTC, a leading independent semiconductor process-development foundry, will use these tools to provide process solutions and a prototyping foundry for emerging MEMS and other devices. 

The SUSS toolset represents the latest technology - giving our customers the opportunity to lead the way for emerging MEMS devices,” said Dave Bergeron, chief executive officer of SVTC.

MEMS devices have been instrumental in creating many state-of-the-art products for the consumer, healthcare, automotive and entertainment industries. Expected to increase at a 13 percent compound annual growth rate through 2010, MEMS are the enabling technology behind many well-known applications such as inkjet printing, automobile air bags, global positioning systems and motion sensing game controllers. Future markets to be opened by MEMS technology include fuel cells, combustion optimization, drug discovery and delivery systems, as well as next-generation navigation and gaming systems.

“We are very pleased to be chosen by a high-quality organization such as SVTC and are excited about the possibilities that this partnership brings to SUSS MicroTec and our customers”, said Dr. Stefan Schneidewind, CEO of SUSS MicroTec. “The MEMS industry has long been a focus for our company.  The opportunity to partner with such highly respected forward-looking organization as SVTC will only strengthen our ability to service our growing customer base and our position as a leading equipment supplier to the MEMS market.”

If you would like additional information on any of our products, please visit www.suss.com or reply to this email.  Please include your full name, mailing address and contact information to receive brochures or technical articles.  If, at any time, you would prefer not to receive SUSS News Alerts, please reply as such to this email and your address will be removed from our list.

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Gore Introduces Online Builder for Specifying Ultra High Density Interconnects

W. L. Gore & Associates (Gore) introduces an online builder for configuring GORE™ Ultra High Density (UHD) Interconnects to use in bench-top test systems, instrument probe cable, parallel data link, production floor equipment, and automated test equipment. GORE™ Ultra High Density (UHD) Interconnects provide an integrated system of board mount headers and ganged assemblies with reliable signal integrity performance. Cost savings are achieved through shorter test setup, fewer calibrations, and smaller boards. GORE™ UHD Interconnects enable lower loss, lower skew, better impedance control, and shorter board trace lengths.

Gore’s new Ultra High Density Interconnect Builder is available at www.gore.com/uhdbuilder. GORE™ Low Loss UHD Cable Assemblies utilize GORE™ Low Loss Coaxial Cable, made using ePTFE dielectric, with UHD-S, UHD-P, and SMA-P connectors. For additional bandwidth, GORE™ High Frequency UHD Cable Assemblies utilize GORE™ Ultra-Low Loss Coaxial Cable and precision UHD connectors to achieve performance up to 15 GHz, supporting up to 10 Gigabit data rates.

GORE™ UHD Cable Assemblies are available as single lines or ganged into 2-, 4-, or 8-position housings that allow easier handling, quick connect and disconnect, and better cable management. A 10pS relative time match is standard for all ganged UHD Cable Assemblies.

For more information, contact W. L. Gore & Associates visit their web site at www.gore.com.

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Lambda’s 300W & 600W Power Supplies Deliver 300% Peak Power

Lambda’s new series of 300W and 600W power supplies deliver up to 300% peak output power.  The AC-DC single-output HWS300P and HWS600P series are ideal for powering industrial equipment that demands high peak currents (e.g., motors, pumps), ultra-reliability, and extended field-life.  All HWS series supplies come with Lambda Americas’ exclusive Limited-Lifetime-Warranty.

Units are available in three nominal output voltages; including 24, 36 and 48 volts, and each model can be adjusted up to +10%/-20% of its nominal voltage to accommodate non-standard system voltages.  The HWS300P and HWS600P series accept a wide range of input voltages – from 85VAC to 265VAC – and comply with the SEMI F47 (with 200VAC line or higher), which is required in the semiconductor fabrication industry, plus EN61000-3-2 harmonic and power factor correction standards. Remote on/off and DC good signals, and overvoltage/overcurrent protections, are standard.  A current-share signal for paralleling two units is standard on the 600-watt models.

The power supplies have a high-quality internal fan and can be operated in a -10°C to +70°C ambient. The 300- and 600-watt units come in a compact footprint – respectively 2.4 x 3.23 x 6.5 and 3.94 x 3.23 x 6.5 inches – making them suitable for mounting in a 2U rack..

The new Lambda power supplies meet Class B EMI standards (radiated and conducted), are CE marked, and are safety-approved to UL/CSA/EN60950-1 and EN50178 specifications. They also meet EN61000-4-X immunity standards and are fully RoHS-compliant.

The HWS300P and HWS600P series are available now, priced from $214.00 each in 100 unit quantities. More information can be found at Lambda’s web site: http://www.lambdapower.com.

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Indium Corporation Expands Sales Network in Western USA and Promotes Greg Hayes

Indium Corporation has named Powell Industries, Inc. as its newest sales channel partner. Powell Industries will focus primarily on selling Indium Corporation’s SMT products, including solder paste, solder bar, cored wire, wave solder fluxes, and rework fluxes. They cover the western coast of the United States, including Washington, Oregon, Idaho, and California.

Powell Industries is a multi-state stocking distributor, serving the electronics manufacturing industry on the west coast since 1991. According to Sherwin Kobak, Area Sales Manager for the Pacific Region, “Powell Industries has a wealth of time-tested experience. They have knowledgeable product specialists supporting a strong customer base. I am looking forward to combining Powell Industries’ successful distribution experience with Indium’s superior products as we collectively support our regional marketplace in 2008.”

 

Indium Corporation announces the appointment of Greg Hayes to the position of Southeastern USA Regional Sales Manager.

Greg is responsible for driving sales growth of Indium’s soldering products for the region.  He will focus on developing, implementing and monitoring sales goals and metrics, as well as work with regional sales teams and representatives in his region. Greg has more than 15 years of experience in soldering materials sales. He earned a bachelors degree in business management from the University of Phoenix and holds his certification for project management from Loyola University in Chicago. 

Indium Corporation’s southeast region includes North and South Carolina, Georgia, Florida, Mississippi, Alabama, Kentucky, Puerto Rico and the Dominican Republic. 

For more information about Indium Corporation visit www.indium.com.

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View the Corporate Bulletin Archives

:: Issue 54 ::
July 1, 2008

Ticona Engineering Polymers

Oneida Research Services

Compex Corp.

National Training Center