AI Technology
:: Corporate Member News ::

:: DuPont Advanced Packaging Lithography Announces Commercial Availability of WBR 2000 Series Films for Advanced Semiconductor Packaging (full story)

:: AIM Announces New Korean Distributor (full story)

:: Datacon and Ablestik Enter Strategic Partnership (full story)

:: Indium Corporation’s Chicago Materials Division Earns ISO-9001:2000 Certification (full story)

:: BI Technologies Develops High Stability, Constant DCR Power Inductor (full story)

:: SUSS MicroTec Boosts Nanotechnology with New Toolset for Mask Aligners (full story)

:: Asymtek Signs New Distributor Agreements with AMB Technic and NORANA (full story)

:: Torrey Hills Technologies, LLC Moves into New Office to Accommodate Rapid Growth (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Dage - a Nordson Company
BI Technologies
AIM Solder

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


DuPont Advanced Packaging Lithography Announces Commercial Availability of WBR 2000 Series Films for Advanced Semiconductor Packaging

Dry Film Photoresist Enables Cost, Productivity and Environmental Benefits

DuPont Advanced Packaging Lithography, part of DuPont Electronic Technologies, has announced the full commercialization of DuPont™ WBR 2000 Series dry film photoresist material for advanced semiconductor packaging applications, including electroplated solder, photostencil and copper pillar bumping.  These newest DuPont dry film photoresists offer a lower overall cost of ownership, while addressing productivity and environmental challenges.  Specifics on the use of DuPont™ WBR 2000 dry film photoresist for copper pillar metallization will be shared at the upcoming IMAPS Device Packaging Conference 2008 in Scottsdale, Ariz., March 18-20, 2008. 

“Even the most advanced packaging designs can be produced cost effectively with DuPont™ WBR 2000, and the idea of a dry, solventless process is more appealing from an environmental standpoint,” said Mats J. Ehlin, global business manager for DuPont Advanced Packaging Lithography.  “DuPont™ WBR 2000 has unique advantages, which is why it’s quickly gaining acceptance as a reliable, well-performing photoresist with a good range of use.  DuPont is continuing to innovate with dry films as a superior alternative to liquid photoresists, and we’re pleased to see our customers achieve new heights using this film.”

DuPont™ WBR 2000 Series dry film photoresists deliver improved resolution, speed and consistent resist thickness across the wafer, as well as simpler processing and a reduced environmental footprint.  Due to its high heat resistance, chemical compatibility and easy removal, WBR 2000 is well-suited for multi-purpose use, including in-via and mushroom plating, photostenciling and copper pillar metallization.

Unlike liquid resists, DuPont™ WBR 2000 Series dry film photoresists do not require drying of solvents and can be applied in a single uniform layer across the entire wafer with no edge bead.  These properties enable higher productivity and yields, particularly for those manufacturers that require thicker layers, which are more difficult to produce with liquid resists.  Films are available in 50, 75, 100 and 120 micron thicknesses. 

DuPont will be sharing technical details on a key WBR 2000 application at the IMAPS Device Packaging Conference 2008 at the Radisson Fort McDowell Resort in Scottsdale, Ariz., March 18-20, 2008, in a session titled, “Optimization of the Dry Film Lithography Process for Copper Pillar Metallization Applications,” scheduled March 19 at 7:30 am MST. 

For more information on DuPont Advanced Packaging Lithography, DuPont™ WBR 2000 or to view abstracts of all the technical papers DuPont will present at the IMAPS Device Packaging Conference, please visit advpackaging.dupont.com,

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AIM Announces New Korean Distributor

AIM is pleased to announce the appointment of Prime Commercial Co., Ltd. as a distributor for AIM’s complete line of electronic assembly materials in Korea. Prime Commercial Co., Ltd. forms yet another link in the global sales and technical support of the AIM line of assembly and fabrication products.   

Prime Commercial Co., Ltd. offering over 10 years of experience, outstanding customer service, and complimentary product lines, is poised to support the electronics assembly industry of Korea.  

Prime Commercial Co., Ltd. may be contacted via email at primecm@unitel.co.kr or by telephone at +82-2-577-0062.

Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry.  The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries.  AIM may be contacted at info@aimsolder.com, or visit AIM on the web at www.aimsolder.com.
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Datacon and Ablestik Enter Strategic Partnership

Research and evaluation agreement for advanced epoxy processes

Datacon and Ablestik, have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace.

The aim of this partnership is to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes, and to advise customers of both companies on the best solutions for their production needs.

The existing demo and laboratory sites of both partners -- Datacon in Trevose, PA and Radfeld, Austria, and Ablestik in Rancho Dominguez, CA and Shanghai, China -- will be open to both companies and their customers. In these process laboratories -- located in the three most important continents for advanced packaging -- processes tailored to the specific needs of the customers can now be developed, evaluated and demonstrated. This enormous process knowledge of Ablestik and Datacon is now available to the clients, which will result in faster time to market, higher yields and lower cost of ownership.

Michael Auer, Vice President Sales of Besi: "I am very excited by this partnership. There is massive synergy between our two companies. We are truly in a position to offer our customers amplified solutions, including best-in-class equipment and leading adhesives and specialty materials, both tailored to their specific needs. Combined with our extensive process and applications expertise, and global service and technical support, the benefit for our clients will be significant."

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Indium Corporation’s Chicago Materials Division Earns ISO-9001:2000 Certification

Indium Corporation’s Chicago Materials Division recently passed its ISO-9001:2000 certification audit.  Indium’s newest facility joins the company’s US, English, Chinese, and Singapore operations in achieving ISO-9001:2000 certification.
 
ISO-9000 focuses primarily on quality management. Certification means that Indium’s Chicago facility has processes, procedures, and standards in place to enhance customer satisfaction by meeting or surpassing quality goals. It also means that the company continues to improve its performance by developing and implementing continuous improvement programs to ensure future performance objectives are met.
 
A team of individuals from throughout Indium Corporation performed training, set up procedures, and executed internal ISO audits in preparation for the independent audit, which was conducted by outside auditors.
 
According to Bill Jackson, Director of Quality for Indium Corporation, “The Chicago-based team worked diligently on this project.  They completed the certification process ahead of our planned schedule. I am very pleased with how quickly the Chicago facility has embraced our successful quality systems, which are used globally throughout all of Indium’s plants.”
 
Indium’s Chicago facility manufactures wave solder fluxes, flux-cored wire, and solder bar for Indium’s global electronics assembly market.

For more information, please visit www.indium.com.

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BI Technologies Develops High Stability, Constant DCR Power Inductor

Providing design engineers with a stable power device capable of sensing current, TT electronics BI Technologies has developed a constant DCR surface mount power inductor.  Designated the HM69S Series, the inductor maintains a constant DC resistance value, with a shift of only ±2% at room temperature and 7% over a 100°C temperature range.

According to David Smolik, director of product development for BI Technologies, power electronics engineers often use the resistance of the inductor to detect current in a PWM circuit because the inductor's DCR is lossless and quite accurate. "While this is a good means of detecting current, stability over the temperature range must be compensated due to the use of a copper conductor, which is typically unstable with TCR at 3900ppm/°C," said Smolik.  "By developing an inductor with a TCR of 700ppm/°C, we are able to provide customers with a much more stable and accurate device, one that does not require thermal compensation for the resistance change of the copper conductor."

The HM69S Series power inductor was designed for multiphase voltage regulator applications, including powering CPUs.

The power inductor features an inductance range of 90nH to 200nH, with a maximum rated DC current of 75A and TCRs of 700ppm/°C. Typical DCRs are 0.950m?. Operating temperature ranges from -40°C to +125°C, with a maximum temperature rise of +40°C.  Constant DC resistance over the specified temperature range is ±2%.

The surface mount power inductors are packaged in 700 piece reels and 4,200 piece cartons.

Typical pricing for the HM69S Series inductor ranges from $0.55 to
$0.65 each depending on volume and package size.  Lead times are from
12 to 14 weeks.

BI Technologies has been an innovator and leader in electronic components for more than 50 years.The company is a global manufacturer of trimming and precision potentiometers, position sensors, turns-counting dials, chip resistor arrays, resistor networks, integrated passive networks, transformers, inductors, hybrid microelectronics and custom integration products for communication, computer, industrial, and automotive applications.

BI Technologies serves a global customer base with manufacturing locations in the United States, Mexico, Scotland, Japan, China and Malaysia.

TT electronics plc is a global electronics company manufacturing a broad range of advanced electronic components, assemblies and sensor modules for the automotive, industrial, telecommunication, computer and aerospace markets.

For more information about the HM69S Series constant DCR inductor, contact BI Technologies at sales@bitechnologies.com visit http://www.bitechnologies.com/products/index.htm.

 

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SUSS MicroTec Boosts Nanotechnology with New Toolset for Mask Aligners

SUSS MicroTec, supplier of innovative solutions for the 3D, MEMS, Advanced Packaging and Nanotechnology markets, has launched an advanced nanotechnology toolset for its Mask Aligners. The new Nano Imprint Lithography (NIL) tool enables SUSS Aligners to print resist thicknesses from less than 100 nanometers to a few hundred microns with a printing resolution down to a few nanometers.

UV-NIL is a low-cost production technology that is based on UV-curing. It has been developed as a cost-effective alternative to high-resolution e-beam lithography to print sub-20 nanometer geometries. UV-NIL applications with promising perspectives include semiconductor, MOEMS, NEMS and optoelectronic technologies.

This toolset can be upgraded on any previously installed SUSS MA6 Mask Aligner with very limited effort.  Therefore SUSS MicroTec offers its customers an easy and quick step into the world of Nano.

“Nanotechnology represents a promising new business opportunity for SUSS MicroTec”, said Rolf Wolf, General Manager of SUSS MicroTec Lithography division. “With the new UV-NIL tooling for mask aligners, SUSS MicroTec is once again providing market leadership for evolutionary as well as revolutionary innovative processing techniques.”

For more information,  please visit www.suss.com.

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Asymtek Signs New Distributor Agreements with AMB Technic and NORANA

Extend sales, service, and support in Poland and Turkey

Asymtek announces the addition of two new distributors to market its automated fluid dispensing and conformal coating systems throughout Poland and Turkey.  AMB Technic, headquartered in Kolo, Poland, and NORANA, headquartered in Izmir, Turkey, will provide Asymtek’s customers with sales support, lab testing, on-site equipment service, and training.  Both distributors have a local, experienced technical service staff with comprehensive customer support programs.

“Both AMB and NORANA are well acquainted with dispensing technologies, and have always demonstrated a strong commitment to customer service,” explains Jacques Mycke, Asymtek’s regional sales manager for Eastern Europe.  “We are pleased to have them join our growing team of sales representatives.”
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Torrey Hills Technologies, LLC Moves into New Office to Accommodate Rapid Growth

Torrey Hills Technologies, LLC has announced that the company has moved into the new headquarter office at 6370 Lusk Blvd, B Suite F111, San Diego, CA. The move was made to accommodate the company’s rapid market growth and to achieve the aggressive plans for the next few years.

The new office is conveniently located off Mira Mesa Blvd among numerous well-known corporations such as Qualcomm. It measures 1700 square foot, featuring a product showroom and applications lab that will be used to display the company’s state-of-the-art industrial heating and mixing equipment.

“I am very delighted to move into this office which doubles in size compared to the old one and will provide convenient facilities to better serve our customers,” said President Ken Kuang. “We believe this will be the place where we achieve steady growth and further expand our client base.”

Torrey Hills Technologies, LLC (www.torreyhillstech.com, www.threerollmill.com, www.beltfurnaces.com, and www.anodizingracksonline.com) is a leader in developing and delivering quality but affordable equipment and supplies for multiple industries.

Since its establishment in 2004, the company has expanded its business from microelectronics manufacturing equipment and packaging components to include industrial mixing equipment and anodizing equipment.

 

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View the Corporate Bulletin Archives

:: Issue 48 ::
March 17, 2008

Ticona Engineering Polymers

Oneida Research Services

Compex Corp.

National Training Center