AI Technology
:: Corporate Member News ::

:: Asymtek Receives 2008 Service Excellence Award from Circuits Assembly (full story)

:: AIM Announces New Solder Plus Support Campaign (full story)

:: Power Supplies are Class I, Div. 2 Rated for use in Hazardous & Explosive Locations (full story)

:: Gore Improves Thermal Performance of its Direct Air Cooling Filter (full story)

:: Palomar Technologies Triples Cleanroom Capacity for Microelectronics Assembly Services (full story)

:: StratEdge Unveils Series of Small Outline Thermally Enhanced Packages for Power Semiconductors (full story)

:: BI Technologies Offers Sn/Pb Solder, RoHS-Compliant Versions of Thin Film Resistor Networks (full story)

:: Silicon Cert achieves DSCC Laboratory Suitability Status for PIND Testing (full story)

:: Cambridge University selects S.E.T. KADETT for LCoS applications (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Silicon Cert Ltd.
StratEdge
WL GORE

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Asymtek Receives 2008 Service Excellence Award from Circuits Assembly

Honored for the Fifth Consecutive Year

Asymtek, announces it has received Circuits Assembly magazine’s prestigious “Service Excellence Award” for the fifth year in a row. Asymtek was selected best electronics assembly equipment supplier in the dispensing category, and received the highest cumulative scores for customer satisfaction in five areas: technology, dependability, responsiveness, ease-of-use, and value for the dollar. Specific customer comments included: “Everyone I dealt with was courteous and very responsive,” “We experienced a 50% increase in production for our process,” and “Asymtek’s customer service is without comparison in responsiveness and ‘going beyond’ to satisfy us.”

Asymtek vice president of operations, Martin Stone remarked, “Asymtek’s customers place a great value in the support we give them before and after the sale, and we work hard to fulfill their expectations in support of that value.  Winning the Service Excellence Award validates our efforts in meeting and exceeding customer expectations.”

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AIM Announces New Solder Plus Support Campaign

Customers need more than just a quality product.  They require service and support every step of the way.  AIM understands this. Many companies offer solder materials, although they do not all offer the support you need, such as assistance from as early as the design stage, custom-made materials, 24-hour tech support, training seminars, application and process support, solder analysis service, solder reclamation service and on-line support at www.aimsolder.com.  AIM is more than just your global solder supplier, we provide Solder plusSupport

For more information, visit AIM on the web at www.aimsolder.com, or contact us through email at info@aimsolder.com.

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Power Supplies are Class I, Div. 2 Rated for use in Hazardous & Explosive Locations

Lambda has introduced a series of Class I, Div. 2 rated DIN Rail-mount AC-DC power supplies available with a choice of output voltages from 5 to 48 volts. The low power DPP series is an economical solution and specifically designed for use in industrial applications including hazardous environments and explosive gas atmospheres such as those found in chemical and petrochemical plants as well as pumping and distribution stations.

Lambda's DPP series includes 6 models with Class I, Div. 2, Groups A, B, C and D ratings; enclosed in rugged insulated cases that are only 2.95” H x 1.77” W x 3.58” D. These ANSI/ISA12.12 certified supplies include the following models (volts/amps): DPP25-5 (5V/5A), DPP30-12 (12V/2.5A), DPP50-15 (15V/3.4A), DPP30-24 (24V/1.3A), DPP50-24 (24V/2.1A) and DPP50-48 (48V/1.01A). The addition of the “UL1604” suffix to these model numbers will insure the proper UL label will be provided (e.g., DPP50-48 UL1604).

 

Each model can operate worldwide with a broad range of AC inputs from 85 to 264 volts AC without the need for pre-selecting the AC input range. In addition, these units will operate from a DC input ranging from 90 to 375 volts DC.

The supplies feature a low ripple and noise of 50 millivolts or less and are protected against over-current and over-voltage conditions. In addition the supplies meet EN55022 Class B EMI standards (radiated and conducted), are certified to UL/EN60950-1 specifications, are listed to UL508 and CE Marked.

The units are convection cooled and can operate at full output power over a wide temperature range of from -10°C to +71°C, with derating above 60°C. Typical operating efficiencies reach up to 87%. The units can be mounted on either a TS35/7.5 or TS35/15 standard DIN rail.

The DPP family of DIN rail-mount power supplies is available now with prices starting at $37 in 100-unit quantities. More information can be obtained at Lambda's Web site: www.lambdapower.com and http://www.lambdapower.com/products/dpp-series.htm.

 

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Gore Improves Thermal Performance of its Direct Air Cooling Filter

W. L. Gore & Associates, Inc., has introduced a new membrane media for its line of GORE® Cooling Filters that increases thermal performance while providing strong environmental protection and reliability. The new GORE® Cooling Filters improve thermal cooling while reducing both capital and operating costs in wireless base stations, MCPAs, base band units, power cabinets, switching systems, and other outdoor electronic enclosures.

The benefits of using the new GORE® Cooling Filter are two-fold — improved cooling efficiency and reduced costs. Constructed with a new membrane technology, the filter improves thermal cooling approximately 20 percent by allowing higher airflow through the filter. At the same time, the membrane protects the electronic components by preventing fine contaminants such as dirt, dust, and sand from entering the enclosure. By increasing airflow while reducing potential contaminant damage, the GORE® Cooling Filter improves overall reliability of telecommunications infrastructure.

GORE® Cooling Filters reduce both capital and operating costs in several ways. First, a significant cost savings is achieved with a new lightweight frame designed into the filter. With these new frames, the filters are significantly lighter and less expensive to purchase and ship. Also with the new media, the filter lasts about 20 percent longer than its predecessor, yielding additional OPEX savings. Second, unlike bulky heat exchangers and energy-consuming air-conditioning systems, direct-air cooling systems have very few moving parts, which further reduce equipment maintenance costs. Finally, the new membrane technology reduces operating expenses by lowering the filter pressure drop by 60 percent, which in turn reduces the amount of energy required by fans to efficiently cool sensitive electronics.

The technology behind the new GORE® Cooling Filter is based on a proprietary expanded polytetrafluoroethylene (ePTFE) membrane. This microporous membrane allows cool, clean air to flow into the cabinet while filtering out harmful contaminants. Expanded PTFE membrane has a 99.0 percent particle filtration efficiency at the 0.3µm level (1cm/sec). GORE® Cooling Filters can incorporate the high-performance Gore filtration media into either a lightweight frame or a rigid anodized aluminium frame, providing the most reliable protection possible for a variety of applications. Cabinets fitted with GORE® Cooling Filters easily pass the most stringent requirements, including IP55 and NEMA 3R.

GORE® Cooling Filters significantly improve Mean Time between Failures (MTBF) because of their ability to lower the internal cabinet temperature over HEX and to increase corrosion protection over standard filters. These filters can be customized to fit small to large base station units for mobile communications as well as wire-lined cabinets such as ADSL and power enclosure applications. According to Dr. Wilson Poon, research associate at Gore, “Using Gore’s ambient-air cooling system with our new membrane technology is a cost-effective solution, whether it is being incorporated into a new product design or retrofitted into an established product. Available in either a lightweight or aluminium frame, GORE® Cooling Filters allow an equipment manufacturer to increase its competitive advantage in the marketplace without compromising optimal performance.”

For more information about the family of GORE® Cooling Filters, visit www.gore.com/coolingfilters or contact Gore at 1-800-638-5300 or by email at industrialfilters.com@wlgore.com.

 

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Palomar Technologies Triples Cleanroom Capacity for Microelectronics Assembly Services

Palomar Technologies announces the expansion of its cleanroom assembly area for Palomar Microelectronics assembly services.  Palomar has tripled its cleanroom space and increased its prototyping, applications engineering, process development, assembly, and test services capabilities with its new 2,500 square foot (232.26 square meter) class 100K and 500 square foot  (46.45 square meter) class 10K cleanrooms.  The expansion enables rapid prototyping and fast turn-around so OEMs can get their products into development or to market faster.

Palomar Microelectronics is a segment of Palomar Technologies that provides quick-turn product development, rapid prototyping, test, and assembly services, as well as continued process development during or after manufacturing services, for microelectronic applications.  Processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.

“The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers,” said Donald Beck, operations manager for Palomar Microelectronics.

 

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StratEdge Unveils Series of Small Outline Thermally Enhanced Packages for Power Semiconductors

StratEdge, announces the introduction of a new family of small outline thermally enhanced molded ceramic packages for power semiconductors.  The new line of packages can be used for silicon, silicon carbide, gallium nitride, and other compound semiconductors in power integrated circuit applications.  Specific devices include amplifiers, discrete transistors, and diodes where greater than 0.5 Watt power is consumed.

These thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together.  All materials used in the packages have matched coefficients of expansion.  They are assembled using a glass-to-metal seal process combined with gold germanium brazing, resulting in a rugged and reliable package.  The packages can handle temperatures up to 360 degrees Celsius.  A hermetic seal provides enhanced reliability for the device and offers protection from harsh environmental conditions, meeting military standard requirements.  Packages in this series are sealed with metal or ceramic lids that have gold-tin solder preforms.

 

These packages incorporate copper composite bases or copper inserts for enhanced thermal dissipation.  Devices are mounted directly to the metal bases thus providing excellent electric ground to the backside of the chip.  They provide superior electrical performance for frequencies up to at least 6 GHz.  For controlled impedance devices, transition designs with higher frequency performance can be utilized.

Packages are available in various shapes, sizes, and lead counts.  All can be provided with gull wing-shaped leads for surface mounting.  A popular package is the two lead G1010M-2C supplied with copper insert.  The G1010M-2C has a 0.100 inch square (2.5mm square) outline with a 0.030 inch (0.75mm) by 0.055 inch (1.4mm) die attach area.  Pricing at 10,000 units is about $6.26 each.  Pricing may vary due to order configuration, the price of gold, and shipping destination.

“These new packages, combined with our Power Package Series with thermally conductive beryllium oxide (BeO) ceramic, give our customers a variety of packages to choose from to package their high power devices,” said Timothy Going, president and CEO of StratEdge.

StratEdge’s new thermal power package can be seen at the MTT-S Show in Atlanta, Georgia from June 17-19 at booth 2039.

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BI Technologies Offers Sn/Pb Solder, RoHS-Compliant Versions of Thin Film Resistor Networks

Providing design engineers with various resistor network configurations to best meet their application requirements, TT electronics BI Technologies continues to offer Sn/Pb versions of their thin film resistor networks.  The resistor networks consist of S Series products including isolated, bussed and voltage divider circuits.  The networks also include NQSxx, 66x, 688 and 69x models in either isolated or bussed circuits.

"Our comprehensive line of thin film resistor networks are available on silicon or ceramic substrates with isolated, bussed, voltage divider and custom network circuitry, and are offered in plastic or hermetically sealed packaging," said Mike Torres, fixed film product marketing  manager for BI Technologies. "By offering the networks with either Sn/Pb solder or RoHS-compliant terminations along with a variety of design configurations, we are able to meet customers requirements while also serving the needs of a number of applications in the military, aerospace and industrial markets."

 

The thin film resistor networks are offered with resistor counts from two to more than 30 per network. Resistance ranges from 10? to 100K?, with tolerance to ±0.1% and ratio tolerance to ±0.05%. The networks are available with TCRs to ±25ppm/°C and TCR tracking to ±5ppm/°C. Operating temperature ranges from -55°C to +125°C.

Typical pricing for the thin film resistor networks starts at $0.50 each. Lead times are from stock to 14 weeks.

BI Technologies also offers their BGA resistor networks, hybrid microcircuits and some trimming potentiometer models in Sn/Pb versions.

For more information about BI Technologies' thin film resistor network products and capabilities visit: http://www.bitechnologies.com/products/passive.htm.
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Silicon Cert achieves DSCC Laboratory Suitability Status for PIND Testing

Silicon Cert Ltd. (SCL) is pleased to announce receipt of Commercial Laboratory Suitability Status for Particle Noise Impact Testing (PIND) MIL-STD-883 test method 2020.  As a result of a recent review by the Defense Logistics Agency, Defense Supply Center, Columbus (DSCC), SCL has received a letter (DSCC-VQC-08-015415) of suitability for this eleventh test to MIL-STD-883 military specifications.

Commercial laboratories that have been issued laboratory suitability status are eligible to test the federal stock class type of device called out in a laboratory suitability letter. The eleven (11) MIL-STD-883 test methods that SCL have been deemed to be suitably equipped to perform include temperature cycle, thermal shock, mechanical shock, vibration, random vibration, solderability, stabilization bake, resistance to solvents, constant acceleration, fine and gross leak, and PIND.  For additional information about specific test conditions within these test methods visit www.SiliconCert.com.

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Cambridge University selects S.E.T. KADETT for LCoS applications

S.E.T Smart Equipment Technology, has announced the successful installation of a KADETT High Accuracy Placement and Bonding system at Cambridge University (UK), department of Engineering. The KADETT has been purchased thanks to a grant of Cambridge Integrated knowledge Centre for various R&D applications and especially for the assembly of LCoS (Liquid Crystal On Silicon) devices using UV-cured adhesive.

Liquid Crystal on Silicon (LCoS) is a reflective micro display using a Silicon Backplane. It is an alternative technology to LCD or Plasma applied for projection television. LCoS technology enables much higher resolution images at a lower cost. The placement of the circuitry behind the pixel allows a high fill factor and consequently high light efficiency. The images are less pixilated because the circuitry is behind the pixel.

“The glass and the silicon IC are aligned and pressed together using the KADETT, then the adhesive is cured with UV light. Subsequently, the device is filled with Liquid Crystal. The S.E.T. KADETT is a flexible and robust tool ideal for our R&D applications”, says Dr. Neil Collings at the Electrical Engineering of the University of Cambridge.

The SET KADETT Semi-Automatic Bonder is a flexible and open platform for accurate assembly and bonding of devices on a large variety of substrates. The machine performs accurate Pick & Place functions as well as Flip Chip bonding. A wide range of bonding processes including In-Situ Reflow, Thermo Compression, and Adhesive joining are available with temperature up to 450°C and force up to 75N.

The flexible architecture of the S.E.T. KADETT enables the integration of many processing modules such as a UV glue curing system, Ultrasonic bonding head and many others. “Its easy and quick changeover between the various process configurations is of primary interest for research environment where adaptability and multi-user compatibility is essential“, said Gilbert Lecarpentier, International Product Manager at S.E.T.

The UV Glue Curing System is available as an option and brings light to the process area through a fiber. Producing a 20 mm diameter spot with 80 W/cm², it provides complete control for step curing of assembly adhesive. Parameters such as intensity, dose, and exposure time are controlled by the software.

For more information, please visit www.set-sas.fr.

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View the Corporate Bulletin Archives

:: Issue 51 ::
May 2, 2008

Ticona Engineering Polymers

Oneida Research Services

Compex Corp.

National Training Center