:: Williams Named VP of Human Resources at Endicott (full
:: Asymtek Wins 2008 Global Technology Award for Spectrum S-920N Series of Scalable Dispensing Platforms for Microelectronics Packaging (full
:: Cookson Electronics’ Site in Monterrey, Mexico Achieves ISO 9001:2000 and ISO 14001:2004 Certifications from BSI (full
:: AIM Announces Expansion in Asia, Opens Hong Kong Bar Solder Production Facility (full
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Williams Named VP of Human Resources at Endicott
Endicott Interconnect Technologies, Inc. (EI) has named Felicia Williams to the position of Vice President of Human Resources effective immediately. In this role, Ms. Williams is responsible for leading EI’s human resource programs, including evaluating and determining needs and opportunities, assessing the effectiveness of existing structures and programs and determining strategic goals and implementation plans.
Ms. Williams has more than 20 years experience in human resources administration and management. For the past fifteen years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward.
“Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”
Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.
Asymtek Wins 2008 Global Technology Award for Spectrum S-920N Series of Scalable Dispensing Platforms for Microelectronics Packaging
Asymtek, has announced it received a 2008 Global Technology Award from Global SMT & Packaging magazine for its Spectrum™ S-920N Series of scalable dispensing platforms. These systems adapt to the needs and requirements of high-volume microelectronics manufacturing and printed circuit board assembly, such as flip chip and CSP underfill. They incorporate Asymtek’s patented process controls that deliver increased throughput, accuracy, and productivity.
This is the fourth consecutive Global Technology Award won by Asymtek. The Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries. Entries are judged by an independent panel based on the product’s innovation, speed/throughput improvements, quality contribution, cost benefits, environmental considerations, ease of use/implementation, and maintainability/repairability.
The Spectrum S-920N Series can be configured with single or dual lanes, and one, two or three heat stations (up to six with dual lane) depending on capacity, process control, application, and footprint requirements. The system footprint is a slim 600 x 1321mm (23.6 x 52.0 in.) with a single heat station, 850 x 1321mm (33.5 x 52.0 in.) for two heat stations, and 1100 x 1321mm (43.3 x 52.0 in.) for three heat stations. As process needs change, the platform can be upgraded in the field and configured to meet specific dispensing requirements, from simple dots of silver epoxy or solder paste to underfilling flip chips with extremely tight keep-out zones. The dual-lane configuration is ideal for applications with long preheat cycles or long flow-out times. Dispensing can be done in one lane while parts in the second lane reach temperature set point or flow-out occurs.
“Winning the Global Technology Award is acknowledgement of the great job done by the team at Asymtek developing and designing the new product line,” said John Byers, president, Asymtek. “The Spectrum Series has been well-received in the marketplace because of its flexibility, innovative features, high quality repeatable results, and low cost-of-ownership.”
Cookson Electronics’ Site in Monterrey, Mexico Achieves ISO 9001:2000 and ISO 14001:2004 Certifications from BSI
Cookson Electronics’ new manufacturing facility located in Apodaca Nuevo León Monterrey, Mexico, was officially recommended for ISO certifications by British Standards Institution (BSI) for two Management System Standards. On July 11th and August 8th, 2008 respectively, ISO 9001:2000 (QMS) and ISO 14001:2004 (EMS) certifications were awarded. These two standards are now operating as an integrated management system (IMS) in the Cookson Monterrey facility, and will soon be joined by the Occupational Health & Safety (OH&S) Standard OHSAS 18001:2007 in early 2009 or sooner. These certifications recognize exceptional performance in meeting stringent quality and environmental standards.
“The new Monterrey facility has met the challenge to achieve Cookson’s world-wide standards of excellence and joins all other Cookson manufacturing operations on a global scale,” said Dr. Nicholas Banis, Cookson Electronics’ Vice President of Global Quality. “Cookson manufacturing facilities in all regions have achieved QMS certifications through BSI (either ISO 9001:2000 and/or ISO/TS 16949), including ISO 14001in most sites and OHSAS 18001 in our larger facilities as integrated systems.”
Monterrey’s Quality Management System has also been integrated into Cookson’s Americas Regional Certification Scheme, which allows for maximum communication and standardized business practices among our 25 worldwide registered locations.
AIM Announces Expansion in Asia, Opens Hong Kong Bar Solder Production Facility
AIM is pleased to announce the opening of a bar solder production facility in Fo Tan, Hong Kong. The newest addition to AIM’s worldwide manufacturing facilities produces AIM’s broad range of Electropure™ lead-free and leaded alloys in high-quality, low-drossing bar solder form. This facility complements AIM’s full-line solder paste, liquid flux, bar and wire solder production facility in Shenzhen, China, and is poised to supply bar throughout Southeast Asia.
“We are very pleased about the opening of our newest production facility in Asia and the flexibility that it provides us in supplying high-quality bar solder throughout the region,” said David Suraski, Managing Director, Asia-Pacific. “Along with the other AIM production facilities located throughout Asia, the Americas, and Europe, AIM’s growing family of customers are guaranteed to receive the same high standards of quality products and service regardless of which AIM facility is serving them.”