TJ Green Associates, LLC
:: Corporate Member News ::

:: EV Group and CEA/Leti Partner to Accelerate Adoption of TSV and 3D Integration Technology (full story)

:: Growth at ASYS Solar in 2008 (full story)

:: Amkor Names Stephen G. Newberry to Board of Directors (full story)

:: Endicott Research Group Establishes European Office (full story)

:: TDK-Lambda Introduces 40 to 65W AC-DC Medical Power Supplies (full story)

:: One System – Many Applications – from Miyachi Unitek (full story)

:: Indium Corporation Expands Sales Team in Upstate New York (full story)

:: RNT Adds New Representation for European and Israeli Sales (full story)

:: StratEdge Introduces Low-profile, High-power Switch Package for GaN, SiC, and GaAs Devices (full story)

:: Kyocera Introduces Thick Film Substrate Stock (full story)

:: Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Zeon Chemicals
ASYS Group
Technic Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


EV Group and CEA/Leti Partner to Accelerate Adoption of TSV and 3D Integration Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti - one of Europe's renowned research labs focusing on microelectronics and nanotechnology.  EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary bonding and debonding technology.  The first system will be shipped in May.  The joint development work will focus on further developing these technologies and processes to accelerate continued adoption of TSV technology - given its demonstrated advantages, which include higher performance, increased functionality, smaller footprint and lower power consumption. 

More functionality, lower power

Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power.  In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications.  This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale. 

"We are extremely pleased to be working with EVG-not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D integration at Leti.  "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance.  Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."

Successful results

Commenting on today's announcement, Stefan Pargfrieder, EVG's business development manager noted, "CEA/Leti is a world leader in accelerating emerging technologies to widespread market adoption.  We are thrilled to be working with such a prestigious institution, and believe their expertise will be crucial to this JDP and pushing TSV and 3D technology forward in the market place.  We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum."

This cooperation also strengthens the existing and established joint development activities between Brewer Science, EVG and Leti.  Ultimately, it exemplifies the synergy between materials, equipment and process expertise, and further enables value-added products and know-how in the growing field of 3D IC/TSV technology, as well as other potential users of temporary bonding and debonding techniques.

CEA/Leti and EV Group have already commenced work on the project and have produced successful results in 3D applications using their TSV technology and processes.

For more information, please visit www.evgroup.com.

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Growth at ASYS Solar in 2008

Annual revenue tripled for the 4th time in a row

Due to the substantial order entry in the second half of 2008, ASYS Solar has continued its dramatic rise and as a result has been able to triple its annual revenues for the fourth time in a row. ASYS Solar is a business unit of the ASYS Group. The solar business unit emerged from an expansion in the screen printing section. The know-how and experience contributed significantly to the innovative designs and new product introductions which made ASYS Solar so successful in the market.

Until December 2008 ASYS installed metallization lines with a capacity of more than 5GW. In order to accommodate the continued growth, ASYS hired additional personnel in R&D, production and service. Production floorspace in Dornstadt Germany the global headquarter, has been doubled to approx. 200,000 sft.

Being 100% vertically integrated, ASYS can do any step in the manufacturing process inhouse. From the design department and the metal shop to powder coating and the software department everybody is committed to the successful product development. A stringend quality program makes ASYS a market leader with the lowest breakage rates in the field.

ASYS is currently present in more than 40 countries with over 20 service and support offices worldwide. This means ASYS can always guarantee quick on-site customer support.

In only a few years ASYS Solar has become one of the leading suppliers for metallization lines. With new developments from 1,200 cph to 4,000 cph per line and a complete portfolio in the field of metallization, ASYS Solar is setting new standards and can now claim to be the technology market leader.

For more information, please visit www.asys-group.com on the web.

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Amkor Names Stephen G. Newberry to Board of Directors

Amkor Technology, Inc. has announced that Stephen G. Newberry has been appointed as a new member of the Company’s Board of Directors. With this appointment, Amkor's Board has been expanded to eight members.

Mr. Newberry, 55, currently serves as president and chief executive officer and as a director of Lam Research Corporation, positions he has held since 2005.  "We are delighted to welcome Steve to Amkor's Board," said James Kim, Amkor's Chairman. "With his extensive experience in the semiconductor industry supply chain, he will be a valuable addition to our team.”

Mr. Newberry joined Lam Research in August 1997 as executive vice president and chief operating officer, and was promoted to the position of president and chief operating officer in July 1998.  Prior to joining Lam Research, Newberry was group vice president of global operations and planning at Applied Materials, Inc.  During his 17 years at Applied Materials, he held various positions of increasing responsibility including assignments in manufacturing, product development, sales and marketing, and customer service.  Newberry served five years in naval aviation prior to joining Applied Materials and is a graduate of the U.S. Naval Academy and the Harvard Graduate School of Business.

Mr. Newberry also serves as a director of SEMI, a global semiconductor industry trade association.
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Endicott Research Group Establishes European Office

Endicott Research Group (ERG), Inc., has created a European office, naming Roland Knuchel as European Sales Manager. ERG, based in Endicott, NY, is the leading manufacturer of DC-AC inverters and LED Drivers for powering LCD backlights.

A resident of Switzerland, Roland brings a solid background of industry experience to the position. He is already familiar with ERG’s products and technologies, having worked with ERG in his capacity as President / CEO of Milgray Distribution in Switzerland from 1986 to the present.

“We wanted ERG to have a man on the ground for customers in the EU and Scandinavia, as well as Eastern Europe, Russia and Israel,” said Earl Lesch, ERG’s International Sales Manager. “Now, Endicott Research Group’s European customers have a qualified contact in their part of the world.”

Roland is an industry veteran with a background as an electronic engineer. His resume includes eight years as Head of Purchasing at Contraves Antriebstechnik, Switzerland, a leading supplier of DC drive technology, as well as experience as Assembly Manager at power supply manufacturer Oltronix Labor AG, Switzerland, and Worldwide Service Engineer for Digitron, Switzerland (now part of Swisslog Holding AG). He is fluent in several languages, including German, French, Italian and English.

For more information, please visit www.ergpower.com.

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TDK-Lambda Introduces 40 to 65W AC-DC Medical Power Supplies

TDK-Lambda has unveiled its latest addition to its line of AC-DC medical power supplies. The new single-output CSS65 series series, 40 to 65-watt supplies, accept a wide input voltage range, has a very low profile and an industry standard footprint of 2 x 4”, with a height of only 1.18”, making it an ideal choice for applications in medical equipment, gaming, point-of-sale and test & measurement equipment, to name a few.

These new open-frame supplies feature a universal 90-264Vac, 47-63Hz input, enabling them to be used anywhere in the world, plus they can operate from a 120-300Vdc input. Fuses are mounted internally on both the Line and Neutral inputs (dual fuses). These supplies feature a very low leakage current of less than 250µA at 264Vac, 63Hz, which is most important for medical applications. In addition, the CSS65 is designed to withstand 4kVac, input-to-output. The series are available with an output voltage of 5V, 12V, 15V, 19V, 24V, 36V or 48V, and can operate with convection cooling (no fans required). The operating temperature range is from -10°C to +70°C with derating above 50°C. The outputs are floating so they can be used as either a positive or negative polarity.

Remote sense connections are provided to compensate for cable drops between the output terminals and the load. Other standard features include overvoltage and short-circuit protections. The input and output connections mate with standard Molex connectors. The CSS65 series have global medical safety agency approvals per UL/EN/IEC60601-1; meet the conducted and radiated EMC requirements of EN55022-B and FCC Class B, which is much tougher to meet than Class A and are RoHS compliant.

More information is available at TDK-Lambda’s website: http://www.us.tdk-lambda.com/lp/products/css-series.htm.

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One System – Many Applications – from Miyachi Unitek

You already know that Miyachi Unitek’s LMF Series Fiber Laser Markers are capable of making contrasting marks on plastics, and annealing and engraving metals. Their compact, robust design and flexible operation make them suitable - (perfect!) - for any manufacturing environment plus, they offer the lowest cost of ownership of any laser marker.

But did you know that in addition to superior marking/engraving on both metals and plastics, the optimal shape and intensity of the LMF2000's pulse waveform make the fiber laser marker the perfect tool to make fine, high quality cuts in copper, steel or aluminum up to 0.02” thick? This enables cost effective prototyping of lead frame, other featured sheet parts, or steel tubes and can be used to modify an existing design. The method uses no direct assist gas, and, precise control over laser parameters means the cut can be tuned for speed and quality with an underside burr of less than 0.0005”.

Miyachi Unitek may be found on the internet at www.muc.miyachi.com.

 

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Indium Corporation Expands Sales Team in Upstate New York

Indium Corporation has appointed Yankee Tronics, Inc. as its newest sales representative in upstate New York. Yankee Tronics is responsible for selling all of Indium’s solder products including solder paste, fluxes, Pb-Free alloys, engineered solders, and thermal interface and die attach materials.
 
Yankee Tronics is a full-service technical manufacturer's representative based in Manlius, New York.  Founded in 1986, they specialize in representing manufacturers of high-quality equipment, materials, and supplies.
 
According to Jeff Anweiler, Regional Sales Manager for Indium Corporation, “Yankee Tronics is an outstanding rep firm with a long history of providing excellent service. We are excited to team up with Yankee Tronics to bring a higher level of service to our current and future customers in upstate New York.”
 
For more information about Indium Corporation, visit http://www.indium.com/  or email abrown@indium.com.   

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RNT Adds New Representation for European and Israeli Sales

Reactive NanoTechnologies, Inc. (RNT), has  announced that it has reached agreements with three new manufacturer's representative companies to support the sale of NanoFoil® products to extend its sales reach in Europe.  Poltronic Ltd. will manage the sale of NanoFoil® products for the Electronics Assembly market to Finland, Sweden and Norway from their office in Espoo, Finland.  Barkoh Technologies, will manage sales for the Electronics Assembly market in Israel from their office in Kfar-Shmaryahu, Israel.  Micronsult will manage the sale of NanoFoil® products for the Electronics Assembly market in Denmark and the Netherlands from their office in Denmark.
 
 "We are pleased to add these new reps to our sales network," commented Michael P. O'Neill, RNT's Global Vice President of Sales.  "Each of these companies have an in depth knowledge of our products and the specific needs of their customer base. This will help RNT bring NanoFoil® and NanoBond®to various sectors of the local electronics assembly industries and extend our sales reach throughout the world."

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StratEdge Introduces Low-profile, High-power Switch Package for GaN, SiC, and GaAs Devices

Provide Complete Turnkey Package Assembly and Test Services

San Diego, Calif – StratEdge, leader in the design and production of semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces a Beryllium Oxide (BeO) package and full assembly and testing services for high power semiconductor switches and small Gallium Nitride (GaN), Silicon Carbide (SiC), and Gallium Arsenide (GaAs) devices.  Applications for these packages include test and measurement, military radios, and radar.

The StratEdge BeO package has a thermal conductivity of 270 watts/meter Kelvin (w/mK).  The 0.205 inch diameter circular package has a BeO disk base to accommodate devices of up to 0.030 by 0.040 inches.  This standard hermetic package comes with a circular metal lid with gold tin preform.  The package is designed with four leads to accommodate single pole, three throw switch (SP3T) devices.  The maximum assembled package height, including the lid, is 0.056 inches.

“Their small size and ability to draw a considerable amount of heat away from tiny high power devices make StratEdge’s BeO packages perfect for older technology silicon diodes as well as newer silicon carbide and gallium nitride devices,” explained Tim Going, president and CEO of StratEdge.  “We have worked with many of our clients who manufacture semiconductor switches to perfect these packages.  For companies looking for a turnkey switch solution, StratEdge can obtain the devices, assemble, test, and deliver them directly to you or your customer.”

StratEdge assembly services are performed at StratEdge headquarters in San Diego, CA.  They include eutectic or epoxy die attach, gold or aluminum wedge-to-wedge thermosonic wire bonding, lidding, lead trimming, marking, bulk packaging, and testing.

The BeO packages are available as part of StratEdge’s new high power family of products.  The Power Package family features thermally enhanced packages in many shapes, sizes, and lead counts.  The materials used in the packages have matched coefficients of expansion to mitigate the inherent stresses of brazing dissimilar materials together.  All packages are designed for high reliability and offer excellent RF performance over the range of the device.  StratEdge packages are capable of passing MIL-STD 883 fine and gross hermeticity testing and meet RoHS and WEEE compliance standards.

For more information visit our website at www.stratedge.com.
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Kyocera Introduces Thick Film Substrate Stock

Kyocera Industrial Ceramics Corporation, is pleased to announce the availability of 96% alumina substrate stock from its Vancouver WA facility.  The method of manufacturing is roll compaction and it affords the following benefits:

  • Less camber
  • Less edge curl
  • Increased sizes up to 12.5” x 12.5”
  • Good mechanical strength
  • Small & well controlled grain size

Sizes currently available for quick turn delivery are as follows:

  • 4.5” x 4.5” x .015”
  • 4.5” x 4.5” x .020”
  • 4.5” x 4.5” x .035”
  • 4.5” x 4.5” x .040”
  • 4.5” x 4.5” x .060”
  • 4.75” x 4.75” x .025”
  • 4.75” x 4.75” x .040”
  • 5.50” x 7.50” x .025”

Other sizes will be made available upon request.

For additional information please contact:

  

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Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

The current economic climate, though challenging, certainly hasn’t deterred the technology specialists at Henkel from continuing on an aggressive R&D path.  As evidenced by an impressive five award wins during last week’s APEX show in Las Vegas, Nevada, Henkel’s commitment to innovation and materials advance is stronger than ever.

Two Henkel electronics assembly materials – Hysol® UF3800™ CSP/BGA underfill and Multicore® LF700™ lead-free, halide-free solder paste – emerged as winners in their respective categories in several awards contests.   Honored by the IPC’s Innovative Technology Center, Circuits Assembly magazine’s NPI Awards and SMT magazine’s Vision Awards programs, Hysol UF3800 proved that underfill materials can deliver on several complex and historically unachievable performance criteria.  Designed for use with CSP and BGA devices within handheld communication and entertainment products, Hysol UF3800 flows fast at room temperature, cures quickly at low temperature is halogen-free, reworkable and delivers excellent thermal cycling performance.  The unique chemistry of the material offers a relatively high glass transition temperature (Tg) required for improved thermal cycle performance as well as good reworkability – two properties that are normally counter to each other.  In most cases, reworkable materials have a low Tg, which then also lowers the thermal performance.  But Hysol UF3800 offers both a high Tg and reworkability.   All of these unique properties combine to offer manufacturers reduced capital equipment and energy costs by eliminating the requirement for dispensing heaters, improved sustainability through the material’s halogen-free formula and reworkability, and excellent thermal cycle performance from Hysol UF3800’s high Tg.  But, it wasn’t just the award judging panels that found the material worthy of recognition, as several well-known device manufacturers visited Henkel during the three-day APEX event and were also quite intrigued with the new underfill’s capabilities.

Also singled out by the IPC’s contest and Circuits Assembly’s NPI awards program was Henkel’s new lead-free, halide-free solder paste, Multicore LF700.     Formulated to deliver improved benefits and performance characteristics as compared older-generation and competitive products, Henkel’s new solder paste goes beyond basic lead-free functionality to deliver more advanced, truly enabling capabilities.  The material reduces voiding in BGA solder joints, delivers a high tack force to provide stability during high-speed component placement and offers long printer abandon times of up to four hours even when printed onto extremely fine-pitch 0.4mm CSP apertures.  Delivering superb solderability over a wide range of reflow profiles in both air and nitrogen with effectiveness on several surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper, Multicore LF700 provides manufacturers with unmatched process flexibility and outstanding in-field performance. 

Commenting on the honors, Henkel’s Vice-President of Product Development and Engineering, Dr. Michael Todd, said, “Clearly, customers are the ultimate judge of our R&D success.  But, having three such prestigious awards programs recognize these ground-breaking materials and our commitment to innovation is very rewarding.  We sincerely thank IPC, Circuits Assembly and SMT for sponsoring these important industry contests and want to congratulate the dedicated Henkel staff that engineered such truly enabling technologies.”

For more information, please visit www.henkel.com/electronics.

 

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View the Corporate Bulletin Archives

 

:: Issue 69 ::
April 15, 2009

RGL Enterprises LLC

Compex Corp.