TJ Green Associates, LLC
:: Corporate Member News ::

:: cyberTECHNOLOGIES Has introduced the CT SERIES (full story)

:: Heraeus Introduces Dielectric and Lead-Free Silver Conductor Pastes for Aluminum Substrates (full story)

:: Torrey Hills Technologies, LLC Opens an office in India (full story)

:: Amkor to Present at Barclays Capital Technology Conference (full story)

:: Gore Introduces Filters for Cleaner, Faster Processing of High-Purity Chemicals at SEMICON Japan (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Cyber Technologies
Ultron Systems
WL Gore

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

cyberTECHNOLOGIES Has introduced the CT SERIES

cyberTECHNOLOGIES has introduced the CT SERIES a new line of high performance, non-contact optical 3D surface metrology solutions.

The new cyberscan CT SERIES from cyberTECHNOLOGIES provides unparalleled performance for optical 3D metrology down to 3 nanometer resolution.

The CT SERIES provides more accurate and faster measurement of most surface topographies or optical film thickness on conformal coatings and other materials, wet or dry.

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Heraeus Introduces Dielectric and Lead-Free Silver Conductor Pastes for Aluminum Substrates

The Thick Film Materials Business Unit of Heraeus has developed two new products to improve the efficiency of mounting silicon IC’s to aluminum substrates. Working in tandem, this new thick film dielectric and conductor system provides very low thermal resistance between the chip and the heat sink in high power applications such as HB LEDs. 

In applications that require significant heat dissipation to prevent damage to the circuit, alumina becomes an inadequate substrate material due to its low thermal conductivity. Aluminum is a much more attractive alternative due to its high thermal conductivity and low cost. However, the main disadvantage of aluminum is its high coefficient of thermal expansion (CTE) compared to glass insulating layers. This mismatch with the insulating materials can cause significant bowing of the substrate.

The unique glass system of the new lead- and cadmium-free dielectric paste (IP6075) from Heraeus was developed to offer excellent thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. The dielectric paste significantly reduces bowing by closely matching the CTE of aluminum, while providing excellent breakdown strength. To complete the package of materials for this application, Heraeus has developed a new lead-free silver conductor paste (C8829A). The conductor paste, fired together at 550°C with the dielectric paste, provides excellent solderability and adhesion.

This new technology is ideal for applications such as direct-mounted light emitting diode (LED) arrays that require significant heat dissipation to increase the lighting efficiencies.

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Torrey Hills Technologies, LLC Opens an office in India

Torrey Hills Technologies, LLC announces that Ganesh Hariharan has been appointed as Applications Engineer in India. Hariharan will be responsible for the sales and technical support of the company’s products in India, especially fast fire belt furnaces and electronic packaging components.

“Ganesh is a great fit for this position in India, which is a market that has been growing very significantly. He brings years of industry experience along with intimate understanding of India’s culture and market.” said Ken Kuang, President of Torrey Hills Technologies, LLC. “I am very excited to have Ganesh as part of our Torrey Hills team.”

Hariharan has a strong technical background in microelectronics packaging. He holds his BS Degree in Mechanical Engineering from University of Madras in India and Master Degree from Auburn University in the US. After graduation, Hariharan worked at the Product Technology Center of Kyocera America Inc. as a Research and New Product Development Engineer. He has more than 3 years of hands-on experience in micro-electronics assembly and process development, material characterization, root cause and failure analysis, DOE, statistical process control, substrate design and tolerance studies, thermo-mechanical reliability modeling and thermal analysis.

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Amkor to Present at Barclays Capital Technology Conference

Amkor Technology, Inc. has announced that Joanne Solomon, chief financial officer, and Jim Fusaro, executive vice president for assembly and test business, will participate in the Barclays Capital Technology Conference in San Francisco, CA on Tuesday, December 8, 2009. The presentation is scheduled to begin at 1:30 p.m. (EST).

An audio-only webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of the company’s website. In accordance with company policy, Amkor will not update, reaffirm or otherwise comment on any prior financial guidance during this conference. Amkor’s financial guidance for the quarter is effective only on the date given.

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Gore Introduces Filters for Cleaner, Faster Processing of High-Purity Chemicals at SEMICON Japan

W. L. Gore & Associates (Gore) is introducing innovative new cartridge filters for the manufacture of bulk high-purity chemicals used in semiconductor, LCD and electronics fabrication at SEMICON Japan 2009, Chiba, Japan, December 2-4. GORE® Filters for High-Purity Chemical Processors can be used as drop-in replacements for existing filters to achieve flow improvements up to 200% compared to the best filter technology currently available. This dramatically increased performance can provide a retention upgrade while maintaining system flow, reducing processing time, or decreasing the number of filters required for a lower total cost of ownership.

The new filters offer maximum benefits to high-throughput filling, packaging and recirculation systems for high-viscosity fluids, acids, bases, solvents, specialty chemicals and other high-purity chemicals. The new filters are available in a pore size rating range from 0.1 to 0.03 µm.

GORE® Filters incorporate Gore’s proprietary high-flow PTFE (polytetrafluoroethylene) filtration media. Gore technology has been used for decades in the world’s best-performing filters for semiconductor, electronics, high-purity chemical and pharmaceutical applications.

The new filters will be displayed at SEMICON Japan by Japan Gore-Tex Inc. (JGI) in Booth 7B-205.

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View the Corporate Bulletin Archives


:: Issue 84 ::
December 1, 2009

RGL Enterprises LLC

Compex Corp.