TJ Green Associates, LLC
:: Corporate Member News ::

:: DYCONEX Implements New Mechanical Drill Equipment (full story)

:: Unique Sensor Film Minimizes Defects and Improves Quality in Wafer Bonding (full story)

:: TDK-Lambda Expands Quarter Brick Line (full story)

:: Fast Turn-Around High-Density Lead Frames for Complicated or Intricate Applications (full story)

:: New GORE® Filters Dramatically Improve Liquid Filtration Performance in Semiconductor Manufacturing (full story)

:: Asymtek Promotes Paul Gallo to Sales Manager, USA and Americas and Tom Schafer to General Manager, Asia Pacific, and Global Accounts Program Manager (full story)

:: 3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors (full story)

:: 22% More Throughput on Existing Metallization Lines from ASYS (full story)

:: Kyzen to Feature AQUANOX® A4520 at Semicon West 2009 (full story)

:: Finetech’sHigh Accuracy Die Bonder on display at Semicon West 2009 (full story)

:: MicroScreen Announces Technical Support in Georgia, Alabama, and Tennessee (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Sensor Products, Inc.
Kyzen
Photofabrication Engineering Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


DYCONEX Implements New Mechanical Drill Equipment

Taking mechanical drilling capabilities one step further, DYCONEX has implemented new, state-of-the art drilling systems capable of routinely producing mechanical holes with diameters as low as 100 micrometers, and even as low as 75 micrometers for some specialty applications! Previously only in the realm of laser hole generation processes, this newly developed mechanical drill capability is already directly reducing product lead times, increasing process efficiency and improving product yields due to generally better hole quality and tighter positioning accuracy.

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Unique Sensor Film Minimizes Defects and Improves Quality in Wafer Bonding

Pressurex® Shows Pressure Distribution and Magnitude of Contacting Surfaces in Bonding Fixtures

Pressurex® film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations which can result in flaws (defects) in the wafer bonding process. When placed between contacting surfaces, it instantaneously and permanently changes color directly proportional to the actual pressure applied. With Pressurex®, variations in pressure that lead to imperfections (or irregularities) in the bonding process can be accurately detected and corrected -- improving yield, decreasing scrap, and boosting productivity.

In wafer bonding, two flat substrates are permanently joined together by applying carefully calculated pressure, temperature, and voltage. Of the three parameters, pressure is often the most difficult to precisely ascertain and control. Traditional methods assume perfectly flat pressure plates. However, in nearly all real environments pressure plates are not ideal due to manufacturing or installation variability and degradation over time from wear. The result is difficult to detect pressure variations across the surface that can lead to un-bonded wafer areas, cracked wafers, and premature wear of the pressure plates.

Pressurex® systematically measures pressure across the entire pressure plate. When placed between contacting surfaces of the wafer bonding fixture, the film instantaneously and permanently changes color directly proportional to the actual pressure applied. Precise pressure magnitude is easily determined by comparing color variation results to a color correlation chart (conceptually similar to interpreting Litmus paper). Additional pressure analysis of the film is available which assimilates the pressure distribution into 2-D and 3-D pseudo color images, histograms and line scans among other features.

Micralyne Inc., an independent foundry located in Canada, uses Pressurex® to adjust the compression exerted by their bonding tools.  Early testing of bonding results analyzed with the film reveals a donut shaped high pressure ring with relatively little pressure applied to the center ((left)). After a series of adjustments the final result is a more uniform distribution of pressure (right).

Wafer-to-wafer bonding has become an enabling semiconductor technology in industries such as 3D packaging, MEMS, MOEMS, and SOI. Pressurex® is being used across a wide range of bonding technologies, including metal eutectic, anodic, fusion, metal diffusion, glass frit, and polymer adhesive bonding

The “snapshot” imaging results of Pressurex® can be used as a control to compare processes and tools, making it ideal for six-sigma and other closely monitored high performance manufacturing operations.

Pressurex® measures pressures from 2 - 43,200 PSI (0.14 - 3,000 kg/cm2).   For a free sample in your desired range, contact Sensor Products Inc. visit our website at www.sensorprod.com/sample where you can view the entire line of products and applications.

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TDK-Lambda Expands Quarter Brick Line

TDK-Lambda has expanded its impressive line of high power quarter brick modules with the introduction of the iQL and iQG Series. Available with nominal output voltages from 2.5V to 12V and power ratings up to 300-watts, these wide input range fully-regulated and isolated DC-DC converters deliver exceptional performance in the industry standard DOSA quarter brick footprint.
 
The iQL/iQG Series has been designed with confined space and demanding thermal environments in mind as required in Telecom, Datacom, Wireless and many other applications including Test & Measurement, Broadcast, Robotics and Industrial Controls. These single board open-frame converters offer up to 95% efficiency, 181W per cubic inch power density and up to 60A of useable output current. Metal baseplates are provided on most models to facilitate conduction cooling when needed.
 
By integrating TDK's latest custom ASIC control devices, newest ferrite cores and multi-layer capacitors, engineers at TDK-Lambda have reduced the component count significantly, providing in a single-board solution with a low height of only 0.52-inch (13.2 mm) the same output power formerly only available on two-board designs. Further, the optimized reduced component count layout and high power density of the iQL/iQG Series provides a more reliable and very cost effective solution.
 
The fully regulated iQL Series are ideal for powering distributed, intermediate and Advanced Telecom Computing Architecture (ATCA) bus applications. For conventional power rails, the 'standard' output voltages of 2.5V, 3.3V and 5V are equipped with both remote sense and output trim (-20/+10%), suitable for powering a wide array of devices. The 8.3V and 12V output models feature output trim (+20/-10%) without remote sense.  This family also boasts wide input voltage ranges of either 18-36V or 36-75V. Output power ratings range from 150W to 300W depending upon the output voltage.
 
The iQG Series is available with a nominal 12V at 25A output, providing up to 300-watts of continuous output power. They can operate from a wide range input of 36-75VDC and are ideal for distributed and intermediate bus applications that have limited airflow available for cooling.
 
The iQL/iQG is fully isolated from the input to output and input to baseplate (1500VDC). Standard features include fixed frequency operation, remote on/off, monotonic and pre-bias load start up, auto-recovery from input under-voltage, plus over-current, over-voltage and over-temperature protection circuitry. 
 
These converters are approved to a wide range of national and international safety standards, including UL60950 (US & Canada), VDE 0805 and CB scheme (IEC950) and are RoHS compliant. In addition they carry the CE Mark (EN60950) and come with TDK-Lambda's 3-year warranty.

The iQL and iQG series are available now and priced from $58.00each in 500-unit quantities. More information can be found at TDK-Lambda's web site www.us.tdk-lambda.com/lp.
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Fast Turn-Around High-Density Lead Frames for Complicated or Intricate Applications

Photofabrication Engineering (PEI) is offering a complete line of photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing.  These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays, and are also used in medical applications such as hearing aids.

Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively.  Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer’s specific electrical and thermal conductivity requirements.  Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI tailors the manufacturing material to maximize the device’s operating life for any given application or environment.

PEI manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts.  Single- or double-sided lead frames can be etched without incurring the stresses associated with typical machining methods.  Most significant is the fact that PEI’s process can be used for lead frames that are too complicated or intricate for stamping.  Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities. 

PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm) centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.  

A significant advantage of photochemical etching is the ability to reproduce large quantities of parts without tooling “wear,” so the millionth part is exactly the same as the first part.  Changes to tools can be implemented very quickly, and phototools are significantly less expensive than traditional tooling methods—ideal for manufacturing various parts or lead frames from prototype to production quantities.  Turnaround time using phototools is about 90% less than that for stamped frames. 

For more information about our lead frames and other photoetched products, please visit our web site, www.photofabrication.com.
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New GORE® Filters Dramatically Improve Liquid Filtration Performance in Semiconductor Manufacturing

W. L. Gore & Associates (Gore)  has announced a major advancement in filtration technology with the release of GORE® Filters for Semiconductor Applications. This new family of 20nm- to 100nm-rated cartridge filters for chemicals, dilute chemicals, and ultrapure water in wet process tools incorporates a new high-flow ePTFE (expanded polytetrafluoroethylene) filtration media that allows a drop-in retention upgrade from 100nm to 30nm, enabling cleaner recirculation baths, reduced processing times and significant savings in cost of ownership.

The new cartridge filters, to be introduced at SEMICON West 2009, July 14-16 in San Francisco, enable up to three times the flow compared to the next best-in-class filters, with improved performance and no sacrifice in retention. GORE® filters provide a drop-in replacement that improves retention performance, reduces particle counts, lowers operating differential pressures, reduces processing times, and enables faster bath turnovers. The filters also allow flow rates to be maintained or even increased with as few as 1/3 the number of filters used previously. The result is a significant reduction in the capital costs typically associated with process upgrades.

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Asymtek Promotes Paul Gallo to Sales Manager, USA and Americas and Tom Schafer to General Manager, Asia Pacific, and Global Accounts Program Manager

Asymtek, a Nordson company, and, announces the promotions of Paul Gallo to the position of Sales Manager, USA and Americas, and Tom Schafer to General Manager, Asia Pacific, and Global Accounts Program Manager.

Gallo has been with Asymtek since 1993 when he joined the company as Northeast regional manager. His territory expanded to the entire U.S. East Coast and Canada in 1995 and in 1996 he started Asymtek’s first North American Regional office in Torrington, Connecticut.  Prior to Asymtek he held positions with Kaman Corporation, Industrial Technologies Division and Atlantic Fasteners. He is a graduate of the University of Connecticut.

Schafer has been with Asymtek since 1997, starting as a regional sales manager, moving to Americas sales manager and most recently serving as global accounts program manager, a position he will continue to hold, where he has worked closely with Asymtek’s direct staff and distribution network on key projects in the Asia Pacific region. Prior to joining Asymtek he was district sales representative for The EMF Company. Schafer received a B.A. degree from Iowa State University and an M.B.A. from Loyola University of Chicago.

 
 “Paul and Tom have been with Asymtek many years and have demonstrated the ability to understand the dispensing and coating needs and concerns of a diverse group of companies covering a broad array of applications and geographical areas.  They have each developed cohesive and focused sales teams in their territories,” said Greg Wood, Asymtek VP sales & marketing.  “I am excited that they are expanding these skills on a much larger geographic scale.”
 


Paul Gallo


Tom Schafer

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3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors

3M , and SUSS MicroTec, a leading supplier of semiconductor processing equipment, have announced an agreement to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3M’s WSS materials including 3M Liquid UV-Curable Adhesive and Light-To-Heat Conversion coating. Under the agreement, both companies will work closely to address customer demands for high-performance process solutions that support high-volume manufacturing with a competitive cost of ownership.

3M WSS uses processes and materials for temporary wafer bonding to support wafer thinning and processing of ultra thin wafers for 3-D packaging. 3M’s innovative use of a UV-curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding. This is particularly important in the multiple high-temperature cycles required in subsequent wafer processing steps. After processing, 3M’s unique Light-To-Heat Conversion layer allows low stress, room temperature debonding of the thinned wafer directly to the tape carrier. The thinned wafer is supported throughout the entire process reducing warpage, stress and process complexity compared to other processes that require high-temperature exposure and stress to the thinned wafer, or solvents to release the temporary bonding material. 3M’s WSS enables wafer processing currently in high-volume production at multiple semiconductor sites worldwide.

“SUSS MicroTec is a recognized leader in wafer bonding and applications for 3-D and MEMS markets. Working with an industry leader, like SUSS, allows 3M to focus on advanced materials development. The joint efforts of both companies provide 3M customers with improved support, lower overall costs and faster access to more advanced solutions for their demanding 3-D packaging requirements,” commented Mike Bowman, marketing development manager for 3M Electronics Markets Materials Division.

“We are pleased to collaborate with a leading material expert like 3M to offer customers a leading edge temporary bonding process with superior performance compared to current materials and processes on the market,” said Wilfried Bair, general manager, Wafer Bonder Division, SUSS MicroTec. “This relationship and process offering fits nicely with SUSS MicroTec’s 3-D strategy to provide a flexible and modular bonding platform that can be configured to meet customers’ needs.”
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22% More Throughput on Existing Metallization Lines from ASYS

ASYS announces the availability of a high speed upgrade kit that allows existing users of ASYS metallization lines to increase throughput by up to 22%

ASYS, a leading provider of metallization lines for the Solar Industry, is now offering its customers a line upgrade, that will increase the capacity by up to 22%. The upgrade kit, consisting of hardward and software changes, can be installed in only 3 days. Single lane users will see their capacity increase from approx. 1,200 cph to 1,440 cells per hour and for dual lane users the throughput will jump from approx. 2,200 cph to 2,700 cph. For a lot of customers operating multiple ASYS lines this will have another huge advantage: upgrading multiple lines might allow them to postpone or cancel the investment for a new metallization line, which translates to big cost savings per Watt due to reduced operator count, capital invest, floorspace and utilities thus making them more competitive in the market.

The upgrade kits are available immediately for most existing ASYS lines.

For more information on ASYS, contact www.asys-group.com on the web.

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Kyzen to Feature AQUANOX® A4520 at Semicon West 2009

Kyzen, announces that it will feature AQUANOX® A4520 in booth 910 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Calif.

A4520 is a highly tested and proven effective aqueous cleaner for flip chips and advanced packaging, proven to be effective on all lead-free, no-clean, and eutectic materials when run at low temperatures and low concentrations. Easy to use, it is effective without the use of sump-side additives and provides brilliant joints. A4520 is widely used in military applications or anywhere a robust cleaner is needed for the harder to clean fluxes.

Additionally, the A4520 features a long bath life, is RoHS compliant, contains no CFCs or HAPs, and is a biodegradable aqueous solution. This cleaning chemistry can clean numerous soils including: lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides, and polymerized soils. This best-in-class cleaning chemistry provides the lowest cost of ownership technology in the industry, while exceeding industry standards for people and environmental safety.

AQUANOX® A4520 is available in one, five, and 55 gallon containers.

For more information about Kyzen’s AQUANOX® A4520, stop by booth 910 at the show or visit www.kyzen.com.

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Finetech’s High Accuracy Die Bonder on display at Semicon West 2009

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

The manual configuration of the Lambda will be on display, capable of sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm.   A significant feature of the manual configuration is the FA7 heating plate, which offers a 50 x 50 mm heating area, high ramp rate, excellent thermal conductivity, very low thermal expansion and optional heated inert gas integration.

Applications for the FINEPLACER® Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, adhesive technologies, and MEMS/MOEMS placement.

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MicroScreen Announces Technical Support in Georgia, Alabama, and Tennessee

MicroScreen is pleased to announce expanded territory for Cope Assembly Products.  Appointed as exclusive representative for MicroScreen is Doug Eidle.

Doug is located in Decatur, Georgia, and will work with screen and stencil customers in Georgia, Alabama, and Tennessee.

He can be reached at email:  capse@mindspring.com or cell phone:  404-561-9726

MicroScreen provides laser cut and electroformed stencils, as well as screens for thick film printing, solar cells, membrane switch assemblies and other large format use.

 To learn more about MicroScreen products, visit www.microscreen.org or contact:

MicroScreen LLC
1106 South High Street
South Bend, IN 46601
Phone:  574-232-4358
FAX: 574-234-7496

Email: info@microscreen.org

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View the Corporate Bulletin Archives

 

:: Issue 74 ::
July 1, 2009

RGL Enterprises LLC

Compex Corp.