TJ Green Associates, LLC
:: Corporate Member News ::

:: Integra Adds Verigy 93k P1000 and 12" Probe Capability (full story)

:: Anaren Announces Availability of Balun Application Note for Analog Devices, Inc. High-Speed Data Converters (full story)

:: Andrew Dodd Joins Miyachi Unitek Corporation (full story)

:: Henkel Launches New High-Temp Compatible Conductive Film for RF Grounding Applications (full story)

:: Sonoscan® to Introduce “Operator-Free” 300mm Bonded Wafer Inspection System at Semicon West (full story)

:: PA&E Announces New Hermetic Aluminum 38999 Connector (full story)

:: MicroScreen Receives ITAR Registration (full story)

:: LORD Corporation's Sara Paisner Elected President of IMAPS Carolinas Chapter (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Integra Technologies
Mentor Graphics

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Integra Adds Verigy 93k P1000 and 12" Probe Capability

Integra Technologies, LLC., has announced that it has added a Verigy 93K P1000 tester for package and probe test of high speed, high pin count, mixed signal devices and high speed multi-site memory test.  The tester has 800 digital pins with 1000Mbits/sec data rates and greater than 600Mhz frequency capabilities.  Digital pattern depths of 56Meg including memory test Algorithmic Pattern Generator capabilities.  Analog resources include PMU per pin, 16 power supplies and 16/24bit Digitizers and 16/18bit Waveform Generators. 
Integra has also added a TSK UF3000 12" Wafer Prober.   The addition of this prober to Integra's existing equipment set, gives them capability to probe 3" to 12" wafers.

For more information, please visit
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Anaren Announces Availability of Balun Application Note for Analog Devices, Inc. High-Speed Data Converters

Anaren, Inc. has announced it has introduced an application note and layout package to facilitate the use of its halogen-free baluns in conjunction with two Analog Devices, Inc. high-speed, analog-to-digital data converter models AD9445 (14bit) and AD9446 (16bit). According to Anaren, its baluns (part numbers BD0205F5050AHF and BD0310E5050AHF) save PCB space, improve gain flatness, and improve spurious free dynamic range (SFDR) when used in conjunction with the Analog Devices data converters.
Analog Devices model AD9445 operates at up to 100 MSPS and is typically used for instrumentation, medical imaging, and radar receivers employing baseband (<100 MHz) IF frequencies. Model AD9445 operates at a 125 MSPS conversion rate and is optimized for multi-carrier, multimode receivers such as those found in cellular infrastructure equipment and very high-end instrumentation. In both cases, Anaren’s baluns assist with improving gain flatness and SFDR performance, in addition to:

  • significant space savings (a 80 to 90% smaller footprint) over wire-wound models;
  • improved and highly repeatable performance (when compared to traditional wirewound equivalents), attributable to Anaren’s unique, multilayer organic substrate construction;
  • a reduced overall component count, since a single, surface-mountable Anaren balun replaces multiple wire-wound parts

“We’re excited to have had the opportunity to work with the Analog Devices team to arrive at a balun solution optimized for their high-performance data converters,” said Anaren Consumer Components Group product line manager, Shawn Halpin. “From both a performance and form-factor standpoint, we’re confident manufacturers using Analog Devices’ converters will appreciate the advantages of our true surface mount alternative to bulky, traditional baluns,” added Halpin.

For more information, please visit

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Andrew Dodd Joins Miyachi Unitek Corporation

Miyachi Unitek is pleased to announce that Andrew Dodd recently joined the company as a Sr. Sales Engineer, effective June 1.  In his new role, Andrew will have responsibility for Laser & Systems Sales and Applications Support in the Midwest United States.  He will be based in the Detroit area. The announcement was made by Jack Lantz, President and CEO.

Andrew brings more than 25 years’ experience to Miyachi Unitek Corporation.  He joins the company after 20 years at GSI Lumonics where he most recently served as the North American Director of Sales and Service for the GSI Laser Group.

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Henkel Launches New High-Temp Compatible Conductive Film for RF Grounding Applications

Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming® CF3366™, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.

Emerson & Cuming CF3366 is a high adhesion strength electrically conductive film formulated for electrical, thermal and mechanical assembly applications.   The material delivers outstanding adhesion at elevated temperatures, offers high electrical conductivity and provides for uniform and void-free bondlines.  In addition, the low temperature, quick cure capabilities of Emerson & Cuming CF3366 ensure maximum process flexibility and ease-of-use.  All of these adhesive properties combine to ensure reliable RF ground plane performance even in extreme environmental conditions.

Historically, electrically conductive interface materials such as solder, thermal greases and conductive films have been used for RF grounding applications.  However, film materials have emerged as the most robust electrically conductive products because of their ability to promote superior grounding function, consistent processing during assembly and deliver void-free bondlines over a very large area.  Conductive films also deliver better RF performance with minimized losses and distortion of high frequency digital signals, while maintaining low impedance to the ground plane.  New requirements, however, dictate that conductive films provide all of these proven benefits in addition to delivering reliable bonding at both room temperature and elevated temperatures. 
Applications in defense and other industries have moved toward smaller, more complex and higher frequency devices and conductive adhesives must address these new technology demands by offering stable bonding even under very harsh environmental aging.  Traditional conductive adhesives are less stable at higher temperatures so are not effective for these applications.  Henkel’s Emerson & Cuming CF3366, however, has been formulated specifically to comply with higher temperature environments.

Enabling operation at high frequency, Emerson & Cuming CF3366 maintains robust adhesion at elevated temperatures and provides improved mechanical stability.  When tested against a well-known, commercial conductive film, Emerson & Cuming CF3366 emerged as the most robust solution, delivering superior adhesion at elevated temperatures even under harsh environmental conditions, better processing through lower curing temperature and a shorter curing time, and superior performance after exposure to moisture sensitivity level conditions.

For more information please visit
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Sonoscan® to Introduce “Operator-Free” 300mm Bonded Wafer Inspection System at Semicon West

Sonoscan, Inc. will introduce its new C-SAM® series AW300™ for bonded wafer inspection at Semicon West in San Francisco’s Moscone Center from July 14 to July 16, 2009.

The new system extends the 10-year legacy of Sonoscan’s Automated Wafer (AW) inspection systems, the first of which was made in 1999.

The AW300™ carries out robotic handling and acoustic imaging of bonded wafer pairs up to 300mm in diameter.  Acoustic imaging is a critical step for finding tiny but lethal defects that can occur in bonded wafers.  Robotic handling makes it unnecessary for human operators to handle the wafer pairs.

In addition, the AW300™ uses twin transducers to scan two wafer pairs simultaneously.  At the same time, the two previously scanned wafers are being dried and returned to their carriers.  Four wafer pairs are thus being processed at the same time. 

The result is very high throughput for 300mm wafers.  High operating speed, combined with very high resolution Sonoscan® technology transducers, gives tremendous leverage in identifying defects that can harm both yield and reliability in wafer pairs that often contain thousands of devices.

The AW300™ is integrated with an industry standard and proven EFEM (Equipment Front End Module) that is SECS/GEM ready, accommodates single or multiple load ports, and utilizes either vacuum or edge grip end effectors.  The scanner system utilizes linear motors and is inertially balanced for vibration-free operation.

For more information, please visit
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PA&E Announces New Hermetic Aluminum 38999 Connector

New Ultra Lightweight, Hermetic Connector Now Available for a Variety of Applications

Design engineers in defense, space, aviation, and other industries, where light weight and superior hermetic performance are key considerations, have a new option following PA&E’s release of its new aluminum circular 38999 DC connector.

Built to the same rugged standards as the company’s other robust, MIL-Spec compliant interconnect products, this new, connector combines PA&E’s patented Kryoflex® ceramic-to-metal sealing technology,  beryllium copper CDA alloy 172/173 contacts for superior electrical performance in a weight-saving all-aluminum shell.

“This new aluminum 38999 DC connector is unique in the market,” said Shaun McGuire, PhD, vice president of engineering at PA&E. “We can now offer our customers a 38999 connector that is up to 60% lighter than our standard stainless steel version and still provides the reliable hermetic performance we’re known for.”

PA&E’s new aluminum 38999 DC connector has an operating temperature range of -65°C to 155°C and a leak rate of less than 1X10-9 cc/sec helium at one atmospheric differential pressure.  It provides insulation resistance of more than 5,000 megohms at 500 VDC during dielectric withstanding voltage testing and exhibits no evidence of breakdown or flashover when tested IAW MIL-STD-1344, Method 3003. The connector accepts 24 to 30 AWG solid or stranded wire.

The new aluminum circular 38999 hermetic connector from PA&E can be designed to be laser welded into aluminum housings. Laser welding is a non-contact, high-precision welding process that exhibits an extremely small heat-affected zone, ensuring components or electronic packages are exposed to the least-hostile welding environment possible. The connector is also available in a jam-nut style.

Besides this new aluminum-shell connector, PA&E custom manufactures circular and rectangular DC connectors in a number of configurations including options with standard stainless steel shells that use both Kryoflex ceramic-to-metal and glass-to-metal sealing processes.

For more information, please contact PA&E at 509-664-8000 or visit us at
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MicroScreen Receives ITAR Registration

MicroScreen LLC has announced they have received their official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State, Bureau of Political-Military Affairs.

ITAR Registration means that MicroScreen is uniquely positioned to fully support defense related projects in the United States. 

Administered by the U.S. Department of State’s Directorate of Defense Trade Controls, under authority established by the Arms Export Control Act, ITAR regulates the manufacture, export and transfer of defense articles, information, and services.

Companies receiving this certificate demonstrate that they have knowledge and understand how to fully comply with the AECE and ITAR, as well as having corporate procedures and controls in place to ensure compliance.

For more information, please visit

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LORD Corporation's Sara Paisner Elected President of IMAPS Carolinas Chapter

LORD Corporation -- a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry -- has announced that Sara Paisner, Ph.D., Senior Research Scientist for Microelectronics Technology, has been elected President of the International Microelectronics and Packaging Society (IMAPS) Carolinas Chapter.

Paisner is well qualified for the position. She received her A.B. at Dartmouth College, and her Ph.D. at the University of California at Berkeley. During her postdoctoral research at UNC-Chapel Hill, she worked on developing new types of low K dielectric materials. She then moved to GE’s Global Research Center where she worked on a variety of projects focusing on developing new materials for the electronics industry. While at GE, Paisner utilized many different technologies, including nanotechnology, to develop new thermal and encapsulating materials.

At LORD, Paisner leads projects focused on developing the company’s next generation of thermal interface gels, greases and adhesives for the microelectronics industry. Paisner is the author of articles in peer reviewed journals, along with four patents and a book chapter. In addition to IMAPS, she is an active member of the American Association for the Advancement of Science, the American Chemical Society and Iota Sigma Pi.

Elected for a one year term, Paisner has many goals and future plans for the chapter. One major responsibility will be the leadership of the 2010 National IMAPS meeting, to be held in Raleigh, N.C.  As a mid-size chapter, Paisner intends to have local section meetings with technical speakers to help and encourage local networking. She would also like to get the local academic community involved in events to show students the many opportunities that exist in the microelectronics industry and allow them to network with professionals in the field. Paisner also hopes to attract new membership and involve current members in events. Further, she plans to reach out to other organizations that are associated with the electronics industry to encourage networking among members.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia.

About LORD Corporation
With global reach and extensive technical capabilities, LORD has the ability to work on complex formulations, balancing contradictory property and process requirements to deliver the solutions that meet customer and market demands. For the electronics industry, LORD serves as a diversified technology company providing high value-added materials to niche markets. LORD builds on its more than 80 year history with a track record of successful long-term partnerships with technology leaders in industries ranging from aerospace to automotive, electronics to industrial heavy equipment.  

With headquarters in Cary, N.C., and sales in excess of  $700-MM, LORD Corporation is a privately-held company that designs, manufactures and markets devices and systems to manage mechanical motion and control noise and vibration; formulates, produces and sells general purpose and specialty adhesives and coatings; and develops products and systems utilizing magnetically responsive technologies. With manufacturing in nine countries and offices in more than 15 major business centers, LORD Corporation employs more than 2,500 worldwide. Visit for more information.
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:: Issue 73 ::
June 16, 2009

RGL Enterprises LLC

Compex Corp.