Medical Parts Photo Etched from Pure Titanium at PEI

Custom chemically machined medical parts for implantable devices requiring precise, intricate, burr-free construction with exact repeatability are available from Photofabrication Engineering Inc. of Milford, Massachusetts.

PEI Photo Etched Titanium Medical Parts are chemically machined rather than stamped which permits exact repeatability because there is no tooling to wear out and allows precise tolerances to within 10% of material thickness. Featuring sizes from 0.050” to 6” sq. and thicknesses from 0.001” to 0.060”, titanium medical parts are bio-compatible, making them ideally suited for implantable devices, and can be made in virtually unlimited configurations.

A contract manufacturer capable of producing over 100,000 parts-per-year, PEI is ISO registered with ANAB and UKAS accreditation and can supply parts in contaminant-free argon packaging.  Typical etched titanium medical parts include maxillofacial and craniofacial treatments, cardiovascular devices such as pacemaker cases and defribrillators, structural components, and intra-vascular stents.  Stainless steel and nickel parts are also offered.

PEI Photo Etched Titanium Medical Parts are priced according to configur-tion and quantity.  Price quotations are typically provided within 24 hours.

For more information olease visit www.photofabrication.com.

New Thick-Film Information Available from Anaren, Inc.

Free literature overviews thick-film manufacturing capabilities of company’s Salem, NH-based Anaren Ceramics subsidiary, includes equipment list and design guide.

Anaren, Inc. has announced  that it has developed an free informational kit developed to introduce design engineers, manufacturing engineers, and purchasing professionals to the company’s thick film ceramic circuits capabilities. Anaren’s thick film service -- in addition to a range of other ceramics solutions ranging from standard, high-volume resistive components to highly customized, complex LTCC modules -- is offered through the company’s Anaren Ceramics subsidiary, located in Salem, New Hampshire.

Product Line Manager Bill Polinksky, at the Salem facility, indicated that the kit includes a design guide “including tips and guidelines for designing a thick-film circuit, equipment list, and top-level introduction to Anaren’s capabilities” and information on the company’s experience with thick-film across the defense, commercial wireless, and consumer electronics sectors.

The kit may be obtained by calling  603.898.2883, emailing  thickfilm@anaren.com, or via download at www.anaren.com.

MicroScreen Appoints Representatives for Screens to Print Photovoltaic Devices

MicroScreen announces the appointment of two sales organizations
as exclusive agents for sales and service of screens used in the printing of solar cells.

The PV screens are being produced by MicroScreen in its newly-established manufacturing facility contiguous to the current screen-making location. This expansion is strictly for manufacture of screens for solar cells and specifically to accommodate larger frame sizes.

Southern California, Arizona, and New Mexico

Appointed as exclusive representatives is Chalman Technologies under the direction of  Ron Chalman.   They will be responsible for sales and service of screens for printing photovoltaic devices.

The website address is www.cti-rep.com

New England States and State of New York
                                                                               
Appointed as exclusive representatives is Creyr Innovation, LLC.   Under the direction of Jim McLenaghan, they will be responsible for the sales and service of screens for printing photovoltaic devices.

Jim McLenaghan	Sarah McLenaghan

The website address is: www.creyr.net

Both sales organizations are a full-service technical manufacturers representative who also represents MicroScreen’s stencils and thick film screens. 

The combination of MicroScreen’s 27 years of experience in the manufacture of screens, along with all new state-of-the-art equipment including automated stretch tables, coating machines, drying cabinets, and exposure units, ensure line width on the screens reproduce customer designs.

For additional information on MicroScreen products, please t info@microscreen.org.

TDK-Lambda Releases 7-Amp POL Converter in Tiny SIP Package

TDK-Lambda expanded its range of point-of-load (POL) DC-DC converters with the launch of the iBD series of 7-Amp non-isolated, single- inline-package (SIP), thru-hole mounted devices. Featuring a DOSA compatible pin-out, the iBD series addresses a broad range of applications including telecom, computer, datacom, medical and industrial equipment. These tiny units are only 1.0" L x 0.50" H x 0.33" W.

With its ultra wide input range from 6V to 14V, the iBD series are particularly well-suited for powering today's diverse range of loads in a variety of architectures including distributed power and 4:1 and 5:1 unregulated bus converter systems. Furthermore, its broad output adjustment range from 0.8V to 5.5V, its ability to start with a pre-biased output, and its maximum output current of 7A make it especially useful in ASIC, FPGA and other applications where multiple voltages may be required.

Special attention has been paid to the electrical design to gain a high power conversion efficiency of up to 92%. Combined with careful component layout, this allows the iBD series to provide better thermal performance than many similar devices. This enables the designer to benefit from higher output power for a given thermal environment, or lower thermal stress for the same output power. 

The iBD POL converter's standard features include fixed-frequency operation for reduced EMI/RFI noise, remote on/off, flexible output voltage sequencing, auto-recovery of input under-voltage and output over-current protection circuitry. Available options include: Negative polarity on/off, no output voltage sequencing, industry standard narrow 9.6V to 14V input voltage range and shorter thru-hole pins at 0.13" (standard pin length is 0.20").

Safety approvals include UL60950, VDE0805, and CB scheme (IEC60950).  All models carry a three-year warranty and are RoHS compliant.

The iBD series are available now and priced from $9.67 each in 1000-unit quantities. More information can be found at TDK-Lambda's web site www.us.tdk-lambda.com/lp.

Panasonic Factory Solutions Company of America Introduces The NPM (Next Production Modular), an Integrated Single-Platform Assembly Solution

Panasonic Factory Solutions Company of America has introduced the NPM (Next Production Modular)—an integrated solution reaching beyond mounting in a single-platform modular assembly system. The NPM incorporates innovative concepts designed to evolve with changes in technology for future production requirements. In addition to its interchangeable, plug-and-play placement heads for nearly any component, the NPM platform integrates solder paste inspection (SPI), adhesive dispense (ADH), post placement inspection (AOI) and screen printing capabilities. Both heads of each NPM unit work on both stages to realize the full benefit of the dual lane configuration. Meanwhile, the Dual Screen Printer (DSP) module performs parallel, simultaneous printing of two unique products.

According to Tom Baggio, Panasonic Factory Solutions Company of America’s Solutions Program Manager, “The NPM is built on the global success of our CM series placement equipment and inherent process technologies such as PoP, APC, 3D sensing, chip thickness sensing and more. This system redefines flexibility and performance. Its cost-effectiveness is immediately apparent in its spatially efficient footprint, user-friendly operation and area productivity of up to 25,000 cph/m2. The NPM provides a highly functional and reliable way to maximize productivity.”

The NPM’s innovative design utilizes the already advanced features of the CM series placement equipment including the same intelligent feeders and nozzles with interchangeable head capabilities. This assists in minimizing the cost of capital investment and spare part inventory management expenses. Additionally, the NPM’s innovative new exchange carts provide virtually zero downtime opportunities during changeover for a lean production system.

“The Next Production Modular coupled with Panasonic Factory Solutions’ new PanaCIM Enterprise Edition software suite can help customers become more productive than ever”, Baggio adds. “Panasonic continues to evolve as a total solution provider to the industry.”

For more information, please visit www.panasonicfa.com.

Asymtek Honored with SMT China Vision Award and EM Asia Innovation Award at NEPCON China 2009 DJ-9500 Fluid Jetting Valve and SV-100 Solder Paste Slider Valve Win in Dispensing Equipment Categories

Asymtek, a Nordson company,, announces it has received two prestigious awards during NEPCON China 2009.  Asymtek’s DispenseJet® DJ-9500 fluid jetting valve won the SMT China VISION Award, while Asymtek’s SV-100 high-speed slider valve received the EM Asia Innovation Award.  The DJ-9500 has a flexible pneumatic design that can jet a wide variety of fluids up to 10 times faster than existing needle type dispensers, even with abrasive fluids.  The SV-100 dispense valve uses slider valve technology to dispense paste-type fluids that contain metal additives.  It is up to 20% faster than standard auger valves with needles.  The speed and accuracy of the SV-100 makes it cost-effective for a range of production requirements.

The SMT China VISION Award honors achievements in China's electronics manufacturing industry.  Selection of the winners is based on 10 criteria: creativeness and innovativeness, performance, reliability, cost effectiveness, ease-of-use, flexibility, compatibility, quality contributions, environmental responsibility, and maintainability/reparability and service.  The VISION Award presentation ceremony was held on April 21, 2009 in the Shanghai Everbright International Hotel, Shanghai, China.

The EM Asia Innovation Award recognizes, rewards, and celebrates excellence in the Asian electronics industry.  The 2009 EM Asia awards were presented to companies that have achieved the highest standards for their products.  An independent panel of industry experts judged entrants on innovation and achievement and in setting challenging objectives. Also held at the Shanghai Everbright International Hotel, the award was presented on April 22, 2009.

“We are honored to receive these two awards,” said Frank Wang, Asymtek’s general manager, Greater China.  “Asymtek has been recognized as the leader in dispensing and coating innovation and technology for over 25 years.  We have grown with our customers to develop equipment and processes to enable them to produce many of the products we rely on today.  We will continue to serve our customers throughout Asia and China with quality products and provide the very best service and support.  We thank SMT China and EM Asia for these awards.”

SMT China is the magazine for professionals in China's electronic manufacturing industry. Its mission is to provide information on solutions to help engineers solve problems in PCB assembly; to provide information on the latest technologies, methodologies, tools, and materials used; and to provide analysis of industry trends.

Electronics Manufacturing (EM) Asia is the primary source of information for industry professionals who design, assemble and test printed circuit board (PCB) assemblies in Asia. It is the premier publication in the region targeted at contract manufacturers (EMS/ ODMs), OEMs, and at vendors, suppliers and distributors who want to remain informed on the latest developments and technologies in the SMT and electronic packaging/interconnect industries.

RNT's NanoBond® Passes 1000 Thermal Cycles for CPV Thermal Interface

Reactive NanoTechnologies, Inc., has announced that it has passed a milestone for the reliability of a concentrated photovoltaic (CPV) receiver to heat sink connection. The thermal interface connection has exceeded 1000 thermal cycles with no degradation in thermal performance or bond strength. Reliability testing on NanoBond® has shown superior thermal conductivity and mechanical integrity compared to epoxies.
 
RNT performed the thermal cycle testing at -40ºC to +110ºC, per IEC 62108, Test 10.6.  Testing at 110ºC typically concludes at 500 cycles, but the testing was continued in order to conclusively demonstrate the superior performance of RNT's bonding technology. Thermal conductivity was measured by laser flash technique.
 
"Exceeding the 1000 cycle threshold demonstrates NanoBond®'s ability to support the 25 year life requirement that CPV systems developers seek to achieve," stated Michael P. O'Neill, RNT's Global Vice President of Sales.  "The unique combination of high reliability and superior thermal performance is a real enabler for high concentration systems and next generation die technology."
 
For more information please visit www.rntfoil.com.eactive NanoTechnologies, Inc., has announced that it has passed a milestone for the reliability of a concentrated photovoltaic (CPV) receiver to heat sink connection. The thermal interface connection has exceeded 1000 thermal cycles with no degradation in thermal performance or bond strength. Reliability testing on NanoBond® has shown superior thermal conductivity and mechanical integrity compared to epoxies.
 
RNT performed the thermal cycle testing at -40ºC to +110ºC, per IEC 62108, Test 10.6.  Testing at 110ºC typically concludes at 500 cycles, but the testing was continued in order to conclusively demonstrate the superior performance of RNT's bonding technology. Thermal conductivity was measured by laser flash technique.
 
"Exceeding the 1000 cycle threshold demonstrates NanoBond®'s ability to support the 25 year life requirement that CPV systems developers seek to achieve," stated Michael P. O'Neill, RNT's Global Vice President of Sales.  "The unique combination of high reliability and superior thermal performance is a real enabler for high concentration systems and next generation die technology."
 
For more information please visit www.rntfoil.com.

Indium Corporation Expands Sales Network in Europe

Indium Corporation has appointed Ostec Enterprises, Ltd. as its newest sales channel partner in Russia, Belarus, and the Ukraine. Ostec is responsible for selling Indium’s solder products including solder paste, wire, rework fluxes, engineered solders, and thermal interface materials.
 
Founded in 1991 and headquartered in Moscow, Ostec is a leader in providing innovative solutions for electronic equipment production, electronic and electrical components, testing, and test control. Ostec provides key services to their market including technical support in all aspects of industrial production with vital shipping and handling logistics support.
 
According to Andy Seager, Sales Channel Partner Manager for Indium Corporation, “Ostec’s focus on industry development and technical support fully aligns with Indium Corporation. I look forward this new partnership as we provide our customers in Russia, Belarus, and the Ukraine with technical excellence and first-class customer support.”

Remtec and Microwave Packaging Technology Form Strategic Alliance

Remtec Inc, and Microwave Packaging Technology, Inc. (MPT) of Anaheim, CA, a leader in the design, test and assembly of microwave modules and components, have announced a strategic alliance to integrate their core competencies.  By combining these capabilities, Remtec and MPT establish a single, reliable source for the design, test and manufacture of advanced microwave and millimeter-wave packages and modules built with PCTF technology.

This new alliance will provide three key advantages to design engineers: speed the introduction of high-frequency products, reduce the cost of development and offer a single stop, integrated source.  Through the alliance microwave designers have access to support for product design, simulation, manufacture and test.  An example of this cooperation is shown in the attached photo of a QFN compatible package, designed by MPT and produced by Remtec.  This package operates from DC to 30 GHz.

Amkor to Present at JP Morgan Technology Conference

Amkor Technology, Inc. has  announced that Joanne Solomon, chief financial officer, and Jim Fusaro, corporate vice president, wirebond products, will participate in the JP Morgan 37th Annual Technology Conference in Boston, Mass. on Wednesday, May 20, 2009. The presentation is scheduled to begin at 9:20 a.m. (EDT).

The presentation format will be an analyst-led Q&A discussion. An audio-only webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of the company’s website. In accordance with company policy, Amkor will not update, reaffirm or otherwise comment on any prior financial guidance during this conference. Amkor’s financial guidance for the quarter is effective only on the date given.

For more information, please visit www.amkor.com.

Our Student Chapters and Local Universities Need Your Support

The future of our society can be enhanced by the tools we provide for the next generation engineers, scientists, and professionals.  Please consider donating production, test, and/or process equipment, or analytical tools or supplies that would enhance the laboratory capabilities of our student chapters.  You may designate the recipient University or IMAPS will provide a forum to match your donation with a University home.

The IMAPS Directors thank you for your consideration.